Metering standard device for PCB soldering tin defect detection

Abstract

The utility model discloses a metering etalon for PCB (printed circuit board) soldering tin defect detection, which comprises a bottom plate and a cover plate movably mounted on the bottom plate. A continuous tin defect calibration piece, an offset defect calibration piece, a pseudo soldering defect calibration piece, a bubble defect calibration piece, a crack defect calibration piece, a less soldering defect calibration piece, an open soldering defect calibration piece and a tin bead foreign matter calibration piece which are arranged in an array are arranged on the bottom plate; the offset defect calibration piece, the bubble defect calibration piece, the continuous tin defect calibration piece, the crack defect calibration piece and the insufficient welding defect calibration piece are all provided with bonding pad pieces and welding spot pieces, and the bottom plate, the bonding pad pieces and the welding spot pieces are sequentially stacked; the open welding defect calibration piece is provided with a bonding pad piece, and the tin bead foreign matter calibration piece is arranged between the two welding spot pieces; the cover plate is provided with a bonding pad piece, the center of the bonding pad piece is provided with a groove, and the groove is in clearance fit with the pseudo soldering defect calibration piece. And the soldering tin defect detection function of the X-ray 3D online detection equipment can be calibrated.

Description

Technical Field

[0001] This utility model belongs to the field of solder defect detection technology, specifically relating to a metrological standard for detecting solder defects on PCB boards. Background Technology

[0002] To improve the yield rate in the microelectronics manufacturing process, X-ray 3D in-circuit inspection equipment is often used to detect solder defects on PCB boards. To improve the inspection accuracy of X-ray 3D in-circuit inspection equipment, its solder defect detection function needs to be calibrated.

[0003] Although there are metrological standards for X-ray inspection equipment, they are mainly for static X-ray inspection equipment and cannot be used for X-ray 3D online inspection equipment, nor are they used for calibration of solder defect detection functions. Summary of the Invention

[0004] The purpose of this invention is to provide a metrological standard for detecting solder defects on PCB boards, which can calibrate the solder defect detection function of X-ray 3D online inspection equipment.

[0005] The technical solution is as follows:

[0006] The metrological standard for detecting solder defects on PCB boards according to this utility model includes:

[0007] A base plate and a cover plate, wherein the cover plate is movably mounted on the base plate;

[0008] The base plate has an array of tin bridging defect calibration components, offset defect calibration components, cold solder joint defect calibration components, bubble defect calibration components, crack defect calibration components, insufficient solder joint defect calibration components, open solder joint defect calibration components, and solder ball foreign object calibration components.

[0009] The offset defect calibration component, the bubble defect calibration component, the bridging defect calibration component, the crack defect calibration component, and the missing solder defect calibration component are all provided with pad components and solder joint components, and the base plate, the pad components, and the solder joint components are stacked in sequence;

[0010] The solder joint defect calibration component is provided with a solder pad component, and the solder ball foreign object calibration component is located between the two solder joint components;

[0011] The cover plate is provided with a solder pad, and the center of the solder pad is provided with a groove, which is in clearance fit with the calibrator for the poor solder joint defect.

[0012] In one embodiment, the pad is a cylindrical platform and the solder joint is hemispherical.

[0013] In one embodiment, the weld defect calibration component is a weld point component, the groove is spherical, and the diameter of the weld defect calibration component is the same as the diameter of the groove.

[0014] In one embodiment, the diameter of the pad component in the missing solder defect calibrator is larger than the diameter of the solder joint component; and / or, the longitudinal axis of the solder joint component in the offset defect calibrator has a horizontal offset distance from the longitudinal axis of the pad component.

[0015] In one embodiment, the weld point of the crack defect calibration piece has a fan-shaped groove.

[0016] In one embodiment, the tin bead foreign object calibrator is spherical.

[0017] In one embodiment, the solder bridging defect calibration component has at least three solder joints, with two solder joints connected by an elongated protrusion to form a first bridge and a second bridge, the width of the first bridge and the width of the second bridge being different.

[0018] In one embodiment, the solder joint of the bubble defect calibrator has multiple spherical cavities of different diameters.

[0019] In one embodiment, the upper surface of the base plate is provided with at least two slots, and the cover plate is provided with at least two bosses. The bosses and the slots are matched one by one, and the bosses and the solder pads on the cover plate are located on the same surface of the cover plate.

