Ultralight fin based on high-thermal-conductivity polymer fibers
By designing high thermal conductivity polymer fiber fins, the weight and cost issues of metal materials in the fields of thermal management and structural reinforcement are solved, providing a lightweight, corrosion-resistant and efficient thermal management solution suitable for electronic devices and automotive thermal management modules.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-11
- Publication Date
- 2026-03-31
AI Technical Summary
Existing metallic materials suffer from problems such as large weight, high cost, and limited corrosion resistance in the fields of thermal management and structural reinforcement, while the potential of polyethylene polymers in these fields has not been fully explored.
Employing a high thermal conductivity polymer fiber fin design, and through precise arrangement and geometric control of the PET matrix and short fiber bundles, efficient thermal management is achieved under non-functional coatings. Combined with a multi-layer composite structure and fiber arrangement, structural strength and thermal conductivity are ensured.
It achieves lightweight, corrosion resistance and efficient thermal management, providing innovative solutions for electronic device cooling systems and automotive thermal management modules, while reducing production and material costs and expanding application scenarios.
Smart Images
Figure CN224066001U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat dissipation fin technology, specifically to an ultralight fin based on high thermal conductivity polymer fiber, its preparation method, and a heat dissipation testing device. Background Technology
[0002] Polyethylene (PE) polymers are widely used in various industrial and engineering applications due to their excellent mechanical properties, chemical resistance, and superior abrasion resistance. However, their potential in thermal management and structural reinforcement remains largely untapped. Traditionally, metallic materials have dominated these fields due to their high thermal conductivity and structural strength. However, metallic materials are heavy, expensive, and limited in their ability to process complex shapes and their corrosion resistance. Summary of the Invention
[0003] The purpose of this invention is to address the problems existing in the prior art by providing an ultralight fin based on a high thermal conductivity polymer fiber.
[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows:
[0005] An ultralight fin based on high thermal conductivity polymer fiber includes a PET matrix. A plurality of short fiber bundles are arranged at intervals on one side of the PET matrix. Each bundle of short fiber bundles is connected to the PET matrix by means of adhesive bonding. Each bundle of short fiber bundles contains at least 100 single fibers.
[0006] This ultralight fin based on high thermal conductivity polymer fibers achieves efficient thermal management without functional coatings by precisely controlling the fiber orientation and fin geometry. This design improves thermal conductivity while ensuring structural strength, providing an innovative solution for electronic device cooling systems, automotive thermal management modules, and other applications requiring lightweight and corrosion resistance.
[0007] Furthermore, the roots of each bundle of short fiber clusters are tightly arranged and bonded to the PET matrix, while the unbonded free ends are pulled from the bundled state to a dispersed state. This facilitates heat conduction and dissipation for each single fiber and also avoids heat concentration.
[0008] Furthermore, the single fiber is a polyethylene fiber, and each bundle of the short fiber clusters is bonded to the PET matrix by a PE adhesive.
[0009] Furthermore, at least 40 bundles of the short fiber clusters are arranged in a dot array on the PET matrix, with a spacing of 5 to 20 mm between the center points of adjacent short fiber clusters to avoid them being arranged too densely or too sparsely.
[0010] Furthermore, the outer contour of the short fiber bundle is circular or regular polygonal, and the PET matrix is a rectangular sheet. This shape facilitates its regular arrangement, helps to accurately determine its size and position, and allows it to fully exert its heat conduction and heat dissipation capabilities.
[0011] Furthermore, the thickness of the PET substrate does not exceed 200 μm.
[0012] Furthermore, let R be the radius or center-to-side distance of the short fiber bundle, L be the length of a single fiber in the short fiber bundle, and D be the distance between the center points of adjacent short fiber bundles. Then D, R, and L satisfy the following relationship: This design reduces the heat accumulation area between adjacent short fiber bundles, which is beneficial for overall heat dissipation.
[0013] Furthermore, the radius or center-to-side distance of the short fiber bundle is 1.5 to 2.5 mm, and the length of the single fiber is 3 to 10 mm.
[0014] More than 40 bundles of ultra-high molecular weight polyethylene fibers are chopped to obtain the required 5 mm short cluster fiber bundles; PE adhesive is evenly applied to a 50 μm thick PET surface, and the obtained short cluster fiber bundles are then bonded to the PET in a rectangular array with 10 mm intervals between each other. Finally, the PE adhesive is allowed to solidify for 24 h before the ultra-light fins are formed.
[0015] An ultralight fin based on a high thermal conductivity polymer fiber was tested using a heat dissipation testing device. The heat dissipation testing device includes a copper sheet, a PI heating element disposed below the copper sheet, the ultralight fin disposed above the copper sheet, and a temperature sensor connected to one side of the copper sheet.
