Wafer film thickness detection device adaptive to material boxes of various specifications

Abstract

The utility model relates to the technical field of wafer detection devices, in particular to a wafer film thickness detection device adaptive to material boxes of various specifications, which comprises a detection device main body, the right side of the detection device main body is connected with a compatible mechanism through a bolt, and the compatible mechanism comprises a self-made material box. The self-made material box is fixedly mounted on the outer wall of the right side of the detection device main body through bolts, the right side of the detection device main body is fixedly connected with a discharging mechanism through bolts, and a stage detection module is mechanically fixed in the detection device main body through bolts. According to the utility model, through mutual switching between the internal parts of the compatible mechanism and the internal parts of the discharging mechanism, a material box carrying wafers of different specifications and sizes can be installed and fixed on one side of the outer wall of the detection device main body, so that the detection device main body can conveniently meet the detection operation of the wafers of different specifications and sizes; and the wafer detection efficiency of the detection device main body can be improved.

Description

Technical Field

[0001] This utility model relates to the technical field of wafer inspection devices, specifically to a wafer film thickness inspection device that is compatible with various specifications of cassettes. Background Technology

[0002] A silicon wafer is a wafer used to fabricate silicon semiconductor circuits. It is made by dissolving high-purity polycrystalline silicon, doping it with silicon seed crystals, and then slowly pulling it out to form a cylindrical monocrystalline silicon ingot. Afterward, the silicon ingot is ground, polished, and sliced ​​to form a silicon wafer. Once the wafer is produced, its performance and quality need to be tested to determine if it is up to standard.

[0003] A search revealed an invention patent with publication number CN115655163B, which discloses a wafer inspection device. The device includes a feeding mechanism to fix wafer cassettes, a robotic arm to pick up, place, and move wafers, a spin corrector to calibrate and correct the spin of the wafers on the robotic arm, and an inspection mechanism to inspect the wafers. A controller manages the operation of the feeding mechanism, robotic arm, spin corrector, and inspection mechanism. The feeding mechanism includes a cassette holder, a clamping unit, a limiting component, and a rotating component. The wafer cassettes on the holder can switch between a placement station and an inspection station. When the cassette is in the placement station, the wafers inside are tilted at a certain angle to the horizontal plane. Under gravity, the wafers slide away from the opening of the cassette and abut against the inner wall of the cassette, ensuring neat wafer alignment. The clamping unit and limiting component fix the wafer cassettes, preventing displacement during rotation and improving the stability of the wafer inspection device during operation, thus reducing inspection errors.

[0004] Although the aforementioned patents can fix the wafer cassette by using clamping units and limiting components to prevent the wafer cassette from shifting during rotation, thereby improving the stability of the wafer inspection device and reducing inspection errors, existing inspection devices cannot inspect wafers of different sizes and specifications. Furthermore, the inlet of the inspection device is not suitable for various cassettes, making the process of allowing wafers of different sizes to enter the inspection device cumbersome and inconvenient, resulting in a limited range of applicability for the inspection device.

[0005] Therefore, it is necessary to propose a wafer film thickness detection device that is compatible with various sized cassettes to solve the above problems. Utility Model Content

[0006] The purpose of this invention is to provide a wafer film thickness inspection device that is compatible with various sizes of cassettes. By switching between the internal parts of the compatibility mechanism and the internal parts of the feeding mechanism, cassettes carrying wafers of different sizes can be installed and fixed on one side of the outer wall of the main body of the inspection device. This facilitates the inspection device to meet the inspection operations of wafers of different sizes. At the same time, the stage inspection module improves the inspection efficiency of the main body of the inspection device for wafers. This solves the problems in the prior art where the inspection device cannot perform feeding inspection of wafers of different sizes, and the feeding port of the inspection device is not suitable for multiple cassettes, making the process of wafers of different sizes entering the inspection device cumbersome and inconvenient, resulting in a limited scope of application for the inspection device.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a wafer film thickness detection device adaptable to various specifications of material boxes, including a detection device body, a compatibility mechanism is bolted to the right side of the detection device body, a feeding mechanism is bolted to the right side of the detection device body, and a stage detection module is mechanically fixed inside the detection device body by bolts;

[0008] The compatibility mechanism includes a self-made material box, which is bolted to the outer wall of the right side of the main body of the detection device. The top of the self-made material box is hinged to a material box cover. A fixing bracket is bolted between the self-made material box and the main body of the detection device and is located inside the main body of the detection device. A first placement platform is mechanically fixed to the top of the fixing bracket. A second placement platform is mechanically connected to the inner cavity of the first placement platform and is located at the top of the fixing bracket.

