Semiconductor packaging device for integrated circuit production

Abstract

The utility model relates to the technical field of semiconductor packaging, and discloses a semiconductor packaging device for integrated circuit production, which comprises a bottom plate, the upper surface of the bottom plate is provided with a base, the upper surface of the base is rotatably connected with a turntable, and the upper surface of the turntable is provided with three grooves which are circumferentially arranged at equal intervals. According to the semiconductor packaging device for integrated circuit production, after packaging operation is completed, an electric push rod drives a bearing plate to rotate, a semiconductor on the upper surface of the bearing plate falls to a flow guide plate to complete discharging, meanwhile, a rotating disc is arranged, the semiconductor is driven to be transferred through rotation of the rotating disc, the packaging mechanical arm and the feeding mechanical arm are arranged, and the packaging efficiency is improved. The packaging mechanical arm can conduct packaging operation and the feeding mechanical arm can conduct feeding operation in the rotating and cooling process of the bearing disc, then feeding, packaging and discharging are conducted at the same time, and the overall operation efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging, specifically to a semiconductor packaging device for integrated circuit production. BACKGROUND

[0002] Semiconductor packaging refers to the process of processing independent chips according to product models and functional requirements from wafers that have passed testing. The packaging process is as follows: wafers are cut into small chips after the wafer slicing process, then the cut chips are attached to the small islands of the corresponding substrate holder with glue, then the bonding pads of the chips are connected to the corresponding pins of the substrate using ultra-fine metal wires or conductive resin, and the required circuit is formed, then the independent chips are packaged and protected with a plastic shell. During plastic packaging of semiconductors, the connection usually needs to be welded.

[0003] The existing patent (announcement number: CN214481996U) discloses a semiconductor packaging device with a heat sink, which includes a device main body, the upper surface of the device main body is provided with two lead screws, the outer sides of the two lead screws are provided with telescopic rods, the top ends of the two telescopic rods are provided with moving tracks, the outer sides of the moving tracks are provided with moving mechanisms, the front sides of the moving mechanisms are welded with welding heads, the upper surface of the device main body is provided with a fixed plate, the middle part of the fixed plate is provided with a trough, and the fixed plate, the trough and the matching auxiliary structure can provide a rotating material fixing structure.

[0004] The above-mentioned patent can dissipate heat through rotation after plastic packaging, the power equipment is arranged in the interior of the device main body, which greatly reduces the occupied space of the whole equipment, simplifies the connection between the equipment, and makes the whole device more convenient to use. However, it has some disadvantages in use, that is, the semiconductor needs to be picked up manually after heat dissipation, which is very inconvenient, and the feeding, packaging and discharging need to be completed in sequence, and the components that have completed packaging cannot be discharged for safety during the packaging operation, which leads to low overall efficiency. UTILITY MODEL CONTENTS

[0005] In view of the deficiencies of the prior art, the utility model provides a semiconductor packaging device for integrated circuit production, which has the advantages of automatic discharging after packaging and high work efficiency, and solves the problems raised in the above background.

[0006] To achieve the above object, the utility model provides the following technical scheme: A semiconductor packaging device for integrated circuit production, including the bottom plate, the upper surface of bottom plate is provided with the base, the upper surface of base is rotatably connected with the turntable, the upper surface of turntable is equipped with three recesses which are arranged in the circumference equidistance, the inner wall of recess is provided with the bearing assembly for bearing the semiconductor, bearing assembly includes the bearing plate, the bearing plate is rotatably connected with the recess through the pivot, the upper surface of bottom plate is provided with the packaging mechanical arm for packaging operation and the feeding mechanical arm for feeding.

[0007] Further, the upper surface of the bearing plate is provided with a placing groove, the inner wall of the placing groove is rotatably connected with a bearing disc, the upper surface of the bearing disc is provided with a sliding groove, the inner wall of the sliding groove is rotatably connected with a bidirectional threaded rod, the inner wall of the sliding groove is slidably connected with a sliding block, and the sliding block is threadedly connected with the bidirectional threaded rod.

[0008] Through the above scheme, the bidirectional threaded rod can drive the sliding block to move, and the semiconductor can be clamped by the movement of the sliding block.

[0009] Further, the recess provided in the upper surface of the bearing disc is internally mounted with a clamping motor, and the output end of the clamping motor is connected with the bidirectional threaded rod.

[0010] Through the above scheme, the bidirectional threaded rod can be driven to rotate by the clamping motor.

