Reflow soldering furnace for reinforcing mainboard and electronic element

Abstract

The utility model discloses a reflow soldering furnace for reinforcing a mainboard and an electronic component, which comprises a working table, a transmission assembly is arranged above the working table, a soldering chamber is arranged on one side above the transmission assembly, a cooling chamber is arranged on one side of the transmission assembly far away from the soldering chamber, air inlets are arranged in the middle above the soldering chamber and the cooling chamber, and an air outlet is arranged on the other side of the transmission assembly far away from the cooling chamber. The welding chamber and the cooling chamber are both provided with fans below the air inlets, the welding chamber is provided with an electric heating box below the fans, an electric heating pipe is arranged in the middle of the electric heating box, an air outlet groove is formed in the bottom of the electric heating box, and the cooling chamber is provided with a plurality of heat exchange fins arranged at equal intervals below the fans. And cooling pipes are inserted into the heat exchange fins. The reflow soldering furnace is good in welding effect, welding of a mainboard and an electronic element can be rapidly completed, the cooling speed of the mainboard and the electronic element which are welded is high, and the welding quality of the mainboard and the electronic element is effectively guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of reflow oven technology, and in particular to a reflow oven for reinforcing motherboards and electronic components. Background Technology

[0002] A reflow soldering machine is a device that provides a heating environment to melt solder paste, thereby reliably bonding surface mount components (SMT) to PCB pads using the solder paste alloy. The solder used in reflow soldering is solder paste. An appropriate amount and type of solder paste is pre-applied to the PCB pads before the SMT components are placed in their corresponding positions, thus completing the soldering of the PCB. Early education machines, as intelligent terminal devices, integrate a large number of precision electronic components on their motherboards, requiring extremely high soldering quality. Chinese Patent No. CN222037086U discloses a reflow soldering device, including a reflow soldering box. A heating frame is welded to the left side of the top of the reflow soldering box, and several electric heating rods are installed inside the heating frame. In this utility model, a filter box is set in the discharge section of the reflow soldering box, and the filter is activated by activating the exhaust fan. The machine causes the exhaust fan to draw air from the inside of the filter box, and the negative pressure in the filter box forces the absorption hoods of the absorption tube to fully extract the welding gas from the reflow oven. This allows particulate matter in the welding gas to be filtered by the filter screen and activated carbon filter and retained in the filter box, while clean welding gas is introduced into the gas purification equipment for deep purification. At this time, the spray pipe sprays water into the filter box through several atomizing nozzles to reduce dust from the welding gas particles. However, this type of reflow oven does not have a cooling function. The soldered circuit boards are discharged from the reflow oven, which requires rapid cooling and solidification of the melted solder to form strong solder joints. This reduces the connection stability between the components and circuit boards and affects the quality of the motherboard. Therefore, we propose a reflow oven that strengthens the motherboard and electronic components. Utility Model Content

[0003] To address the aforementioned problems, this invention provides a reflow oven for reinforcing motherboards and electronic components. This invention solves the problem that reflow ovens lack cooling capabilities, requiring the soldered circuit boards to be rapidly cooled and solidified after melting to form strong solder joints. This reduces the connection stability between components and circuit boards, negatively impacting the quality of the motherboard.

[0004] This utility model discloses a reflow oven for reinforcing motherboards and electronic components, comprising a workbench, a transfer assembly above the workbench, a welding chamber on one side above the transfer assembly, a cooling chamber on the side of the transfer assembly away from the welding chamber, inlet and outlet ports at the lower ends of the sides of the welding chamber and cooling chamber away from each other, sealing assemblies outside the inlet and outlet ports of the welding chamber and cooling chamber, air inlets at the upper center of the welding chamber and cooling chamber, fans below the air inlets of the welding chamber and cooling chamber, an electric heating box below the fans in the welding chamber, an electric heating tube in the center of the electric heating box, multiple matrix-arranged air outlet slots at the bottom of the electric heating box, and multiple equidistantly arranged heat exchange fins below the fans in the cooling chamber, with cooling tubes inserted into the heat exchange fins.

[0005] Preferably, the transmission component includes a support frame, a motor is provided on one side of the support frame, the output end of the motor is fixedly connected to the drive roller, a driven roller is provided on the side of the support frame away from the drive roller, and the drive roller and the driven roller are connected by a transmission belt.

[0006] Preferably, the sealing assembly includes connecting blocks, and four connecting blocks are provided. The connecting blocks are located at both ends of the inlet and outlet. A support rod is provided between two connecting blocks located on the same side of the inlet and outlet. Both ends of the support rod are provided with sleeves. The sleeves are fixedly connected to the connecting plate. The two connecting blocks located on the same side of the inlet and outlet are fixedly connected to the sealing plate.

[0007] Preferably, the sealing plates are provided with handles on one side close to each other.

[0008] Preferably, a partition is provided between the welding chamber and the cooling chamber.

[0009] Preferably, the air inlet is equipped with a filter screen.

[0010] Preferably, a CNC panel is provided on the upper end of one side wall of the cooling chamber.

