Computer memory bank structure with high heat dissipation performance

Abstract

The utility model relates to the technical field of high-heat-dissipation memory banks, in particular to a high-heat-dissipation computer memory bank structure. An air inlet fan and an air exhaust fan are arranged on the two opposite sides of the shell respectively, a top cover is arranged at the top of the shell, a plurality of groups of flow guide plates are fixedly mounted on the inner wall of the top cover and are arranged in a non-parallel manner in the length direction of the top cover, and the distance between the flow guide plates is gradually increased from the air inlet side to the air exhaust side. Through the arrangement of the same-flow-direction fans and the differentiated staggered flow guide plates on the two sides of the shell, when the memory bank generates heat, the air inlet fan drives external cold air to enter the cavity, convection is increased under the influence of the flow guide plates, the cold air is guided to flow to the memory bank, and after the cold air is heated, the cold air flows into the cavity. And the air flow forms forced convection in the shell, and the gradual expansion channel of the flow guide plate is matched, so that the cold air coverage area and the heat exchange efficiency are effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of high heat dissipation memory module technology, specifically, to a high heat dissipation computer memory module structure. Background Technology

[0002] Computer memory modules generate heat during use. If this heat cannot be dissipated for an extended period, it can slow down the computer's memory read speed. To address this, Chinese Patent Publication No. CN218866447U describes a heat dissipation mechanism for computer memory modules. During use, a cooling fan on the top of the casing is activated, guiding air into the casing through vents on the motherboard surface. The center line of the vents is aligned with the horizontal center line of the side panel. Because the side panel is tilted 40°-45° towards the memory modules, when air enters the cavity through the vents, it comes into contact with the memory modules due to the tilt of the side panel. Furthermore, the airflow direction is consistently towards the memory modules. This method effectively dissipates the heat generated by the memory modules through two sets of cooling fans.

[0003] In existing technologies, air is drawn from the cavity in one direction only by the cooling fan at the top of the casing. The fixed connection between the motherboard and the host casing results in a small gap in the vents that can draw air, which cannot provide sufficient aerodynamic force. In addition, the airflow path is simple, which can easily lead to uneven airflow distribution inside the casing, insufficient local heat dissipation of the memory modules, and stagnation of hot air inside the cavity, resulting in limited overall heat dissipation effect. Utility Model Content

[0004] This invention provides a high-heat-dissipation computer memory module structure. Through the arrangement of co-current fans on both sides of the casing and differentiated staggered airflow guide plates, when the memory module generates heat, the intake fan draws external cool air into the cavity. Under the influence of the airflow guide plates, convection is increased and the cool air is guided towards the memory module. After being heated, the cool air is again drawn in by the exhaust fan and discharged outside the cavity, thereby solving the problems mentioned in the background art, namely:

[0005] In existing technologies, the single airflow path for heat dissipation, coupled with insufficient cold air power, leads to problems such as insufficient local heat dissipation of memory modules and the inability to expel heated air from the cavity.

[0006] To achieve the above objectives, the high heat dissipation memory module includes a housing and a heat dissipation mechanism disposed within the housing, wherein an intake fan and an exhaust fan are respectively disposed on opposite sides of the housing;

[0007] The top of the outer shell is provided with a top cover, and several sets of guide plates are fixedly installed on the inner wall of the top cover. The guide plates are arranged non-parallel along the length of the top cover, and the spacing of the guide plates gradually increases from the air inlet side to the air outlet side, forming a progressively expanding airflow channel.

[0008] The blades of the intake fan and the exhaust fan are on the same side, forming a convection circulation that runs through the outer casing.

[0009] In the above technical solution, an intake fan and an exhaust fan are respectively installed on opposite sides of the outer casing. The fan blades of both are on the same side and rotate in the same direction. By installing them in opposite directions, i.e., the intake fan faces inward and the exhaust fan faces outward, a bidirectional forced convection circulation is formed throughout the outer casing, which accelerates the airflow circulation efficiency inside the outer casing. At the same time, through the differentiated staggered guide plate design, the high-angle guide plate at the near end quickly guides the cold air to the surface of the memory module below, absorbing its surface heat. After the hot air rises, the secondary and tertiary guide plates gradually absorb the heat from various parts of the memory module. Then, the low-angle guide plate guides the heated air to the exhaust fan, and then exhausts it into the inner casing.

[0010] Based on this, the intake fan and exhaust fan rotate in the same direction, and the exhaust fan is installed at a lower height than the intake fan, forming an airflow path that gradually descends from the intake side to the exhaust side. The exhaust fan rotates at a higher speed than the intake fan to accelerate the airflow circulation efficiency inside the housing. The difference in installation height and rotation speed causes the cold air to form an airflow path that gradually descends from the intake side to the exhaust side after entering the housing cavity, effectively accelerating the airflow circulation efficiency inside the housing.

