Silicon wafer cleaning device with inclined placing groove
By designing a silicon wafer cleaning device with an inclined placement groove and an isosceles triangular connecting plate, the problem of impurity accumulation during silicon wafer cleaning was solved, achieving effective silicon wafer cleaning and impurity removal, and improving cleaning effect and convenience.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-25
- Publication Date
- 2026-04-03
AI Technical Summary
In existing silicon wafer cleaning devices, impurities tend to accumulate at the bottom of the cleaning basket, affecting the subsequent cleaning effect, and existing devices are difficult to effectively remove contaminants from the surface of silicon wafers.
Design a silicon wafer cleaning device with an inclined placement tank. The device uses an inclined placement tank and an isosceles triangular connecting plate structure, combined with ultrasonic cleaning and a filter screen, to achieve inclined placement of silicon wafers and effective removal of impurities.
This technology enables the effective removal of impurities from silicon wafers during the cleaning process, preventing accumulation and improving cleaning efficiency and the convenience of subsequent cleaning.
Smart Images
Figure CN224072856U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of silicon wafer cleaning technology, specifically to a silicon wafer cleaning device with an inclined placement groove. Background Technology
[0002] Ultrathin silicon wafers are obtained through chemical mechanical polishing. In semiconductor device manufacturing, silicon wafers must undergo rigorous cleaning, as even trace amounts of contamination can lead to device failure. The purpose of cleaning is to remove surface contaminants, including organic and inorganic substances. These impurities exist on the silicon wafer surface in atomic or ionic states, as well as in thin film or particle forms. Cleaning ultrathin silicon wafers requires multiple cleaning processes. Most current cleaning devices utilize ultrasonic cleaning. Currently, silicon wafers are typically placed using cleaning baskets. During cleaning, impurities tend to accumulate at the bottom of the cleaning basket, affecting its subsequent use. Therefore, we propose a silicon wafer cleaning device with an inclined placement groove. Utility Model Content
[0003] The purpose of this invention is to provide a silicon wafer cleaning device with an inclined placement groove to solve the problems mentioned in the background art.
[0004] To achieve the above objectives, this utility model provides the following technical solution: a silicon wafer cleaning device with an inclined placement slot, comprising a cleaning tank, an ultrasonic generator at the bottom of the cleaning tank, a filter screen on the inner wall of the cleaning tank, a placement rack inside the cleaning tank, the placement rack including a first vertical plate inside the cleaning tank, a connecting plate on the rear side wall of the first vertical plate, a second vertical plate on the rear side wall of the connecting plate, multiple sets of partitions on the rear side wall of the first vertical plate and the front side wall of the second vertical plate, support plates on the rear side wall of the first vertical plate and the front side wall of the second vertical plate, and a lifting assembly on the rear side wall of the cleaning tank.
[0005] Furthermore, the rear side wall of the lifting assembly is provided with a mounting bracket, the top of the mounting bracket is connected to a threaded rod via a bearing, the outer wall of the threaded rod is fitted with a threaded sleeve, the rear side wall of the second vertical plate is provided with a fixing plate, one end of the threaded sleeve is connected to the top of the fixing plate, the outer wall of the threaded rod is fitted with a driven gear, the mounting bracket is provided with a driving gear that meshes with the driven gear, the top of the mounting bracket is provided with a motor, and the output end of the motor is connected to the top of the driving gear.
[0006] Furthermore, two sets of sliding rods are movably provided through the top of the fixed plate, and the bottom of both sets of sliding rods are connected to the rear side wall inside the cleaning tank. The sliding rods are arranged in an L-shape.
[0007] Furthermore, both sets of sliding rods are equipped with limiting plates at their tops.
[0008] Furthermore, the multiple sets of partitions are arranged at an angle, and an inclined placement groove is formed between each pair of partitions.
[0009] Furthermore, the first vertical plate, the second vertical plate, and the connecting plate are integrally formed.
[0010] Furthermore, the connecting plate is arranged in an isosceles triangular shape. Compared with the prior art, the beneficial effects of this utility model are: the supporting plate and partition plate of this utility model can tilt the silicon wafer, and the inclined placement groove is formed between the two partition plates, thereby ensuring that the silicon wafer can be tilted during cleaning. At the same time, the isosceles triangular connecting plate can discharge the cleaned impurities from the placement rack, avoiding the accumulation of impurities in the placement rack. With the help of the filter screen, the impurities can be filtered, which facilitates subsequent cleaning. Attached Figure Description
[0011] Figure 1 This is a schematic diagram of the structure of this utility model;
[0012] Figure 2 This is a left view of the structure of this utility model;
[0013] Figure 3 This is a schematic diagram of structure A of this utility model. In the diagram: 1. Cleaning tank; 2. Ultrasonic generator; 3. Filter screen; 4. Placement rack; 40. First vertical plate; 41. Second vertical plate; 42. Partition; 43. Connecting plate; 44. Support plate; 5. Lifting assembly; 50. Slide rod; 51. Threaded sleeve; 52. Limiting plate; 53. Threaded rod; 54. Mounting frame; 55. Motor; 56. Drive gear; 57. Driven gear; 58. Fixing plate. Detailed Implementation
[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0015] Example 1:
[0016] Please see Figure 1-3This utility model provides a technical solution: a silicon wafer cleaning device with an inclined placement groove, including a cleaning tank 1, an ultrasonic generator 2 at the bottom of the cleaning tank 1, a filter screen 3 on the inner wall of the cleaning tank 1, and a placement rack 4 inside the cleaning tank 1. The placement rack 4 includes a first vertical plate 40 inside the cleaning tank 1, a connecting plate 43 on the rear side wall of the first vertical plate 40, and a second vertical plate 41 on the rear side wall of the connecting plate 43. The first vertical plate 40, the second vertical plate 41, and the connecting plate 43 are integrally formed, and the connecting plate 43 is isosceles in shape. The triangular shape, combined with the isosceles triangular connecting plate 43, allows the cleaned impurities to be discharged from the placement rack 4, preventing impurities from accumulating inside the placement rack 4. Multiple sets of partitions 42 are provided on the rear side wall of the first vertical plate 40 and the front side wall of the second vertical plate 41. The multiple sets of partitions 42 are arranged at an incline, forming an inclined placement groove between each pair of partitions 42, thereby ensuring that the silicon wafers can be placed at an incline during cleaning. Support plates 44 are provided on the rear side wall of the first vertical plate 40 and the front side wall of the second vertical plate 41. A lifting assembly 5 is provided on the rear side wall of the cleaning box 1.
