Display module and display device

By introducing a graphene heat dissipation layer and adhesive layer with high thermal conductivity into the display panel support assembly, the problem of low heat dissipation efficiency of flexible OLED display devices is solved, thereby improving the lifespan and display effect of the display devices.

CN224069068UActive Publication Date: 2026-03-31BOE TECHNOLOGY GROUP CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-20
Publication Date
2026-03-31

AI Technical Summary

Technical Problem

Flexible organic light-emitting diode (OLED) display devices have poor heat dissipation efficiency during operation, leading to temperature rise and affecting the lifespan of electronic components and display effect.

Method used

A heat dissipation layer is introduced into the support assembly of the display panel. Graphene material is used to improve thermal conductivity, and the heat dissipation layer is fixed to the flexible and rigid support layers through an adhesive layer to form a multi-layer structure to enhance heat dissipation efficiency.

Benefits of technology

It improves the heat dissipation efficiency of the display device, extends the lifespan of electronic components, and reduces the negative impact of high temperatures on display performance.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224069068U_ABST
    Figure CN224069068U_ABST
Patent Text Reader

Abstract

The embodiment of the utility model provides a display module and a display device, relates to the technical field of display, and aims to solve the problem that the service life of the display device is shortened due to poor heat dissipation efficiency of the display device. The display module comprises a display panel and a supporting assembly. The display panel is provided with a display side and a non-display side which are oppositely arranged, and the supporting assembly is arranged on the non-display side of the display panel. The supporting assembly comprises a flexible supporting layer, a rigid supporting layer, a heat dissipation layer, a first bonding layer and a second bonding layer. The rigid supporting layer is arranged on the side, away from the display panel, of the flexible supporting layer, the heat dissipation layer is arranged between the flexible supporting layer and the rigid supporting layer, and the heat conductivity of the heat dissipation layer is larger than that of the rigid supporting layer. The first bonding layer is arranged between the flexible supporting layer and the heat dissipation layer, and the second bonding layer is arranged between the heat dissipation layer and the rigid supporting layer. The display module is used for the display device.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] As electronic devices become thinner and more portable, flexible organic light-emitting diode (OLED) displays have attracted widespread attention due to their bendable and foldable characteristics. However, these displays generate a significant amount of heat during operation. Their poor heat dissipation efficiency prevents rapid heat dissipation, leading to increased internal temperatures and a reduced lifespan for the electronic components, ultimately shortening the overall lifespan of the display. Utility Model Content

[0003] The purpose of the embodiments disclosed herein is to provide a display module and display device to improve the problem of reduced lifespan of the display device due to poor heat dissipation efficiency.

[0004] To achieve the above objectives, the embodiments of this disclosure provide the following technical solutions:

[0005] On one hand, a display module is provided. The display module includes a display panel and a support assembly. The display panel has a display side and a non-display side disposed opposite to each other, and the support assembly is disposed on the non-display side of the display panel. The support assembly includes a flexible support layer, a rigid support layer, a heat dissipation layer, a first adhesive layer, and a second adhesive layer. The rigid support layer is disposed on the side of the flexible support layer away from the display panel, and the heat dissipation layer is disposed between the flexible support layer and the rigid support layer, wherein the thermal conductivity of the heat dissipation layer is greater than that of the rigid support layer. The first adhesive layer is disposed between the flexible support layer and the heat dissipation layer, and the second adhesive layer is disposed between the heat dissipation layer and the rigid support layer.

[0006] In this scenario, because the thermal conductivity of the heat dissipation layer is greater than that of the rigid support layer, the heat dissipation layer can improve the heat dissipation efficiency of the support components, thus mitigating the problem of reduced lifespan of the display device caused by poor heat dissipation efficiency of the support components. Simultaneously, it mitigates the issue of performance parameter changes in electronic components within the display device due to high temperatures, thereby reducing the risk of decreased display quality.

[0007] In some embodiments, the material of the heat dissipation layer includes graphene.