[0011] Further, the bottom surface of the bearing plate is provided with a ventilation groove, and the ventilation groove is communicated with the placing groove, and the bottom surface of the bearing disc is mounted with a heat dissipation fin.

[0012] Through the above scheme, the heat dissipation fin can increase the heat dissipation area of the bearing disc, and the heat dissipation fin will rotate with the bearing disc after rotating, thereby improving the heat dissipation efficiency.

[0013] Further, the bottom surface of the bearing plate is mounted with a heat dissipation motor, and the output end of the heat dissipation motor is connected with the bearing disc.

[0014] Through the above scheme, the bearing disc can be driven to rotate by the heat dissipation motor, and the semiconductor on the upper surface of the bearing disc can be cooled by the rotation of the bearing disc.

[0015] Further, the bottom surface of the turntable is fixed with a support, the upper surface of the support is hingedly connected with an electric push rod, the other end of the electric push rod is hingedly connected with the bearing plate, the side surface of the base is provided with a discharge port, and the discharge port is fixed with a guide plate.

[0016] Through the above scheme, the bearing plate is driven to rotate by the electric push rod, the bearing plate is inclined, and the semiconductor on the upper surface of the bearing plate falls to the guide plate.

[0017] Further, the upper surface of the bearing disc is fixed with two horizontal plates, the upper surface of the bearing plate is installed with two light generators and corresponding light receivers, the installation direction of the light generator and the light receiver is parallel to the installation direction of the horizontal plate, and the light generator and the light receiver are signal connected with the control device of the external environment.

[0018] Through the above scheme, when the light receiver cannot receive the light emitted by the light generator, it indicates that the horizontal plate blocks it at this time, and the heat dissipation motor needs to drive the bearing disc to rotate and adjust until the light receiver receives the light emitted by the light generator, and at this time, the semiconductor can fall along the horizontal plate to the flow guide plate.

[0019] Further, the upper surface of the bottom plate is installed with a driving motor, and the output end of the driving motor is connected with the rotating disc.

[0020] Through the above scheme, the rotating disc can be driven to rotate by the driving motor.

[0021] Compared with the prior art, the technical scheme of the utility model has the following beneficial effects:

[0022] The semiconductor packaging device for integrated circuit production is provided with the electric push rod, the bearing plate is driven to rotate, the semiconductor on the upper surface of the bearing plate falls to the flow guide plate to complete the discharging, the rotating disc is arranged, the semiconductor is transferred through the rotation of the rotating disc, the packaging mechanical arm and the feeding mechanical arm are arranged, the packaging mechanical arm can perform the packaging operation and the feeding mechanical arm can perform the feeding operation during the rotation and cooling of the bearing disc, and therefore the feeding, packaging and discharging are simultaneously performed at the same time, and the overall operation efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 It is a whole three-dimensional structure diagram of the present application;

[0024] Figure 2 It is a sectional view of the whole bottom plate side view of the present application;

[0025] Figure 3 It is a bottom view of the whole bearing plate of the present application;

[0026] Figure 4 It is a structure detail view of the whole bearing assembly of the present application.

[0027] In the figure:

[0028] 1, bottom plate; 2, base; 3, rotating disc;

[0029] 4, bearing assembly; 401, bearing plate; 402, bearing disc; 403, bidirectional threaded rod; 404, sliding block; 405, clamping motor; 406, heat dissipation fin; 407, heat dissipation motor; 408, support; 409, electric push rod; 410, cross plate; 411, light generator; 412, light receiver;

[0030] 5, packaging mechanical arm; 6, feeding mechanical arm; 7, discharge port; 8, deflector; 9, driving motor. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0032] Please refer to Figure 1 , Figure 2 and Figure 3 , a semiconductor packaging device for integrated circuit production in the embodiment includes a bottom plate 1, the upper surface of the bottom plate 1 is provided with a base 2, the upper surface of the base 2 is rotationally connected with a turntable 3, the upper surface of the turntable 3 is provided with three recesses arranged at equal intervals in a circle, the inner wall of the recess is provided with a bearing assembly 4 for bearing a semiconductor, the bearing assembly 4 includes a bearing plate 401, the bearing plate 401 is rotationally connected with the recess through a rotating shaft, the upper surface of the bottom plate 1 is provided with a packaging mechanical arm 5 for packaging operation and a feeding mechanical arm 6 for feeding.