[0020] In one embodiment, the slot is a square slot, two slots are located on the same side of the base plate and are arranged in parallel, and the boss is an arc-shaped block extending outward from the surface of the cover plate.

[0021] The technical solution provided by this utility model has the following advantages and effects:

[0022] By setting up an array of calibration components such as bridging defect calibration components, offset defect calibration components, cold solder joint defect calibration components, bubble defect calibration components, crack defect calibration components, missing solder defect calibration components, open solder joint defect calibration components, and solder ball foreign object calibration components, each calibration component simulates different defects, and the relevant solder defect detection performance can be calibrated. Thus, it simulates various defect types of PCB packaged soldering components, and can calibrate the solder defect detection function of X-ray 3D online inspection equipment. Attached Figure Description

[0023] Figure 1 This is a perspective view of the base plate of the metrological standard in an embodiment of this utility model;

[0024] Figure 2This is a perspective view of the cover plate in the metrological standard device according to an embodiment of the present utility model.

[0025] Explanation of reference numerals in the attached figures:

[0026] 100. Base plate

[0027] 110. Solder bridging defect calibration component; 112. Fifth solder joint component; 113. First connecting bridge; 114. Second connecting bridge.

[0028] 120. Offset defect calibration component; 121. First solder pad component; 122. First solder joint component.

[0029] 130. Calibration part with poor weld quality; 131. Part with the seventh weld point.

[0030] 140. Bubble defect calibration component; 141. Second solder pad component; 142. Second solder joint component; 143. Spherical cavity.

[0031] 150. Crack defect calibration part; 152. Third weld point part; 153. Crack.

[0032] 160. Missing weld defect calibration part; 161. Fourth solder pad part; 162. Fourth solder point part.

[0033] 170. Calibrator part for weld defects; 171. Part for the sixth solder pad.

[0034] 180. Solder bead foreign object calibration component; 190. Card slot;

[0035] 200, cover plate; 210, solder pad; 211, groove; 220, boss. Detailed Implementation

[0036] To facilitate understanding of this utility model, the specific embodiments of this utility model will be described in more detail below with reference to the accompanying drawings.

[0037] Unless otherwise specified or defined, the terms "first," "second," etc., used in this document are for distinguishing names only and do not represent a specific number or order.

[0038] Unless otherwise stated or defined, the term “and / or” as used herein includes any and all combinations of one or more of the associated listed items.

[0039] It should be noted that in this article, "fixed to" or "connected to" can mean directly fixed to or connected to a component, or indirectly fixed to or connected to a component.

[0040] X-ray 3D online inspection can be applied to industrial applications such as chip and integrated circuit manufacturing, as well as PCB printed circuit board and PCBA packaging testing. It uses rapid X-ray planar scanning followed by 3D imaging reconstruction to inspect targets. The accuracy of the reconstructed data is particularly important during 3D imaging; therefore, metrological standards are needed to calibrate the scanning and data reconstruction image values ​​of the X-ray 3D online inspection equipment to ensure accurate inspection results.

[0041] This invention designs a metrological standard for online detection of solder defects in microelectronics board products (such as PCB boards). By arraying calibration components for solder bridging defects, offset defects, cold solder joint defects, bubble defects, crack defects, missing solder defects, open solder joint defects, and solder ball foreign object defects, the detection performance of various solder defects in X-ray 3D online inspection equipment can be calibrated, improving detection accuracy.

[0042] Specifically, the measuring standard in this embodiment includes a base plate 100 and a cover plate 200, the base plate 100 as follows: Figure 1 As shown, cover plate 200 Figure 2 As shown, the metrological standard is made by 3D printing. Various calibration components are arrayed on the base plate 100, specifically including a bridging defect calibration component 110, an offset defect calibration component 120, a cold solder joint defect calibration component 130, a bubble defect calibration component 140, a crack defect calibration component 150, a missing solder defect calibration component 160, an open solder joint defect calibration component 170, and a solder ball foreign object calibration component 180. Among them, the bridging defect calibration component 110 simulates a bridge between two solder joints, forming a conductive structure, used to calibrate the bridging defect detection performance during solder joint inspection; the offset defect calibration component 120 simulates a certain dimensional offset between the solder pad and the solder joint, used to calibrate the solder joint / pad offset defect detection performance during solder joint inspection; the cold solder joint defect calibration component 130 simulates the separation between the solder joint and the solder pad, forming a disconnected structure, used to calibrate the cold solder joint defect detection performance during solder joint inspection; the bubble defect calibration component 140 simulates the presence of bubbles inside the solder joint, used to calibrate the bubble defect detection performance during solder joint inspection; the crack defect calibration component 150... The simulated solder joint cracks form a cracked structure, used to calibrate the solder joint crack detection performance during solder testing; the insufficient solder defect calibration component 160 simulates insufficient solder at the solder joint between the solder joint and the pad, forming a smaller solder joint structure, used to calibrate the insufficient solder defect detection performance during solder testing; the open solder defect calibration component 170 simulates a completely solderless connection between the soldered component and the pad, forming a broken structure, used to calibrate the open solder defect detection performance during solder testing; the solder ball foreign matter calibration component 180 simulates residual splattered solder between solder joints, forming solder foreign matter residue, used to calibrate the solder ball foreign matter detection performance during solder testing.

