Packaging glue potting device for preventing chip position deviation

Abstract

The utility model relates to the field of chip packaging glue filling and sealing, and discloses a packaging glue filling and sealing device for preventing chip position deviation, which comprises a processing table and a chip, the chip is arranged at the top of the processing table, a filling and sealing fixing mechanism and a positioning and supporting mechanism are arranged at the top of the processing table, the filling and sealing fixing mechanism comprises a translation cross beam and an electric push rod, and the translation cross beam and the electric push rod are arranged on the positioning and supporting mechanism. And an inner rod of the electric push rod is fixedly connected with a lifting plate, the bottom of the lifting plate is fixedly connected with a filling and sealing machine, the bottom of the translation cross beam is rotationally connected with a two-way screw rod, and the outer walls of the two ends of the two-way screw rod are fixedly connected with gears. According to the utility model, by arranging the potting fixing mechanism, the left and right sides of the chip can be clamped and fixed, thereby effectively preventing the position deviation of the chip caused by external force and other factors in the subsequent potting process, greatly improving the quality and stability of chip potting, ensuring that the packaging glue can be uniformly potted on the chip, and improving the production efficiency. And the encapsulation defect caused by the position change of the chip is reduced.

Description

Technical Field

[0001] This utility model relates to the field of chip encapsulation adhesive potting, and in particular to an encapsulation adhesive potting device for preventing chip position displacement. Background Technology

[0002] Chip encapsulation is a process in which liquid encapsulation adhesive is filled into the area around a chip and its related electronic components or into a specific encapsulation structure to achieve functions such as chip protection, fixation, electrical insulation, and heat dissipation.

[0003] In the prior art, when encapsulating chips with encapsulating adhesive, the appropriate encapsulating adhesive is first prepared and the chip and the encapsulation area are cleaned. After fixing the chip with silver paste or the like, the prepared adhesive is metered and poured in by the encapsulation machine. After pouring, air bubbles are removed by vacuum degassing, etc. Then, depending on the properties of the adhesive, room temperature, heating or ultraviolet curing is selected. Finally, the quality is checked, the edges are trimmed and the packaging is marked.

[0004] In existing chip encapsulation processes, the chip fixing process is easily affected by external forces such as vibration, resulting in chip position displacement. Traditional fixing methods rely on single-point or single-sided fixing, which is difficult to effectively cope with the influence of complex external forces on chip position. As a result, the encapsulation adhesive cannot be uniformly and accurately encapsulated on the chip. Therefore, an encapsulation adhesive encapsulation device to prevent chip position displacement is proposed to solve the above problems. Utility Model Content

[0005] To overcome the above deficiencies, this utility model provides a potting device for preventing chip position displacement, aiming to solve the problem that the potting of encapsulant is easily affected by external forces such as external vibration, resulting in position displacement.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a potting device for preventing chip position displacement, comprising a processing table and a chip, wherein the chip is disposed on the top of the processing table, and the top of the processing table is provided with a potting fixing mechanism and a positioning support mechanism, wherein the potting fixing mechanism comprises a translation beam and an electric push rod, wherein a lifting plate is fixedly connected to the inner rod of the electric push rod, a potting machine is fixedly connected to the bottom of the lifting plate, a bidirectional screw is rotatably connected to the bottom of the translation beam, gears are fixedly connected to the outer walls of both ends of the bidirectional screw, a fixing frame is threadedly connected to the outer wall of the bidirectional screw, and a toothed plate is fixedly connected to the bottom of the lifting plate, wherein the outer wall of the toothed plate meshes with the outer wall of the gear.

[0007] As a further description of the above technical solution:

[0008] The potting and fixing mechanism also includes a support frame, the bottom of which is fixedly connected to the top of the translation beam, and the top of which is fixedly connected to the bottom of the electric push rod.

[0009] As a further description of the above technical solution:

[0010] The potting and fixing mechanism also includes a limiting rod, both ends of which are fixedly connected to the bottom of the translation beam, and the outer wall of the limiting rod is slidably connected to the inner wall of the fixing frame.

