Cover plate assembly and power module assembly

By adding a cover plate assembly and a positioning unit to the power module, the problems of difficult signal terminal fixing and insufficient creepage distance were solved, achieving stable assembly of the signal terminals and strengthening the structure, thus improving processing efficiency.

CN224069105UActive Publication Date: 2026-03-31UNITED AUTOMOTIVE ELECTRONICS SYST
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-31
Publication Date
2026-03-31

AI Technical Summary

Technical Problem

In existing power modules, signal terminals are difficult to fix, assembly is difficult and they are prone to loosening, and creepage distance is insufficient.

Method used

A cover plate assembly is added to the power module. The cover plate is equipped with positioning units and positioning holes. The signal terminals are fixed to the cover plate through the positioning holes. The boss or groove structure made of insulating material increases the creepage distance.

Benefits of technology

After the signal terminals are fixed, the assembly difficulty is reduced, the structural strength is improved, the creepage distance is increased, loosening and breakage are avoided, and the processing efficiency is improved.

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Abstract

The utility model belongs to the technical field of power modules, and discloses a cover plate assembly and a power module assembly, the cover plate assembly comprises a cover plate, and positioning units are distributed on the cover plate; each positioning unit is internally provided with a positioning hole, and the positioning holes are used for being connected with signal terminals in a close fit mode and enabling the signal terminals to penetrate through the cover plate. The power module assembly comprises a cover plate assembly, a power module and a side frame. The power module is surrounded in the side frame, and the cover plate covers an opening of the side frame and is fixedly connected with the side frame; signal terminal connecting parts are distributed on the surface of the power module, and the signal terminal connecting parts are distributed corresponding to the positioning units on the cover plate; and one end of the signal terminal is electrically connected with the signal terminal connecting part, and the other end is tightly matched and connected with the positioning hole and penetrates through the cover plate. According to the utility model, the signal terminals are fixed through the positioning units on the cover plate, the assembly difficulty of the signal terminals is reduced, the structural strength of the signal terminals is improved, and the creepage distance between the signal terminals can be prolonged through the positioning units with specific structures.
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Description

Technical Field

[0001] This utility model belongs to the field of power module technology, specifically relating to a cover plate assembly and a power module assembly. Background Technology

[0002] A power module is a packaged assembly that integrates multiple power electronic devices and control circuits. Power modules need to be connected to external components such as capacitors and PCBs via signal terminals. Currently, signal terminals are typically led out from the side of the power module and then bent and fixed to a plastic side frame. The main drawbacks are: limited side space, a large number of signal terminals, narrow spacing between signal terminals, and insufficient creepage distance between signal terminals.

[0003] Although extending the signal terminals from the surface of the power module can increase the creepage distance, it is difficult to fix the signal terminals with plastic side frames. Due to the lack of fixation, the relative dimensional tolerances between the signal terminals are prone to change, which increases the assembly difficulty between the signal terminals and external devices, and the signal terminals are prone to loosening and breakage. Utility Model Content

[0004] This application provides a cover plate assembly to solve the technical problems of signal terminals being difficult to assemble and prone to loosening.

[0005] A cover plate assembly includes a cover plate on which positioning units are distributed; each positioning unit has a positioning hole for tightly fitting a signal terminal and allowing the signal terminal to pass through the cover plate.

[0006] This invention adds a cover plate assembly to a power module. The cover plate itself isolates high-voltage components and protects the power module. Positioning units are distributed on the cover plate surface. When the cover plate is placed on the power module, the signal terminals are inserted into the positioning holes on the cover plate and fixed thereon. This ensures the signal terminals are distributed across the cover plate surface, allowing for a larger creepage distance between the terminals and facilitating connection of the signal terminals to the signal terminal connectors on the power module surface. Because the signal terminals are fixed, their relative positions are also fixed, making it easier to assemble the signal terminals with external components, reducing assembly difficulty and improving assembly efficiency. Furthermore, since the signal terminals are fixed to the cover plate, they are less prone to loosening or breakage after assembly.

[0007] Furthermore, the positioning unit includes a boss disposed on the upper surface of the cover plate, the boss being made of insulating material, and the positioning hole including a first through hole and a second through hole that are axially connected, the first through hole being disposed within the boss, and the second through hole being disposed on the lower surface of the cover plate; the diameter of the first through hole is less than or equal to the diameter of the second through hole.