[0033] Please refer to Figure 2 , Figure 3 and Figure 4 , the upper surface of the bearing plate 401 is provided with a placing groove, the inner wall of the placing groove is rotationally connected with a bearing disc 402, the upper surface of the bearing disc 402 is provided with a sliding groove, the inner wall of the sliding groove is rotationally connected with a bidirectional threaded rod 403, the inner wall of the sliding groove is slidingly connected with a sliding block 404, the sliding block 404 is threadedly connected with the bidirectional threaded rod 403, the bidirectional threaded rod 403 can drive the sliding block 404 to move through rotation, the semiconductor can be clamped through the movement of the sliding block 404, the inner part of the recess provided on the upper surface of the bearing disc 402 is installed with a clamping motor 405, the output end of the clamping motor 405 is connected with the bidirectional threaded rod 403, the bidirectional threaded rod 403 can be driven to rotate through the clamping motor 405.

[0034] Please refer to Figure 2 , Figure 3 and Figure 4The bottom surface of the bearing plate 401 is provided with a ventilation groove, which is communicated with the placing groove. The bottom surface of the bearing disc 402 is provided with the heat dissipation fins 406. The heat dissipation fins 406 can increase the heat dissipation area of the bearing disc 402. After the rotation of the bearing disc 402, the heat dissipation fins 406 will rotate, thereby improving the heat dissipation efficiency. The bottom surface of the bearing plate 401 is provided with the heat dissipation motor 407. The output end of the heat dissipation motor 407 is connected with the bearing disc 402. The heat dissipation motor 407 can drive the bearing disc 402 to rotate. The rotation of the bearing disc 402 can drive the semiconductor on the upper surface of the bearing disc 402 to dissipate heat.

[0035] Please refer to Figure 2 、 Figure 3 and Figure 4 The bottom surface of the rotating disc 3 is fixedly provided with the bracket 408. The upper surface of the bracket 408 is hingedly provided with the electric push rod 409. The other end of the electric push rod 409 is hingedly connected with the bearing plate 401. The side surface of the base 2 is provided with the discharge port 7. The discharge port 7 is fixedly provided with the flow guide plate 8. The electric push rod 409 drives the bearing plate 401 to rotate. The bearing plate 401 is inclined. The semiconductor on the upper surface of the bearing plate 401 falls to the flow guide plate 8. The upper surface of the bearing disc 402 is fixedly provided with the two horizontal plates 410. The upper surface of the bearing plate 401 is provided with the two light generators 411 and the corresponding light receivers 412. The installation direction of the light generators 411 and the light receivers 412 is parallel to the installation direction of the horizontal plates 410. The light generators 411 and the light receivers 412 are signal connected with the control device in the external environment. When the light receiver 412 cannot receive the light emitted by the light generator 411, it indicates that the horizontal plate 410 blocks the light at this time. The heat dissipation motor 407 needs to drive the bearing disc 402 to rotate and adjust until the light receiver 412 receives the light emitted by the light generator 411. At this time, the semiconductor can fall along the horizontal plate 410 to the flow guide plate 8. The upper surface of the bottom plate 1 is provided with the driving motor 9. The output end of the driving motor 9 is connected with the rotating disc 3. The driving motor 9 can drive the rotating disc 3 to rotate.

[0036] In the embodiment, the semiconductor packaging device for integrated circuit production is provided. After the packaging operation is completed, the electric push rod 409 drives the bearing plate 401 to rotate. The semiconductor on the upper surface of the bearing plate 401 falls to the flow guide plate 8 to complete the discharging. At the same time, the rotating disc 3 is arranged. The rotation of the rotating disc 3 drives the semiconductor to transfer. The packaging mechanical arm 5 and the feeding mechanical arm 6 are arranged. During the rotation and cooling of the bearing disc 402, the packaging mechanical arm 5 can perform the packaging operation, and the feeding mechanical arm 6 can perform the feeding operation. Thus, the feeding, packaging and discharging can be simultaneously performed at the same time, thereby improving the overall operation efficiency.

[0037] It should be noted that after the semiconductor is finished, the semiconductor needs to be taken away in time to avoid collision between the semiconductors.

[0038] The working principle of the above embodiment is that: in use, first, the feeding mechanical arm 6 is controlled by the control device to complete feeding, the rotating disc 3 is driven to rotate by the driving motor 9, the feeding mechanical arm 6 feeds the new carrier plate 401, and the carrier plate 401 that has completed feeding moves to the lower side of the packaging mechanical arm 5, and the packaging mechanical arm 5 performs packaging work, then the rotating disc 3 is continuously moved under the driving of the driving motor 9, and the packaged semiconductor is transferred to the upper side of the flow guide plate 8, and the carrier disc 402 on which the packaged semiconductor is located is driven to rotate by the heat dissipation motor 407 in the moving process, and the semiconductor on the upper surface of the carrier disc 402 is cooled by the rotation of the carrier disc 402, and the heat dissipation fins 406 improve the heat dissipation speed with the rotation.