[0011] As a further description of the above technical solution:

[0012] The potting and fixing mechanism also includes a translation seat, the bottom of which is slidably connected to the top of the processing table, and a hydraulic rod is fixedly connected to the top of the translation seat. The inner rod of the hydraulic rod is fixedly connected to the bottom of the translation beam.

[0013] As a further description of the above technical solution:

[0014] The potting and fixing mechanism also includes a motor, the outer wall of which is fixedly connected to the top of the processing table, and a screw is fixedly connected to the output end of the motor. The outer wall of the screw is threadedly connected to the inner wall of the translation seat.

[0015] As a further description of the above technical solution:

[0016] The positioning support mechanism includes a support cylinder, the top of which is fixedly connected to the bottom of the lifting plate.

[0017] As a further description of the above technical solution:

[0018] The positioning support mechanism also includes a spring, the top of which is fixedly connected to the top of the inner wall of the support cylinder.

[0019] As a further description of the above technical solution:

[0020] The positioning support mechanism also includes a positioning rod, the outer wall of which is slidably connected to the inner wall of the support cylinder, and the top end of the positioning rod is fixedly connected to the bottom end of the spring.

[0021] This utility model has the following beneficial effects:

[0022] 1. In this utility model, by setting a potting and fixing mechanism, the left and right sides of the chip can be clamped and fixed, which effectively prevents the chip from shifting in position due to external forces or other factors during the subsequent potting process. This greatly improves the quality and stability of chip potting, ensures that the encapsulating glue can be uniformly and accurately potted on the chip, and reduces potting defects caused by chip position changes.

[0023] 2. In this utility model, by setting a positioning support mechanism, the chip can be accurately positioned and stably supported, providing a reliable initial positioning foundation for the subsequent fixing frame to accurately clamp both sides of the chip, ensuring that the chip is in the optimal position for potting and improving potting accuracy. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the main structure of a potting compound device for preventing chip position displacement proposed in this utility model;

[0025] Figure 2 This is a partial bottom view of the translation beam structure of the encapsulation device for preventing chip position displacement proposed in this utility model.

[0026] Figure 3 This is a partial structural diagram of the potting and fixing mechanism of the encapsulating adhesive potting device for preventing chip position displacement proposed in this utility model;

[0027] Figure 4 This is a partial structural diagram of the potting and fixing mechanism of the encapsulating adhesive potting device for preventing chip position displacement proposed in this utility model;

[0028] Figure 5 This is a schematic cross-sectional view of the support cylinder structure of the encapsulation device for preventing chip position displacement proposed in this utility model.

[0029] Legend:

[0030] 1. Processing table; 2. Filling and fixing mechanism; 211. Translation beam; 212. Electric actuator; 213. Lifting plate; 214. Filling machine; 215. Bidirectional screw; 216. Gear; 217. Fixing frame; 218. Tooth plate; 219. Support frame; 220. Limiting rod; 221. Translation seat; 222. Hydraulic rod; 223. Motor; 224. Screw; 3. Positioning support mechanism; 311. Support cylinder; 312. Spring; 313. Positioning rod; 4. Chip. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] Reference Figures 2-4The present invention provides an embodiment of a potting device for preventing chip misalignment, comprising a processing table 1 and a chip 4. The chip 4 is disposed on the top of the processing table 1. The top of the processing table 1 is provided with a potting fixing mechanism 2 and a positioning support mechanism 3. The potting fixing mechanism 2 includes a translation beam 211 and an electric push rod 212. The translation beam 211 is used to support and drive the electric push rod 212 and other components to move. The electric push rod 212 is used to drive the lifting plate 213 to rise and fall. The lifting plate 213 is fixedly connected to the inner rod of the electric push rod 212. The lifting plate 213 is used to support a potting machine 214. The bottom of the lifting plate 213 is fixedly connected to the potting machine 214. The potting machine 214 is used to encapsulate the chip 4. For potting, a bidirectional screw 215 is rotatably connected to the bottom of the translation beam 211. The bidirectional screw 215 rotates under the drive of the gear 216, which can drive the fixed frame 217 to move. Gears 216 are fixedly connected to the outer walls of both ends of the bidirectional screw 215. The gears 216 mesh with the toothed plate 218 and rotate by the lifting of the toothed plate 218. The fixed frame 217 is threadedly connected to the outer wall of the bidirectional screw 215. The fixed frame 217 is used to clamp and fix the two sides of the chip 4 to prevent displacement during potting. The toothed plate 218 is fixedly connected to the bottom of the lifting plate 213. The toothed plate 218 drives the gear 216 to rotate by lifting, which in turn drives the bidirectional screw 215. The outer wall of the toothed plate 218 meshes with the outer wall of the gear 216.