[0043] The offset defect calibration component 120 includes a first pad component 121 and a first solder joint component 122. The base plate 100, the first pad component 121, and the first solder joint component 122 are stacked sequentially from bottom to top. The first pad component 121 simulates a solder pad, and the first solder joint component 122 simulates a solder joint. In this embodiment, the first solder joint component 122 is hemispherical, and the first pad component 121 is a cylindrical platform. The diameter of the first solder joint component 122 is 3mm, the diameter of the cylindrical platform is 3mm, and the height of the cylindrical platform is 0.05mm. The horizontal offset between the longitudinal axis of the first pad component 121 and the longitudinal axis of the first solder joint component 122 is approximately 0.25mm. When calibrating offset defects, the image acquisition system of the X-ray 3D online inspection equipment scans and images the first pad component 121 and the first solder joint component 122 and reconstructs a three-dimensional graphic. The axes of the first pad component 121 and the first solder joint component 122 are extracted, and the distance between the two axes is the offset amount of the detected offset defect. This is compared with the traceability value to calibrate the X-ray 3D online inspection equipment.

[0044] The bubble defect calibration component 140 includes a second solder pad component 141 and a second solder joint component 142. The base plate 100, the second solder pad component 141, and the second solder joint component 142 are stacked sequentially from bottom to top. The second solder pad component 141 simulates a solder pad, and the second solder joint component 142 simulates a solder joint. In this embodiment, the second solder joint component 142 is hemispherical, and the second solder pad component 141 is a truncated cylinder. The diameter of the second solder joint component 142 is 3mm, the diameter of the truncated cylinder is 3mm, and the height of the truncated cylinder is 0.05mm. It should be noted that... Figure 1 The second weld point 142 shown is a quarter-section sphere for demonstration purposes only; the actual second weld point 142 is hemispherical. The second weld point 142 contains multiple spherical cavities 143 of different diameters to simulate air bubbles. The diameters of the spherical cavities 143 can be 0.05mm, 0.10mm, 0.20mm, or 0.50mm. When calibrating for air bubble defects, the image acquisition system of the X-ray 3D online inspection equipment scans and images the second weld point 142 and the spherical cavities 143, reconstructing a three-dimensional graphic. This allows for the detection of the air bubble defect structure, which is then compared with traceability values ​​to calibrate the X-ray 3D online inspection equipment.

[0045] The crack defect calibration component 150 includes a third pad component (not shown in the figure) and a third solder joint component 152. The base plate 100, the third pad component, and the third solder joint component 152 are stacked sequentially from bottom to top. The third pad component simulates a solder pad, and the third solder joint component 152 simulates a solder joint. In this embodiment, the third solder joint component 152 is hemispherical, and the third pad component is a cylindrical platform. The diameter of the third solder joint component 152 is 3 mm, the diameter of the cylindrical platform is 3 mm, and the height of the cylindrical platform is 0.05 mm. The third solder joint component 152 of the crack defect calibration component has a fan-shaped crack 153 with a fan angle of 2°, forming a wedge-shaped gap on the hemispherical third solder joint component 152 to simulate a crack. When calibrating crack defects, the image acquisition system of the X-ray 3D online inspection equipment scans and images the crack 153 and the third solder joint 152 and reconstructs a three-dimensional graphic. The crack defect structure can be detected and compared with the traceability value, thereby calibrating the X-ray 3D online inspection equipment.