[0039] After the heat dissipation is completed, the semiconductor that has completed heat dissipation is located at the upper side of the flow guide plate 8, the corresponding light generator 411 emits light to confirm whether the angle of the carrier disc 402 is correct, then the carrier plate 401 is driven to rotate by the electric push rod 409, the carrier plate 401 is inclined, and the semiconductor on the upper surface of the carrier plate 401 falls to the flow guide plate 8, and the unloading work of the semiconductor is completed, during which the semiconductor located below the packaging mechanical arm 5 has completed packaging, and the semiconductor located below the feeding mechanical arm 6 is clamped by the sliding block 404 under the driving of the clamping motor 405, and the feeding work is completed, thereby realizing simultaneous feeding, packaging and unloading at the same time, improving the overall work efficiency, and having the advantages of automatic unloading after packaging and high work efficiency.

[0040] It should be noted that in this document, the terms such as first and second are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment. Without more limitations, the element defined by the statement "including a" does not exclude the presence of another identical element in the process, method, article or equipment including the element.

[0041] While embodiments of the application have been shown and described, it is to be understood that the embodiments described are merely exemplary and that changes can be made in detail without departing from the principles and spirit of the application. The scope of the application is therefore defined by the appended claims and their equivalents.

Claims

1. A semiconductor packaging apparatus for integrated circuit production, comprising a base plate (1), characterized in that: The upper surface of the bottom plate (1) is provided with a base (2), the upper surface of the base (2) is rotationally connected with a rotating disc (3), the upper surface of the rotating disc (3) is provided with three recesses arranged at equal intervals in a circle, the inner wall of the recess is provided with a bearing assembly (4) for bearing a semiconductor, the bearing assembly (4) comprises a bearing plate (401), the bearing plate (401) is rotationally connected with the recess through a rotating shaft, and the upper surface of the bottom plate (1) is provided with a packaging mechanical arm (5) for packaging operation and a feeding mechanical arm (6) for feeding.

2. The semiconductor packaging device for integrated circuit production according to claim 1, wherein: The upper surface of the bearing plate (401) is provided with a placing groove, the inner wall of the placing groove is rotationally connected with a bearing disc (402), the upper surface of the bearing disc (402) is provided with a sliding groove, the inner wall of the sliding groove is rotationally connected with a bidirectional threaded rod (403), the inner wall of the sliding groove is slidingly connected with a sliding block (404), and the sliding block (404) is threadedly connected with the bidirectional threaded rod (403).

3. The semiconductor package device for integrated circuit production according to claim 2, wherein: The inner part of the recess provided on the upper surface of the bearing disc (402) is provided with a clamping motor (405), and the output end of the clamping motor (405) is connected with the bidirectional threaded rod (403).

4. The semiconductor package device for integrated circuit production according to claim 3, wherein: The bottom surface of the bearing plate (401) is provided with a ventilation groove, and the ventilation groove is communicated with the placing groove; and the bottom surface of the bearing disc (402) is provided with a heat dissipation fin (406).

5. The semiconductor package device for integrated circuit production according to claim 1, wherein: The bottom surface of the bearing plate (401) is provided with a heat dissipation motor (407), and the output end of the heat dissipation motor (407) is connected with the bearing disc (402).

6. The semiconductor package device for integrated circuit production according to claim 1, wherein: The bottom surface of the rotating disc (3) is fixedly provided with a support (408), the upper surface of the support (408) is hingedly connected with an electric push rod (409), the other end of the electric push rod (409) is hingedly connected with the bearing plate (401), the side surface of the base (2) is provided with a discharge port (7), and the discharge port (7) is fixedly provided with a guide plate (8).

7. The semiconductor package device for integrated circuit production according to claim 4, wherein: The upper surface of the bearing disc (402) is fixedly provided with two cross plates (410), the upper surface of the bearing plate (401) is provided with two light generators (411) and corresponding light receivers (412), the installation direction of the light generators (411) and the light receivers (412) is parallel to the installation direction of the cross plates (410), and the light generators (411) and the light receivers (412) are signal connected with an external control device.

8. The semiconductor package device for integrated circuit production according to claim 1, wherein: The upper surface of the bottom plate (1) is provided with a driving motor (9), and the output end of the driving motor (9) is connected with the rotating disc (3).

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