[0008] In some embodiments, the first adhesive layer includes a first adhesive layer, a first substrate layer, and a second adhesive layer stacked together. The first adhesive layer is in contact with the flexible support layer. The second adhesive layer is in contact with the heat dissipation layer.

[0009] In some embodiments, the material of the first substrate includes at least one of polyethylene terephthalate, thermoplastic polyurethane elastomer rubber, polyurethane foam, polyethylene foam, and polyvinyl chloride foam.

[0010] In some embodiments, the second adhesive layer includes a stacked third adhesive layer, a second substrate layer, and a fourth adhesive layer. The third adhesive layer is in contact with the heat dissipation layer. The fourth adhesive layer is in contact with the rigid support layer.

[0011] In some embodiments, the material of the second substrate includes at least one of polyethylene terephthalate, thermoplastic polyurethane elastomer rubber, polyurethane foam, polyethylene foam, and polyvinyl chloride foam.

[0012] In some embodiments, the thickness of the heat dissipation layer is greater than or equal to 0.01 mm and less than or equal to 0.05 mm.

[0013] In some embodiments, the thickness of the first adhesive layer is greater than or equal to 0.005 mm and less than or equal to 0.02 mm; and / or, the elastic modulus of the first adhesive layer is greater than or equal to 300 kPa and less than or equal to 500 kPa.

[0014] In some embodiments, the thickness of the second adhesive layer is greater than or equal to 0.09 mm and less than or equal to 0.15 mm; and / or, the elastic modulus of the second adhesive layer is greater than or equal to 100 kPa and less than or equal to 400 kPa.

[0015] In some embodiments, the display panel has a connected planar portion and a flexible portion, the flexible portion and the planar portion being arranged along a first direction. The display module further includes a pivot disposed on the side of the rigid support layer away from the display panel, the pivot being configured to cause the flexible portion to bend or unfold, the centerline of the pivot being perpendicular to the first direction.

[0016] In some embodiments, the boundary of the heat dissipation layer's orthographic projection on the display panel is located within the boundary of the flexible support layer's orthographic projection on the display panel.

[0017] In some embodiments, the distance between the boundary of the heat dissipation layer's orthographic projection on the display panel and the boundary of the flexible support layer's orthographic projection on the display panel is less than or equal to 3 mm.

[0018] In some embodiments, the rigid support layer includes a plurality of support strips and a support plate, wherein the plurality of support strips are located in the bendable portion and are spaced apart along the first direction. The support plate is located in the planar portion, and the orthographic projection of the support plate on the display panel coincides with the planar portion.

[0019] On the other hand, a display device is provided. The display device includes a display module as described in the above embodiments.

[0020] The above-described display device has the same structure and beneficial technical effects as the display module provided in some of the above embodiments, and will not be described again here. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0022] Figure 1 This is a structural diagram of a display device according to some embodiments;

[0023] Figure 2 for Figure 1 A cross-sectional view along section line AA;

[0024] Figure 3 for Figure 1 Another cross-sectional view along section line AA;

[0025] Figure 4 for Figure 3 Structural diagram of region D in the middle. Detailed Implementation

[0026] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0027] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0028] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0029] In describing some embodiments, the term "connection" and its derivative expressions may be used. The term "connection" should be interpreted broadly; for example, "connection" can be a mechanical connection or an electrical connection; it can be a fixed connection or a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art will understand the specific meaning of the above terms herein based on the specific circumstances.

[0030] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0031] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0032] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0033] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable deviation range, which is determined by those skilled in the art taking into account the measurement under discussion and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0034] In this disclosure, terms such as “down,” “below,” “above,” and “up” are used to explain the relationships between components shown in the accompanying drawings. The terms may be relative concepts and described based on the directions shown in the drawings, or based on the sequence of process steps, but are not limited thereto.

[0035] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0036] The term "relative" means that the first element can be directly or indirectly relative to the second element. In the case where the third element is between the first and second elements, although they are still relative to each other, the first and second elements can be understood as being indirectly relative to each other.