[0017] Please see Figure 1-2 The lifting assembly 5 has a mounting bracket 54 on its rear side wall. A threaded rod 53 is connected to the top of the mounting bracket 54 via a bearing. A threaded sleeve 51 is sleeved on the outer wall of the threaded rod 53. A fixing plate 58 is provided on the rear side wall of the second vertical plate 41. One end of the threaded sleeve 51 is connected to the top of the fixing plate 58. A driven gear 57 is sleeved on the outer wall of the threaded rod 53. A driving gear 56 that meshes with the driven gear 57 is provided inside the mounting bracket 54. A motor 55 is provided on the top of the mounting bracket 54. The output end of the motor 55 is connected to the top of the driving gear 56. Two sets of sliding rods 50 are movably connected through the top of the fixing plate 58. The bottom of both sets of sliding rods 50 is connected to the rear side wall of the cleaning tank 1. The sliding rods 50 are L-shaped. Under the action of the sliding rods 50, the fixing plate 58 moves up and down more stably. A limiting plate 52 is provided on the top of both sets of sliding rods 50. Under the action of the limiting plate 52, the fixing plate 58 can be limited to prevent the placement frame 4 from moving out of the sliding rods 50.
[0018] Working principle: The silicon wafer is placed in the inclined placement groove between the partitions. The support plate supports the silicon wafer. Then, the motor 55 drives the drive gear 56 to rotate, which in turn drives the driven gear 57 to rotate. The driven gear 57 drives the threaded rod 53 to rotate. Under the action of the slide rod 50, the threaded sleeve 51 moves downward on the outer wall of the threaded rod 53. The threaded sleeve 51 drives the fixed plate 58 to move downward. The fixed plate 58 drives the second vertical plate 41 and the first vertical plate 40 to move downward, thereby moving the silicon wafer into the cleaning tank 1. The ultrasonic high-frequency vibration of the ultrasonic generator 2 can quickly remove dirt and impurities from the surface of the silicon wafer. With the help of the isosceles triangular connecting plate 43, the cleaned impurities can be discharged from the placement rack 4, preventing impurities from accumulating in the placement rack 4. With the help of the filter screen 3, the impurities can be filtered, which facilitates subsequent cleaning. Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A silicon wafer cleaning device with a tilted slot, comprising a cleaning box (1), an ultrasonic generator (2) is arranged at the bottom of the cleaning box (1), characterized in that: The inner wall of the cleaning box (1) is provided with a filter screen (3), and the cleaning box (1) is provided with a placing rack (4), the placing rack (4) comprises a first vertical plate (40) provided in the cleaning box (1), the rear side wall of the first vertical plate (40) is provided with a connecting plate (43), the rear side wall of the connecting plate (43) is provided with a second vertical plate (41), the rear side wall of the first vertical plate (40) and the front side wall of the second vertical plate (41) are both provided with a plurality of partition plates (42), the rear side wall of the first vertical plate (40) and the front side wall of the second vertical plate (41) are both provided with a supporting plate (44), the rear side wall of the cleaning box (1) is provided with a lifting assembly (5), a plurality of partition plates (42) are arranged in an inclined manner, and inclined placing grooves are formed between every two partition plates (42), and the connecting plate (43) is arranged in an isosceles triangular shape.
2. The apparatus for cleaning a silicon wafer by setting a tilt placement slot according to claim 1, wherein: The rear side wall of the lifting assembly (5) is provided with a mounting bracket (54), a threaded rod (53) is connected to the inner top of the mounting bracket (54) through a bearing, a threaded sleeve (51) is connected to the outer wall of the threaded rod (53), a fixed plate (58) is arranged on the rear side wall of the second vertical plate (41), one end of the threaded sleeve (51) is connected to the top of the fixed plate (58), a driven gear (57) is mounted on the outer wall of the threaded rod (53), a driving gear (56) engaged with the driven gear (57) is arranged in the mounting bracket (54), and a motor (55) is arranged on the top of the mounting bracket (54), and the output end of the motor (55) is connected to the top of the driving gear (56).
3. The apparatus for cleaning a silicon wafer by setting a tilt placement slot according to claim 2, wherein: The top of the fixed plate (58) is movably penetrated by two groups of slide rods (50), the bottoms of the two groups of slide rods (50) are connected to the rear inner wall of the cleaning box (1), and the slide rods (50) are arranged in an L shape.
4. The apparatus for cleaning a silicon wafer by setting a tilt placement slot according to claim 3, wherein: The top of the fixed plate (58) is movably penetrated by two groups of slide rods (50), the bottoms of the two groups of slide rods (50) are connected to the rear inner wall of the cleaning box (1), and the slide rods (50) are arranged in an L shape.
5. The apparatus for cleaning a silicon wafer by disposing the wafer in an inclined slot according to claim 1, wherein: The first vertical plate (40), the second vertical plate (41) and the connecting plate (43) are integrally formed.