Tin material recovery device
By using the guide and limit components and air knife components in the tin recycling device to process waste tin-coated solder strips, the problems of resource waste and production costs are solved, and efficient tin recycling and high recycling rate are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-31
- Publication Date
- 2026-04-03
AI Technical Summary
In existing technologies, the direct disposal of waste tin-coated solder ribbons leads to resource waste and increased production costs, and fails to effectively recycle tin.
A solder recycling device was designed, including a solder furnace, a guide and limiting component, and an air knife component. The guide and limiting component adjusts the flow channel and direction of the solder strip, and the air knife component separates the hot molten solder, so as to realize the synchronous processing of multiple solder strips.
It improves the efficiency of tin recycling, increasing the tin recycling rate to over 90%, avoids solder ribbon entanglement, and reduces production costs.
Smart Images
Figure CN224073525U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of industrial manufacturing, and more particularly to a highly efficient and high-recyclability device for recovering solder from waste tin-coated solder strips. Background Technology
[0002] Tinned solder ribbon (or tin-plated copper ribbon, PV solder ribbon) is a key component of mainstream photovoltaic modules. Currently, waste solder ribbon is generated during the production and commissioning processes of tinned solder ribbon. Generally, this waste ribbon is directly disposed of as scrap. However, the scrapped tinned solder ribbon is actually an alloy product made from processed copper, composed of both copper and tin. Directly disposing of it as scrap would result in a serious waste of resources and increase production costs. Summary of the Invention
[0003] To address the aforementioned technical problems, this application provides a novel solder recovery device. This device enables simultaneous solder removal from multiple waste solder strips, significantly improving solder removal efficiency.
[0004] This application provides a solder recovery device, which may include: a solder furnace; a guide and limiting component disposed on the solder furnace; and an air knife assembly disposed above the solder furnace; wherein the solder furnace is used to transfer solid solder from the solder-coated ribbon to hot-melt solder; the guide and limiting component defines the flow channel of the solder-coated ribbon and / or adjusts the flow direction so that the solder-coated ribbon flows in from the side of the solder furnace and then flows out from above the solder furnace; the air knife assembly is used to separate the hot-melt solder from the solder-coated ribbon flowing out from above the solder furnace.
[0005] According to some embodiments of this application, the guide limiting assembly may include a tooling frame and a guide limiting structure disposed on the tooling frame; the tooling frame may include side frames that are movably connected to the solder pot, and the guide limiting structure may be disposed between the side frames; when an external force is applied to the tooling frame, the guide limiting structure can enter or exit the solder pot.
[0006] According to some embodiments of this application, the guide limiting structure may include a tooling rod disposed between the side frames and one or more protrusions disposed on the tooling rod; a first space may be defined between two adjacent protrusions, or a second space may be defined between the protrusions and the side frames of the tooling frame to provide the flow channel, and the tooling rod may be used to adjust the flow direction.
[0007] According to some embodiments of this application, the guide limiting structure may include a tooling rod disposed between the side frames and one or more tooling guide wheels mounted on the tooling rod; the tooling guide wheels can provide the flow channel and are used to adjust the flow direction.
[0008] According to some embodiments of this application, the guide limiting structure may further include a guide rod, which may be arranged parallel to the tooling rod for adjusting the flow direction of the solder strip.
[0009] According to some embodiments of this application, the angle between the flow direction of the tin-coated solder strip after it flows out of the tin furnace and the horizontal plane can be 80°-100°.
[0010] According to some embodiments of this application, the flow direction of the solder strip after it flows out of the solder pot can be vertical.
[0011] According to some embodiments of this application, the air knife assembly may include air knives disposed on both sides of the solder strip flowing out of the tin furnace, and the angle between the air blowing direction of the air knife outlet and the solder strip may be 0-90°.
[0012] According to some embodiments of this application, the solder recovery device may further include a guide structure disposed above the air knife assembly for adjusting the flow direction of the solder strip passing through the air knife assembly.
