Arrangement equipment for polishing back surfaces of chips

Abstract

The utility model discloses an arrangement device for chip back polishing, which comprises a supporting combination frame and a heating through groove, the side edge of the supporting combination frame is provided with the heating through groove, the outer surface of the bottom of the supporting combination frame is provided with a fixing frame, and the fixing frame is provided with an installation groove. A combination groove and a storage groove are formed in the inner wall of the front end of the supporting combination frame, the combination groove communicates with the storage groove, an arrangement platform is installed in the supporting combination frame, and positioning bonding points are arranged on the top face of the arrangement platform. According to the arrangement equipment for chip back surface polishing, the supporting combination frame is installed at a proper position in the chip polishing equipment through the installation groove in the fixing frame to be fixed, subsequent uniform heating treatment is facilitated according to the heating through groove formed in the supporting combination frame, and the chip back surface polishing efficiency is improved according to positioning bonding points arranged on the arrangement platform at equal intervals. And the chip can be accurately bonded and cured to a proper position, so that subsequent batch polishing treatment is facilitated.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, specifically to an arrangement device for polishing the back of a chip. Background Technology

[0002] Chip processing refers to the process of processing chips, which requires tools and equipment. This includes smoothing and polishing the back of the chip, removing excess material from the back of the chip, reducing the roughness of the back surface, and arranging equipment for clamping and positioning the chip back for polishing.

[0003] Common methods for sorting and clamping chips include vacuum clamping, mechanical clamping, and adhesive clamping. Adhesive clamping uses a special adhesive film to fix the chip on the polishing platform. During chip polishing, heat annealing is required to relieve stress. The chip is then bonded and cured with a thermosetting adhesive, which requires a certain amount of time and heat treatment, thus affecting the efficiency of polishing the back of the chip.

[0004] An innovative design was made based on the existing arrangement equipment for polishing the back of chips. Utility Model Content

[0005] The purpose of this utility model is to provide an arrangement device for chip back polishing, so as to solve the problem mentioned in the background art that the common chip back polishing arrangement devices on the market require a certain amount of time and heat treatment to bond and cure the chips with thermosetting adhesives, which affects the work efficiency of chip back polishing.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a chip back-side polishing arrangement device, comprising a support assembly frame and a heating channel, wherein the support assembly frame has a heating channel on its side, and a fixing frame is provided on the bottom outer surface of the support assembly frame, and an installation slot is provided on the fixing frame; the front inner wall of the support assembly frame has a combination slot and a storage slot, and the combination slot and the storage slot are interconnected; an arrangement platform is installed inside the support assembly frame, and a positioning adhesive point is provided on the top surface of the arrangement platform; a combination side strip is provided on the side of the frame of the arrangement platform, and the combination side strip is located inside the combination slot.

[0007] Preferably, the connection between the fixed frame and the support assembly frame is welding, and the fixed frame has symmetrically distributed mounting grooves, while the support assembly frame has equally spaced heating slots.

[0008] Preferably, a limiting plate and a support spring are installed inside the storage slot, with the support spring located below the limiting plate. The limiting plate extends through the storage slot into the combination slot, and an adjusting rod is installed on the outer surface of the limiting plate, with the adjusting rod located below the arrangement platform.

[0009] Preferably, the limiting straight plate forms a telescopic structure with the support spring and the storage groove, and the connection between the limiting straight plate and the combination groove is a sliding connection, and the connection between the limiting straight plate and the outer surface of the combination side strip is a fitted connection.

[0010] Preferably, the connection between the adjusting rod and the limiting plate is an embedded fixation, and there is a gap between the adjusting rod and the arranging platform.

[0011] Preferably, the arranging platform has positioning adhesive points distributed at equal intervals, and the positioning adhesive points and the top surface of the arranging platform are flush with the top surface of the supporting assembly frame.

[0012] Preferably, the arrangement platform and the combined side strip are integrated into a single structure, and the combined side strip is connected to the supporting frame via a sliding connection through a combined groove.

[0013] Compared with the prior art, the beneficial effects of this utility model are: the arrangement equipment for polishing the back of the chip,

[0014] 1. The support assembly frame is fixed in a suitable position inside the chip polishing equipment by the mounting slot on the fixed frame. The heating slot on the support assembly frame facilitates uniform heating treatment. The positioning bonding points set at equal intervals on the arrangement platform can accurately bond and cure the chip to the appropriate position, which is beneficial for subsequent batch polishing.