[0037] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0038] See Figure 1 The present disclosure provides a display device 1000, which is a product with image display functionality. Exemplarily, the display device 1000 can be any device that displays either moving (e.g., video) or fixed (e.g., still image) content, and whether it is text or an image.

[0039] For example, the display device 1000 can be any product or component with a display function, such as a monitor, television, billboard, digital photo frame, laser printer with display function, telephone, mobile phone, personal digital assistant (PDA), digital camera, portable camcorder, viewfinder, navigator, vehicle, large wall surface, home appliance, information query equipment (such as business query equipment of e-government, bank, hospital, power and other departments), monitor, etc.

[0040] In some embodiments, such as Figure 1 As shown, the display device 1000 includes a display module 100 and a housing 200, the housing 200 being used to achieve portable storage and protection of the display module 100.

[0041] For example, the shape of the housing 200 includes any shape such as a cuboid or cylinder, and the embodiments disclosed herein do not specifically limit this.

[0042] In some embodiments, such as Figure 2 As shown, the display module 100 includes a display panel 10 and a circuit board 40. The display panel 10 is connected to the circuit board 40, and the circuit board 40 controls the display panel 10 to display images.

[0043] In some examples, such as Figure 2 As shown, the display panel 10 has a display side 10A and a non-display side 10B that are disposed opposite to each other. The display side 10A refers to the side of the display panel 10 where the image is displayed. Figure 2 The upper side of the display panel 10), the non-display side 10B refers to the side opposite to the display side 10A ( Figure 2 (Lower side of the central display panel 10).

[0044] In some examples, such as Figure 2 As shown, the circuit board 40 can be disposed on the non-display side 10B of the display panel 10 to reduce the outer bezel of the display panel 10 and increase the screen ratio.

[0045] In some examples, such as Figure 3As shown, the display panel 10 also has a flat portion CA1 and a flexible portion CA2 connected to each other, and the flat portion CA1 and the flexible portion CA2 are arranged along a first direction X. The flat portion CA1 is used for flat display, and the flexible portion CA2 can be bent at different positions so that the flexible portion CA2 can be used for scrolling display.

[0046] In this configuration, when the display area of ​​the display panel 10 needs to be increased, a portion of the flexible part CA2 can switch from a bent state to a flat state, so that a portion of the surface of the flexible part CA2 is on the same plane as the surface of the flat part CA1, thereby increasing the screen size of the display panel 10 to meet viewing requirements. When the display area of ​​the display panel 10 needs to be reduced, the flexible part CA2 switches from a flat state to a bent state, so that a portion of the flexible part CA2 is rolled up to one side of the flat part CA1, reducing the screen size of the display panel 10. This allows for the display panel 10 to be rolled up and stored, improving portability.

[0047] In some embodiments, such as Figure 3 As shown, the display module 100 also includes a pivot 30. The pivot 30 is disposed on the non-display side 10B of the display panel 10 and is located in the bendable portion CA2. The pivot 30 is configured to drive the bendable portion CA2 to bend or unfold, and the centerline L of the pivot 30 is perpendicular to the first direction X.

[0048] In some examples, such as Figure 2 and Figure 3 As shown, the housing 200 has an opening 210, and the pivot 30 can drive the flexible part CA2 of the display panel 10 to enter and exit the opening 210, and make the flexible part CA2 roll or unfold on the pivot 30, so as to achieve the purpose of changing the screen size of the display panel during use.

[0049] For example, such as Figure 2 and Figure 3 As shown, the rotating shaft 30 can be cylindrical, with a center line L, and the rotating shaft 30 can rotate about its center line L. The opening 210 can be rectangular. The embodiments disclosed herein do not specifically limit the shape of the opening.

[0050] In some embodiments, such as Figure 3 As shown, the display module 100 also includes a support component 20, which is disposed on the non-display side 10B of the display panel 10 to provide support and protection for the display panel 10 when it is in a rolled or unfolded state. In actual use, the pivot 30 rotates around its center line L, thereby driving the support component 20, which is in contact with the pivot 30, to move along the circumferential sidewall of the pivot 30. The moving support component 20 can cause the bendable portion CA2 to be rolled or unfolded, thereby reducing or increasing the screen size of the display panel 10.