[0008] The boss not only serves a positioning function, but the boss structure made of insulating material also makes the path between signal terminals tortuous, thereby increasing the creepage distance between signal terminals.

[0009] The first via on the boss plays a major positioning role for the signal terminal: when the diameter of the first via is equal to that of the second via, the positioning hole is a straight hole, and the first via and the second via are simultaneously tightly connected to the signal terminal; when the diameter of the first via is smaller than that of the second via, the first via is used to tightly connect the signal terminal, and the second via is used to pass through the signal terminal.

[0010] Furthermore, the cover plate is made of insulating material; the insulating positioning unit includes a groove on the upper surface of the cover plate and a through hole on the lower surface of the cover plate, the groove and the through hole communicating to form a positioning hole; the diameter of the groove is larger than the diameter of the through hole.

[0011] In this case, the positioning hole is a stepped hole, and the through hole is used for tight-fit connection of the signal terminal. The groove structure set on the cover plate made of insulating material makes the path between the signal terminals tortuous, thereby increasing the creepage distance between the signal terminals.

[0012] Furthermore, the positioning unit and the cover plate are integrally injection molded. This makes processing convenient and ensures precise dimensions.

[0013] Furthermore, it also includes a signal terminal that penetrates the cover plate, the signal terminal being injection molded integrally with the cover plate to form a tight fit connection with the positioning hole.

[0014] The signal terminal and the cover plate are integrally injection molded to form a whole, which not only improves the connection strength between the signal terminal and the cover plate, but also saves the step of installing the signal terminal on the cover plate, greatly improving the processing efficiency.

[0015] This utility model also provides a power module assembly, including the aforementioned cover plate assembly, a power module, and a side frame. The power module is surrounded within the side frame, and the cover plate covers the opening of the side frame and is fixedly connected to the side frame. Signal terminal connection portions are distributed on the surface of the power module, and the signal terminal connection portions are distributed corresponding to the positioning units on the cover plate. One end of the signal terminal is electrically connected to the signal terminal connection portion, and the other end is tightly fitted to the positioning hole and penetrates the cover plate.

[0016] Furthermore, the signal terminal connection part includes a plug hole located on the top surface of the power module, and a plug base is provided in the plug hole; the plug base is used to interfere with the signal terminal and electrically connect the signal terminal to the internal circuit of the power module.

[0017] The power module connects to the signal terminals via a connector hole and a base, which is not only convenient and quick to install, but also provides a certain degree of fixation and protection for the signal terminals. However, the tolerance for relative positional error between the connector hole and the positioning hole is small, making manufacturing more difficult.

[0018] Furthermore, the signal terminal connection portion includes a welding hole located on the top surface of the power module, and a pad is provided inside the welding hole; the pad is used to weld the signal terminal and electrically connect the signal terminal to the internal circuit of the power module.

[0019] Compared to the insertion hole, the pad has a larger area and a greater tolerance for the relative positional error between the pad and the positioning hole, thus reducing the difficulty of processing and manufacturing.

[0020] Furthermore, the cover plate is provided with welding operation holes corresponding to the welding holes. This facilitates welding operations, and is essential when signal terminals are pre-installed on the cover plate.

[0021] Furthermore, the cover plate and the side frame are detachably connected. This facilitates the replacement and maintenance of the power module and also allows for the reuse of the cover plate.

[0022] This invention uses a positioning unit on the cover plate to fix the signal terminals, which reduces the assembly difficulty of the signal terminals and improves the structural strength of the signal terminals. The positioning unit with a specific structure can also extend the creepage distance between the signal terminals. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0024] Figure 1 This is a top view of the cover plate assembly in Embodiment 1;

[0025] Figure 2 This is a cross-sectional view of the power module assembly in Embodiment 2;

[0026] Figure 3 This is a cross-sectional view of the power module assembly in Embodiment 3;

[0027] Figure 4 This is a cross-sectional view of the power module assembly in Example 4. Detailed Implementation

[0028] To address the technical problems of signal terminals distributed on the surface of power modules being difficult to assemble with external devices and prone to loosening, this invention adds a cover plate assembly to the power module. The cover plate itself can isolate high-voltage devices and protect the power module; the positioning units on the cover plate fix the signal terminals, reducing the assembly difficulty of the signal terminals, improving the structural strength of the signal terminals, and the positioning units with a specific structure can also extend the creepage distance between the signal terminals. Different embodiments are described below.