[0013] This application also provides a method for recycling tin, which is based on the tin recycling apparatus described above.
[0014] The solder recycling device disclosed in this application limits and adjusts the flow channel and / or flow direction of waste solder strips by setting guide and limiting components, which can process multiple solder strips at the same time while avoiding entanglement between solder strips, thereby improving processing efficiency. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0016] Figure 1 These are exemplary structural diagrams of a tin recycling apparatus according to some embodiments of this application;
[0017] Figure 2 This is an exemplary structural diagram of a guide and limiting component according to some embodiments of this application;
[0018] Figure 3 This is an exemplary schematic diagram showing the flow direction according to some embodiments of this application;
[0019] Figure 4These are exemplary schematic diagrams of air knife assemblies according to some embodiments of this application;
[0020] Figure 5 These are exemplary structural diagrams of a tin recycling device according to some embodiments of this application;
[0021] Figure 6 This is an exemplary schematic diagram of a line segment shown according to some embodiments of this application;
[0022] Figure 7 This is an exemplary schematic diagram of a take-up segment according to some embodiments of this application. Detailed Implementation
[0023] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0024] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application and in its specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The terms "comprising" or "including," as used in this application, mean that an element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms "and / or" or "and / or" as used in this application include any and all combinations of one or more of the associated listed items.
[0025] The terms “comprising,” “having,” and their cognates used in this application are intended only to indicate a particular feature, number, step, operation, element, component, or combination thereof, and should not be construed as excluding, firstly, the presence of one or more other features, numbers, steps, operations, elements, components, or combinations thereof, or adding the possibility of one or more features, numbers, steps, operations, elements, components, or combinations thereof.
[0026] It should be noted that the terms "first," "second," "third," etc., used in this application are only for distinguishing descriptions and should not be construed as indicating or implying relative importance. When a component is referred to as being "fixed to," "installed on," or "set on" another component, it may be directly on the other component or may be connected to other components in between. When a component is considered to be "connected to" another component, it may be directly connected to the other component or may be connected to other components in between. The orientations or positional relationships indicated by terms such as "vertical," "parallel," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer" are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this application.
[0027] The following describes some preferred embodiments of this application. It should be noted that the following description is for illustrative purposes and is not intended to limit the scope of protection of this application. References Figure 1 The tin recycling apparatus shown according to some embodiments of this application may include a tin furnace 100 and a guide and limiting assembly ( Figure 1 Not shown in the image, please refer to the following: Figure 2 The diagram shows an exemplary structural diagram of the guide and limiting assembly, and the air knife assembly 300. Figure 1 As shown, the tin-coated solder ribbon AT (i.e. the aforementioned waste solder ribbon) flows in the tin recycling device according to the direction of the arrow shown in the figure. After flowing in from the side of the tin furnace 100, the flow direction is adjusted after passing through the guide and limit component, and then flows out from the top of the tin furnace 100. After passing through the air knife component 300, it enters the next process.
[0028] The solder pot 100 can be used to transfer solid solder from the solder ribbon AT to hot-melt solder. Exemplarily, the solder pot 100 can be made of high-purity quartz glass, boron nitride ceramic, or metal alloy materials such as stainless steel. An induction coil can surround its periphery to electrically heat its interior. Alternatively, a heating element such as a resistance wire or burner can be installed at the bottom of the solder pot 100 to heat its interior. This is not a limitation of this application. The solder pot 100 may also include a temperature sensor, such as a thermocouple disposed on the inner wall of the solder pot 100, to control the heating elements accordingly by sensing the internal temperature of the solder pot 100, for example, by raising, maintaining, or lowering the temperature. One feasible implementation is that the internal temperature of the solder pot 100 can be maintained near the melting point of tin, for example, 230°C-235°C. In this way, after the solder ribbon AT flows into the solder bath 100, the solid solder on it can be heated and transformed into molten hot solder, which greatly reduces the adhesion between the solder and the copper strip, which is beneficial for the solder to detach from the copper strip.