[0033] Reference Figures 1-3 The potting and fixing mechanism 2 also includes a support frame 219, which supports the electric actuator 212 and securely connects it to the translation beam 211. The bottom of the support frame 219 is fixedly connected to the top of the translation beam 211, and the top of the support frame 219 is fixedly connected to the bottom of the electric actuator 212. The potting and fixing mechanism 2 also includes a limiting rod 220, which guides and limits the movement of the fixing frame 217 to ensure its linear movement. Both ends of the limiting rod 220 are fixedly connected to the bottom of the translation beam 211, and the outer wall of the limiting rod 220 is slidably connected to the inner wall of the fixing frame 217. The potting and fixing mechanism 2 also includes a translation seat 221, which is located on the screw 212. Driven by 24, the translation beam 211 moves. The bottom of the translation seat 221 is slidably connected to the top of the processing table 1. A hydraulic rod 222 is fixedly connected to the top of the translation seat 221. The hydraulic rod 222 is used to drive the translation beam 211 to rise and fall. The inner rod of the hydraulic rod 222 is fixedly connected to the bottom of the translation beam 211. The potting fixing mechanism 2 also includes a motor 223. The motor 223 provides power for the rotation of the screw 224. The outer wall of the motor 223 is fixedly connected to the top of the processing table 1. The output end of the motor 223 is fixedly connected to the screw 224. The screw 224 drives the translation seat 221 to move through the threaded transmission. The outer wall of the screw 224 is threadedly connected to the inner wall of the translation seat 221.

[0034] Reference Figure 5The positioning support mechanism 3 includes a support cylinder 311, which is used to house a spring 312 and a positioning rod 313. The top of the support cylinder 311 is fixedly connected to the bottom of the lifting plate 213. The positioning support mechanism 3 also includes a spring 312, which uses its elasticity to make the positioning rod 313 provide positioning support for the chip 4. The top of the spring 312 is fixedly connected to the top of the inner wall of the support cylinder 311. The positioning support mechanism 3 also includes a positioning rod 313, which provides positioning support for the chip 4 by contacting the top of the chip 4 and being acted upon by the spring 312. The outer wall of the positioning rod 313 is slidably connected to the inner wall of the support cylinder 311, and the top of the positioning rod 313 is fixedly connected to the bottom of the spring 312.

[0035] Working principle: When encapsulating chip 4 with encapsulating glue is required, the hydraulic rod 222 is activated. The inner rod of the hydraulic rod 222 pushes the translation beam 211 to rise, and then the circuit board can be fixed on the top of the processing table 1. The inner rod of the hydraulic rod 222 drives the translation beam 211 to reset. Then, the motor 223 is activated, and the output end of the motor 223 drives the fixedly connected screw 224 to rotate, thereby moving the translation seat 221 threaded on the outer wall of the screw 224. This moves the translation beam 211 and the encapsulation machine 214 to directly above chip 4.

[0036] By activating the electric push rod 212, the inner rod of the electric push rod 212 pushes the lifting plate 213 to descend, thereby gradually bringing the encapsulation machine 214 closer to the chip 4. As the lifting plate 213 descends, it also drives the toothed plate 218 to descend. During descent, the toothed plate 218 drives the gear 216 meshing with the outer wall to rotate, thereby driving the bidirectional screw 215 fixedly connected to the inner wall of the gear 216 to rotate. Under the limiting action of the limiting rod 220, the fixing frame 217 threadedly connected to the outer wall of the bidirectional screw 215 moves, thereby gradually approaching the chip 4. When the encapsulation machine 214 descends to the specified encapsulation height, the fixing frame 217 can clamp and fix the left and right sides of the chip 4, thereby preventing the chip 4 from shifting its position during subsequent encapsulation.