[0009] Preferably, the feeding mechanism includes a loadport box, which is fixed to the right outer wall of the main body of the detection device by bolts. The right outer wall of the main body of the detection device is mechanically fixed with an SMIF box by bolts. The loadport box and the SMIF box are mechanically connected to the main body of the detection device. A hopper is mechanically fixed to the top of the SMIF box.

[0010] Preferably, the self-made material box is suitable for Open Cassette wafers, and the Open Cassette wafer size is 12 inches, and the inner cavity of the first placement stage matches the Open Cassette wafer size.

[0011] Preferably, the bottom of the loadport cassette and the SMIF cassette are both equipped with casters. The loadport cassette is suitable for FOUP & FOSB cassettes and mainly contains 12-inch wafers. The hopper mainly contains 8-inch wafers.

[0012] Preferably, the stage detection module adopts a central control design, which is compatible with both transmission and reflection optical paths. The inner cavity of the second placement stage is smaller than that of the first placement stage, and the inner cavity of the second placement stage is suitable for 8-inch wafer sizes.

[0013] Preferably, the right side surface of the main body of the testing device has a feeding port that matches the self-made material box, loadport material box, and SMIF material box, and the self-made material box, loadport material box, and SMIF material box are installed at the same horizontal height on the main body of the testing device.

[0014] The technical effects and advantages provided by this utility model in the above technical solution are as follows:

[0015] 1. By selecting appropriate loadport and SMIF containers based on the size of the wafers to be inspected, and by installing and fixing pulleys at the bottom of the loadport and SMIF containers, it is easy for them to slide and fit against the right side of the main body of the inspection device, and they are fixed by bolts. The loadport containers are suitable for FOUP & FOSB containers and mainly contain 1-inch wafers, while the container mainly contains 1-inch wafers. This allows the loadport and SMIF containers to be switched and connected to one side of the main body of the inspection device, so that the main body of the inspection device can meet the inspection operations of 1-inch and 1-inch wafers. At the same time, since the Open Cassette wafer size is 1-inch, the inner cavity of the first placement stage matches the Open Cassette wafer size, while the inner cavity of the second placement stage is smaller than that of the first placement stage, and the inner cavity of the second placement stage is suitable for 1-inch wafers. By switching and connecting the self-made containers, loadport containers, and SMIF containers to one side of the main body of the inspection device, the main body of the inspection device can meet the inspection operations of 1-inch and 1-inch wafers, thus improving the applicability of the main body of the inspection device.

[0016] 2. The right side surface of the main body of the testing device has a feeding port that matches the self-made material box, loadport material box, and SMIF material box. The self-made material box, loadport material box, and SMIF material box are installed at the same horizontal height on the main body of the testing device, which facilitates the feeding of wafers in the self-made material box, loadport material box, and SMIF material box into the main body of the testing device through the feeding port on the right side of the testing device to complete the testing operation. The stage testing module adopts a central control design and is compatible with both transmission and reflection optical paths. This allows the stage testing module to quickly detect the film thickness on the wafer surface through both transmission and reflection optical paths, thereby improving the testing efficiency of the main body of the testing device. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the connection structure between the main body of the detection device and the loadport box of this utility model;

[0020] Figure 3 This is a schematic diagram of the connection structure between the main body of the detection device and the SMIF material box of this utility model;

[0021] Figure 4 This is a schematic diagram of the connection structure between the main body of the detection device and the fixed bracket of this utility model;

[0022] Figure 5 This is a schematic diagram of the overall structure of the fixed bracket of this utility model;

[0023] Figure 6 This is a cross-sectional structural diagram of the main body of the detection device of this utility model.

[0024] Figure 7 This is a schematic diagram of the overall structure of the stage detection module of this utility model.

[0025] Explanation of reference numerals in the attached figures:

[0026] 1. Detection device main body; 2. Compatibility mechanism; 201. Self-made material box; 202. Material box cover; 203. Fixed bracket; 204. Placement platform No. 1; 205. Placement platform No. 2; 3. Material feeding mechanism; 301. Loadport material box; 302. SMIF material box; 303. Material hopper; 4. Stage detection module. Detailed Implementation

[0027] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0028] This utility model provides, for example Figure 1-7 The wafer film thickness detection device shown is compatible with various specifications of material boxes. It includes a detection device body 1, a compatibility mechanism 2 is bolted to the right side of the detection device body 1, a feeding mechanism 3 is bolted to the right side of the detection device body 1, and a stage detection module 4 is mechanically fixed inside the detection device body 1 by bolts.