[0051] In some embodiments, such as Figure 3 As shown, the support assembly 20 includes a flexible support layer 21 and a rigid support layer 25. The rigid support layer 25 is disposed on the side of the flexible support layer 21 away from the display panel 10. The rigid support layer 25 serves to support the display panel 10. The flexible support layer 21 isolates the display panel 10 from the rigid support layer 25, reducing the risk of mold marks on the display panel 10 due to direct contact between the rigid support layer 25 and the display panel 10, thus protecting the display panel 10.

[0052] In some examples, the flexible support layer 21 is made of stainless steel (SUS). SUS provides flexibility when the stainless steel layer is thin. For example, the thickness of the flexible support layer 21 ranges from 0.02 mm to 0.04 mm. Specifically, the thickness of the flexible support layer 21 may be any one of 0.02 mm, 0.025 mm, 0.03 mm, 0.035 mm, and 0.04 mm.

[0053] The aforementioned flexible support layer 21 can be a continuous layer structure covering the non-display side 10B of the display panel 10, or it can be a patterned structure with an opening in the middle. The embodiments disclosed herein do not specifically limit this.

[0054] In some embodiments, such as Figure 3 As shown, the rigid support layer 25 includes multiple support bars 251 and a support plate 252. The multiple support bars 251 are located in the bendable portion CA2 and are spaced apart along the first direction X. The support plate 252 is located in the planar portion CA1, and the orthographic projection of the support plate 252 on the display panel 10 coincides with the planar portion CA1. At this time, the multiple support bars 251 can enable the display panel 10, which drives the bendable portion CA2, to be rolled up or flattened, and the support plate 252 serves to support the display panel 10 located in the planar portion CA2.

[0055] In some examples, such as Figure 3 As shown, multiple support strips 251 are spaced apart along the first direction X, and the distance between adjacent support strips 251 is equal. A support plate 252 is disposed on the same layer as the support strips 251, and there may be a certain gap between the support plate 252 and the support strips 251. In this configuration, the above structure helps improve the smoothness of the display panel 10 during the rolling process. Furthermore, the rigid support layer 25 has a simple structure and is easy to process.

[0056] In addition, such as Figure 3 As shown, multiple support bars 251 can extend along a second direction Y. The second direction Y is parallel to the center line L of the rotation axis 30.

[0057] For example, the material of the rigid support layer 25 includes stainless steel. The thickness of the rigid support layer 25 includes 0.3 mm to 1 mm. For example, the thickness of the rigid support layer 25 includes any one of 0.3 mm, 0.5 mm, 0.6 mm, 0.8 mm, 0.9 mm and 1 mm.

[0058] However, in related technologies, display modules generate a large amount of heat during operation. The stainless steel materials used in the flexible and rigid support layers of the support components result in poor heat dissipation efficiency, and the patterned rigid support layer further reduces this efficiency, preventing the heat from dissipating quickly from the display device. High-temperature environments reduce the lifespan of electronic components within the display device, thereby shortening the overall lifespan of the display device.

[0059] Based on this, such as Figure 3 As shown, in a display module 100 provided in the disclosed embodiment, the support component 20 further includes a first adhesive layer 22, a heat dissipation layer 23, and a second adhesive layer 24. The heat dissipation layer 23 is disposed between the flexible support layer 21 and the rigid support layer 25, and the thermal conductivity of the heat dissipation layer 23 is greater than that of the rigid support layer 25. The first adhesive layer 22 is disposed between the flexible support layer 21 and the heat dissipation layer 23 to bond and fix the heat dissipation layer 23 to the flexible support layer 21, and the second adhesive layer 24 is disposed between the heat dissipation layer 23 and the rigid support layer 25 to bond and fix the heat dissipation layer 23 to the rigid support layer 25.

