Quartz crystal frequency chip raw material cutting device

Abstract

The utility model discloses a quartz crystal frequency chip raw material cutting device which comprises a fixing platform, a supporting column is fixedly connected to the bottom face of the fixing platform, a cutting groove is formed in the top face of the fixing platform in a penetrating mode, quartz raw materials are placed on the top face of the fixing platform, and a laser range finder is started to detect and adjust the current cutting distance of a baffle. The driving mechanism is started to drive the adjusting baffle to transversely move along the top face of the fixing platform through the adjusting assembly, the cutting distance can be adjusted, quartz raw materials are pushed to move leftwards to make contact with the adjusting baffle and the contact sensor, the clamping assembly can be automatically started to fix the quartz raw materials, and the cutting mechanism is started to enter the cutting groove. According to the cutting device, the quartz raw materials can be sliced only by adjusting the cutting thickness of the quartz crystal frequency piece, the aim of automatically adjusting the cutting thickness of the quartz crystal frequency piece conveniently is achieved, and the problem that due to the fact that the cutting thickness of an existing cutting device is difficult to adjust, the machining flexibility of the cutting device on the quartz crystal frequency piece is greatly reduced is solved.

Description

Technical Field

[0001] This utility model relates to the field of quartz crystal frequency wafer processing technology, and in particular to a quartz crystal frequency wafer raw material cutting device. Background Technology

[0002] A quartz crystal frequency converter is an electronic component that utilizes the piezoelectric effect of quartz crystals to provide stable frequency signals. Quartz crystals are chemically composed of silicon dioxide and exhibit piezoelectricity; that is, when an alternating voltage is applied to a quartz crystal wafer, the wafer generates periodic mechanical vibrations, forming an alternating current. The amplitude of this mechanical vibration is small, but the vibration frequency is very stable.

[0003] When producing quartz crystal frequency wafers, a cutting device is needed to cut the quartz raw material. Depending on the usage requirements, the cutting thickness of the quartz crystal frequency wafers is also different. However, the cutting thickness of the existing cutting devices is relatively uniform and it is difficult to automatically adjust the cutting thickness according to production needs, which greatly reduces the flexibility of quartz crystal frequency wafer production and processing. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a quartz crystal frequency wafer raw material cutting device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A quartz crystal frequency wafer raw material cutting device includes a fixed platform, a support column fixedly connected to the bottom surface of the fixed platform, a cutting groove and a limit groove through the top surface of the fixed platform, an adjusting baffle slidably connected to the top surface of the fixed platform, a contact sensor fixedly connected to the inner wall of the adjusting baffle, a connecting frame fixedly connected to the left side of the fixed platform, a laser rangefinder fixedly connected to the inner wall of the connecting frame, a cutting mechanism inside the connecting frame, an adjusting component on the bottom surface of the fixed platform, a driving mechanism on the left side of the fixed platform, and a clamping component on the top surface of the fixed platform.

[0007] Preferably, the cutting mechanism consists of a hydraulic push rod, a fixed frame, a drive motor, and a cutting blade. The hydraulic push rod is fixedly connected to the inner wall of the connecting frame, the fixed frame is fixedly connected to the output end of the hydraulic push rod, the drive motor is fixedly connected to the right side of the fixed frame, and the output end of the drive motor is rotatably connected to the inner wall of the fixed frame. The cutting blade is fixedly connected to the output end of the drive motor.

[0008] Preferably, the adjusting assembly consists of a limiting ring, a threaded rod, and a threaded sleeve. The limiting ring is fixedly connected to the bottom surface of the fixed platform, the threaded rod is rotatably connected to the inner wall of the limiting ring, the inner wall of the threaded sleeve is threadedly connected to the surface of the threaded rod, the threaded sleeve is slidably connected to the inner wall of the limiting groove, and the threaded sleeve is fixedly connected to the bottom surface of the adjusting baffle.