[0016] Compared with existing technologies, the beneficial effects of this utility model are as follows: 1. This ultralight fin based on high thermal conductivity polymer fiber achieves efficient thermal management capabilities of polymer fins without functional coatings by precisely controlling the orientation of the fibers and the geometric design of the fins. This design improves thermal conductivity while ensuring structural strength, providing an innovative solution for electronic device cooling systems, automotive thermal management modules, and other applications requiring lightweight and corrosion resistance. 2. This ultralight fin based on high thermal conductivity polymer fiber adopts a multi-layer composite structure, with fibers arranged along the heat flow direction to maximize heat conduction efficiency while maintaining low weight and excellent mechanical properties. 3. In addition to its advantages in weight and thermal conductivity, the ultralight fin is also easy to process and manufacture, has low production costs and low material costs, and has fewer limitations in overall shape, making it applicable to a variety of scenarios. Attached Figure Description
[0017] Figure 1This is a front view of an ultralight fin based on a high thermal conductivity polymer fiber according to the present invention.
[0018] Figure 2 This is a top view schematic diagram of an ultralight fin based on a high thermal conductivity polymer fiber according to the present invention.
[0019] Figure 3 This is a partially enlarged structural diagram of a single fiber in a short fiber bundle of this utility model;
[0020] Figure 4 This is a schematic diagram of the ultralight fin heat dissipation capacity test bench of this utility model;
[0021] Figure 5 This is a test diagram of the heat dissipation capacity of the ultralight fins of this utility model;
[0022] In the diagram: 1. PET matrix; 2. Short fiber bundle; 201. Single fiber; 3. Copper sheet; 4. PI heating element; 5. Temperature sensor. Detailed Implementation
[0023] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0024] In the description of this utility model, it should be noted that the terms "middle", "upper", "lower", "left", "right", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Example 1
[0025] like Figures 1-3 As shown, an ultralight fin based on high thermal conductivity polymer fiber includes a PET matrix 1. A plurality of short fiber bundles 2 are arranged at intervals on one side of the PET matrix 1. Each bundle of short fiber bundles 2 is connected to the PET matrix 1 by means of adhesive bonding. Each bundle of short fiber bundles 2 contains at least 100 single fibers 201, such as 120 single fibers.
[0026] This ultralight fin based on high thermal conductivity polymer fibers achieves efficient thermal management without functional coatings by precisely controlling the fiber orientation and fin geometry. This design improves thermal conductivity while ensuring structural strength, providing an innovative solution for electronic device cooling systems, automotive thermal management modules, and other applications requiring lightweight and corrosion resistance.
[0027] This ultralight fin, based on highly thermally conductive polymer fibers, employs a multi-layer composite structure with fibers arranged along the heat flow direction to maximize heat transfer efficiency while maintaining low weight and excellent mechanical properties.
[0028] In addition to its advantages in weight and thermal conductivity, the ultralight fins are easy to process and manufacture, have low production and material costs, and are less restricted in overall shape, making them suitable for a variety of applications.
[0029] Furthermore, the roots of each bundle of short fiber clusters 2 are tightly arranged and bonded to the PET matrix 1, while the unbonded free ends are pulled into a dispersed state by the bundle gathering.
[0030] When manufacturing the ultralight fins, each bundle of short fiber clusters 2 is in a bundled state and is distributed at intervals on the PET substrate 1. This arrangement is convenient and the roots are relatively fixed. After manufacturing or before use, it is necessary to separate and disperse the single fibers 201 in each bundle of short fiber clusters 2, that is, to separate the unbonded ends of the fiber clusters from the bundled state. This is beneficial for each single fiber to conduct heat dissipation and can also avoid heat concentration.
[0031] Furthermore, the single fiber 201 is a polyethylene fiber, and each bundle of the short fiber clusters 2 is bonded to the PET matrix 1 by a PE adhesive.
[0032] The PE adhesive is preferably a polymer adhesive with good bonding strength, especially suitable for low surface energy materials such as polyethylene. This allows these similar materials to be bonded to the substrate well without affecting their thermal conductivity.
[0033] The outline shape of the short fiber bundle 2 in the bundled state can be of various forms, depending on the shape of the mold used (such as silicone sleeve); preferably, the outer outline shape of the short fiber bundle is circular or regular polygonal, and the PET substrate is rectangular or circular sheet; this shape facilitates its regular arrangement, is conducive to the accurate determination of size and position, and allows it to fully exert its heat conduction and heat dissipation capabilities.
[0034] Furthermore, at least 40 bundles of the short fiber bundles 2 are arranged in a dot array on the PET matrix 1. The distance between the center points of adjacent short fiber bundles 2 is 5 to 20 mm. The distance between them should not be too dense or too sparse. If they are too close, it will affect air circulation and heat dissipation. If they are too sparse, the heat dissipation function of the fiber bundles will not be fully utilized.
[0035] Furthermore, the thickness of the PET substrate 1 does not exceed 200 μm.
[0036] Furthermore, let R be the radius or center-to-side distance of the short fiber bundle 2, L be the length of a single fiber in the short fiber bundle 2, and D be the distance between the center points of adjacent short fiber bundles 2. Then D, R, and L satisfy the following relationship: .
[0037] Since each of the short fiber bundles 2 is spread out during use, in order to avoid the single fibers 201 at the edges of adjacent short fiber bundles 2 overlapping to form a heat accumulation area, it is necessary to reasonably control their spacing and size relationship. Under the constraints of the above formula, the heat accumulation area between adjacent short fiber bundles 2 can be reduced, which is beneficial to the overall heat dissipation.
