Two-way transmission LED support

Abstract

The utility model discloses a bidirectional transmission LED support, which relates to the technical field of LED supports and comprises a circuit layer and a covering layer which are positioned and laminated. Metal bonding pads are distributed on the two faces of the circuit layer, metalized through holes are formed in the circuit layer, and the metal bonding pads on the two faces can be connected through the metalized through holes, so that use of copper foil of a PCB in electronic assembly is reduced, the material cost is reduced, the manufacturing process of the support is simplified, the machining difficulty is reduced, and the production efficiency is improved. Therefore, the overall manufacturing cost is effectively controlled, the function of data transmission at any end in the transmission direction of the display screen is achieved, breakpoint continuous transmission is supported, and the flexibility and reliability of data transmission are improved.

Description

Technical Field

[0001] This utility model relates to the technical field of LED brackets, and more specifically, to a bidirectional transmission LED bracket. Background Technology

[0002] Integrated LEDs with built-in ICs (referred to as integrated LEDs) are currently limited by their built-in integrated circuit design, primarily supporting unidirectional transmission. To ensure the splicing accuracy, signal transmission stability, and display effect of the finished display screen, existing LED chips and their integrated circuits are configured as unidirectional output / input modes.

[0003] To expand display screen sizes and improve display quality, integrated circuit manufacturers need to develop integrated circuits compatible with both pin designs. Correspondingly, packaging companies must design and package LED chips with two different pin configurations based on the specific needs of the end market. Display screen manufacturers, in turn, need to redesign the connection circuitry and ensure that the LED chips or display screen can reliably resume signal transmission even when data transmission is interrupted.

[0004] Currently, unidirectional LED driver-integrated LEDs require packaging manufacturers to produce LED chips with two different pin configurations to meet diverse customer needs. Similarly, display manufacturers need to use LED chips that support bidirectional signal transmission to ensure optimal display performance. This situation places additional resource consumption and cost pressures on the company's design and manufacturing processes.

[0005] Based on this, we provide a bidirectional LED bracket. Utility Model Content

[0006] To address the problems mentioned in the background art, this utility model provides a bidirectional LED bracket, which not only reduces the use of copper foil on the PCB in electronic assembly, thus lowering material costs, but also simplifies the bracket manufacturing process and reduces processing difficulty, thereby effectively controlling the overall manufacturing cost. It enables data transmission at either end of the display screen's transmission direction and supports breakpoint resume transmission, improving the flexibility and reliability of data transmission.

[0007] The bidirectional LED bracket provided by this utility model adopts the following technical solution:

[0008] A bidirectional LED support includes a circuit layer and a cover layer, wherein the cover layer and the circuit layer are positioned and pressed together; metal pads are distributed on both sides of the circuit layer, and metallized vias are formed inside the circuit layer, wherein the metallized vias can connect the metal pads on both sides; each metal pad corresponds to six metallized vias, the six metallized vias being numbered 1, 2, 3, 4, 5, and 6 respectively; each metal pad includes five functional areas, numbered 1, 2, 3, 4, and 5 respectively; wherein functional area 2 connects metallized vias 2 and 5.

[0009] Preferably, each of the metallized vias is plugged using solder resist ink.

[0010] Preferably, the circuit layer is provided with T-shaped electroplated leads for connecting the metal pads.

[0011] Preferably, positioning holes are provided at all four corners of the circuit layer.

[0012] Preferably, the line layer is further provided with mark points.

[0013] Preferably, the masking layer covers all parts except for the metal pads, positioning holes, and Mark points.

[0014] In summary, this utility model has the following beneficial technical effects:

[0015] 1. By using double-sided metal pads and metallized vias for electrical connection, the use of copper foil on PCBs in electronic assembly is reduced, material costs are lowered, the manufacturing process of the bracket is simplified, and processing difficulty is reduced, thereby effectively controlling the overall manufacturing cost.

[0016] 2. The interconnected design of metallized vias 2 and 5 further optimizes the internal structure, enhances the convenience of packaging and processing, and ensures the reliability of the LED bracket and the display effect. Through the layout and connection of the metallized vias, data transmission can be performed at either end of the display's transmission direction, and it supports breakpoint resume, improving the flexibility and reliability of data transmission. For upstream and downstream equipment, only one pin configuration is needed to achieve better display effects. This not only simplifies circuit design and reduces processing costs but also improves the utilization rate of LED chips and the display screen.

[0017] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0018] Figure 1 This is a cross-sectional structural schematic diagram of a bidirectional transmission LED bracket according to an embodiment of the present invention;

[0019] Figure 2 This is a schematic diagram of the front structure of the circuit layer in an embodiment of this utility model;

[0020] Figure 3 This is a schematic diagram of the structure on the back side of the circuit layer in an embodiment of this utility model;

[0021] Figure 4 This is a schematic diagram of the structure of the metal pads and metallized through holes in an embodiment of this utility model;

[0022] Figure 5 This is a schematic diagram of the structure after the cover layer and the circuit layer are laminated in an embodiment of this utility model.

[0023] Explanation of reference numerals in the attached diagram: 1. Circuit layer; 2. Cover layer; 3. Metal pad; 4. Metallized via; 5. T-shaped plated lead; 6. Positioning hole; 7. Mark point; 8. Metallized via No. 1; 9. Metallized via No. 2; 10. Metallized via No. 3; 11. Metallized via No. 4; 12. Metallized via No. 5; 13. Metallized via No. 6; 14. Functional area No. 1; 15. Functional area No. 2; 16. Functional area No. 3; 17. Functional area No. 4; 18. Functional area No. 5. Detailed Implementation

[0024] The following is in conjunction with the appendix Figures 1 to 5 The present invention will be described in further detail below.