[0029] Example 1

[0030] refer to Figure 1 As shown, this embodiment provides a cover plate assembly, including a cover plate 1, on which positioning units 101 are distributed; each positioning unit 101 is provided with a positioning hole, which is used to tightly connect a signal terminal and allow the signal terminal to pass through the cover plate 1.

[0031] A cover plate assembly is added to the power module. Cover plate 1 itself protects the power module, and the cover plate 1, supported by insulating material, also isolates high-voltage devices. Positioning units are distributed on the surface of cover plate 1. When cover plate 1 is placed on the power module, signal terminals inserted into the positioning holes on cover plate 1 are fixed to it, ensuring the signal terminals are distributed across the surface of cover plate 1. This allows for a larger creepage distance between terminals and facilitates connection of the signal terminals to the signal terminal connectors on the power module surface. Because the signal terminals are fixed, their relative positions are also fixed, making it easier to align the signal terminals with external devices, reducing assembly difficulty and improving assembly efficiency. Furthermore, since the signal terminals are fixed to cover plate 1, they are less prone to loosening or breakage after assembly.

[0032] In this embodiment, the positioning unit and the cover plate 1 are integrally injection molded. This makes processing convenient and ensures precise dimensions.

[0033] Since it is a one-piece injection molded unit, both the cover plate 1 and the positioning unit are made of plastic, which is lightweight and has insulating properties.

[0034] For power modules with signal terminals already distributed on the surface, only positioning units need to be machined on the cover plate 1 corresponding to the signal terminals. For power modules without signal terminals on the surface, integrating the cover plate 1 with the signal terminals into one piece can further improve processing and installation efficiency.

[0035] In this embodiment, the cover plate assembly further includes a signal terminal that penetrates the cover plate 1. The signal terminal is integrally injection molded with the cover plate 1 to form a tight fit connection with the positioning hole.

[0036] The signal terminal and the cover plate 1 are integrally injection molded to form a whole, which not only improves the connection strength between the signal terminal and the cover plate 1, but also saves the step of installing the signal terminal on the cover plate 1, greatly improving the processing efficiency.

[0037] Example 2

[0038] refer to Figure 2 As shown, in this embodiment, the positioning unit includes a boss 1011 disposed on the upper surface of the cover plate 1. The boss 1011 is made of insulating material. The positioning hole includes a first through hole and a second through hole that are axially connected. The first through hole is disposed in the boss 1011, and the second through hole is disposed on the lower surface of the cover plate 1. The diameter of the first through hole is less than or equal to the diameter of the second through hole.

[0039] In this embodiment, the cover plate assembly further includes a signal terminal 3 penetrating the cover plate 1. The signal terminal 3 is integrally injection molded with the cover plate 1 to form a tight fit connection with the positioning hole. Since it is integrally injection molded, both the cover plate 1 and the positioning unit are made of plastic, which is lightweight and has insulating properties.

[0040] The boss 1011 not only serves a positioning function, but also, because the boss 1011 structure is made of insulating material, the path between the signal terminals 3 becomes tortuous, thereby increasing the creepage distance between the signal terminals 3.

[0041] The first via on the boss 1011 plays a major positioning role for the signal terminal 3: when the diameter of the first via is equal to that of the second via, the positioning hole is a straight hole, and the first via and the second via are simultaneously tightly connected to the signal terminal 3; when the diameter of the first via is smaller than that of the second via, the first via is used to tightly connect the signal terminal 3, and the second via is used to pass through the signal terminal 3.

[0042] refer to Figure 2 As shown, this embodiment also provides a power module assembly, including the cover plate assembly of this embodiment, and further including a power module 2 and a side frame 4. The power module 2 is surrounded in the side frame 4, and the cover plate 1 covers the opening of the side frame 4 and is fixedly connected to the side frame 4. The surface of the power module 2 is distributed with signal terminal connection portions, which are distributed corresponding to the positioning units on the cover plate 1. One end of the signal terminal 3 is electrically connected to the signal terminal connection portion, and the other end is tightly fitted to the positioning hole and penetrates the cover plate 1.