[0015] 2. The arrangement platform is assembled and installed by sliding the combination side strips and combination grooves. It can be disassembled. After the chips that need to be polished are glued to the top surface of the arrangement platform in advance with thermosetting adhesive, the chips on the arrangement platform are preheated and cured by heating device. After the chips inside the polishing equipment are processed, they can be quickly replaced, improving the overall work efficiency.

[0016] 3. After the arranging platform is installed on the support frame, its position can be fixed by the limiting straight plate to prevent shaking and displacement during polishing. After subsequent processing, the positioning can be quickly released and the platform can be removed by pressing down the adjusting rod. The operation is convenient and fast. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall assembled three-dimensional structure of this utility model;

[0018] Figure 2 This utility model Figure 1 Enlarged structural diagram at point A in the middle;

[0019] Figure 3 This is a top view of the overall structure of this utility model;

[0020] Figure 4 This is a schematic diagram of the three-dimensional structure of the support frame of this utility model;

[0021] Figure 5 This is a schematic diagram of the three-dimensional structure of the arrangement platform of this utility model.

[0022] In the diagram: 1. Support frame; 2. Heating channel; 3. Fixing frame; 4. Mounting slot; 5. Combination slot; 6. Storage slot; 7. Limiting plate; 8. Supporting spring; 9. Adjusting rod; 10. Arrangement platform; 11. Positioning adhesive point; 12. Combination side strip. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figures 1 to 5 This utility model provides a technical solution: a chip back-side polishing arrangement device, including a support assembly frame 1 and a heating channel 2. The support assembly frame 1 has a heating channel 2 on its side, and a fixing frame 3 is provided on the bottom outer surface of the support assembly frame 1. The fixing frame 3 has an installation groove 4. The front inner wall of the support assembly frame 1 has a combination groove 5 and a storage groove 6, and the combination groove 5 and the storage groove 6 are interconnected. An arrangement platform 10 is installed inside the support assembly frame 1, and a positioning adhesive point 11 is provided on the top surface of the arrangement platform 10. A combination side strip 12 is provided on the side of the frame of the arrangement platform 10, and the combination side strip 12 is located inside the combination groove 5.

[0025] The connection between the fixed frame 3 and the support assembly frame 1 is by welding. The fixed frame 3 has symmetrically distributed mounting grooves 4, and the support assembly frame 1 has equally spaced heating grooves 2. The support assembly frame 1 can be fixedly installed inside the chip polishing equipment through the mounting grooves 4 on the fixed frame 3, which facilitates the subsequent assembly polishing work.

[0026] The storage slot 6 is equipped with a limiting plate 7 and a support spring 8. The support spring 8 is located below the limiting plate 7, and the limiting plate 7 extends through the storage slot 6 into the combination slot 5. An adjusting rod 9 is installed on the outer surface of the limiting plate 7, and the adjusting rod 9 is located below the arrangement platform 10. The limiting plate 7 and the storage slot 6 form a telescopic structure through the support spring 8. The limiting plate 7 and the combination slot 5 are connected by a sliding connection, and the limiting plate 7 and the outer surface of the combination side strip 12 are connected by a fitted connection. This allows the limiting plate 7 to telescopically move. The limiting plate 7 can be pushed into the combination slot 5 by the elastic force of the support spring 8 to maintain stability and prevent separation. The limiting plate 7 limits the combination side strip 12 to prevent shaking during subsequent polishing.

[0027] The adjusting rod 9 is connected to the limiting plate 7 by embedding and fixing. There is a gap between the adjusting rod 9 and the arranging platform 10. The adjusting rod 9 can be fixed to the limiting plate 7. When disassembling later, the adjusting rod 9 can be pressed down, which is convenient.

[0028] The arranging platform 10 has positioning adhesive points 11 evenly distributed on it, and the top surface of the arranging platform 10 and the top surface of the supporting assembly frame 1 are flush with each other. Based on the positioning adhesive points 11 set on the arranging platform 10, the chips can be accurately arranged and bonded through the positioning adhesive points 11.