[0009] Preferably, the drive mechanism consists of a servo motor, a worm gear, and a worm wheel. The servo motor is fixedly connected to the left side of the fixed platform, the worm gear is fixedly connected to the output end of the servo motor, and the inner wall of the worm wheel is fixedly connected to the surface of the threaded rod, and the worm wheel meshes with the worm gear.

[0010] Preferably, the clamping assembly consists of a fixed base, an electric push rod, and a clamping plate. The fixed base is fixedly connected to the top surface of the fixed platform, the electric push rod is fixedly connected to the inner wall of the fixed base, and the clamping plate is fixedly connected to the output end of the electric push rod.

[0011] Preferably, the adjusting baffle is rectangular and made of metal.

[0012] Preferably, there are multiple electric push rods, and the multiple electric push rods are symmetrically arranged with the vertical center line on the right side of the fixed platform as the axis of symmetry.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: This quartz crystal frequency sheet raw material cutting device places the quartz raw material on the top surface of a fixed platform, activates a laser rangefinder to detect the current cutting spacing of the adjusting baffle, and activates a drive mechanism to drive the adjusting baffle to move laterally along the top surface of the fixed platform through an adjusting component, thereby adjusting the cutting spacing. Pushing the quartz raw material to the left to contact the adjusting baffle and the contact sensor automatically activates the clamping component to fix the quartz raw material, and activates the cutting mechanism to enter the cutting groove, thus enabling the quartz raw material to be sliced. This achieves the goal of facilitating automatic adjustment of the cutting thickness of the quartz crystal frequency sheet, avoiding the problem that the cutting thickness of existing cutting devices is difficult to adjust, resulting in a significant reduction in the processing flexibility of the cutting device for quartz crystal frequency sheets. Attached Figure Description

[0014] Figure 1 This is an isometric drawing of the structure of this utility model;

[0015] Figure 2 This is an enlarged view of the structure at point A of this utility model;

[0016] Figure 3 This is a cross-sectional view of the structure of this utility model;

[0017] Figure 4 This is an enlarged view of structure B of this utility model.

[0018] In the diagram: 1. Fixed platform; 2. Support column; 3. Cutting groove; 4. Limiting slide; 5. Adjusting baffle; 6. Contact sensor; 7. Connecting frame; 8. Laser rangefinder; 9. Hydraulic push rod; 10. Fixed frame; 11. Drive motor; 12. Cutting disc; 13. Limiting ring; 14. Threaded rod; 15. Threaded sleeve; 16. Servo motor; 17. Worm gear; 18. Worm wheel; 19. Fixed seat; 20. Electric push rod; 21. Clamping plate. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Reference Figure 1-4 A quartz crystal frequency wafer raw material cutting device includes a fixed platform 1, a support column 2 fixedly connected to the bottom surface of the fixed platform 1, a cutting groove 3 penetrating through the top surface of the fixed platform 1, a limit slide groove 4 penetrating through the top surface of the fixed platform 1, an adjusting baffle 5 slidably connected to the top surface of the fixed platform 1, the adjusting baffle 5 being rectangular in shape and made of metal material, which has higher strength, is less prone to deformation and damage under force, and is more durable, a contact sensor 6 fixedly connected to the inner wall of the adjusting baffle 5, a connecting frame 7 fixedly connected to the left side of the fixed platform 1, a laser rangefinder 8 fixedly connected to the inner wall of the connecting frame 7, a cutting mechanism set inside the connecting frame 7, the cutting mechanism consisting of a hydraulic push rod 9, a fixed frame 10, a drive motor 11 and a cutting blade 12, the hydraulic push rod 9 being fixedly connected to the inner wall of the connecting frame 7, and the fixed frame 10 being fixedly connected to the output end of the hydraulic push rod 9. The fixed platform 1 is fixedly connected to the right side of the fixed frame 10, and the output end of the drive motor 11 is rotatably connected to the inner wall of the fixed frame 10. The cutting blade 12 is fixedly connected to the output end of the drive motor 11 and is used to cut quartz crystals, which facilitates the cutting and production of frequency wafers. The bottom surface of the fixed platform 1 is provided with an adjustment component, which consists of a limit ring 13, a threaded rod 14 and a threaded sleeve 15. The limit ring 13 is fixedly connected to the bottom surface of the fixed platform 1, the threaded rod 14 is rotatably connected to the inner wall of the limit ring 13, the inner wall of the threaded sleeve 15 is threadedly connected to the surface of the threaded rod 14, and the threaded sleeve 15 is slidably connected to the inner wall of the limit slide groove 4. The threaded sleeve 15 is fixedly connected to the bottom surface of the adjustment baffle 5 and is used to drive the adjustment baffle 5 to move laterally, which facilitates the adjustment of the cutting spacing by the moving distance. The left side of the fixed platform 1 is provided with a drive mechanism, and the top surface of the fixed platform 1 is provided with a clamping component.