[0060] In this case, since the thermal conductivity of the heat dissipation layer 23 is greater than that of the rigid support layer 25, the heat dissipation layer 23 can improve the heat dissipation efficiency of the support component 20, thus mitigating the problem of reduced lifespan of the display device 1000 due to poor heat dissipation efficiency of the support component 20. Simultaneously, it mitigates the problem of performance parameter changes in electronic components within the display device 1000 caused by high temperatures, thereby reducing the risk of decreased display performance of the display device 1000.

[0061] The heat dissipation layer 23 is made of graphene. Graphene has a thermal conductivity greater than or equal to 1800 W / mK, while stainless steel has a thermal conductivity of 16 W / mK to 20 W / mK. The thermal conductivity of graphene is significantly higher than that of stainless steel, which improves the heat dissipation efficiency of the support component 20 and mitigates the problem of reduced lifespan of the display device 1000 due to poor heat dissipation efficiency of the support component 20.

[0062] The thickness of the heat dissipation layer 23 is greater than or equal to 0.01 mm and less than or equal to 0.05 mm. For example, the thickness of the heat dissipation layer 23 includes any one of 0.01 mm, 0.02 mm, 0.03 mm, 0.04 mm and 0.05 mm.

[0063] In some embodiments, such as Figure 3 and Figure 4 As shown, the boundary of the orthographic projection of the heat dissipation layer 23 onto the display panel 10 lies within the boundary of the orthographic projection of the flexible support layer 21 onto the display panel 10. This arrangement ensures that the heat dissipation layer 23 covers a larger area of ​​the support component 20, achieving better heat dissipation. Furthermore, during the manufacturing process, the heat dissipation layer 23 is recessed relative to the flexible support layer 21, preventing the edges of the heat dissipation layer 23 from being exposed on the surface of the support component 20. This prevents edge damage and reduces the risk of arching or cracking in the display device 1000. For example, when the material of the heat dissipation layer 23 is graphene, it prevents delamination at the edges of the graphene, further reducing the risk of arching or cracking in the display device 1000.

[0064] It should be noted that the boundary of the orthographic projection of the heat dissipation layer 23 on the display panel 10 is located within the boundary of the orthographic projection of the flexible support layer 21 on the display panel 10, excluding the case where the boundary of the orthographic projection of the heat dissipation layer 23 on the display panel 10 coincides with the boundary of the orthographic projection of the flexible support layer 21 on the display panel 10.

[0065] For example, the distance H between the boundary of the orthographic projection of the heat dissipation layer 23 on the display panel 10 and the boundary of the orthographic projection of the flexible support layer 21 on the display panel 10 is less than or equal to 3 mm. For example, the distance H includes any one of 1 mm, 1.5 mm, 2 mm, 2.5 mm and 3 mm.

[0066] In some embodiments, the first adhesive layer 22 can be a substrate-free adhesive film, which is also known as a pure adhesive film, referring to an adhesive film without a substrate. This arrangement helps to further isolate the display panel 10 from the rigid support layer 25, reducing the risk of mold marks on the display panel 10 caused by direct contact between the rigid support layer 25 and the display panel 10, and further protecting the display panel 10. Furthermore, the first adhesive layer 22 and the second adhesive layer 24 are single-layer adhesive films, with a simple structure and easy manufacturing process.

[0067] In other embodiments, such as Figure 4 As shown, the first adhesive layer 22 includes a first adhesive layer 221, a first substrate layer 222, and a second adhesive layer 223 stacked together. The first adhesive layer 221 is in contact with the flexible support layer 21, and the second adhesive layer 223 is in contact with the heat dissipation layer 23. This arrangement helps to further isolate the display panel 10 from the rigid support layer 25, reducing the risk of mold marks on the display panel 10 caused by direct contact between the rigid support layer 25 and the display panel 10, and further protecting the display panel 10.