[0043] In this embodiment, the signal terminal connection part includes a plug hole located on the top surface of the power module 2, and a plug base 201 is provided in the plug hole; the plug base 201 is used to interfere with the signal terminal 3 and electrically connect the signal terminal 3 to the internal circuit of the power module 2.

[0044] After the cover plate assembly is prepared by the integrated insert injection molding process, the plug hole is processed by laser unpacking and the plug base 201 inside the power module 2 is exposed.

[0045] The power module 2 connects to the signal terminal 3 via a connector hole and a connector base 201. This not only makes installation convenient and quick, but the connector hole also provides some fixation and protection for the signal terminal 3. However, the tolerance for relative positional error between the connector hole and the positioning hole is small, making manufacturing more difficult.

[0046] In this embodiment, an insulating substrate 5 is also included, which is disposed at the bottom of the power module. The insulating substrate 5 is fixedly connected to the bottom of the chip and the insertion base 201 within the power module 2, such as by welding or sintering. The insulating substrate 5 serves to support the chip and the insertion base, as well as to dissipate heat from the chip. The insulating substrate 5 can be made of Si3N4 copper-clad substrate, Al2O3 copper-clad substrate, etc.

[0047] Example 3

[0048] refer to Figure 3 As shown, this embodiment provides a power module 2 assembly, including the cover plate assembly in embodiment 2, and also includes a power module 2 and a side frame 4. The power module 2 is surrounded within the side frame 4, and the cover plate 1 covers the opening of the side frame 4 and is fixedly connected to the side frame 4. Signal terminal connection portions are distributed on the surface of the power module 2, and the signal terminal connection portions are distributed corresponding to the positioning units on the cover plate 1. One end of the signal terminal 3 is electrically connected to the signal terminal connection portion, and the other end is tightly fitted to the positioning hole and penetrates the cover plate 1.

[0049] In this embodiment, the signal terminal connection part includes a welding hole located on the top surface of the power module 2, and a pad 202 is provided in the welding hole; the pad 202 is used to weld the signal terminal 3 and electrically connect the signal terminal 3 to the internal circuit of the power module 2.

[0050] Compared to the insertion hole, the pad 202 has a larger area and a greater tolerance for relative positional errors between the pad 202 and the positioning hole, thus reducing the difficulty of processing and manufacturing.

[0051] After the cover plate assembly is prepared by the integrated insert injection molding process, welding holes are processed by laser unsealing to expose the pad 202 inside the power module 2.

[0052] In this embodiment, a welding operation hole 102 is provided on the cover plate 1 at the position corresponding to the welding hole. This welding operation hole 102 is essential for facilitating welding operations 102, especially when the signal terminal 3 is pre-installed on the cover plate 1.

[0053] In this embodiment, the cover plate 1 and the side frame 4 are detachably connected. This facilitates the replacement and maintenance of the power module 2, and also allows for the reuse of the cover plate 1.

[0054] In this embodiment, an insulating substrate 5 is also included, which is disposed at the bottom of the power module. The insulating substrate 5 is fixedly connected to the bottom of the chip and pad 202 within the power module 2, such as by welding or sintering. The insulating substrate 5 serves to support the chip and pad, and to dissipate heat from the chip. The insulating substrate 5 can be made of Si3N4 copper-clad substrate, Al2O3 copper-clad substrate, etc.

[0055] Example 4

[0056] refer to Figure 4 As shown, the cover plate assembly in this embodiment differs from the cover plate assembly in embodiment 3 only in the structure of the positioning unit: the cover plate 1 is made of insulating material; the positioning unit includes a groove 1012 disposed on the upper surface of the cover plate 1 and a through hole disposed on the lower surface of the cover plate 1; the groove 1012 and the through hole communicate to form a positioning hole; the diameter of the groove 1012 is larger than the diameter of the through hole.

[0057] In this case, the positioning hole is a stepped hole, and the through hole is used for tight-fit connection of the signal terminal 3. The groove 1012 structure set on the cover plate 1 made of insulating material makes the path between the signal terminals 3 tortuous, thereby increasing the creepage distance between the signal terminals 3.