[0038] Furthermore, the radius or center-to-side distance of the short fiber bundle 2 is 1.5 to 2.5 mm, and the length of the single fiber 201 is 3 to 10 mm. Example 2
[0039] This embodiment provides a method for preparing ultralight fins based on high thermal conductivity polymer fibers, as described in Example 1.
[0040] The preparation method of high thermal conductivity polymer fiber fins involves bonding several short clusters of fiber bundles onto a PET matrix using 2104 multi-purpose strong adhesive, and allowing the adhesive to fully solidify for 24 hours. PE fiber fins formed by this method have a unified PE fiber structure that is not easily detached, exhibiting good mechanical properties and stable chemical properties. The high thermal conductivity PE fiber fins prepared by this method demonstrate excellent performance in the field of thermal management.
[0041] Specifically, the preparation process includes the following steps:
[0042] (1) Gather at least 100 single fibers to obtain a PE fiber bundle, and tie the stacked PE fiber bundles together;
[0043] (2) Cut the bundled PE fiber bundles into 5 mm segments, apply PE adhesive evenly to the 50 μm thick PET substrate surface, and attach the bundled PE fiber bundles to the PET substrate surface in an array with a 5 mm spacing between each other.
[0044] (3) After waiting 24 hours for the glue to completely solidify, ultralight fins of high thermal conductivity polyethylene polymer fiber are obtained.
[0045] The diameter of the bundled PE fiber bundles is about 3.5 mm. Example 3
[0046] This embodiment provides a heat dissipation testing device based on ultralight fins made of high thermal conductivity polymer fibers.
[0047] like Figure 4 As shown, the heat dissipation testing device includes a copper sheet 3, a PI heating element 4 is disposed below the copper sheet 3, an ultralight fin is disposed above the copper sheet 3, and a temperature sensor 5 is connected to one side of the copper sheet 3.
[0048] The PI heating element 4 has a heat flux density of 600-100 W / m³. 2 (600 W / m) 2 800 W / m 2 1000 W / m 2 The heating element is 4cm × 4cm; the copper sheet 3 is 5cm × 5cm in size; and the temperature sensor 5 can be a thermocouple.
[0049] The heat dissipation test was performed on the ultralight fins and the device without heat dissipation components using the aforementioned heat dissipation testing device, and the resulting heat dissipation curves are as follows: Figure 5 As shown, it can be seen that under the same time conditions, the temperature of the copper sheet with the ultralight fins is significantly lower than that without the ultralight fins, indicating that the ultralight fins have better and faster heat dissipation capabilities.
[0050] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A super light fin based on high thermal conductive polymer fiber, characterized in that, The PET substrate is provided with a plurality of short cluster fiber bundles on one side at intervals, each of the short cluster fiber bundles is connected to the PET substrate by pasting, and each of the short cluster fiber bundles contains at least 100 single fibers.
2. The ultra-light fin based on high thermal conductive polymer fibers according to claim 1, characterized in that, The roots of each of the short cluster fiber bundles are closely arranged and bonded to the PET substrate, and the unbonded free ends are dispersed by converging.
3. The ultra-light fin based on high thermal conductive polymer fibers according to claim 1, characterized in that, The single fibers are polyethylene fibers, and each of the short cluster fiber bundles is bonded to the PET substrate by a PE adhesive.
4. The ultra-light fin based on high thermal conductive polymer fibers according to claim 1, characterized in that, At least 40 short cluster fiber bundles are arranged on the PET substrate in a dot array, and the interval between the center points of adjacent short cluster fiber bundles is 5-20 mm.
5. The ultra-light fin based on high thermal conductive polymer fibers according to claim 1, characterized in that, The short cluster fiber bundles have a circular or regular polygonal outer contour shape, and the PET substrate is a rectangular sheet.
6. The ultra-light fin based on high thermal conductive polymer fibers according to claim 1, characterized in that, The thickness of the PET substrate is not more than 200 µm.
7. The ultra-light fin based on high thermally conductive polymer fibers according to claim 1, wherein the fin is provided with a plurality of protrusions on the surface of the fin. The radius or edge distance of the short cluster fiber bundle is R, the length of the single fiber in the short cluster fiber bundle is L, and the distance between the center points of adjacent short cluster fiber bundles is D. D, R, and L satisfy the following relationship: .
8. The ultra-light fin based on high thermal conductive polymer fibers according to claim 1, characterized in that, The radius or side distance of the short cluster fiber bundles is 1.5-2.5 mm, and the length of the single fibers is 3-10 mm.
9. The ultra-light fin based on high thermally conductive polymer fibers according to any one of claims 1-8, characterized in that, The ultra-light fin is tested by a heat dissipation testing device, the heat dissipation testing device comprises a copper sheet, a PI heating sheet is arranged below the copper sheet, the ultra-light fin is arranged above the copper sheet, and a temperature sensor is connected to one side of the copper sheet.