Multi-layer overlapped circuit board

Abstract

The utility model discloses a multilayer overlapped circuit board, which relates to the technical field of circuit boards, and comprises a first circuit board, a second circuit board and a third circuit board which are sequentially arranged from top to bottom, and connecting mechanisms are arranged between the upper side and the lower side of the second circuit board and the first circuit board and between the upper side and the lower side of the second circuit board and the third circuit board. The lower surface of the second circuit board and the lower surface of the third circuit board are both provided with elastic conductive mechanisms, and the upper surface of the first circuit board and the upper surface of the second circuit board are both fixedly connected with conductive grooves matched with the elastic conductive mechanisms. Through the arrangement of the first springs, when the circuit board is extruded, the first springs can be shrunk to play a role in buffering protection, under the action of the second springs, the pins can stably make contact with the conductive grooves, electric signal transmission is guaranteed, and the pins can be protected and prevented from being damaged when the circuit board is extruded.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a multi-layer overlapping circuit board. Background Technology

[0002] In the prior art, common circuit modules integrate all electronic components on a single circuit board. For some circuit modules, specific electronic components need to be integrated onto the corresponding circuit board first, and then multiple circuit boards are sequentially soldered together. According to the search, Chinese patent publication number CN221901083U discloses a multi-layer overlapping circuit board, including a first circuit board assembly and a second circuit board assembly. The first circuit board assembly includes a first circuit board, and the second circuit board assembly includes a second circuit board.

[0003] Although the above technical solution can fix the first circuit board and the second circuit board through the connecting post and the connecting groove, and can overlap and fix multiple first circuit boards and multiple second circuit boards, the connecting post and conductive terminal used for connection are fixed structures. Therefore, when the circuit board is squeezed, it cannot protect the circuit board, making the circuit board easy to bend and be damaged. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a multi-layer overlapping circuit board, which solves the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution: a multi-layer overlapping circuit board, comprising a first circuit board, a second circuit board, and a third circuit board arranged sequentially above and below each other, wherein connecting mechanisms are installed between the upper and lower sides of the second circuit board and the first and third circuit boards, and elastic conductive mechanisms are installed on the lower surfaces of the second and third circuit boards, and conductive grooves that cooperate with the elastic conductive mechanisms are fixedly connected to the upper surfaces of the first and second circuit boards.

[0006] Preferably, the connecting mechanism includes elastic buckles fixedly connected to both sides of the lower surface of the second and third circuit boards, and the top sides of the first and second circuit boards are fixedly connected with slots that cooperate with the elastic buckles, so as to facilitate the connection of the two adjacent circuit boards.

[0007] Preferably, a first spring is fixedly connected inside the slot, and a top plate that contacts the bottom end of the elastic buckle is fixedly connected to the top of the first spring, which can provide buffer protection while achieving a stable connection between two adjacent circuit boards.

[0008] Preferably, the elastic conductive mechanism includes frames symmetrically fixedly connected to both sides of the lower surface of the second and third circuit boards, with a crossbar slidably connected between the two opposing frames. The bottom end of the crossbar is fixedly connected to a plurality of pins that cooperate with the conductive groove to facilitate the transmission of electrical signals.

[0009] Preferably, a second spring is fixedly connected to the inner top of the frame, and the bottom end of the second spring is fixedly connected to the top of the crossbar for a stable connection.

[0010] Preferably, mounting holes are provided around the top surfaces of the first circuit board, the second circuit board, and the third circuit board to facilitate installation.

[0011] This invention provides a multi-layered overlapping circuit board. It has the following advantages:

[0012] This multi-layered overlapping circuit board facilitates the connection and disassembly of two adjacent circuit boards through elastic buckles and slots. The first spring can retract when the circuit board is squeezed, providing a buffer protection. Under the action of the second spring, not only can the pins be stably in contact with the conductive groove to ensure the transmission of electrical signals, but the pins can also be protected from damage when the circuit board is squeezed. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0014] Figure 2 This is a schematic diagram of the structure of the first circuit board of this utility model;

[0015] Figure 3 This is a schematic diagram of the structure of the third circuit board of this utility model.