[0029] The arranging platform 10 and the combined side strip 12 are integrated into one structure. The combined side strip 12 is connected to the supporting frame 1 via the combined groove 5 in a sliding connection manner. The arranging platform 10 is slidably assembled via the combined side strip 12 and the combined groove 5, making the overall assembly and disassembly convenient.

[0030] Working principle: According to Figures 1 to 5First, the support frame 1 can be placed on the worktable of the polishing equipment. Simultaneously, the mounting slots 4 on the bottom fixing frame 3 of the support frame 1 are assembled and fixed with bolts. Next, the chips can be pre-cured onto the arrangement platform 10 at suitable positions using thermosetting adhesive and positioning bonding points 11. Then, the chips on the arrangement platform 10 are heated and cured in advance. Next, the adjusting rod 9 is pressed down, pulling down the limiting plate 7. The limiting plate 7 retracts through the storage groove 6, pushing the support spring 8 to retract. Simultaneously, the limiting plate 7 separates from the assembly groove 5, allowing it to slide completely into the storage groove 6. Then, the arrangement platform 1 can be... The arrangement platform 10 is installed at the center of the support frame 1 by sliding the combination side strip 12 into the combination groove 5. Then, the adjusting rod 9 is released, and the limiting plate 7 is pushed back by the elastic force of the support spring 8. The top of the limiting plate 7 slides into the combination groove 5. At the same time, the limiting plate 7 and the outer surface of the combination side strip 12 are pressed together to maintain the stability of the arrangement platform 10 after installation. Subsequently, the chip bonded and cured on the arrangement platform 10 can be polished. At the same time, the heating channel 2 set on the support frame 1 is used for uniform heating and stress relief. The above is the working process of the whole device. All contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An arrangement for backside polishing of chips, comprising a support assembly frame (1) and a heating tunnel (2), characterized in that: The side of the support combination frame (1) is provided with a heating through groove (2), and the bottom outer surface of the support combination frame (1) is provided with a fixed frame (3), and the fixed frame (3) is provided with a mounting groove (4), the front end inner wall of the support combination frame (1) is provided with a combination groove (5) and a storage groove (6), and the combination groove (5) and the storage groove (6) are in communication with each other, and the inside of the support combination frame (1) is provided with an arrangement platform (10), and the top surface of the arrangement platform (10) is provided with a positioning adhesive point (11), and the frame side surface of the arrangement platform (10) is provided with a combination side strip (12), and the combination side strip (12) is located in the inside of the combination groove (5).

2. The arrangement device for backside polishing of a chip according to claim 1, wherein: The fixed frame (3) and the support combination frame (1) are connected by welding, and the fixed frame (3) is provided with a mounting groove (4) symmetrically, and the support combination frame (1) is provided with a heating through groove (2) at equal intervals.

3. The arrangement for backside polishing of a chip according to claim 1, wherein: The inside of the storage groove (6) is provided with a limiting straight plate (7) and a supporting spring (8), the supporting spring (8) is located below the limiting straight plate (7), and the limiting straight plate (7) extends into the combination groove (5) through the storage groove (6), and the outer surface of the limiting straight plate (7) is provided with an adjusting straight rod (9), and the adjusting straight rod (9) is located below the arrangement platform (10).

4. The arrangement according to claim 3, characterized in that: The limiting straight plate (7) and the storage groove (6) constitute a telescopic structure through the supporting spring (8), and the limiting straight plate (7) and the combination groove (5) are connected by sliding connection, and the limiting straight plate (7) and the outer surface of the combination side strip (12) are connected by adhering connection.

5. The arrangement according to claim 3, characterized in that: The adjusting straight rod (9) and the limiting straight plate (7) are connected by inlaying, and the adjusting straight rod (9) and the arrangement platform (10) have a spacing.

6. The arrangement for backgrinding a chip according to claim 1, wherein: The arrangement platform (10) is provided with a positioning adhesive point (11) at equal intervals, and the top surface of the positioning adhesive point (11) and the arrangement platform (10) is flush with the top surface of the support combination frame (1).

7. The arrangement according to claim 1, wherein: The arrangement platform (10) and the combination side strip (12) are provided in an integrated structure, and the combination side strip (12) and the support combination frame (1) are connected by sliding connection through the combination groove (5).

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