Electrical connection assembly for atomic layer deposition apparatus

Abstract

An electrical connection assembly for an atomic layer deposition apparatus includes a conductive module and a radio frequency shielding element. The conductive module is used for electrically connecting a power source with a heater of the atomic layer deposition equipment, the conductive module comprises at least one electric feed-through element, the electric feed-through element extends along an axial direction and respectively comprises a feed-in end and an output end, and an electric conduction path is formed between the feed-in end and the output end. The radio frequency shielding element comprises a sleeve. The sleeve comprises a body and a hollow part, the hollow part penetrates through the body and comprises a first opening and a second opening, and the electric feed-through element is at least partially arranged in the hollow part of the sleeve. The electrical feed-through element is disposed at a distance from an inner wall of the sleeve of the RF shielding element.

Description

Technical Field

[0001] This utility model relates to an electrical connection component for an atomic layer deposition apparatus, and more particularly to an electrical connection component for an atomic layer deposition apparatus that is radio frequency shielded. Background Technology

[0002] Deposition equipment and technologies play a crucial role in the semiconductor and advanced manufacturing industries, especially chemical vapor deposition (CVD) and atomic layer deposition (ALD) technologies. These deposition techniques can grow thin films on substrates with excellent thickness control and uniformity, and can be used to fabricate the complex structures required for microelectronic and nanoelectronic components.

[0003] CVD (Chemical Vapor Deposition) is one of the most common thin film deposition methods. Its working principle involves introducing reactive gases into a reaction chamber, where thermal energy or plasma is used to decompose the gases and deposit them onto a substrate to form a thin film. CVD is suitable for depositing a variety of materials, including metals, oxides, and nitrides, and is therefore widely used in integrated circuits (ICs), solar cells, displays, and other components. The advantages of CVD include high deposition rates, high film density, and excellent uniformity.

[0004] Alternating Layer Deposition (ALD) is another high-precision thin-film deposition technology that deposits only a single layer of atoms per deposition. ALD typically consists of two main stages: adsorption and reaction. In the adsorption stage, reactant molecules adhere to the substrate surface and then undergo a chemical reaction with another reactant to form a stable monolayer film. Due to its monolayer deposition characteristics, ALD can achieve high film uniformity and finer thickness control, making it particularly suitable for submicron and nanometer-scale processes. ALD is currently mainly used in the fabrication of high-k materials, gate dielectric layers, and ultrathin insulating layers.

[0005] Alternating current deposition (ALD) processes are often used in conjunction with radio frequency (RF) power devices and heaters. The RF power device uses an RF electric field to excite gas molecules and generate plasma, facilitating deposition. To prevent the RF signal from the power device from interfering with the heater's power supply, a metal mesh is typically used to cover the heater's power cord to shield it from RF interference. However, this metal mesh is prone to loosening, falling off, or even being damaged, resulting in poor shielding effectiveness. Utility Model Content

[0006] The main purpose of this invention is to solve the problem of unstable power line shielding structure of heaters in conventional atomic layer deposition equipment.

[0007] To achieve the above objectives, this utility model discloses an electrical connection assembly for an atomic layer deposition (ALD) apparatus. The electrical connection assembly includes a conductive module and a radio frequency (RF) shielding element. The conductive module is used for electrical connection between a power source and a heater of the ALD apparatus. The conductive module includes at least one electrical feedthrough element, which extends along an axial direction and includes a feed-in end and an output end, forming an electrical conduction path between the feed-in end and the output end. The RF shielding element includes a sleeve, which includes a body and a hollow portion. The hollow portion extends through the body and includes a first opening and a second opening. The electrical feedthrough element is at least partially disposed within the hollow portion of the sleeve. The electrical feedthrough element is spaced apart from an inner wall of the sleeve of the RF shielding element, allowing the electrical conduction path to be shielded by the sleeve of the RF shielding element.

[0008] In one embodiment, the electrical feedthrough element includes a first electrical feedthrough section electrically connected to the power source, a second electrical feedthrough section electrically connected to the heater, a first insulating sleeve sleeved outside the first electrical feedthrough section, and a second insulating sleeve sleeved outside the second electrical feedthrough section. The first electrical feedthrough section and the second electrical feedthrough section are axially connected to each other, and the first electrical feedthrough section and the second electrical feedthrough section are fixed together by a set of connectors.

[0009] In one embodiment, the connector includes a first through hole and a second through hole, the first electrical feed section is inserted into the first through hole, the second electrical feed section is inserted into the second through hole, and the first electrical feed section and the second electrical feed section form an electrical connection via the connector.

[0010] In one embodiment, the electrical feedthrough element further includes a base and a spacer. The spacer includes at least one third through hole, and the base includes at least one through hole coaxially disposed with the third through hole. The second electrical feedthrough segment is inserted into the third through hole of the spacer and the through hole of the base.