[0029] The solder strip AT, flowing from the side into the solder pot 100, flows out from the top of the solder pot 100 after passing through the guide and limiting assembly. Figure 2 The illustrated exemplary structural diagram of the guide limiting assembly 200 shows that the guide limiting assembly 200 may include a tooling frame 210 and a guide limiting structure 220 disposed on the tooling frame 210. The tooling frame 210 may include side frames 211 and connecting rods 212 connecting the two side frames 211. The side frames 211 may be movably connected to the solder pot 100. One possible approach is that the side frames 211 may be as follows: Figure 2 The diagram shows a two-section "L" configuration. One section is connected to the side wall (e.g., outer or inner wall) of the solder pot 100 via a rotating connector, such as a rolling bearing 213. A protrusion is provided on the side wall of the solder pot 100, which is fixedly connected to the inner ring of the rolling bearing 213. A through hole is provided on the side frame 211, which is fixed to the outer ring of the rolling bearing 213. This allows the side frame 211 to rotate relative to the solder pot 100. Alternatively, a recess is provided on the side wall of the solder pot 100 for fixing the rolling bearing 213, and a protrusion is provided on the side frame 211 for fixing to the inner ring of the rolling bearing 213. Furthermore, the rotating connection between the side frame 211 and the solder pot 100 can be achieved directly without an intermediate component (e.g., the aforementioned rolling bearing). That is, a frictional rotating connection is achieved through the engagement between the protrusion / protrusion and the recess. Of course, a lubricant can be used for the aforementioned rotating connection.
[0030] This section can also be slidably connected to the side wall of the solder pot 100. For example, grooves or protrusions are provided on the side frame 211 and the side wall of the solder pot 100, respectively, and the slidable connection is achieved through the cooperation between the two. Alternatively, it can be achieved by guide rails and sliders respectively provided on the side frame 211 and the side wall of the solder pot 100.
[0031] It should be noted that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. The movable connection between the tooling holder 210 and the side wall of the solder pot 100 can also take other forms. For example, it can be achieved through meshing gears and racks. These are all within the scope of protection of this application.
[0032] The other section of the side frame 211 can be connected via a connecting rod 212. For example, this section can have a threaded through hole, and both ends of the connecting rod 212 can have external threads. By screwing both ends of the connecting rod 212 into the through hole, the connection between the two side frames 211 can be achieved. Of course, snap-fit, socket, welding, and other methods are also applicable.
[0033] This section can also be used to set the guide limiting structure 220. For example, the guide limiting structure 220 may include a tooling rod 221 that is the same as or similar to the connecting rod 212. This tooling rod 221 can be arranged between the side frames 211 in the same or similar manner as the connecting rod 212. In this way, the guide limiting structure 220 can move together with the tooling frame 210. In some implementations, by applying an external force to the tooling frame 210, for example... Figure 2 Applying an upward or downward force at the location indicated by the middle arrow will cause the entire guide and limiting assembly 200 to rotate counterclockwise or clockwise. Thus, the guide and limiting assembly 200, at least the guide and limiting structure 220, can enter or exit the solder pot 100. Additionally, for ease of force application, a handle can be provided on the side frame 211, for example, at the location indicated by the arrow.
[0034] The tooling rod 221 can also be used to adjust the flow direction of the solder ribbon AT entering the solder bath 100. (Reference) Figure 3 An exemplary schematic diagram showing the flow direction is shown, such as Figure 3 As shown in (a), the solder ribbon AT that flows in horizontally in the direction of the arrow can flow out vertically after the direction of the tooling rod is adjusted.