[0058] refer to Figure 4 As shown, this embodiment provides a power module 2 assembly, including the cover plate assembly of this embodiment, and also includes a power module 2 and a side frame 4. The power module 2 is surrounded within the side frame 4, and the cover plate 1 covers the opening of the side frame 4 and is fixedly connected to the side frame 4. Signal terminal connection portions are distributed on the surface of the power module 2, and the signal terminal connection portions are distributed corresponding to the positioning units on the cover plate 1. One end of the signal terminal 3 is electrically connected to the signal terminal connection portion, and the other end is tightly fitted to the positioning hole and penetrates the cover plate 1.

[0059] In this embodiment, the signal terminal connection part includes a welding hole located on the top surface of the power module 2, and a pad 202 is provided in the welding hole; the pad 202 is used to weld the signal terminal 3 and electrically connect the signal terminal 3 to the internal circuit of the power module 2.

[0060] Compared to the insertion hole, the pad 202 has a larger area and a greater tolerance for relative positional errors between the pad 202 and the positioning hole, thus reducing the difficulty of processing and manufacturing.

[0061] After the cover plate assembly is prepared by the integrated insert injection molding process, welding holes are processed by laser unsealing to expose the pad 202 inside the power module 2.

[0062] In this embodiment, a welding operation hole 102 is provided on the cover plate 1 at the position corresponding to the welding hole. This welding operation hole 102 is essential for facilitating welding operations 102, especially when the signal terminal 3 is pre-installed on the cover plate 1.

[0063] In this embodiment, the cover plate 1 and the side frame 4 are detachably connected. This facilitates the replacement and maintenance of the power module 2, and also allows for the reuse of the cover plate 1.

[0064] In this embodiment, an insulating substrate 5 is also included, which is disposed at the bottom of the power module. The insulating substrate 5 is fixedly connected to the bottom of the chip and pad 202 within the power module 2, such as by welding or sintering. The insulating substrate 5 serves to support the chip and pad, and to dissipate heat from the chip. The insulating substrate 5 can be made of Si3N4 copper-clad substrate, Al2O3 copper-clad substrate, etc.

[0065] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this application.

Claims

1. A cover assembly, characterized by: The cover plate is provided with positioning units distributed thereon; each positioning unit is provided with a positioning hole for tightly connecting a signal terminal and allowing the signal terminal to penetrate the cover plate; the positioning unit comprises a boss provided on the upper surface of the cover plate, the boss is made of insulating material, the positioning hole comprises axially communicated first and second through holes, the first through hole is provided in the boss, and the second through hole is provided on the lower surface of the cover plate; the diameter of the first through hole is less than or equal to the diameter of the second through hole.

2. The cover plate assembly of claim 1, wherein: The positioning unit and the cover plate are integrally injection molded.

3. The cover plate assembly of claim 2, wherein: The signal terminal penetrating the cover plate is integrally injection molded with the cover plate to form a tight fit connection with the positioning hole.

4. A power module assembly, characterized by: The cover plate assembly comprises the cover plate, a power module and a side frame. The power module is surrounded by the side frame, the cover plate covers the opening of the side frame and is fixedly connected with the side frame. The surface of the power module is provided with a signal terminal connecting portion corresponding to the positioning units on the cover plate; one end of the signal terminal is electrically connected with the signal terminal connecting portion, and the other end is tightly connected with the positioning hole and penetrates the cover plate.

5. The power module assembly of claim 4, wherein: The signal terminal connecting portion comprises a plug-in hole on the top surface of the power module, and a plug-in base is arranged in the plug-in hole; the plug-in base is used for interference fit with the signal terminal and electrically connects the signal terminal with the internal circuit of the power module.

6. The power module assembly of claim 5, wherein: The signal terminal connecting portion comprises a welding hole on the top surface of the power module, and a pad is arranged in the welding hole; the pad is used for welding the signal terminal and electrically connects the signal terminal with the internal circuit of the power module.

7. The power module assembly of claim 6, wherein: The cover plate is provided with a welding operation hole corresponding to the position of the welding hole.

8. The power module assembly of claim 7, wherein: The cover plate and the side frame are detachably connected.