[0068] Furthermore, before bonding the first adhesive layer 22 between the flexible support layer 21 and the heat dissipation layer 23, a first protective layer and a second protective layer are provided on both sides of the first adhesive layer 22 to protect the first adhesive layer 221 and the second adhesive layer 223. The first protective layer is located on the side of the first adhesive layer 221 away from the second adhesive layer 223, and the second protective layer is located on the side of the second adhesive layer 223 away from the first adhesive layer 221. In practical applications, the second protective layer needs to be peeled off to bond the second adhesive layer 223 to the heat dissipation layer 23; then the first protective layer needs to be peeled off to bond the first adhesive layer 221 to the flexible support layer 21. At this time, because the first substrate layer 222 has a certain stiffness (i.e., bending stiffness), the process of peeling off the first protective layer can prevent the second adhesive layer 223 from adhering to the heat dissipation layer 23, thus preventing damage and failure of the heat dissipation layer 23 and avoiding a decrease in the thermal conductivity of the heat dissipation layer 23. For example, when the material of the heat dissipation layer 23 is graphene, the phenomenon of graphene material delamination can be avoided, thereby avoiding the problem of the thermal conductivity of the heat dissipation layer 23 decreasing due to graphene material delamination.

[0069] The materials of the first adhesive layer 221 and the second adhesive layer 223 mentioned above include optically clear adhesive (OCA) or pressure-sensitive adhesive (PSA). For example, the materials of the first adhesive layer 221 and the second adhesive layer 223 are pressure-sensitive adhesives.

[0070] In some embodiments, the material of the first substrate layer 222 includes one or more of the following: polyethylene terephthalate (PET), thermoplastic polyurethanes (TPU), polyurethane foam (PU), polyethylene foam (PE), and polyvinyl chloride foam (PVC), to ensure the bonding effect between the flexible support layer 21 and the heat dissipation layer 23.

[0071] In some embodiments, the second adhesive layer 24 may also be a substrate-free adhesive film, which is a pure adhesive film without a substrate. This configuration further isolates the display panel 10 from the rigid support layer 25, reducing the risk of mold marks on the display panel 10 due to direct contact between the rigid support layer 25 and the display panel 10, thus providing further protection for the display panel 10. Furthermore, the first adhesive layer 22 and the second adhesive layer 24 are single-layer adhesive films, resulting in a simple structure and ease of fabrication.

[0072] In other embodiments, such as Figure 4 As shown, the second adhesive layer 24 includes a third adhesive layer 241, a second substrate layer 242, and a fourth adhesive layer 243 stacked together. The third adhesive layer 241 contacts the heat dissipation layer 23, and the fourth adhesive layer 243 contacts the rigid support layer 25. This arrangement further facilitates the isolation between the display panel 10 and the rigid support layer 25, reducing the risk of mold marks on the display panel 10 caused by direct contact between the rigid support layer 25 and the display panel 10, thereby further protecting the display panel 10.

[0073] Furthermore, before bonding the second adhesive layer 24 between the heat dissipation layer 23 and the rigid support layer 25, a third protective layer and a fourth protective layer are provided on both sides of the second adhesive layer 24 to protect the third adhesive layer 241 and the fourth adhesive layer 243. The third protective layer is located on the side of the third adhesive layer 241 away from the fourth adhesive layer 243, and the fourth protective layer is located on the side of the fourth adhesive layer 243 away from the third adhesive layer 241. In practical applications, the third protective layer needs to be peeled off to bond the third adhesive layer 241 to the heat dissipation layer 23; then the fourth protective layer needs to be peeled off to bond the fourth adhesive layer 243 to the rigid support layer 25. At this time, because the second substrate layer 242 has a certain stiffness (i.e., bending stiffness), the process of peeling off the fourth protective layer can prevent the third adhesive layer 241 from adhering to the heat dissipation layer 23, thus preventing damage and failure of the heat dissipation layer 23 and avoiding a decrease in the thermal conductivity of the heat dissipation layer 23. For example, when the material of the heat dissipation layer 23 is graphene, the phenomenon of graphene material delamination can be avoided, thereby avoiding the problem of the thermal conductivity of the heat dissipation layer 23 decreasing due to graphene material delamination.