[0011] Compared with related technologies, this utility model has the following beneficial effects:

[0012] This invention provides a reflow oven for reinforcing motherboards and electronic components. A rotating conveyor belt transports the motherboard and electronic components. As they enter the soldering chamber, a fan drives airflow, which enters the heating chamber through an air inlet. The heating element heats the incoming airflow, effectively accelerating the soldering process. When the airflow enters the cooling chamber, coolant is injected into the cooling pipes through external pipes. The coolant exchanges heat with the heat exchange fins, which cool the airflow as it passes through them. This cooled airflow effectively cools the soldered electronic components. This reflow oven has a simple structure, provides excellent soldering results, and can quickly complete the soldering process for motherboards and electronic components. The rapid cooling of the soldered motherboard and electronic components effectively ensures the quality of the soldering. Attached Figure Description

[0013] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0014] Figure 1 This is a schematic diagram of the structure of this utility model;

[0015] Figure 2 This is a cross-sectional view of the present invention;

[0016] Figure 3 This is a schematic diagram of part A of the present invention;

[0017] Figure 4 This is a schematic diagram of part B of the present invention.

[0018] In the diagram: 1. Workbench; 2. Transmission assembly; 21. Support frame; 22. Motor; 23. Driven roller; 24. Driven roller; 25. Conveyor belt; 3. Welding chamber; 4. Cooling chamber; 5. Inlet / outlet; 6. Sealing assembly; 61. Connecting block; 62. Support rod; 63. Sleeve; 64. Connecting plate; 65. Sealing plate; 66. Handle; 7. Air inlet; 8. Fan; 9. Heating box; 10. Heating tube; 11. Air outlet duct; 12. Heat exchange fins; 13. Cooling pipe; 14. Partition; 15. Filter screen; 16. CNC panel. Detailed Implementation

[0019] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings and examples. The following examples are only used to more clearly illustrate the technical solution of this utility model and should not be construed as limiting the scope of protection of this utility model.

[0020] like Figure 1-4 As shown, this utility model is a reflow oven for reinforcing motherboards and electronic components. It includes a workbench 1, a conveyor assembly 2 above the workbench 1 for conveying the motherboard to be processed, a welding chamber 3 on one side above the conveyor assembly 2, and a cooling chamber 4 on the side of the conveyor assembly 2 away from the welding chamber 3. Both the welding chamber 3 and the cooling chamber 4 have inlet / outlet ports 5 at their lower ends on the opposite sides. A sealing assembly 6 is located outside the inlet / outlet ports 5 in both the welding chamber 3 and the cooling chamber 4. An air inlet 7 is located in the middle of the upper part of both the welding chamber 3 and the cooling chamber 4, allowing airflow into the welding chamber 3 and the cooling chamber 4. A fan 8 is located below the air inlet 7 in both the welding chamber 3 and the cooling chamber 4, accelerating airflow when the fan 8 is operating. An electric heating box 9 is located below the fan 8 in the welding chamber 3, and an electric heating tube 1 is located in the middle of the electric heating box 9. The bottom of the electric heating box 9 is provided with multiple matrix-arranged air outlet slots 11. When the electric heating tube 10 is working, the heat generated by the electric heating tube 10 can be diffused through the air outlet slots 11. The heat generated by the electric heating tube 10 can be used to solder electronic components. When the airflow driven by the fan 8 passes through the electric heating tube 10, the electric heating tube 10 heats the airflow. The heated airflow can effectively accelerate the soldering of electronic components in the reflow oven. The cooling chamber 4 is located below the fan 8 and is provided with multiple equidistantly arranged heat exchange fins 12. Cooling tubes 13 are inserted into the heat exchange fins 12. The cooling tubes 13 are connected to external pipes, through which coolant can be injected into the cooling tubes 13. The coolant exchanges heat with the heat exchange fins 12 through the cooling tubes 13. When the airflow passes through the heat exchange fins 12, the heat exchange fins 12 cool the airflow. The cooled airflow can cool the soldered electronic components.

[0021] The transmission component 2 includes a support frame 21. A motor 22 is provided on one side of the support frame 21. The output end of the motor 22 is fixedly connected to the drive roller 23. A driven roller 24 is provided on the side of the support frame 21 away from the drive roller 23. Both ends of the drive roller 23 and the driven roller 24 are movably connected to the support frame 21. The drive roller 23 and the driven roller 24 are connected by a transmission belt 25. When the motor 22 is working, the motor 22 drives the drive roller 23 to rotate. Through the transmission of the transmission belt 25, the drive roller 23 also rotates. Through the cooperation between the drive roller 23 and the driven roller 24, the transmission belt 25 can transport the motherboard to be soldered.