[0025] It should be noted that the accompanying drawings are schematic and not to scale. For clarity and convenience, the relative dimensions and proportions of the parts shown are exaggerated or reduced in size; all dimensions are merely illustrative and not limiting. Furthermore, the same reference numerals are used for the same structures, elements, or fittings appearing in more than two drawings to indicate similar features.

[0026] This utility model discloses a bidirectional LED support. (Refer to...) Figures 1 to 5A bidirectional LED bracket includes a circuit layer 1 and a cover layer 2, which are positioned and pressed together with the circuit layer 1. Metal pads 3 are distributed on both sides of the circuit layer 1, and metallized through holes 4 are opened inside the circuit layer 1, which can connect the metal pads 3 on both sides.

[0027] Specifically, a single metal pad 3 corresponds to six metallized vias 4, which are, in order, metallized via 1 (8), metallized via 2 (9), metallized via 3 (10), metallized via 4 (11), metallized via 5 (12), and metallized via 6 (13). The metal pad 3 includes five functional areas, in order, functional area 14, functional area 2 (15), functional area 3 (16), functional area 4 (17), and functional area 5 (18). Among them, functional area 2 (15) connects metallized via 2 (9) and metallized via 5 (12), so that metallized via 2 (9) and metallized via 5 (12) are connected within the package.

[0028] The connection between metallized via 9 (No. 2) and metallized via 12 (No. 5) reduces the cost of copper foil on the PCB during electronic assembly, simplifies the bracket manufacturing process, reduces processing difficulty and manufacturing costs, optimizes the internal structure, and improves the convenience of packaging and processing, thereby enhancing the reliability and display effect of the LED bracket.

[0029] Specifically, each metallized via 4 is plugged with solder resist ink, which can effectively prevent the exposed side pins from reflecting light and metal from oxidation. Except for the metal pads 3, all other parts of the circuit layer 1 are covered by the masking layer 2.

[0030] Specifically, the bidirectional transmission LED bracket of this utility model achieves electrical connection by arranging the metal pads 3 on both sides and using metallized through holes 4. This not only reduces the use of copper foil on the PCB in electronic assembly and lowers material costs, but also simplifies the bracket manufacturing process and reduces processing difficulty, thereby effectively controlling the overall manufacturing cost.

[0031] In particular, the interconnected design of metallized vias 2 and 5 further optimizes the internal structure, enhances the convenience of packaging and processing, and ensures the reliability of the LED bracket and the display effect. Through the layout and connection of metallized via 4, data transmission can be achieved at either end of the display's transmission direction, and it supports breakpoint resumption, improving the flexibility and reliability of data transmission. For upstream and downstream equipment, only one pin configuration is needed to achieve better display effects. This not only simplifies circuit design and reduces processing costs but also improves the utilization rate of LED chips and the display screen.

[0032] like Figure 2 and Figure 3 As shown, T-shaped electroplating leads 5 are provided on the circuit layer 1 to connect the metal pads 3, facilitating electroplating connection.

[0033] like Figure 2 and Figure 3 As shown, positioning holes 6 are provided at the four corners of the circuit layer 1 for bracket positioning, measuring expansion and contraction dimensions, and pressing positioning.

[0034] like Figure 2 and Figure 3 As shown, mark points 7 are also set on the circuit layer 1 for cutting and positioning after processing.

[0035] like Figure 5 As shown, the masking layer 2 covers all parts except for the metal pads 3, positioning holes 6 and Mark points 7.

[0036] All standard parts used in this utility model can be purchased from the market. Irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. In addition, the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here.

[0037] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. "A plurality of" means two or more, unless otherwise explicitly specified.

[0038] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0039] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0040] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0041] The accompanying drawings of the embodiments disclosed in this utility model only involve the structures involved in the embodiments disclosed in this utility model. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this utility model can be combined with each other.

[0042] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A bidirectional transmission LED holder, characterized in that, Include: The circuit layer (1) and cover layer (2), the cover layer (2) and the circuit layer (1) positioning compression; Both sides of the circuit layer (1) are distributed with metal pads (3), the inside of the circuit layer (1) is provided with metalized through holes (4), and the metalized through holes (4) can connect the metal pads (3) on both sides; Each metal pad (3) corresponds to six metalized through holes (4), and the six metalized through holes (4) are in turn No. 1 metalized through hole (8), No. 2 metalized through hole (9), No. 3 metalized through hole (10), No. 4 metalized through hole (11), No. 5 metalized through hole (12), and No. 6 metalized through hole (13); The metal pad (3) includes five functional areas in turn No. 1 functional area (14), No. 2 functional area (15), No. 3 functional area (16), No. 4 functional area (17), and No. 5 functional area (18); Among them, the No. 2 functional area (15) connects the No. 2 metalized through hole (9) and the No. 5 metalized through hole (12); Each metalized through hole (4) is plugged with solder resist ink; The circuit layer (1) is provided with a T-shaped electroplating lead (5) for connecting the metal pad (3); The circuit layer (1) is provided with a T-shaped electroplating lead (5) for connecting the metal pad (3); The circuit layer (1) is provided with a T-shaped electroplating lead (5) for connecting the metal pad (3); The circuit layer (1) is provided with a T-shaped electroplating lead (5) for connecting the metal pad (3); The cover layer (2) covers other parts except the metal pad (3), the positioning hole (6) and the mark point (7).

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