[0011] In another technical solution, the extension direction of the air guide plate forms an inclined angle with the axis of the intake fan. The inclination angle of the air guide plate gradually decreases from the intake side to the exhaust side. The gradual decrease in the inclination angle of the air guide plate disturbs the intake airflow in multiple directions and guides it evenly to the surface of the memory module, avoiding local heat dissipation blind spots.

[0012] The high heat dissipation memory module device also includes an electrostatic adsorption plate electrically connected to the motherboard via a plug-in interface. The electrostatic adsorption plate and the memory module are staggered in the vertical direction. The electrostatic adsorption plate uses its own static electricity to adsorb dust in the air entering the casing, thus preventing dust accumulation and obstructing airflow.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] With the co-current fans on both sides of the casing and the differentiated staggered air deflectors, when the memory module generates heat, the intake fan draws external cool air into the cavity. Under the influence of the air deflectors, convection is increased and the cool air is guided to the memory module. After the cool air is heated, it is drawn in again by the exhaust fan and discharged outside the cavity, so that the airflow forms forced convection inside the casing. Combined with the progressive expansion channel of the air deflectors, the coverage area of ​​cool air and the heat exchange efficiency are effectively improved. Attached Figure Description

[0015] Figure 1This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a cross-sectional structural diagram of the present invention;

[0017] Figure 3 This is a schematic diagram of the internal structure of the present invention;

[0018] Figure 4 This is a schematic diagram of the internal airflow structure during the operation of this utility model.

[0019] The meanings of the labels in the diagram are as follows:

[0020] 100. Outer casing; 101. Top cover; 102. Air deflector; 103. Electrostatic adsorption plate; 104. Memory module; 105. Electrical interface;

[0021] 200. Heat dissipation mechanism; 201. Intake fan; 202. Exhaust fan. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Currently, existing technologies suffer from problems such as insufficient heat dissipation in certain areas of the memory module 104 due to a single airflow path and insufficient cold air power, leading to stagnation of heated air within the cavity. This invention provides a high-heat-dissipation computer memory module structure. (See [link to relevant documentation]). Figures 1-3 As shown, it includes a housing 100 and a heat dissipation mechanism 200 disposed inside the housing 100. An intake fan 201 and an exhaust fan 202 are respectively disposed on opposite sides of the housing 100.

[0024] The top of the outer casing 100 is provided with a top cover 101. Several sets of guide plates 102 are fixedly installed on the inner wall of the top cover 101. The guide plates 102 are arranged non-parallel along the length of the top cover 101. The spacing of the guide plates 102 gradually increases from the air inlet side to the air outlet side, forming a progressively expanding airflow channel.

[0025] The blades of the intake fan 201 and the exhaust fan 202 are on the same side, forming a convection circulation that runs through the housing 100. The two fans are on the same side and rotate in the same direction, creating a unidirectional airflow channel inside the housing 100. When external cold air enters the housing 100, it comes into contact with the differentiated staggered air guide plate 102, thereby disrupting the airflow direction, changing the flow direction, and blowing it onto the surface of the memory module 104 for heat exchange. After absorbing heat from various parts, the heated air is exhausted from the housing 100 by the suction of the exhaust fan 202, thereby effectively increasing the area of ​​cold air covering the memory module 104 and improving heat dissipation efficiency.

[0026] See Figure 3 As shown, the blades of the intake fan 201 and the exhaust fan 202 are on the same side, and the rotation directions of the intake fan 201 and the exhaust fan 202 are the same. The installation height of the exhaust fan 202 is lower than that of the intake fan 201. The height difference between the two fans causes the airflow to form an airflow path that gradually descends from the intake side to the exhaust side inside. In addition, the speed of the exhaust fan 202 is higher than that of the intake fan 201. Combined with the height difference, the circulation efficiency of the airflow inside the housing 100 is effectively improved.

[0027] Figure 4 In the process, the tilt angle of the guide plate 102 gradually decreases from the air intake side to the air exhaust side. When cold air enters, it first contacts the high-angle guide plate 102 with a tilt angle of 60°, causing the cold air to quickly adjust its flow direction and blow to the front part of the memory module 104. After carrying away the heat, the hot air rises due to the decrease in density. During the flow, it contacts the middle guide plate 102 with a tilt angle of 45° and flows to the middle part of the memory module 104 again. Finally, it flows through the low-angle guide plate 102 with a tilt angle of 30° to the exhaust fan 202 and is then discharged from the casing 100 for heat dissipation.