[0011] In one embodiment, the body of the sleeve is a non-mesh structure. Attached Figure Description

[0012] Figure 1 This is a front view schematic diagram of an atomic layer deposition apparatus according to an embodiment of the present invention;

[0013] Figure 2 ,for Figure 1 A three-dimensional schematic diagram;

[0014] Figure 3 This is a three-dimensional schematic diagram of an electrical connection component according to an embodiment of the present utility model;

[0015] Figure 4 ,for Figure 3 Partially exploded diagram;

[0016] Figure 5 ,for Figure 3 An exploded view of the conductive module.

[0017] [Symbol Explanation]

[0018] 10: Atomic Layer Deposition Equipment

[0019] 11: Frame

[0020] 20: Electrical connection components

[0021] 20a: First electrical connection assembly

[0022] 20b: Second electrical connection assembly

[0023] 21: Conductive Module

[0024] 210: Electrical feedthrough element

[0025] 210a: Feeder end

[0026] 210b: Output terminal

[0027] 211: First power supply section

[0028] 212: Second power feeder section

[0029] 213: First insulating sleeve

[0030] 214: Second insulating sleeve

[0031] 215: Assembly Components

[0032] 215a: Ontology

[0033] 215b: Seat

[0034] 215c: Groove

[0035] 215d: First through hole

[0036] 215e: Second through hole

[0037] 216: Base

[0038] 217: Spacer

[0039] 217a: Third through hole

[0040] 22: Radio frequency shielding components

[0041] 23: Sleeve

[0042] 23a: Ontology

[0043] 23b: Hollow section

[0044] 231: First casing

[0045] 231a: First section

[0046] 231b: Second section

[0047] 231c: First opening

[0048] 232: Second casing

[0049] 232a: Second opening Detailed Implementation

[0050] The terminology used herein is for the purpose of illustrating particular embodiments only and is not intended to limit the invention. Unless the context otherwise indicates, the singular forms “a” and “the” used herein may also include the plural forms.

[0051] The directional terms used herein, such as up, down, left, right, front, back, and their derivatives or synonyms, refer to the orientation of the elements in the accompanying drawings and are not intended to limit the present invention, unless the context clearly states otherwise.

[0052] Figure 1 and Figure 2 An atomic layer deposition apparatus 10, illustrating an example of the present invention, has a frame 11. In this example, the atomic layer deposition apparatus 10 includes a heater and a radio frequency power device. The heater may be a resistance heating coil, which is connected to a power source via an electrical connection assembly 20. In this example, the electrical connection assembly 20 includes a first electrical connection assembly 20a and a second electrical connection assembly 20b, respectively mounted on a left side and a right side of the frame 11. The electrical connection assembly 20 electrically connects the heater and the power source. In this example, the heater is located above the electrical connection assembly 20, while the power source is located below the electrical connection assembly 20.

[0053] Figure 3 This is a perspective view of an electrical connection component according to an embodiment of the present invention. The electrical connection component 20 includes a conductive module 21 and a radio frequency shielding element 22. Figure 4 for Figure 3 Partially exploded diagram. Figure 5 for Figure 3 An exploded view of the conductive module 21 shows that the conductive module 21 includes at least one feedthrough element 210. The feedthrough element 210 extends along an axial direction and includes a feed inlet 210a and an output outlet 210b. The feed inlet 210a is electrically connected to the power source, and the output outlet 210b is electrically connected to the heater. An electrical conduction path is formed between the feed inlet 210a and the output outlet 210b, and the electrical conduction path is shielded by the radio frequency shielding element 22.

[0054] In one example, the electrical feedthrough element 210 includes a plurality of parallel electrical feedthrough sections, each of which includes a first electrical feedthrough section 211, a second electrical feedthrough section 212, a first insulating sleeve 213, and a second insulating sleeve 214. The first electrical feedthrough section 211 is electrically connected to the power source, the second electrical feedthrough section 212 is electrically connected to the heating coil, the first insulating sleeve 213 is fitted over the first electrical feedthrough section 211, and the second insulating sleeve 214 is fitted over the second electrical feedthrough section 212. The first electrical feedthrough section 211 and the second electrical feedthrough section 212 are axially connected to each other and are fixed together by a conductive connector 215. In other words, the electrical feedthrough section of the electrical feedthrough element 210 has a two-section structure, which facilitates the installation of the atomic layer deposition equipment 10, especially the assembly of the electrical connection assembly 20 within a chamber of the atomic layer deposition equipment 10. In one example, the first insulating sleeve 213 is made of polyvinyl chloride (PVC) resin, and the second insulating sleeve 214 is made of ceramic material.