[0029] The compatibility mechanism 2 includes a self-made material box 201, which is bolted to the outer wall of the right side of the main body 1 of the detection device. The top of the self-made material box 201 is connected to the material box cover 202 by a hinge. A fixing bracket 203 is bolted between the self-made material box 201 and the main body 1 of the detection device, and is located inside the main body 1 of the detection device. A first placement platform 204 is mechanically fixed to the top of the fixing bracket 203. A second placement platform 205 is mechanically connected to the inner cavity of the first placement platform 204 and is located at the top of the fixing bracket 203.

[0030] By switching between the internal parts of the compatibility mechanism 2 and the internal parts of the feeding mechanism 3, the cassettes carrying wafers of different sizes can be installed and fixed on one side of the outer wall of the main body 1 of the testing device. This makes it easier for the main body 1 of the testing device to meet the testing operations of wafers of different sizes. At the same time, the stage testing module 4 can improve the testing efficiency of the main body 1 of the testing device for wafers.

[0031] Refer to the instruction manual appendix Figure 1-7 The feeding mechanism 3 includes a loadport box 301, which is fixed to the outer right side of the main body 1 of the testing device by bolts. The outer right side of the main body 1 of the testing device is mechanically fixed to an SMIF box 302 by bolts. The loadport box 301 and the SMIF box 302 are mechanically connected to the main body 1 of the testing device by switching. The top of the SMIF box 302 is mechanically fixed to a hopper 303. Through the cooperation between the internal parts of the feeding mechanism 3, it is easy for the loadport box 301 and the SMIF box 302 to carry wafers of different specifications and sizes and switch to connect on the main body 1 of the testing device.

[0032] Refer to the instruction manual appendix Figure 1-7 The self-made material box 201 is suitable for Open Cassette wafers, and the size of the Open Cassette wafer is 12 inches. The inner cavity of the first placement stage 204 is matched with the size of the Open Cassette wafer. By using the self-made material box 201 to accommodate Open Cassette wafers, and the inner cavity of the first placement stage 204 is matched with the size of the Open Cassette wafer, it is easy to place the wafer in the first placement stage 204, thus completing the clamping and placement of the wafer in the first placement stage 204.

[0033] Refer to the instruction manual appendix Figure 1-7Both the loadport cassette 301 and the SMIF cassette 302 are equipped with casters at their bottom ends. The loadport cassette 301 is suitable for FOUP & FOSB cassettes and mainly contains 12-inch wafers. The cassette 303 mainly contains 8-inch wafers. By using the loadport cassette 301 to be compatible with FOUP & FOSB cassettes and mainly contains 12-inch wafers, and the cassette 303 mainly contains 8-inch wafers, it is easy to switch the loadport cassette 301 and the SMIF cassette 302 to one side of the main body of the testing device, so that the main body of the testing device can meet the testing operations of 8-inch wafers and 12-inch wafers.

[0034] Refer to the instruction manual appendix Figure 1-7 The stage detection module 4 adopts a central control design, which is compatible with both transmission and reflection optical paths. The inner cavity of the second placement stage 205 is smaller than that of the first placement stage 204, and the inner cavity of the second placement stage 205 is suitable for 8-inch wafer sizes. The central control design of the stage detection module 4, which is compatible with both transmission and reflection optical paths, facilitates the rapid detection of the film thickness on the wafer surface by the stage detection module 4 through both transmission and reflection optical paths, thereby improving the detection efficiency of the main body 1 of the detection device.

[0035] Refer to the instruction manual appendix Figure 1-7 The right side surface of the testing device body 1 is provided with a feeding port that matches the self-made material box 201, loadport material box 301, and SMIF material box 302. The self-made material box 201, loadport material box 301, and SMIF material box 302 are all installed at the same horizontal height on the testing device body 1. The wafers in the self-made material box 201, loadport material box 301, and SMIF material box 302 are easily transported into the testing device body 1 through the feeding port on the right side of the testing device body 1 to complete the testing operation.