[0035] The guide and limit assembly 200 can also be movably connected to the solder pot 100 in other ways. For example, the solder pot 100 may have a mounting bracket, for instance, disposed on the pot opening of the solder pot 100. The guide and limit assembly 200 is movably connected to this mounting bracket in the same manner as described above, thereby enabling entry and exit from the solder pot 100.
[0036] The guide and limiting structure 220 may also include one or more protrusions 222 disposed on the tooling rod 221. For example, the protrusion 222 may be a short rod, one end of which is fixed to the tooling rod 221. Thus, the protrusions 222 and the side frame 211 of the tooling frame 210 can be used for spatial separation. For example, the space between two adjacent protrusions 222 may be designated as a first space, and the space between the protrusion 222 and the side frame 211 may be designated as a second space. Each first or second space can provide a flow channel for one solder ribbon AT. That is, the solder ribbon flows within this space without intersecting with solder ribbon AT in other spaces, avoiding ribbon entanglement. Simultaneously, multiple solder ribbons AT are allowed to flow into the solder bath 100, improving the ribbon handling efficiency. Figure 2 As shown, three protrusions 222, together with two side frames 211, define a total of four spaces, including two first spaces and two second spaces. This allows four solder ribbons AT to be processed simultaneously without concern for ribbon entanglement during processing.
[0037] Figure 2 The diagram shows one example of the guide limiting structure 220, but other forms are also possible. For example, the guide limiting structure may include the aforementioned tooling rod and one or more tooling guide wheels, such as grooved guide wheels, mounted on the tooling rod. The flow path of the solder ribbon AT will be defined within the groove of the grooved guide wheel. Simultaneously, the tooling guide wheel can also adjust the flow direction of the solder ribbon AT, for example, from horizontal to vertical, similar to the tooling rod (see reference). Figure 3 (as shown in (a)).
[0038] It should be noted that the number of protrusions 222 or tooling guide wheels can be adjusted according to the actual situation, so as to achieve simultaneous processing of different numbers of solder strips.
[0039] In some feasible implementations, the guide limiting structure 220 may also include a guide rod ( Figure 2 (Not shown in the image). The guide rod can be arranged parallel to the tooling rod 221 and is used to adjust the flow direction of the solder ribbon AT. One example is that the guide rod may include one or more, and can be arranged between the connecting rod 212 and the tooling rod 221. The solder ribbon flowing out of the flow channel may change its flow direction after passing one or more of the aforementioned guide rods. (See reference...) Figure 3As shown in (b), the guide rods may include three. The solder ribbon AT flowing out of the flow channel can first flow horizontally into the first guide rod (e.g., from below the guide rod), then flow in and out above the second guide rod in the direction of the arrow, and enter the third guide rod from below, flowing out vertically. Multiple guide rods can provide greater tension for the solder ribbon AT to spread out as much as possible, thereby allowing the solid solder to be heated evenly and to convert as much of it as possible into hot melt solder.
[0040] The various components of the guide and limit assembly 200 can be made of metal or alloy, such as iron. This reduces costs and allows the entire assembly to maintain stability and prevent deformation compared to the temperatures within the tin furnace 100.
[0041] After passing through the guide and limiting component 200, the solder ribbon AT can flow out from above the solder pot 100. One feasible implementation is that the angle between the flow direction of the solder ribbon AT and the horizontal plane is 80°-100°. In this way, the hot molten solder on both sides of the solder ribbon AT can be more easily detached due to the combined effect of gravity. Optionally or preferably, the flow direction of the solder ribbon AT is vertical, that is, perpendicular to the horizontal direction.