[0046] The missing solder defect calibration component 160 includes a fourth solder pad component 161 and a fourth solder joint component 162. The base plate 100, the fourth solder pad component 161, and the fourth solder joint component 162 are stacked sequentially from bottom to top. The fourth solder pad component 161 simulates a solder pad, and the fourth solder joint component 162 simulates a solder joint. In this embodiment, the fourth solder joint component 162 is hemispherical, and the fourth solder pad component 161 is a cylindrical platform. The diameter of the fourth solder joint component 162 is 2 mm, the diameter of the cylindrical platform is 3 mm, and the height of the cylindrical platform is 0.05 mm. When calibrating missing solder defects, the image acquisition system of the X-ray 3D online inspection equipment scans and images the fourth solder joint component 162 and the fourth solder pad component 161 and reconstructs a three-dimensional graphic. The missing solder defect structure can be detected and compared with the traceability value, thereby calibrating the X-ray 3D online inspection equipment.

[0047] The bridging defect calibration component 110 includes a fifth pad component (not shown in the figure) and a fifth solder joint component 112. The base plate 100, the fifth pad component, and the fifth solder joint component 112 are stacked sequentially from bottom to top. The fifth pad component simulates a pad, and the fifth solder joint component 112 simulates a solder joint. In this embodiment, the fifth solder joint component 112 is hemispherical, and the fifth pad component is a cylindrical platform. The diameter of the fifth solder joint component 112 is 3mm, the diameter of the cylindrical platform is 3mm, and the height of the cylindrical platform is 0.05mm. The bridging defect calibration component has at least three fifth solder joint components 112. Two fifth solder joint components 112 are connected by a long strip-shaped protrusion to form a first bridge 113 and a second bridge 114, with widths of 0.2mm and 0.5mm, and heights of 0.25mm and 0.5mm, respectively. When calibrating for solder bridging defects, the image acquisition system of the X-ray 3D online inspection equipment scans and images the fifth solder joint 112 and the two connecting bridges, reconstructs a three-dimensional graphic, extracts the dimensions of the solder joint and solder bridging structure, and compares them with traceability values ​​to calibrate the X-ray 3D online inspection equipment.

[0048] The solder joint defect calibration component 170 only includes the sixth solder pad component 171, which is a cylindrical platform with a diameter of 3 mm and a height of 0.05 mm. When calibrating the solder joint defect, the image acquisition system of the X-ray 3D online inspection equipment scans and images the sixth solder pad component 171 and reconstructs a three-dimensional graphic, allowing the structure of the solder joint defect to be observed.

[0049] The solder ball foreign object calibration component 180 is spherical with a diameter of 1 mm and is bonded between two solder joint components. The specific solder joint components are not restricted to which calibration component they belong to. During the calibration of solder ball foreign object defects, the image acquisition system of the X-ray 3D online inspection equipment scans and images the solder ball foreign object calibration component 180 and reconstructs a three-dimensional graphic, allowing observation of the solder ball foreign object defect structure.

[0050] To simulate the separation between the solder joint and the pad, forming a disconnected structure, i.e., simulating a cold solder joint defect, this embodiment sets a cold solder joint defect calibration component 130 on the base plate 100, equivalent to a solder joint, and a pad component 210 on the cover plate 200, equivalent to a pad. A groove 211 is set in the center of the pad component 210, and the position of the groove 211 corresponds to the position of the cold solder joint defect calibration component 130. When the cover plate 200 is placed on the base plate 100, the groove 211 is located above the cold solder joint defect calibration component 130 and has a gap between it and the cold solder joint defect calibration component 130, i.e., a gap fit. The gap is used to simulate the separation between the solder joint and the pad, calibrating the cold solder joint defect detection performance during solder testing. Specifically, the weld defect calibration component 130 on the base plate 100 is a hemispherical seventh weld point component 131 with a diameter of 3 mm. The solder pad component 210 on the cover plate 200 is a cylindrical truncated cone with a diameter of 3 mm and a height of 0.05 mm. The groove 211 is spherical, and the diameter of the weld defect calibration component 130 is the same as the diameter of the spherical groove 211, both being 3 mm. During defect calibration, the cover plate 200 is placed on the base plate 100, with the groove 211 above the seventh weld point component 131. The image acquisition system of the X-ray 3D online inspection equipment scans and images the seventh weld point component 131 and the spherical groove 211 and reconstructs a three-dimensional graphic, allowing observation of the simulated weld defect structure.

