Film manufacturing device

Abstract

The utility model provides a film manufacturing device capable of continuously manufacturing laminated films. A film manufacturing device is provided with: a feeding means for feeding an original roll film having a first film and a functional film provided on the first film; a cutting unit that forms a functional layer by forming a notch in the functional film of the original roll film fed by the feeding unit; a removal unit that removes at least a portion of a region other than the functional layer in the functional film from the original roll film; the pasting unit is used for pasting a second film on the functional layer arranged on the first film to obtain a laminated film; a winding unit which winds the laminated film obtained by the pasting unit into a roll shape; and a conveyance unit that is provided between the feed-out unit and the take-up unit, and that conveys a laminated body before the laminated film is obtained using the original roll film.

Description

Technical Field

[0001] This utility model relates to a membrane manufacturing apparatus for manufacturing laminated membranes. Preferably, this utility model relates to a membrane manufacturing apparatus for manufacturing diced / chip bonding membranes. Background Technology

[0002] Semiconductor wafers (workpieces) with circuit patterns are diced into semiconductor chips (chip-shaped workpieces) after their thickness is adjusted by back-side grinding as needed (dicing process). During the dicing process, moderate hydraulic pressure (typically 2 kg / cm²) is used to remove the cutting layer. 2 (Left and right) The semiconductor wafer is cleaned. Next, after the semiconductor chip is fixed to a lead frame or other adhesive using an adhesive (mounting process), it proceeds to the bonding process. In the mounting process, an adhesive is applied to the lead frame and the semiconductor chip. However, this method makes it difficult to achieve a uniform adhesive layer, and the application of the adhesive requires special equipment and a long time. Therefore, a dicing / chip bonding film has been proposed that bonds and holds the semiconductor wafer during the dicing process and also provides an adhesive layer for chip fixing required in the mounting process (for example, see Patent Document 1).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 60-57642 Utility Model Content

[0006] The problem to be solved by the utility model

[0007] As an example of a laminated film such as a dicing / chip bonding film, there exists a laminated film in which multiple functional layers of a specific shape, such as an adhesive layer, are separately disposed on a first film such as a substrate film and a release film, and a second film such as other substrate films and other release films are further laminated on it.

[0008] The purpose of this invention is to provide a membrane manufacturing apparatus capable of continuously manufacturing laminated membranes.

[0009] Technical solutions for solving the problem

[0010] In order to solve the above-mentioned problems, the designers of this utility model conducted in-depth research and found that the above-mentioned problems could be solved, thus completing this utility model with the following main purpose.

[0011] That is, this utility model includes the following contents.

[0012] The first aspect of this utility model is a membrane manufacturing apparatus, which has:

[0013] The delivery unit delivers the original roll film, which has a first film and a functional film disposed on the first film;

[0014] A cutting unit forms a functional layer by making a cut in the functional film of the original roll film delivered by the delivery unit;

[0015] A removal unit that removes at least a portion of the region outside the functional layer in the functional film from the original roll film;

[0016] A pasting unit that pastes a second film onto the functional layer disposed on the first film to obtain a laminated film;

[0017] A winding unit that winds the laminated film obtained by the pasting unit into a roll; and

[0018] A conveying unit, disposed between the delivery unit and the winding unit, conveys the laminate before the laminate is obtained using the original roll film.

[0019] The second aspect of this invention is based on the membrane manufacturing apparatus of the first aspect, wherein the original roll film is a chip-bonded original roll film, and the chip-bonded original roll film has a release film as the first film and a chip-bonding film as the functional film.

[0020] The second film is a cutting film, which has a substrate and an adhesive layer disposed on the substrate.

[0021] The laminated film is a dicing / chip bonding film, which has the dicing film, a plurality of chip bonding layers as a plurality of functional layers disposed separately on the adhesive layer, and the release film disposed on the chip bonding layers.

[0022] The third aspect of this utility model is based on the film manufacturing apparatus of the second aspect, wherein the chip bonding original roll film further comprises a second release film disposed on the chip bonding film.