[0042] The air knife assembly 300 may include air knives disposed on both sides of the solder strips AT flowing out of the solder bath 100. The air knife may be a strip-shaped air knife, with its outlet simultaneously covering multiple parallel solder strips AT flowing out of the solder bath 100, to simultaneously blow away the hot molten material from the base strip (i.e., the copper strip) into the solder bath 100 for collection. In some feasible implementations, the angle between the air knife outlet's blowing direction and the solder strips AT can be 0°-90°. (Reference) Figure 4 An exemplary schematic diagram of the air knife assembly is shown. Figure 4 As shown in (a), two air knives are positioned on either side of the solder strip AT, and the dashed lines indicate the airflow direction. For example, horizontal airflow is shown in the figure. The air knives can be installed using rotating components (e.g., ball joints), allowing them to be rotated after installation to adjust the airflow direction. Figure 4 As shown by the double arrows in (a), the air knife can be rotated. For example, rotating the left air knife clockwise and the right air knife counterclockwise will create an angle between 0° and 90° between the air knife and the solder pad AT. Figure 4 As shown in (b). This setting allows the air knife to be adjusted to a suitable blowing direction for maximum efficiency in desoldering.
[0043] Return to reference Figure 1The solder recovery device may further include a guide roller 400. The guide roller 400 can be used to deflect the upward-flowing solder strip AT, for example... Figure 1 The near-horizontal orientation shown is for subsequent recycling of solder ribbon AT. In some examples, the steering guide wheel 400 can be a multi-slot guide wheel, with each slot used for steering one solder ribbon AT.
[0044] Figure 5 A tin recycling apparatus according to some embodiments of this application is shown. For example... Figure 5 As shown, the solder recycling equipment 500 may include a wire feeding mechanism 510, a desoldering mechanism 520, and a wire take-up mechanism 530. The wire feeding mechanism 510 and the wire take-up mechanism 530 may be respectively arranged before and after the desoldering mechanism 520. "Wire feeding" and "wire take-up" can be understood as the coordinated traction and conveying of the solder-coated ribbon. For example, the solder-coated ribbon is drawn out from the wire feeding mechanism 510, flows to the desoldering mechanism 520, and is then collected by the wire take-up mechanism 530. The desoldering mechanism 520 may be the solder recycling device described above. After the solder-coated ribbon (i.e., the aforementioned flow) enters the solder furnace, it undergoes a hot-melt diversion and flows out. The hot-melt solder is stripped off by pneumatic air blowing from the air knife and recycled back into the solder furnace.
[0045] The wire feeding mechanism 510 may include a wire feeding frame 511 and a support 512. One end of the wire feeding rod 511 is fixedly connected to the support 512, and the other ends of both are fixedly connected to the mounting base plate. An exemplary structure of the wire feeding frame 511 can be found in [reference needed]. Figure 6 The device can be equipped with multiple feed rods 610, each of which can hold a piece of soldering tape wound onto a reel, for example, by fitting it onto the feed rod 610. The number of soldering tapes processed simultaneously can be adjusted by changing the number of reels placed on it.
[0046] The tin removal mechanism 520 can be a tin recycling device as described above, and will not be repeated here.
[0047] The receiving structure 530 may include a traction bracket 531, a traction wheel 532, a traction wheel 533, and a traction motor 534. An exemplary structure can be referred to. Figure 7 The traction wheels 720 (including traction wheels 721 and 722) can be connected to the traction bracket 710 by stacking them vertically. The upper and lower traction wheels can be connected and driven by belt B1, while the lower traction wheel and the traction motor 730 bracket can also be connected and driven by belt B2.
[0048] It should be noted that the above description is merely exemplary and not restrictive. Different configurations can be made according to actual needs without departing from the inventive concept of this application. For example, the wire feeding mechanism 510 can be passively feeding or driven by a motor. As another example, the wire take-up mechanism 530 can be replaced with a shaft take-up, coil take-up, or other methods for recovering the welding strip.
[0049] The tin recycling device disclosed in this application remelts the tin on the waste solder strip in the tin furnace and blows and rewinds it. Through continuous transmission of the waste solder strip from front to back, the product is continuously driven to remove tin in the tin furnace, which can achieve a tin recycling rate of over 90%.