[0022] The sealing assembly 6 includes four connecting blocks 61 located at the ends of the inlet / outlet 5. A support rod 62 is provided between two connecting blocks 61 on the same side of the inlet / outlet 5. The two ends of the support rod 62 are movably connected to the connecting blocks 61, allowing the support rod 62 to rotate around the connecting blocks 61. Each end of the support rod 62 is provided with a sleeve 63, which is fixedly connected to a connecting plate 64. Two of the support rods on the same side of the inlet / outlet 5 are fixedly connected to a sealing plate 65. When the support rod 62 rotates, it drives the sleeve 63 to rotate. Through the transmission of the connecting plate 64, the sealing plate 65 also rotates, thus sealing the inlet / outlet 5 and reducing energy waste.

[0023] The sealing plates 65 are provided with handles 66 on one side close to each other, and the handles 66 make it easier to open and close the sealing plates 65.

[0024] A partition 14 is provided between the welding chamber 3 and the cooling chamber 4. The partition 14 can divide the welding chamber 3 and the cooling chamber 4, and the mutual influence between the welding chamber 3 and the cooling chamber 4 is effectively reduced by the setting of the partition 14.

[0025] The air inlet 7 is equipped with a filter screen 15, which can filter the airflow entering the welding chamber 3 and the cooling chamber 4.

[0026] A CNC panel 16 is provided on the upper end of one side wall of the cooling chamber 4, through which the working status of the reflow oven can be controlled.

[0027] Specifically, when soldering the motherboard and electronic components, the motherboard and electronic components to be soldered are placed on the conveyor belt 25. The motor 22 drives the drive roller 23 to rotate. Through the transmission of the conveyor belt 25, the drive roller 23 also rotates. The rotating conveyor belt 25 drives the motherboard and electronic components. When the motherboard and electronic components enter the soldering chamber 3, the fan 8 drives the airflow, so that the airflow enters the electric heating box 9 through the air inlet 7. The electric heating tube 10 heats the incoming airflow. The overheated airflow can effectively accelerate the soldering of electronic components in the reflow oven. When the airflow enters the cooling chamber 4, coolant is injected into the cooling pipe 13 through the external pipe. The coolant exchanges heat with the heat exchange fins 12 through the cooling pipe 13. When the airflow passes through the heat exchange fins 12, the heat exchange fins 12 cool the airflow. The cooled airflow can cool the soldered electronic components.

[0028] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A reflow soldering furnace for reinforcing a main board and electronic components, comprising a worktable (1), characterized in that, The workbench (1) is provided with a transmission assembly (2) above, one side of the transmission assembly (2) is provided with a welding chamber (3) above, the side away from the welding chamber (3) of the transmission assembly (2) is provided with a cooling chamber (4), the side away from each other of the welding chamber (3) and the cooling chamber (4) is provided with an inlet and outlet port (5) at the lower end, the welding chamber (3) and the cooling chamber (4) are provided with a blocking assembly (6) outside the inlet and outlet port (5), the welding chamber (3) and the cooling chamber (4) are provided with an air inlet (7) at the middle part above, the welding chamber (3) and the cooling chamber (4) are provided with a fan (8) below the air inlet (7), the welding chamber (3) is provided with an electric heating box (9) below the fan (8), the electric heating box (9) is provided with an electric heating tube (10) in the middle part, a plurality of air outlet grooves (11) are arranged in the matrix in the bottom of the electric heating box (9), the cooling chamber (4) is provided with a plurality of equidistantly arranged heat exchange fins (12) below the fan (8), and the heat exchange fins (12) are inserted with cooling pipes (13).

2. The reflow soldering furnace for reinforcing a main board and electronic components according to claim 1, wherein The transmission assembly (2) comprises a support frame (21), one side of the support frame (21) is provided with a motor (22), the output end of the motor (22) is fixedly connected with a driving roller shaft (23), the side away from the driving roller shaft (23) of the support frame (21) is provided with a driven roller shaft (24), and the driving roller shaft (23) and the driven roller shaft (24) are drivingly connected through a transmission belt (25).

3. The reflow soldering furnace for reinforcing a main board and electronic components according to claim 1, wherein The blocking assembly (6) comprises a connecting block (61), four connecting blocks (61) are arranged, the connecting blocks (61) are arranged at the both side ends of the inlet and outlet port (5), a supporting rod (62) is arranged between the two connecting blocks (61) on the same side of the inlet and outlet port (5), the both ends of the supporting rod (62) are provided with sleeve pipes (63), the sleeve pipes (63) are fixedly connected with connecting plates (64), and the two connecting blocks (61) on the same side of the inlet and outlet port (5) are fixedly connected with sealing plates (65).

4. The reflow soldering furnace for reinforcing a main board and electronic components according to claim 3, wherein The sealing plates (65) are provided with handles (66) on the side close to each other.

5. The reflow soldering furnace for reinforcing a main board and electronic components according to claim 1, wherein A partition plate (14) is arranged between the welding chamber (3) and the cooling chamber (4).

6. The reflow soldering furnace for reinforcing a main board and electronic components according to claim 1, wherein A filter screen (15) is arranged in the air inlet (7).

7. The reflow soldering furnace for reinforcing a main board and electronic components according to claim 1, wherein A numerical control panel (16) is arranged on the side wall of the cooling chamber (4) at the upper end.

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