[0051] In this embodiment, the cover plate 200 is movably mounted on the base plate 100. Specifically, the upper surface of the base plate 100 is provided with two slots 190, which are square grooves. The two slots 190 are located on the left side of the base plate 100 and are arranged in parallel. The cover plate 200 is provided with two bosses 220. The bosses 220 and the pads 210 on the cover plate 200 are located on the same surface of the cover plate 200. The bosses 220 are arc-shaped blocks extending outward from the surface of the cover plate 200 and can be fitted into the slots 190 one by one. It should be noted that the number of slots 190 and bosses 220 is at least two, but can also be three or four, etc. The cover plate 200 and the base plate 100 are detachably installed. When calibrating the performance of detecting cold weld defects, the cover plate 200 is placed on the base plate 100. When calibrating the performance of other items, the cover plate 200 can be easily separated from the base plate 100.

[0052] In summary, this embodiment uses an array of calibration components to form a metrological standard. Each calibration component simulates different defects, which can calibrate the relevant solder defect detection performance. Thus, the metrological standard simulates various defect types of PCB packaged solder parts and can calibrate the solder defect detection function of X-ray 3D online inspection equipment.

[0053] The above embodiments are not an exhaustive list based on the present invention, and there may be other embodiments not listed. Any substitutions and improvements made without departing from the concept of the present invention are within the protection scope of the present invention.

Claims

1. A gauge standard for PCB soldering defect detection, characterized in that, The utility model relates to a calibration device for soldering defects, comprising: a bottom plate and a cover plate movably mounted on the bottom plate; a plurality of calibration pieces for different soldering defects arranged in an array on the bottom plate, including a misalignment defect calibration piece, a void defect calibration piece, a continuous solder defect calibration piece, a bubble defect calibration piece, a crack defect calibration piece, a lack of solder defect calibration piece, an open solder defect calibration piece, and a solder bead foreign matter calibration piece; the misalignment defect calibration piece, the void defect calibration piece, the continuous solder defect calibration piece, the crack defect calibration piece, and the lack of solder defect calibration piece are each provided with a pad piece and a soldering point piece, and the bottom plate, the pad piece, and the soldering point piece are sequentially stacked; the open solder defect calibration piece is provided with a pad piece, and the solder bead foreign matter calibration piece is arranged between two soldering point pieces; the cover plate is provided with a pad piece, the center of the pad piece is provided with a groove, and the groove is in clearance fit with the void defect calibration piece.

2. The metrology standard for PCB soldering defect detection of claim 1, wherein, The pad piece is a cylindrical table, and the soldering point piece is hemispherical.

3. The metrology standard for PCB soldering defect detection of claim 2, wherein, The void defect calibration piece is a soldering point piece, the groove is in the shape of a spherical cap, and the diameter of the void defect calibration piece is the same as the diameter of the groove.

4. The metrology standard for PCB soldering defect detection of claim 2, wherein, The diameter of the pad piece in the lack of solder defect calibration piece is greater than the diameter of the soldering point piece; and / or, the longitudinal axis of the soldering point piece in the misalignment defect calibration piece and the longitudinal axis of the pad piece have a horizontal offset distance.

5. The metrology standard for PCB soldering defect detection of claim 2, wherein, The soldering point piece of the crack defect calibration piece has a fan-shaped groove.

6. The metrology standard for PCB soldering defect detection of claim 2, wherein, The solder bead foreign matter calibration piece is spherical.

7. The metrology standard for PCB solder defect detection of claim 1, wherein, The continuous solder defect calibration piece has at least three soldering point pieces, two soldering point pieces are connected by a long strip-shaped protrusion to form a first continuous bridge and a second continuous bridge, and the width of the first continuous bridge and the width of the second continuous bridge are different.

8. The metrology standard for PCB solder defect detection of claim 1, wherein, The soldering point piece of the bubble defect calibration piece has a plurality of spherical cavities with different diameters.

9. A gauge standard for soldering defects detection of PCB board as claimed in any one of the claims 1 to 8 wherein, The upper surface of the bottom plate is provided with at least two clamping grooves, the cover plate is provided with at least two bosses, the bosses are in one-to-one fit with the clamping grooves, and the bosses and the pad piece on the cover plate are arranged on the same surface of the cover plate.

10. The metrology standard for PCB soldering defect detection of claim 9, wherein, The clamping grooves are square grooves, two clamping grooves are arranged on the same side of the bottom plate, and the two clamping grooves are arranged in parallel, and the boss is an arc-shaped block extending outward from the surface of the cover plate.

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