[0074] The materials of the third adhesive layer 241 and the fourth adhesive layer 243 mentioned above include optically clear adhesive (OCA) or pressure-sensitive adhesive (PSA). For example, the materials of the third adhesive layer 241 and the fourth adhesive layer 243 are pressure-sensitive adhesives.

[0075] In some embodiments, the material of the second substrate layer 242 includes one or more of the following: polyethylene terephthalate (PET), thermoplastic polyurethanes (TPU), polyurethane foam (PU), polyethylene foam (PE), and polyvinyl chloride foam (PVC), to ensure the bonding effect between the heat dissipation layer 23 and the rigid support layer 25.

[0076] The thickness of the first adhesive layer 22 is greater than or equal to 0.005 mm and less than or equal to 0.02 mm. For example, the thickness of the first adhesive layer 22 includes any one of 0.005 mm, 0.01 mm, 0.015 mm, and 0.02 mm. When the thickness of the first adhesive layer 22 is set as described above, a higher thermal conductivity can be achieved in the support component 20, thereby achieving a better heat dissipation effect for the display device 1000.

[0077] The thickness of the second adhesive layer 24 is greater than or equal to 0.09 mm and less than or equal to 0.15 mm. For example, the thickness of the second adhesive layer 24 includes any one of 0.09 mm, 0.1 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, and 0.15 mm. When the thickness of the second adhesive layer 24 is set as described above, a higher thermal conductivity of the support component 20 can be achieved, thereby achieving a better heat dissipation effect for the display device 1000.

[0078] For example, when the thickness of the first adhesive layer 22 is 0.01 mm and the thickness of the second adhesive layer 24 is 0.09 mm (the thickness of the first adhesive layer 221 is 0.003 mm, the thickness of the first substrate layer 222 is 0.004 mm, the thickness of the second adhesive layer 223 is 0.003 mm; the thickness of the third adhesive layer 241 is 0.02 mm, the thickness of the second substrate layer 242 is 0.05 mm, and the thickness of the fourth adhesive layer 243 is 0.02 mm), the thermal conductivity of the support component 20 is 88.733 W / mK, which means that the support component 20 can achieve a high thermal conductivity, thereby achieving a better heat dissipation effect for the display device 1000.

[0079] The elastic modulus of the first adhesive layer 22 is greater than or equal to 300 kPa and less than or equal to 500 kPa. For example, the elastic modulus of the first adhesive layer 22 includes any one of 300 kPa, 350 kPa, 400 kPa, 450 kPa, and 500 kPa. When the elastic modulus of the first adhesive layer 22 is set as described above, it can prevent the heat dissipation layer 23 from failing due to breakage, reducing the risk of arching or cracking of the display device 1000. For example, when the material of the heat dissipation layer 23 is graphene, it can prevent graphene material delamination, reducing the risk of arching or cracking of the display device 1000 caused by graphene material delamination. Furthermore, it can make the thermal conductivity of the heat dissipation layer 23 more stable, allowing the support component 20 to transfer heat more effectively, thereby achieving a better heat dissipation effect for the display device 1000.

[0080] The elastic modulus of the second adhesive layer 24 is greater than or equal to 100 kPa and less than or equal to 400 kPa. For example, the elastic modulus of the second adhesive layer 24 includes any one of 100 kPa, 200 kPa, 300 kPa, 350 kPa, and 400 kPa. When the elastic modulus of the second adhesive layer 24 is set as described above, it can prevent the heat dissipation layer 23 from failing due to breakage, reducing the risk of arching or cracking of the display device 1000. For example, when the material of the heat dissipation layer 23 is graphene, it can prevent graphene material delamination, reducing the risk of arching or cracking of the display device 1000 caused by graphene material delamination. Furthermore, it can make the thermal conductivity of the heat dissipation layer 23 more stable, allowing the support component 20 to transfer heat more effectively, thereby achieving a better heat dissipation effect for the display device 1000.