[0028] Figure 3Inside the casing 100, there is a motherboard. Above the motherboard, the memory module 104 and the electrostatic adsorption plate 103 are electrically connected via a plug-in interface. In this design, the electrostatic adsorption plate 103 is powered by the motherboard. The electrostatic adsorption plate 103 integrates a high-voltage electrostatic generator module (not shown in the figure, which is prior art and will not be described in detail here). This module is driven by the 5V / 12V voltage input from the motherboard to form a high-voltage electrostatic field. The electrostatic adsorption plate 103 and the memory module 104 are staggered in the vertical direction. The motherboard in the casing 100 has an electrical interface 105 near the inner edge of the intake fan 201 and the exhaust fan 202. The electrical interface 105 is connected to the fan power cable via elastic contacts (not shown in the figure, which is prior art). This device powers the two fans through the motherboard. While dissipating heat internally, the electrostatic adsorption plate 103 can also adsorb dust in the air onto its outer surface through its electrostatic adsorption, preventing dust from adhering to the surface of the memory module 104 and avoiding dust from obstructing the internal airflow and reducing the heat dissipation effect.

[0029] Example 1: An experimental comparison was conducted between the existing technology (top fan) and this solution (side fans + air deflector) under the same conditions (ambient temperature: 25℃; memory module full load; test duration: 30 minutes):

[0030] Table 1. Temperature distribution uniformity of memory modules

[0031]

[0032]

[0033] As shown in Table 1, when the memory module 104 is running at full load, the heat dissipation performance of this solution (two side fans + air guide plate 102) is better than that of the top fan path heat dissipation effect in the front, middle and rear parts. In addition, the temperature of different areas of the memory module 104 is relatively uniform during the heat dissipation process, and there is no phenomenon of excessive temperature difference at point points. This indicates that when the cold air circulates for heat dissipation, it covers a large area and has high heat exchange efficiency with the memory module 104.

[0034] Working principle: During use, the operator connects the power cords of the intake fan 201 and the exhaust fan 202 to the electrical interface 105. When the memory module 104 generates heat, the internal airflow direction can be referenced. Figure 4When the intake fan 201 draws in external cold air into the housing 100, part of the airflow flows between the electrostatic adsorption plate 103 and the memory module 104, while another part of the airflow preferentially contacts the high-angle guide plate 102, thereby changing the flow direction towards the surface of the memory module 104 below. After being heated by the memory module 104, the heated air rises due to the decrease in density and continues to flow forward. Similarly, after passing through the secondary and tertiary guide plates 102, the air flows along its extension direction to the blade surface of the exhaust fan 202 at the low-angle guide plate 102 and is discharged from the housing 100 by the exhaust fan 202.

[0035] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A high heat dissipation computer memory bar structure, comprising a shell (100) and a heat dissipation mechanism (200) arranged in the shell (100), characterized in that: The shell (100) is provided with an air inlet fan (201) and an air outlet fan (202) on opposite sides respectively. The top of the shell (100) is provided with a top cover (101), and a plurality of groups of guide plates (102) are fixedly installed on the inner wall of the top cover (101). The guide plates (102) are non-parallel arranged along the length direction of the top cover (101), and the spacing of the guide plates (102) gradually increases from the air inlet side to the air outlet side, forming a gradually expanding air flow channel. The fan blades of the air inlet fan (201) and the air outlet fan (202) are on the same side, forming a convection circulation through the shell (100). After the cold air is guided to cover the surface of the memory stick (104) by the guide plates (102), it is discharged from the shell (100) by the air outlet fan (202).

2. The high heat dissipating computer memory bank structure of claim 1, wherein: The rotation directions of the air inlet fan (201) and the air outlet fan (202) are the same, and the installation height of the air outlet fan (202) is lower than that of the air inlet fan (201), forming an air flow path gradually descending from the air inlet side to the air outlet side.

3. The high heat dissipating computer memory bank structure of claim 2, wherein: The rotating speed of the air outlet fan (202) is 1.2-1.5 times of the rotating speed of the air inlet fan (201), so as to accelerate the air flow circulation efficiency inside the shell (100).

4. The high heat dissipating computer memory bank structure of claim 2, wherein: The extension direction of the guide plate (102) forms an inclined angle with the axis of the air inlet fan (201), which is used for multi-directional disturbance of the air inlet flow and guiding to the surface of the memory stick (104).

5. The high heat dissipating computer memory bank structure of claim 4, wherein: The inclined angle of the guide plate (102) gradually decreases from 45°-60° on the air inlet side to 15°-30° on the air outlet side.

6. The high heat dissipating computer memory bank structure of claim 1, wherein: The shell (100) is provided with a mainboard, and the memory stick (104) and the electrostatic adsorption plate (103) are electrically connected to the mainboard through a plug-in interface above the mainboard. The electrostatic adsorption plate (103) and the memory stick (104) are staggered in the vertical direction.

7. The high heat dissipating computer memory bank structure of claim 6, wherein: The mainboard of the shell (100) is provided with an electrical interface (105) near the inner side edge of the air inlet fan (201) and the air outlet fan (202), and the electrical interface (105) is connected with the fan power line through elastic contacts.

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