[0050] The solder recycling device provided in this application limits and adjusts the flow channel and / or flow direction of waste solder strips by setting guide and limiting components, which can process multiple solder strips at the same time while avoiding entanglement between solder strips, thereby improving processing efficiency.
[0051] This application also discloses a method for recovering tin material, which can be used to recover tin material from waste solder strips using the aforementioned tin material recovery device.
[0052] This application has described the basic concepts. Obviously, for those skilled in the art, the above detailed disclosure is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore such modifications, improvements, and corrections still fall within the spirit and scope of the exemplary embodiments of this application.
[0053] Furthermore, this application uses specific terms to describe its embodiments. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic related to at least one embodiment of this application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this application do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application can be appropriately combined.
[0054] Similarly, it should be noted that, in order to simplify the description of this application and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of the embodiments of this application sometimes combines multiple features into one embodiment or its description. However, this disclosure method does not imply that the subject matter of this application requires more features than those mentioned in the claims. In fact, the embodiments have fewer features than all the features of the single embodiments disclosed above.
[0055] Finally, it should be understood that the embodiments described in this application are merely illustrative of the principles of the embodiments of this application. Other variations may also fall within the scope of this application. Therefore, as examples and not limitations, alternative configurations of the embodiments of this application can be considered consistent with the teachings of this application. Accordingly, the embodiments of this application are not limited to the embodiments explicitly described and illustrated in this application. The above descriptions are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A tin recycling device, characterized in that, The tin recycling device includes: Tin furnace; A guide and limiting assembly disposed on the tin furnace; and... An air knife assembly is disposed above the tin furnace; wherein... The tin furnace is used to transfer solid solder on the tin-coated solder strip to hot-melt solder; the guide and limiting component defines the flow channel of the tin-coated solder strip and / or adjusts the flow direction so that the tin-coated solder strip flows in from the side of the tin furnace and then flows out from the top of the tin furnace; The air knife assembly is used to separate the hot molten solder from the soldering strip flowing from above the solder furnace.
2. The tin recycling device according to claim 1, characterized in that, The guide limiting assembly includes a fixture and a guide limiting structure disposed on the fixture; the fixture includes a side frame that is movably connected to the solder pot, and the guide limiting structure is disposed between the side frames; when an external force is applied to the fixture, the guide limiting structure can enter or exit the solder pot.
3. The tin recycling device according to claim 2, characterized in that, The guide limiting structure includes a tooling rod disposed between the side frames and one or more protrusions disposed on the tooling rod; a first space defined between two adjacent protrusions, or a second space defined between the protrusions and the side frames of the tooling frame, is used to provide the flow channel, and the tooling rod is used to adjust the flow direction.
4. The tin recycling device according to claim 2, characterized in that, The guide limiting structure includes a tooling rod disposed between the side frames and one or more tooling guide wheels mounted on the tooling rod; the tooling guide wheels provide the flow channel and are used to adjust the flow direction.
5. The tin recycling device according to claim 3 or 4, characterized in that, The guide limiting structure also includes a guide rod, which is arranged parallel to the tooling rod and is used to adjust the flow direction of the solder strip.
6. The tin recycling device according to claim 1, characterized in that, The angle between the direction of the tin-coated solder strip flowing out of the tin furnace and the horizontal plane is 80°-100°.
7. The tin recycling device according to claim 6, characterized in that, The direction of the tin-coated solder strip after it flows out of the tin furnace is vertical.
8. The tin recycling device according to claim 1, characterized in that, The air knife assembly includes air knives disposed on both sides of the solder strip flowing out of the tin furnace, and the angle between the air blowing direction of the air knife outlet and the solder strip is 0-90°.
9. The tin recycling device according to claim 1, characterized in that, The tin recovery device also includes a guide structure disposed above the air knife assembly for adjusting the flow direction of the tin-coated solder strip passing through the air knife assembly.
10. The tin recycling device according to claim 9, characterized in that, The guiding structure includes steering guide wheels.