Wafer flat edge pre-positioning device of photoetching machine

Abstract

The utility model relates to the technical field of photoetching machines, and discloses a wafer flat edge pre-positioning device of a photoetching machine, which comprises a working table, a mounting frame is fixedly connected to the upper surface of the working table, a rotating device is arranged on the upper surface of the working table, and the mounting frame is fixedly connected with the rotating device. An optical fiber sensor is fixedly connected to the bottom of the mounting frame, a wafer is arranged on the upper surface of the rotating device, a positioning device is arranged on the upper surface of the workbench, in order to enable the wafer to be damaged due to excessive pressure, the wafer is placed on the upper surface of the rotating device, and the outer surface of the wafer makes contact with the outer surface of the movable roller; and the threaded rod is rotated to enable the L-shaped movable part to move downwards, so that the arc-shaped outer surface arranged on the outer surface of the movable roller is in contact with the corner, close to the top, of the outer surface of the wafer, and therefore, the wafer can be better attached to the rotating device, and the wafer can be pre-positioned when being placed on the upper surface of the rotating device.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of photoetching machine, concretely is a wafer flat edge prepositioning device of photoetching machine. BACKGROUND

[0002] The semiconductor device pattern exposure machine is a key process equipment in the production process of semiconductor devices, and is used for generating various patterns of semiconductor devices. The substrates for producing semiconductor devices have different crystal orientation arrangements according to their own characteristics, and the relationship between the pattern design of the device and the crystal orientation mainly depends on the electrical characteristics and the slicing requirement of the subsequent process.

[0003] According to a wafer flat edge prepositioning device of a photoetching machine (publication number: CN210428090U), in the above-mentioned application, the first bevel gear is driven to rotate by the motor, thereby driving the second bevel gear to rotate, and then the second rotating shaft is driven to rotate to drive the circular segment type turntable to rotate. The arc-shaped edge of the circular segment type turntable pushes the L-shaped swing lever to swing outward in the process of rotating, then the wafer is placed on the workbench, so that the flat edge of the wafer is in contact with the two second fixed positioning wheels, and the arc-shaped edge of the wafer is in contact with the first fixed positioning wheel. When the wafer is accurately positioned, the optical fiber sensor cannot receive the light reflected back by the wafer, and the three optical fiber sensors do not detect the wafer. Then the motor is controlled to reverse rotation, thereby driving the circular segment type turntable to reverse rotation, and the L-shaped swing lever returns to the initial position under the torsional force of the torsional spring sleeved on the first rotating shaft and in contact with the arc-shaped edge of the wafer, thereby fixing the wafer.

[0004] However, in the actual use process of the above-mentioned device, when the motor drives the swing lever to drive the positioning wheel to contact the outer surface of the wafer through transmission, the positioning wheel will exert excessive pressure on the wafer, thereby easily damaging the wafer. In view of this, we propose a wafer flat edge prepositioning device of a photoetching machine. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a wafer flat edge prepositioning device of a photoetching machine to solve the problems in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a wafer flat edge prepositioning device of a photoetching machine, which comprises a workbench, the upper surface of the workbench is fixedly connected with a mounting bracket, the upper surface of the workbench is provided with a rotating device, the bottom of the mounting bracket is fixedly connected with an optical fiber sensor, the upper surface of the rotating device is provided with a wafer, the upper surface of the workbench is provided with a positioning device, and the positioning device comprises:

[0007] The movable groove is arranged on the upper surface of the workbench, the movable block is slidably connected in the movable groove, and the upper surface of the movable block is fixedly connected with a fixing piece.

[0008] A fixing block is fixedly connected to the side of a fixing component. A bolt is provided on the upper surface of the fixing block. A threaded rod is rotatably connected to the bottom of the inner wall of the fixing component. A movable component is threadedly connected to the outer surface of the threaded rod. A movable roller is rotatably connected to the bottom of the movable component.

[0009] Preferably, the outer surface of the movable roller is provided with an arc-shaped surface, and the position of the movable roller corresponds to the center of the movable part, which allows the movable roller to rotate well at the bottom of the horizontal part of the movable part.

[0010] Preferably, the bottom of the fixed block is in contact with the upper surface of the worktable, and the size of the fixed block is adapted to the size of the movable block, which allows the movable block to be limited by using bolts passing through the fixed block.

[0011] Preferably, the movable part is L-shaped and is disposed inside the fixed part, which allows the movable part to move inside the fixed part.