[0081] For example, when the elastic modulus of the first adhesive layer 22 and the second adhesive layer 24 meet the above-mentioned settings, the strain of the key film layer of graphene is less than or equal to 2‰, which can reduce the probability of graphene material delamination and reduce the risk of arching and cracking of the display device 1000 caused by graphene material delamination. Furthermore, it can make the thermal conductivity of graphene more stable, allowing the support component 20 to transfer heat more effectively, thereby achieving a better heat dissipation effect for the display device 1000.

[0082] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A display module, characterized by The display module comprises: a display panel having a display side and a non-display side arranged oppositely; a support assembly arranged on the non-display side of the display panel; the support assembly comprises: a flexible support layer; a rigid support layer arranged on a side of the flexible support layer away from the display panel; a heat dissipation layer arranged between the flexible support layer and the rigid support layer; and the thermal conductivity of the heat dissipation layer is greater than that of the rigid support layer; a first adhesive layer arranged between the flexible support layer and the heat dissipation layer; a second adhesive layer arranged between the heat dissipation layer and the rigid support layer.

2. The display module of claim 1, wherein, The material of the heat dissipation layer comprises graphene.

3. The display module of claim 1, wherein, The first adhesive layer comprises a first adhesive layer, a first substrate layer and a second adhesive layer arranged in sequence; the first adhesive layer is in contact with the flexible support layer; and the second adhesive layer is in contact with the heat dissipation layer.

4. The display module of claim 3, wherein, The material of the first substrate comprises at least one of polyethylene terephthalate, thermoplastic polyurethane elastomer rubber, polyurethane foam, polyethylene foam and polyvinyl chloride foam.

5. The display module of claim 1, wherein, The second adhesive layer comprises a third adhesive layer, a second substrate layer and a fourth adhesive layer arranged in sequence; the third adhesive layer is in contact with the heat dissipation layer; and the fourth adhesive layer is in contact with the rigid support layer.

6. The display module of claim 5, wherein, The material of the second substrate comprises at least one of polyethylene terephthalate, thermoplastic polyurethane elastomer rubber, polyurethane foam, polyethylene foam and polyvinyl chloride foam.

7. The display module of claim 1, wherein, The thickness of the heat dissipation layer is greater than or equal to 0.01 mm and less than or equal to 0.05 mm.

8. The display module of claim 1, wherein, The thickness of the first adhesive layer is greater than or equal to 0.005 mm and less than or equal to 0.02 mm; and / or the elastic modulus of the first adhesive layer is greater than or equal to 300 KPa and less than or equal to 500 KPa.

9. The display module of claim 1, wherein, The thickness of the second adhesive layer is greater than or equal to 0.09 mm and less than or equal to 0.15 mm; and / or the elastic modulus of the second adhesive layer is greater than or equal to 100 KPa and less than or equal to 400 KPa. 10.The display module of any one of claims 1-9, wherein, The display panel has a planar portion and a bendable portion connected to each other, and the bendable portion and the planar portion are arranged along a first direction; The display module further comprises: a rotating shaft arranged on a side of the rigid support layer away from the display panel; the rotating shaft is configured to drive the bendable portion to be rolled up or unfolded, and the center line of the rotating shaft is perpendicular to the first direction.

11. The display module of claim 10, wherein, The boundary of the orthographic projection of the heat dissipation layer on the display panel is located within the boundary of the orthographic projection of the flexible support layer on the display panel.

12. The display module of claim 11, wherein, The distance between the boundary of the orthographic projection of the heat dissipation layer on the display panel and the boundary of the orthographic projection of the flexible support layer on the display panel is less than or equal to 3 mm. 13.The display module of claim 10, wherein The rigid support layer comprises a plurality of support strips and a support plate, the plurality of support strips are arranged on the bendable portion and spaced along the first direction, and the support plate is arranged on the planar portion and the orthographic projection of the support plate on the display panel coincides with the planar portion.

14. A display device comprising: The display module comprises any one of claims 1-13. The display module comprises any one of claims 1-13.