Display mainboard support

By using a combination of double-sided tape and adhesive layers in the monitor stand, the problem of increased weight caused by liquid adhesive was solved, achieving lightweight design and improved heat dissipation efficiency.

CN224067362UActive Publication Date: 2026-03-31WUHAN LONGSHENG PLASTIC CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-29
Publication Date
2026-03-31

AI Technical Summary

Technical Problem

Existing monitor stands use liquid adhesive for bonding, making it difficult to maintain a constant thickness, which increases their weight.

Method used

A combination of double-sided tape and adhesive layer is used. The double-sided tape maintains the gap between the inner board and the rear frame, and the thickness of the adhesive layer is adjusted to reduce the thickness of the inner board. Heat sinks made of graphite, copper or aluminum are used for heat dissipation.

Benefits of technology

It effectively maintains the gap between the inner board and the rear rack, reduces the weight of the monitor motherboard bracket, and improves heat dissipation efficiency.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224067362U_ABST
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Abstract

The utility model provides a display mainboard support which comprises a hollow front rack, a rear rack, an inner plate and a rear cover, the front end face of the rear rack is provided with a plurality of double-sided adhesive tapes and adhesive layers, the plurality of double-sided adhesive tapes are evenly arranged along the front end face of the rear rack at intervals, and the adhesive layers are arranged between every two adjacent double-sided adhesive tapes. The inner plate is fixedly adhered to the front end surface of the rear rack through a double-sided tape and an adhesive layer; a double-sided tape capable of maintaining a solid state of a predetermined thickness is attached between a rear chassis and an inner plate, a gap between the rear chassis and the inner plate can be maintained by the thickness of the double-sided tape, and the thickness of an adhesive layer is adjusted by adjusting the thickness of the double-sided tape because the thickness of the double-sided tape is almost unchanged. When the thickness of the adhesive layer is kept constant to the expected thickness, the adhesive layer can increase the moment of inertia between the rear rack and the inner plate, and compared with the prior art, the thickness of the inner plate can be reduced, so that the weight of the whole display mainboard support is reduced.
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Description

Technical Field

[0001] This utility model relates to the field of display product technology, specifically to a display motherboard bracket. Background Technology

[0002] Typically, a display device is an output device used to convert acquired or stored information into visual information and display that visual information to a user. Display devices are used in various fields, such as home and commercial applications. A display device includes a display panel, a front frame, a rear frame, and an inner panel. The display panel is mounted within the inner frame of the front frame, the rear frame is mounted on the rear surface of the front frame and covers the rear surface of the display panel, and the inner panel is connected to the front surface of the rear frame to enhance its strength.

[0003] In existing technologies, the inner panel is bonded to the front surface of the rear frame using liquid adhesive, meaning a large area of ​​adhesive is applied to the front surface of the rear frame, resulting in a large bonding area. To ensure proper assembly between the rear and front frames, the rear surface of the rear frame needs to fit snugly against the rear surface of the front frame after assembly. However, since liquid adhesive is difficult to maintain a constant thickness after curing under pressure, current methods increase the thickness of the inner panel to ensure that the rear surface of the rear frame fits snugly against the rear surface of the front frame after assembly. However, this increased internal thickness increases the overall weight of the monitor stand. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a monitor motherboard bracket that can reduce weight.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] This application provides a monitor motherboard bracket, including a hollow front frame, a rear frame, an inner plate, and a rear cover. The front end face of the rear frame is provided with multiple double-sided tapes and an adhesive layer. The multiple double-sided tapes are evenly spaced along the front end face of the rear frame, and the adhesive layer is provided between adjacent pairs of double-sided tapes. The inner plate is fixedly bonded to the front end face of the rear frame by the double-sided tapes and the adhesive layer.

[0007] Furthermore, the thickness t2 of the adhesive layer is greater than the thickness t1 of the double-sided tape.

[0008] Furthermore, it also includes a heat sink, which is fixed to the front end face of the inner plate by an adhesive layer.

[0009] Furthermore, the heat sink is made of one of the following materials: graphite, copper, or aluminum.

[0010] Furthermore, the inner panel is made of aluminum.