[0012] Preferably, the worktable surface is provided with an auxiliary component, the auxiliary component including a slide groove, the slide groove being opened on the worktable surface, a spring being fixedly connected to the inner wall side of the slide groove, a pressing member being fixedly connected to the end of the spring, a placement groove being opened on the side of the pressing member, and a rotating rod being rotatably connected to the bottom of the inner wall of the placement groove.

[0013] Preferably, the size of the placement groove is adapted to the size of the rotating rod, and the placement groove is evenly distributed in a circumferential array on the side of the pressing member.

[0014] Preferably, the pressing element is disposed inside the slide groove, and the side of the pressing element is arc-shaped.

[0015] Compared with the prior art, the present invention provides a wafer flat edge pre-positioning device for a lithography machine, which has the following advantages:

[0016] 1. The wafer flat edge pre-positioning device of this lithography machine, in order to prevent the wafer from being damaged by excessive pressure, places the wafer on the upper surface of the rotating device, so that the outer surface of the wafer contacts the outer surface of the movable roller, and rotates the threaded rod to move the L-shaped movable part downward, so that the arc-shaped outer surface of the movable roller contacts the edge near the top corner of the outer surface of the wafer. This allows the wafer to fit better with the rotating device, and also allows the wafer to be pre-positioned when placed on the upper surface of the rotating device.

[0017] 2. The wafer flat edge pre-positioning device of the lithography machine, in order to better position the wafer at the center of the rotating device, after the outer surface of the wafer contacts the outer surface of the movable roller, the elastic force of the spring pushes the pressing part to move towards the outer surface of the wafer, thereby allowing the outer surface of the rotating rod to contact the outer surface of the wafer, so that the wafer can be better positioned at the center of the rotating device. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the three-dimensional left-side structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the main body structure of this utility model;

[0020] Figure 3 This is a schematic diagram of the limiting component structure of this utility model;

[0021] Figure 4 This is a schematic diagram of the pressing component structure of this utility model.

[0022] In the diagram: 1. Workbench; 2. Mounting bracket; 3. Fiber optic sensor; 4. Rotating device; 5. Wafer; 6. Positioning device; 601. Movable slot; 602. Movable block; 603. Fixing component; 604. Fixing block; 605. Bolt; 606. Threaded rod; 607. Movable component; 608. Movable roller; 7. Auxiliary component; 701. Slide groove; 702. Spring; 703. Pressing component; 704. Placement slot; 705. Rotating rod. Detailed Implementation

[0023] like Figures 1-4 As shown, this utility model provides a technical solution: a wafer flat edge pre-positioning device for a lithography machine, including a worktable 1, a mounting frame 2 fixedly connected to the upper surface of the worktable 1, a rotating device 4 provided on the upper surface of the worktable 1, an optical fiber sensor 3 fixedly connected to the bottom of the mounting frame 2, a wafer 5 provided on the upper surface of the rotating device 4, and a positioning device 6 provided on the upper surface of the worktable 1. The positioning device 6 includes a movable groove 601, a movable block 602, a fixing component 603, a fixing block 604, a bolt 605, a threaded rod 606, a movable component 607, and a movable roller 608.

[0024] In this embodiment of the invention, a movable groove 601 is formed on the upper surface of the workbench 1. A movable block 602 is slidably connected inside the movable groove 601. A fixing member 603 is fixedly connected to the upper surface of the movable block 602. A fixing block 604 is fixedly connected to the side of the fixing member 603. The bottom of the fixing block 604 contacts the upper surface of the workbench 1. The size of the fixing block 604 is adapted to the size of the movable block 602. This allows the movable block 602 to be limited by a bolt 605 passing through the fixing block 604. The upper surface of the fixing block 604 is provided with bolts 605 for fixing. A threaded rod 606 is rotatably connected to the bottom of the inner wall of part 603. A movable part 607 is threadedly connected to the outer surface of the threaded rod 606. The movable part 607 is L-shaped and is located inside the fixed part 603, which allows the movable part 607 to move inside the fixed part 603. A movable roller 608 is rotatably connected to the bottom of the movable part 607. The outer surface of the movable roller 608 is provided with an arc-shaped surface. The position of the movable roller 608 corresponds to the center of the movable part 607, which allows the movable roller 608 to rotate well at the bottom of the horizontal part of the movable part 607.