[0055] The connector 215 includes a body 215a and a plurality of seats 215b. The seats 215b are disposed on a plurality of grooves 215c of the body 215a. After the seats 215b are installed in the grooves 215c, the body 215a and the seats 215b have a plurality of first through holes 215d and a plurality of second through holes 215e. The body 215a is formed in a disc shape. The first through holes 215d and the second through holes 215e penetrate the connector 215 in the thickness direction. The first through holes 215d and the second through holes 215e correspond to each other, but are eccentrically arranged in the axial direction. The first electrical feed section 211 is inserted into the first through hole 215d, and the second electrical feed section 212 is inserted into the second through hole 215e. The connector 215 is used to connect the first power feed section 211 and the second power feed section 212. The base 215b or the connector 215 is made of conductive material so that the first power feed section 211 and the second power feed section 212 can form an electrical connection with each other.

[0056] Furthermore, the electrical feedthrough element 210 may further include a base 216 and a spacer 217. The base 216 and the spacer 217 are formed in a disc shape. The spacer 217 is disposed on the base 216 and includes at least one third through hole 217a. The third through hole 217a is coaxially disposed and communicates with a plurality of through holes on the base 216. The first electrical feedthrough section 211 and the first insulating sleeve 213 are inserted into the third through hole 217a of the spacer 217 and the through hole of the base 216.

[0057] Back Figure 4 The radio frequency shielding element 22 includes a sleeve 23, which includes a body 23a and a hollow portion 23b. In this example, the sleeve 23 adopts a two-section design, including a first sleeve 231 and a second sleeve 232. The first sleeve 231 includes a first section 231a and a second section 231b. The second section 231b extends from one end of the first section 231a. The second sleeve 232 is fitted onto the second section 231b of the first sleeve 231 and is connected to the first sleeve 231. The first sleeve 231 has a first opening 231c, and the second sleeve 232 has a second opening 232a.

[0058] The electrical feed element 210 is inserted into the hollow portion 23b of the sleeve 23 and is at least partially disposed within the hollow portion 23b of the sleeve 23, and the base 216 abuts against the first opening 231c of the first sleeve 231. The outer diameter of the body 215a of the connector 215 and the spacer 217 corresponds to or is close to an inner diameter of the first sleeve 231, so that the electrical feed element 210 is inserted into the hollow portion 23b of the sleeve 23, while the outer diameter of the base 216 is larger than the first opening 231c.

[0059] In summary, the electrical connection assembly of this utility model is provided with an electrical feed section connected to the power source and an electrical feed section connected to the heater, which can form a two-section metal tube sleeve structure, achieving the effect of not being easily deformed or falling off, and is conducive to stably shielding the heating coil.

Claims

1. An electrical connection assembly for an atomic layer deposition apparatus, characterized by, Comprising: a conductive module for electrically connecting a power source and a heater of an atomic layer deposition apparatus, the conductive module comprising at least one electric feedthrough element extending along an axial direction and comprising a feed-in end and an output end, respectively, the feed-in end and the output end forming an electrically conductive path therebetween; and a radio frequency shielding element comprising a sleeve, the sleeve comprising a body and a hollow portion, the hollow portion extending through the body and comprising a first opening and a second opening, the electric feedthrough element being at least partially disposed in the hollow portion of the sleeve, wherein the electric feedthrough element is disposed apart from an inner wall of the sleeve of the radio frequency shielding element, such that the electrically conductive path is shielded by the sleeve of the radio frequency shielding element. The electric feedthrough element comprises a first electric feedthrough section electrically connected to the power source, a second electric feedthrough section electrically connected to the heater, a first insulating sleeve sleeved on the first electric feedthrough section, and a second insulating sleeve sleeved on the second electric feedthrough section, the first electric feedthrough section and the second electric feedthrough section being axially connected to each other, the first electric feedthrough section and the second electric feedthrough section being fixed by a set of connectors.

2. An electrical connection assembly for an atomic layer deposition apparatus according to claim 1, characterized in that, The set of connectors comprises a first through hole and a second through hole, the first electric feedthrough section being inserted into the first through hole, the second electric feedthrough section being inserted into the second through hole, the first electric feedthrough section and the second electric feedthrough section forming an electrical connection via the set of connectors.

3. An electrical connection assembly for an atomic layer deposition apparatus according to claim 2, characterized in that, The electric feedthrough element further comprises a base and a spacer, the spacer comprising at least one third through hole, the base comprising at least one through hole coaxially disposed with the third through hole, the second electric feedthrough section being inserted into the third through hole of the spacer and the through hole of the base.

4. An electrical connection assembly for an atomic layer deposition apparatus according to claim 2, characterized in that, The body of the sleeve is a non-net structure.

5. An electrical connection assembly for an atomic layer deposition apparatus according to claim 1, characterized in that, ​

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