[0011] The beneficial effects of this utility model are as follows:

[0012] By employing the aforementioned monitor motherboard bracket, double-sided tape, which maintains a solid state with a specified thickness, is attached between the rear frame and the inner panel. The thickness of the double-sided tape maintains the gap between the rear frame and the inner panel. Since the thickness of the double-sided tape remains almost constant, the thickness does not decrease even when subjected to force in the direction close to the inner panel and the rear frame. Furthermore, because the double-sided tape connects the rear frame and the inner panel to each other, and because it maintains the gap between the inner panel and the rear frame, the adhesive layer, initially dispensed in a liquid state, can cure into a solid with a thickness equal to the gap between the inner panel and the rear frame. In other words, the adhesive layer can cure into a solid with a thickness equal to the thickness of the double-sided tape. Therefore, the thickness of the adhesive layer can be adjusted by adjusting the thickness of the double-sided tape. When the thickness of the adhesive layer remains constant to the desired thickness, the adhesive layer can increase the moment of inertia between the rear frame and the inner panel. Compared to existing technologies, this allows for a reduction in the thickness of the inner panel, thereby reducing the overall weight of the monitor motherboard bracket. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of a monitor with the monitor motherboard bracket of the present application installed.

[0014] Figure 2 This is a three-dimensional structural diagram of a monitor with the monitor motherboard bracket of this application mounted at another angle.

[0015] Figure 3 This is an exploded view of the installation and assembly of a monitor with the monitor motherboard bracket from the embodiments of this application.

[0016] Figure 4 This is an exploded view of the installation and assembly structure of a monitor with the monitor motherboard bracket of this application installed from another angle.

[0017] Figure 5 This is an exploded view of the installation and assembly structure between the inner plate and the rear frame in an embodiment of this application.

[0018] Figure 6 This is a schematic diagram of the structure in which the inner plate is mounted on the rear frame in an embodiment of this application.

[0019] Figure 7 This is a schematic diagram of the cross-sectional structure of the inner plate before it is installed onto the rear frame in an embodiment of this application.

[0020] Figure 8This is a schematic diagram of the cross-sectional structure of the inner plate after it is installed on the rear frame in an embodiment of this application. Detailed Implementation

[0021] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0022] See appendix Figure 1 To be continued Figure 6 As shown, this embodiment provides a monitor motherboard bracket for mounting a display panel 10. In this embodiment, the monitor motherboard bracket includes a hollow front frame 30 extending along the periphery of the display panel 10 to cover the side surface of the display panel 10, a rear frame 40 configured to cover the rear surface of the display panel 10, and a rear cover 50 configured to cover a portion of the rear surface of the rear frame 40. Furthermore, the monitor motherboard bracket also includes an inner plate 60, which is configured to reinforce the strength of the rear frame 40 by being connected to the front of the rear frame 40 and to dissipate heat generated from the display panel 10.

[0023] According to an embodiment, the display motherboard bracket further includes a heat sink 20, which is fixed to the front end face of the inner plate 60 by an adhesive layer. The heat sink 20 can be configured to be attached to the front end face of the inner plate 60 so as to contact the rear surface of the display panel 10 for heat dissipation. The heat sink 20 can increase the contact area with the display panel 10 to effectively absorb heat from the display panel 10. The material of the heat sink 20 may include graphite, aluminum, and copper.

[0024] According to this embodiment, double-sided tape 110 and adhesive layer 120 can be disposed on the front surface of the rear frame 40 to connect the inner panel 60 to the rear frame 40. In this embodiment, double-sided tape 110 and adhesive layer 120 can be disposed on the rear frame 40 respectively. More specifically, double-sided tape 110 can be attached to multiple points on the front surface of the rear frame 40 to enhance the bonding force between the inner panel 60 and the rear frame 40. Adhesive layer 120 can be distributed to multiple points on the front surface of the rear frame 40 to enhance the bonding force between the inner panel 60 and the rear frame 40. Refer to the attached drawing. Figure 5 As shown, in some embodiments, multiple double-sided tapes 110 are evenly spaced along the front end face of the rear frame 40, and an adhesive layer 120 is provided between adjacent pairs of double-sided tapes 110.

[0025] According to one embodiment, the double-sided tape 110 may have a predetermined first thickness t1 (see attached figure). Figure 7As described above, according to the embodiment, in order to connect the rear frame 40 and the inner panel 60, double-sided tape 110 and an adhesive layer 120 that cures after being dispensed in a liquid state can be used in combination. This reduces the thickness and weight of the rear frame 40 and the inner panel 60.