[0025] Meanwhile, an auxiliary component 7 is provided on the upper surface of the worktable 1. The auxiliary component 7 includes a slide groove 701, which is opened on the upper surface of the worktable 1. A spring 702 is fixedly connected to the inner side of the slide groove 701, and a pressing member 703 is fixedly connected to the end of the spring 702. The pressing member 703 is located inside the slide groove 701. The side of the pressing member 703 is arc-shaped, and a placement groove 704 is opened on the side of the pressing member 703. The size of the placement groove 704 is adapted to the size of the rotating rod 705. The placement grooves 704 are evenly distributed in a circumferential array on the side of the pressing member 703. The rotating rod 705 is rotatably connected to the bottom of the inner wall of the placement groove 704. In this way, after the outer surface of the wafer 5 contacts the outer surface of the movable roller 608, the elastic force of the spring 702 pushes the pressing member 703 to move towards the outer surface of the wafer 5, thereby allowing the outer surface of the rotating rod 705 to contact the outer surface of the wafer 5. This allows the wafer 5 to be better positioned at the center of the rotating device 4.

[0026] In this invention, during use, the wafer 5 is placed on the upper surface of the rotating device 4, so that the outer surface of the wafer 5 contacts the outer surface of the movable roller 608, and the threaded rod 606 is rotated to move the L-shaped movable part 607 downward, so that the arc-shaped outer surface of the movable roller 608 contacts the corner of the outer surface of the wafer 5 near the top, thereby allowing the wafer 5 to fit better with the rotating device 4, and allowing the wafer 5 to be pre-positioned when placed on the upper surface of the rotating device 4.

[0027] Furthermore, after the outer surface of the wafer 5 comes into contact with the outer surface of the movable roller 608, the elastic force of the spring 702 pushes the pressing member 703 to move towards the outer surface of the wafer 5, thereby allowing the outer surface of the rotating rod 705 to come into contact with the outer surface of the wafer 5, so that the wafer 5 can be better positioned at the center of the rotating device 4.

[0028] The present invention has been described in detail above. However, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, any modifications or improvements that do not depart from the spirit of the present invention are within the protection scope of the present invention.

Claims

1. A wafer flat-edge pre-positioning device for a lithography machine, comprising a worktable (1), a mounting frame (2) fixedly connected to the upper surface of the worktable (1), a rotating device (4) provided on the upper surface of the worktable (1), and an optical fiber sensor (3) fixedly connected to the bottom of the mounting frame (2), characterized in that: The upper surface of the workbench (1) is provided with a positioning device (6), which comprises A movable groove (601) is formed in the upper surface of the workbench (1), and a movable block (602) is slidably connected inside the movable groove (601), and a fixed part (603) is fixedly connected to the upper surface of the movable block (602); A fixed block (604) is fixedly connected to the side of the fixed part (603), and a bolt (605) is arranged on the upper surface of the fixed block (604), a threaded rod (606) is rotatably connected to the inner wall of the fixed part (603), and an active part (607) is threadedly connected to the outer surface of the threaded rod (606), and an active roller (608) is rotatably connected to the bottom of the active part (607).

2. The wafer edge alignment positioning device of a photoetching machine according to claim 1, wherein: The outer surface of the active roller (608) is provided with an arc surface, and the position of the active roller (608) corresponds to the center of the active part (607).

3. The wafer edge alignment positioning device of a photoetching machine according to claim 1, wherein: The bottom of the fixed block (604) is in contact with the upper surface of the workbench (1), and the size of the fixed block (604) is matched with the size of the movable block (602).

4. The wafer edge alignment positioning device of a photoetching machine according to claim 1, wherein: The active part (607) is L-shaped, and the active part (607) is arranged inside the fixed part (603).

5. The wafer edge alignment positioning device of a photoetching machine according to claim 1, wherein: The upper surface of the workbench (1) is provided with an auxiliary assembly (7), which comprises a sliding groove (701) formed in the upper surface of the workbench (1), a spring (702) fixedly connected to the inner wall side of the sliding groove (701), a pressing part (703) fixedly connected to the end of the spring (702), a placing groove (704) formed in the side of the pressing part (703), and a rotating rod (705) rotatably connected to the inner wall bottom of the placing groove (704).

6. The wafer edge alignment positioning device of a photoetching machine according to claim 5, wherein: The size of the placing groove (704) is matched with the size of the rotating rod (705), and the placing grooves (704) are uniformly distributed in a circumferential array on the side of the pressing part (703).

7. The wafer edge alignment positioning device of a photoetching machine according to claim 5, wherein: The pressing part (703) is arranged inside the sliding groove (701), and the side of the pressing part (703) is arc-shaped.

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