[0016] In the diagram, 1 is the first circuit board; 2 is the second circuit board; 3 is the third circuit board; 4 is the connecting mechanism; 41 is the elastic buckle; 42 is the slot; 43 is the first spring; 44 is the top plate; 5 is the elastic conductive mechanism; 51 is the frame; 52 is the crossbar; 53 is the pin; 54 is the second spring; 6 is the conductive groove; and 7 is the mounting hole. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Example 1:

[0019] like Figures 1 to 3 As shown, a multi-layered overlapping circuit board includes a first circuit board 1, a second circuit board 2, and a third circuit board 3 arranged sequentially vertically. Connecting mechanisms 4 are installed between the upper and lower sides of the second circuit board 2 and the first and third circuit boards 3. Elastic conductive mechanisms 5 are installed on the lower surfaces of both the second and third circuit boards 2. Conductive grooves 6, which cooperate with the elastic conductive mechanisms 5, are fixedly connected to the upper surfaces of both the first and second circuit boards 1 and 2. Mounting holes 7 are formed around the upper surfaces of the first, second, and third circuit boards 3.

[0020] The connecting mechanism 4 includes elastic buckles 41 fixedly connected to both sides of the lower surface of the second circuit board 2 and the third circuit board 3. The top sides of both the first circuit board 1 and the second circuit board 2 are fixedly connected to slots 42 that mate with the elastic buckles 41. A first spring 43 is fixedly connected inside the slot 42, and a top plate 44 that contacts the bottom end of the elastic buckle 41 is fixedly connected to the top of the first spring 43. The elastic buckles 41 and the slots 42 facilitate the connection and disassembly of adjacent circuit boards. The first spring 43 can retract when the circuit board is compressed, providing cushioning and protection.

[0021] The elastic conductive mechanism 5 includes frames 51 symmetrically fixedly connected to both sides of the lower surface of the second circuit board 2 and the third circuit board 3. A crossbar 52 is slidably connected between the two opposing frames 51. Multiple pins 53 that mate with the conductive grooves 6 are fixedly connected to the bottom end of the crossbar 52. A second spring 54 is fixedly connected to the inner top of the frame 51, and the bottom end of the second spring 54 is fixedly connected to the top of the crossbar 52. Under the action of the second spring 54, not only can the pins 53 be stably contacted with the conductive grooves 6 to ensure the transmission of electrical signals, but it can also protect the pins 53 from damage when the circuit board is compressed.

[0022] Working principle: The elastic buckle 41 and the slot 42 facilitate the connection and disassembly of two adjacent circuit boards. The first spring 43 can retract when the circuit board is squeezed, which plays a buffering and protective role. Under the action of the second spring 54, not only can the pin 53 be stably contacted with the conductive groove 6 to ensure the transmission of electrical signals, but the pin 53 can also be protected from damage when the circuit board is squeezed.

[0023] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It will be apparent to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and thus all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this utility model. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0024] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A multi-layered interleaved circuit board, characterized by: The utility model provides a circuit board connection structure, including first circuit board (1), second circuit board (2) and third circuit board (3) are arranged in turn from top to bottom, and the upper and lower sides of second circuit board (2) are equipped with connecting mechanism (4) between first circuit board (1) and third circuit board (3), and the lower surface of second circuit board (2) and third circuit board (3) is equipped with elastic conductive mechanism (5), and the upper surface of first circuit board (1) and second circuit board (2) is fixedly connected with the conductive groove (6) matched with elastic conductive mechanism (5).

2. The multi-layered interleaved circuit board of claim 1, wherein: The connecting mechanism (4) includes the elastic buckle (41) fixedly connected on the lower surface of second circuit board (2) and third circuit board (3), and the top of first circuit board (1) and second circuit board (2) is fixedly connected with the clamping groove (42) matched with the elastic buckle (41).

3. The multi-layered interleaved circuit board of claim 2, wherein: The inside of clamping groove (42) is fixedly connected with first spring (43), and the top of first spring (43) is fixedly connected with the top plate (44) in contact with the bottom of elastic buckle (41).

4. The multi-layered interleaved circuit board of claim 1, wherein: The elastic conductive mechanism (5) includes the frame body (51) fixedly connected on the lower surface of second circuit board (2) and third circuit board (3) on both sides, and the horizontal rod (52) is slidably connected between the opposite two frame bodies (51), and the bottom of horizontal rod (52) is fixedly connected with a plurality of needle feet (53) matched with the conductive groove (6).

5. The multi-layered interleaved circuit board of claim 4, wherein: The inner top of frame body (51) is fixedly connected with second spring (54), and the bottom of second spring (54) is fixedly connected with the top of horizontal rod (52).

6. The multi-layered interleaved circuit board of claim 1, wherein: The upper surface of first circuit board (1), second circuit board (2) and third circuit board (3) is provided with mounting hole (7) around.

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