[0023] The fourth aspect of this invention is based on the membrane manufacturing apparatus of the first aspect, wherein the cutting unit has a cutter for forming the cut.

[0024] The fifth aspect of this utility model is based on the membrane manufacturing apparatus of the fourth aspect, wherein the cutter is a cutter used to form a closed-loop cut.

[0025] The sixth aspect of this utility model is based on the film manufacturing apparatus of the first aspect, wherein the removal unit comprises: an adhesive tape feeding member that feeds out an adhesive tape; an adhesive tape contact member that brings the adhesive tape into contact with the original roll film; an adhesive tape peeling member that peels off the adhesive tape; and an adhesive tape winding member that winds up the adhesive tape.

[0026] The seventh embodiment of this utility model is based on the membrane manufacturing apparatus of the first embodiment, wherein the bonding unit comprises: a second membrane delivery member that delivers the second membrane; and a second membrane bonding member that bonds the second membrane to the functional layer in such a way that the second membrane contacts the functional layer.

[0027] The eighth aspect of this utility model is based on the membrane manufacturing apparatus of the first aspect, wherein the membrane manufacturing apparatus further comprises an antistatic unit, which performs antistatic treatment on at least one of the laminates before obtaining the laminated membrane using the original roll film.

[0028] The ninth aspect of this utility model is based on the membrane manufacturing apparatus of the first aspect, wherein the membrane manufacturing apparatus further comprises a two-end removal unit, which removes the two ends of the laminated film in the width direction before the winding unit winds up the laminated film obtained by the bonding unit.

[0029] Utility Model Effect

[0030] According to the present invention, a membrane manufacturing apparatus capable of continuously manufacturing laminated membranes can be provided. Attached Figure Description

[0031] Figure 1 A schematic cross-sectional view of an example of chip bonding to the original roll film.

[0032] Figure 2 This is a schematic cross-sectional view of an example of a cut membrane.

[0033] Figure 3A This is a schematic diagram illustrating an example of a dicing / chip bonding film.

[0034] Figure 3B yes Figure 3A A-A' cross-sectional view of the cut / chip bonding film.

[0035] Figure 4A This is a schematic diagram illustrating another example of a diced / chip bonding film.

[0036] Figure 4B yes Figure 4A A-A' cross-sectional view of the cut / chip bonding film.

[0037] Figure 5A This is a schematic diagram illustrating an example of a chip bonding film.

[0038] Figure 5B yes Figure 5A A-A' cross-sectional view of the chip bonding film.

[0039] Figure 6A This is a schematic perspective view of an example of a membrane manufacturing apparatus.

[0040] Figure 6B yes Figure 6A A side view of the membrane manufacturing apparatus.

[0041] Figure 7 It is to utilize Figure 6A as well as Figure 6B or Figure 9A as well as Figure 9B A schematic cross-sectional view and a schematic top view of the state (structure) of the laminated film during the process of manufacturing a dicing / chip bonding film using a film manufacturing apparatus.

[0042] Figure 8A This is a schematic perspective view of an example of a cutting roller.

[0043] Figure 8B This is a schematic top view of an example of a sheet material with a cutter.

[0044] Figure 8C yes Figure 8B A-A' sectional view of the sheet material with a cutter.

[0045] Figure 9A This is a schematic perspective view of another example of a membrane manufacturing apparatus.

[0046] Figure 9B yes Figure 9A A side view of the membrane manufacturing apparatus.

[0047] Figure 10 This is a schematic perspective view of an example of re-fitting components.

[0048] Figure 11A This is a schematic perspective view of an example of a heating element.

[0049] Figure 11B This is a schematic perspective view of another example of a heating element.

[0050] Figure 12A This is a schematic perspective view of another example of a membrane manufacturing apparatus.

[0051] Figure 12B yes Figure 12A A side view of the membrane manufacturing apparatus.