[0021] Specifically, the drive mechanism consists of a servo motor 16, a worm gear 17, and a worm wheel 18. The servo motor 16 is fixedly connected to the left side of the fixed platform 1, the worm gear 17 is fixedly connected to the output end of the servo motor 16, and the inner wall of the worm wheel 18 is fixedly connected to the surface of the threaded rod 14. The worm wheel 18 meshes with the worm gear 17 to drive the adjustment component to rotate, which facilitates adjustment and transmission work and improves movement stability.

[0022] Specifically, the clamping assembly consists of a fixed base 19, an electric push rod 20, and a clamping plate 21. There are multiple electric push rods 20, which are symmetrically arranged about the vertical center line on the right side of the fixed platform 1 as the axis of symmetry. They are used to connect multiple clamping plates 21, which improves the clamping stability. The fixed base 19 is fixedly connected to the top surface of the fixed platform 1, the electric push rod 20 is fixedly connected to the inner wall of the fixed base 19, and the clamping plate 21 is fixedly connected to the output end of the electric push rod 20. It is used to clamp and fix the quartz raw material, which facilitates stable frequency wafer cutting.

[0023] All electrical components mentioned in this article are connected to an external main controller and 220V AC mains power, and the main controller can be a conventional known device such as a computer that can control it.

[0024] In use: First, place the quartz raw material to be cut on the top surface of the fixed platform 1. Start the laser rangefinder 8 to emit a laser to the left side of the adjusting baffle 5. The laser rangefinder 8 detects the moving distance of the adjusting baffle 5 by receiving the laser reflection time, thus detecting the current cutting spacing. Start the servo motor 16 to drive the worm gear 17 to rotate. Through the meshing of the worm gear 17 and the worm wheel 18, the threaded rod 14 is driven to rotate along the inner wall of the limiting ring 13. Through the threaded connection between the threaded rod 14 and the threaded sleeve 15, the adjusting baffle 5 is driven to move laterally along the top surface of the fixed platform 1, thus adjusting the cutting spacing. Push the quartz raw material to the left to contact the adjusting baffle 5 and the contact sensor 6. Through the force detection of the contact sensor 6, start the electric push rod 20 to push the clamping plate 21 to move and clamp the quartz raw material. Start the drive motor 11 to drive the cutting blade 12 to rotate along the inner wall of the fixed frame 10. Start the hydraulic push rod 9 to drive the cutting blade 12 to move downward into the cutting groove 3 through the fixed frame 10 and the drive motor 11, thus performing the slicing work on the quartz raw material.