[0026] See attached document Figure 7 and attached Figure 8 As shown, before the inner panel 60 is attached to the rear frame 40, a double-sided adhesive tape 110 having a first thickness t1 can be attached to the rear frame 40. Furthermore, a liquid adhesive layer 120 having a second thickness t2 greater than the first thickness t1 can be dispensed onto the rear frame 40. As described above, the double-sided adhesive tape 110 can be attached to multiple points on the rear frame 40, and the adhesive layer 120 can be dispensed to multiple points on the rear frame 40. Furthermore, with the attached… Figure 8As shown, instead of the inner panel 60, a double-sided tape and adhesive layer can also be disposed on the inner panel 60, and the rear frame 40 can then be attached to the inner panel 60. After the inner panel 60 moves toward the rear frame 40 to attach the inner panel 60 to the rear frame 40, the thickness of the adhesive 120 can be a first thickness t1. More specifically, since the gap between the inner panel 60 and the rear frame 40 is maintained at the first thickness t1, the adhesive 120 layer, dispensed in a liquid state, can cure into a solid having the first thickness t1. In other words, when the double-sided tape 110 is attached to the rear frame 40 and the inner panel 60 is disposed on the double-sided tape 110, the double-sided tape 110 can maintain its thickness, thereby maintaining the gap between the rear frame 40 and the inner panel 60 at the first thickness t1. Furthermore, since the upper and lower surfaces of the double-sided tape 110 are attached to the inner panel 60 and the rear frame 40, respectively, the gap between the inner panel 60 and the rear frame 40 can be maintained without increasing due to the adhesive force of the double-sided tape 110. That is, the double-sided tape 110 is located between the rear frame 40 and the inner panel 60, thereby maintaining a constant spacing between the rear frame 40 and the inner panel 60. In this case, the spacing between the rear frame 40 and the inner panel 60 can be maintained at a first thickness t1, which is the thickness of the double-sided tape 110. Therefore, the adhesive layer 120, which is distributed in a liquid state, can be cured into a solid with a thickness equal to the gap between the inner panel 60 and the rear frame 40. In other words, the adhesive layer 120 can be cured into a solid with a thickness equal to that of the double-sided tape 110. Therefore, the thickness of the adhesive layer 120 can be adjusted by adjusting the thickness t1 of the double-sided tape 110. When the thickness of the adhesive layer 120 is kept constant to the desired thickness, the adhesive layer 120 can increase the moment of inertia between the rear frame 40 and the inner panel 60. Compared with the prior art, since the size of the gap between the inner panel 60 and the rear frame 40 can be guaranteed by the double-sided tape 110, there is no concern that the rear frame 40 may not fit properly against the rear surface of the front frame 30 due to the change in thickness of the cured adhesive layer 120 after the liquid state during the installation and pressing of the inner panel 60 and the rear frame 40. Therefore, the thickness of the inner panel 60 can be reduced by controlling the thickness t1 of the double-sided tape 110, thereby reducing the weight of the entire monitor motherboard bracket.

[0027] To better understand the structure of the monitor motherboard bracket in this embodiment, the installation process between the inner board 60 and the rear frame 40 is described below:

[0028] First, double-sided tape 110 with a first thickness t1 is attached to one surface of the rear frame 40. Then, a liquid adhesive layer 120 with a second thickness t2 greater than the first thickness t1 is applied to said one surface of the rear frame 40. Next, the inner panel 60 is positioned on the rear frame 40 such that the inner panel 60 covers said one surface of the rear frame 40. At this point, due to the weight of the inner panel 60, the double-sided tape 110 attached to the rear frame 40 may adhere to the inner panel 60. However, due to the lightweight nature of the inner panel 60, the double-sided tape 110 may not adhere to the inner panel 60 by its own weight alone. To prevent this, the inner panel 60 is pressed down to allow the double-sided tape 110 to adhere to the inner panel 60. When the double-sided tape 110 is attached to the inner panel 60, the gap between the inner panel 60 and the rear frame 40 is maintained by the adhesive force of the double-sided tape 110, and the downward pressure is stopped, so that the gap between the inner panel 60 and the rear frame 40 is maintained at a first thickness t1, and the thickness of the adhesive layer 120 is cured into a solid with a first thickness t1.

[0029] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

Claims

1. A display main board support comprising a hollow front chassis, a rear chassis, an inner plate, and a rear cover, characterized in that, The front end face of the rear rack is provided with a plurality of double-sided adhesive tapes and an adhesive layer, the plurality of double-sided adhesive tapes are uniformly and spacedly arranged along the front end face of the rear rack, the adhesive layer is arranged between a pair of adjacent double-sided adhesive tapes, and the inner plate is fixed and adhered to the front end face of the rear rack through the double-sided adhesive tapes and the adhesive layer.

2. The display main board support of claim 1, wherein, The thickness t2 of the adhesive layer is greater than the thickness t1 of the double-sided adhesive tape.

3. The display mainboard support of claim 1 or 2, wherein, The heat dissipation fin is further included, and the heat dissipation fin is fixed to the front end face of the inner plate through the adhesive layer.

4. The display main board support of claim 3, wherein, The heat dissipation fin is made of one of graphite, copper and aluminum.

5. The display main board support of claim 1, wherein, The inner plate is made of aluminum material.