[0037] When the lifting plate 213 drives the filling machine 214 to descend, the bottom end of the positioning rod 313 will first contact the top of the chip 4. As the lifting plate 213 and the filling machine 214 gradually descend, the top of the positioning rod 313 will press against the spring 312 fixedly connected inside the support cylinder 311. The elastic force of the spring 312 can position and support the chip 4 with the positioning rod 313 to avoid displacement, so that the subsequent fixing frame 217 can stably clamp and fix the two sides of the chip 4.

[0038] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A potting apparatus for preventing chip position displacement, comprising a processing table (1) and a chip (4), characterized in that: The chip (4) is arranged on the top of the processing table (1), and the top of the processing table (1) is provided with a pouring fixing mechanism (2) and a positioning support mechanism (3); The pouring fixing mechanism (2) comprises a translation beam (211) and an electric push rod (212), the inner rod of the electric push rod (212) is fixedly connected with a lifting plate (213), the bottom of the lifting plate (213) is fixedly connected with a pouring machine (214), the bottom of the translation beam (211) is rotatably connected with a bidirectional screw rod (215), the outer walls of the two ends of the bidirectional screw rod (215) are fixedly connected with gear wheels (216), the outer wall of the bidirectional screw rod (215) is threadedly connected with a fixing frame (217), the bottom of the lifting plate (213) is fixedly connected with a toothed plate (218), and the outer wall of the toothed plate (218) is meshedly connected with the outer wall of the gear wheel (216).

2. The encapsulation adhesive potting device for preventing chip position deviation according to claim 1, wherein: The pouring fixing mechanism (2) further comprises a support frame (219), the bottom of the support frame (219) is fixedly connected to the top of the translation beam (211), and the top of the support frame (219) is fixedly connected to the bottom of the electric push rod (212).

3. The encapsulation adhesive potting device for preventing the shift of chip position according to claim 1, wherein: The pouring fixing mechanism (2) further comprises a limiting rod (220), the two ends of the limiting rod (220) are fixedly connected to the bottom of the translation beam (211), and the outer wall of the limiting rod (220) is slidably connected with the inner wall of the fixing frame (217).

4. The encapsulation adhesive potting device for preventing chip position deviation according to claim 1, wherein: The pouring fixing mechanism (2) further comprises a translation seat (221), the bottom of the translation seat (221) is slidably connected to the top of the processing table (1), the top of the translation seat (221) is fixedly connected with a hydraulic rod (222), and the inner rod of the hydraulic rod (222) is fixedly connected with the bottom of the translation beam (211).

5. The encapsulation adhesive potting device for preventing chip position deviation according to claim 1, wherein: The pouring fixing mechanism (2) further comprises a motor (223), the outer wall of the motor (223) is fixedly connected to the top of the processing table (1), the output end of the motor (223) is fixedly connected with a screw rod (224), and the outer wall of the screw rod (224) is threadedly connected with the inner wall of the translation seat (221).

6. The encapsulation adhesive potting device for preventing chip position deviation according to claim 1, wherein: The positioning support mechanism (3) comprises a support cylinder (311), and the top of the support cylinder (311) is fixedly connected with the bottom of the lifting plate (213).

7. The encapsulation adhesive potting device for preventing chip position deviation according to claim 1, wherein: The positioning support mechanism (3) further comprises a spring (312), and the top end of the spring (312) is fixedly connected with the inner wall top of the support cylinder (311).

8. The encapsulation adhesive potting device for preventing chip position deviation according to claim 1, wherein: The positioning support mechanism (3) further comprises a positioning rod (313), the outer wall of the positioning rod (313) is slidably connected with the inner wall of the support cylinder (311), and the top end of the positioning rod (313) is fixedly connected with the bottom end of the spring (312).

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