[0025] In summary, this quartz crystal frequency wafer raw material cutting device places the quartz raw material on the top surface of the fixed platform 1, activates the laser rangefinder 8 to detect the current cutting spacing of the adjusting baffle 5, and activates the drive mechanism to drive the adjusting baffle 5 to move laterally along the top surface of the fixed platform 1 via the adjusting component, thereby adjusting the cutting spacing. Pushing the quartz raw material to the left to contact the adjusting baffle 5 and the contact sensor 6 automatically activates the clamping component to fix the quartz raw material, and activates the cutting mechanism to enter the cutting groove 3, thus enabling the quartz raw material to be sliced. This achieves the goal of automatically adjusting the cutting thickness of the quartz crystal frequency wafer, avoiding the problem that the cutting thickness of existing cutting devices is difficult to adjust, which greatly reduces the processing flexibility of the cutting device for quartz crystal frequency wafers. This device solves the problems mentioned in the background art.

[0026] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0027] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A quartz crystal frequency piece raw material cutting device comprising a fixed platform (1), characterized in that, The bottom surface of the fixed platform (1) is fixedly connected with a support column (2), a cutting groove (3) is vertically formed in the top surface of the fixed platform (1), a limiting sliding groove (4) is vertically formed in the top surface of the fixed platform (1), an adjusting baffle (5) is slidably connected to the top surface of the fixed platform (1), a contact sensor (6) is fixedly connected to the inner wall of the adjusting baffle (5), a connecting frame (7) is fixedly connected to the left side of the fixed platform (1), a laser range finder (8) is fixedly connected to the inner wall of the connecting frame (7), a cutting mechanism is arranged in the connecting frame (7), an adjusting assembly is arranged on the bottom surface of the fixed platform (1), a driving mechanism is arranged on the left side of the fixed platform (1), and a clamping assembly is arranged on the top surface of the fixed platform (1).

2. The quartz crystal frequency plate raw material cutting device according to claim 1, characterized in that, The cutting mechanism is composed of a hydraulic push rod (9), a fixed frame (10), a driving motor (11) and a cutting piece (12), the hydraulic push rod (9) is fixedly connected to the inner wall of the connecting frame (7), the fixed frame (10) is fixedly connected to the output end of the hydraulic push rod (9), the driving motor (11) is fixedly connected to the right side of the fixed frame (10), and the output end of the driving motor (11) is rotatably connected to the inner wall of the fixed frame (10), and the cutting piece (12) is fixedly connected to the output end of the driving motor (11).

3. The apparatus according to claim 1, wherein The adjusting assembly is composed of a limiting ring (13), a threaded rod (14) and a threaded sleeve (15), the limiting ring (13) is fixedly connected to the bottom surface of the fixed platform (1), the threaded rod (14) is rotatably connected to the inner wall of the limiting ring (13), the inner wall of the threaded sleeve (15) is threadedly connected to the surface of the threaded rod (14), the threaded sleeve (15) is slidably connected to the inner wall of the limiting sliding groove (4), and the threaded sleeve (15) is fixedly connected to the bottom surface of the adjusting baffle (5).

4. The apparatus according to claim 1, wherein The driving mechanism is composed of a servo motor (16), a worm (17) and a worm gear (18), the servo motor (16) is fixedly connected to the left side of the fixed platform (1), the worm (17) is fixedly connected to the output end of the servo motor (16), the inner wall of the worm gear (18) is fixedly connected to the surface of the threaded rod (14), and the worm gear (18) is engaged with the worm (17).

5. The apparatus according to claim 1, wherein The clamping assembly is composed of a fixed seat (19), an electric push rod (20) and a clamping plate (21), the fixed seat (19) is fixedly connected to the top surface of the fixed platform (1), the electric push rod (20) is fixedly connected to the inner wall of the fixed seat (19), and the clamping plate (21) is fixedly connected to the output end of the electric push rod (20).

6. The quartz crystal frequency plate raw material cutting device according to claim 1, characterized in that, The adjusting baffle (5) is rectangular in shape and is made of metal material.

7. The apparatus according to claim 5, wherein the apparatus is characterized by: The number of the electric push rods (20) is multiple, and the multiple electric push rods (20) are symmetrically arranged with the vertical middle line of the right side of the fixed platform (1) as the axis of symmetry.

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