[0036] The working principle of this practical application is as follows:

[0037] Refer to the instruction manual appendix Figure 1-7Based on the size of the wafers to be inspected, appropriate loadport cassettes 301 and SMIF cassettes 302 are selected. Both loadport cassettes 301 and SMIF cassettes 302 are equipped with casters at their bottom ends, facilitating their sliding and contact with the right side of the inspection device body 1. They are then secured with bolts. Loadport cassette 301 is suitable for FOUP & FOSB wafers and primarily contains 12-inch wafers. The cassette 303 primarily contains 8-inch wafers. This allows loadport cassettes 301 and SMIF cassettes 302 to be switched and connected to one side of the inspection device body 1, enabling the inspection device body 1 to handle both 8-inch and 12-inch wafers. Furthermore, the Open Cassette wafers are 12-inch, and the inner cavity of the first placement stage 204 is connected to the Open Cassette. The size of the Cassette wafer is matched, and the inner cavity of the second placement stage 205 is smaller than that of the first placement stage 204. The inner cavity of the second placement stage 205 is suitable for 8-inch wafers. It can be switched and connected to one side of the main body of the inspection device 1 through the self-made material box 201, loadport material box 301 and SMIF material box 302, so that the main body of the inspection device 1 can meet the inspection operation of 8-inch wafers and 12-inch wafers and improve the applicability of the main body of the inspection device 1.

[0038] Refer to the instruction manual appendix Figure 1-7 The right side surface of the main body 1 of the testing device has a feeding port that matches the self-made material box 201, loadport material box 301, and SMIF material box 302. The self-made material box 201, loadport material box 301, and SMIF material box 302 are installed at the same horizontal height on the main body 1 of the testing device. This facilitates the delivery of wafers in the self-made material box 201, loadport material box 301, and SMIF material box 302 to the main body 1 of the testing device through the feeding port on the right side of the main body 1 of the testing device to complete the testing operation. The stage testing module 4 adopts a central control design and is compatible with both transmission and reflection optical paths. This allows the stage testing module 4 to quickly detect the film thickness on the wafer surface through both transmission and reflection optical paths, thereby improving the testing efficiency of the main body 1 of the testing device.

[0039] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A wafer film thickness detection device suitable for adapting to a plurality of specifications of a cassette, characterized by: Including detection device body (1), the right side of detection device body (1) is connected with compatible mechanism (2) by bolt mounting, the right side of detection device body (1) is fixedly connected with discharging mechanism (3) by bolt, the inside of detection device body (1) is mechanically fixed with stage detection module (4) by bolt; The compatible mechanism (2) includes a self-made material box (201), the self-made material box (201) is fixed on the outer wall of the right side of the detection device body (1) by bolt mounting, the top end of the self-made material box (201) is rotatably connected with a material box cover (202) by a hinge, the self-made material box (201) and the detection device body (1) are fixed with a fixed support (203) between them by bolt, and located inside the detection device body (1), the top end of the fixed support (203) is mechanically fixed with a first placing table (204), the inner cavity of the first placing table (204) is mechanically connected with a second placing table (205), and located at the top end of the fixed support (203).

2. The wafer film thickness measuring device of claim 1, wherein: The discharging mechanism (3) includes a loadport material box (301), the loadport material box (301) is fixed on the right outer wall of the detection device body (1) by bolt, the right outer wall of the detection device body (1) is mechanically fixed with a SMIF material box (302) by bolt, and the loadport material box (301) and the SMIF material box (302) are switched with the detection device body (1) mechanically connected, the top end of the SMIF material box (302) is mechanically fixed with a material bin (303).

3. The wafer film thickness detection device adaptable to various specifications of cassettes according to claim 1, characterized in that: The self-made material box (201) is suitable for Open Cassette wafer, and the size of Open Cassette wafer is 12 inches, the inner cavity of the first placing table (204) matches the size of Open Cassette wafer.

4. The wafer film thickness detection device adaptable to various specifications of cassettes according to claim 2, characterized in that: The bottom end of the loadport material box (301) and the SMIF material box (302) is fixedly installed with a pulley, the loadport material box (301) is suitable for FOUP&FOSB material box, and mainly contains 12-inch wafers inside, the material bin (303) mainly contains 8-inch wafers inside.

5. A wafer film thickness detection device adaptable to various specifications of cassettes according to claim 1, characterized in that: The stage detection module (4) adopts a central control design, which is compatible with both transmission and reflection light paths, the inner cavity of the second placing table (205) is smaller than that of the first placing table (204), and the inner cavity of the second placing table (205) is suitable for 8-inch wafer size.

6. The wafer film thickness measuring device of claim 2, wherein: The right surface of the detection device body (1) is provided with a discharging port matched with the self-made material box (201), the loadport material box (301) and the SMIF material box (302), and the horizontal installation height of the self-made material box (201), the loadport material box (301) and the SMIF material box (302) on the detection device body (1) is consistent.

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