[0052] Figure 13 It is to utilize Figure 12A as well as Figure 12BA schematic cross-sectional view and a schematic top view of the state (structure) of the laminated film during the process of manufacturing a dicing / chip bonding film using a film manufacturing apparatus. Detailed Implementation

[0053] (Membrane manufacturing apparatus and membrane manufacturing method)

[0054] The membrane manufacturing apparatus of this invention is an apparatus for manufacturing laminated membranes.

[0055] The membrane manufacturing apparatus includes a feeding unit, a cutting unit, a removal unit, a bonding unit, a winding unit, and a conveying unit.

[0056] The membrane manufacturing apparatus may also include a second removal unit, a static electricity removal unit, and a two-end removal unit.

[0057] The membrane manufacturing method of this invention is a method for manufacturing laminated membranes.

[0058] The membrane manufacturing method includes a feeding process, a cutting process, a removal process, a bonding process, a winding process, and a conveying process.

[0059] The membrane manufacturing method may also include a second removal process, a static electricity removal process, and a two-end removal process.

[0060] The laminated membrane has a first membrane, multiple functional layers, and a second membrane.

[0061] Examples of first membranes include substrate membranes and release membranes.

[0062] Examples of second membranes include substrate membranes and release membranes.

[0063] Functional layers can be, for example, adhesive layers.

[0064] The first membrane can be a single-layer structure or a multi-layer structure.

[0065] The second membrane can be a single-layer structure or a multi-layer structure.

[0066] There are no particular limitations on the type of laminated film; for example, the following laminated films can be cited.

[0067] (1): Cutting / chip bonding film

[0068] (2): Chip bonding laminate

[0069] (3): Chip protective film used to protect the surface of semiconductor chips

[0070] (4): A bonding film for bonding semiconductor wafers to enhancement wafers.

[0071] (5): Temporary fixing film used to temporarily fix semiconductor wafers during semiconductor wafer processing

[0072] The dicing / chip bonding film has a dicing film, multiple chip bonding layers, and a release film.

[0073] The cutting film has a substrate and an adhesive layer disposed on the substrate.

[0074] In the dicing / chip bonding film, multiple chip bonding layers are disposed separately on an adhesive layer.

[0075] In the dicing / die bonding film, a release film is disposed on the die bonding layer.

[0076] In the case where the laminated film is a cutting / chip bonding film, for example, the first film is a release film, the functional layer is a chip bonding layer, and the second film is a cutting film having a substrate and an adhesive layer disposed on the substrate.

[0077] In the case of a chip bonding laminate, for example, the first film is a release film, the functional layer is a chip bonding layer, and the second film is a release film (or a third release film).

[0078] It should be noted that the structural elements of the membrane manufacturing apparatus and membrane manufacturing method can be considered solely as the subject of this utility model.

[0079] <Delivery Unit and Delivery Process>

[0080] The delivery unit is the unit that delivers the original roll of film.

[0081] The delivery process is the process of delivering the original roll of film.

[0082] The original roll film is a laminated film consisting of at least a first film and a functional film stacked sequentially.

[0083] The original roll film may also have other films. For example, a release film can be considered as one of these other films. The release film is disposed on the functional film.

[0084] Original roll film, for example, is a chip bonding original roll film.

[0085] In the case where the original roll film is a chip bonding original roll film, for example, the first film is a release film and the functional film is a chip bonding film.

[0086] In the case where the original roll film is a chip bonding original roll film, the chip bonding original roll film may further have a second release film. The second release film is disposed on the chip bonding film.

[0087] The chip bonding original roll film is, for example, a laminated film in which a release film, a chip bonding film and a second release film are stacked in sequence.

[0088] The feeding unit may include, for example, a feeding roller for feeding the original roll of film, and a drive device (e.g., a motor) for rotating the feeding roller.

[0089] In the feeding process, for example, the original roll of film is fed out from the feeding roller.

[0090] There are no particular restrictions on the diameter of the feed roller, but it is preferably 70mm to 80mm.

[0091] The feed roller is, for example, an air shaft. The air shaft has a roller body and protrusions (claws) disposed on the outer peripheral surface of the roller body. When air is forced into the air shaft, the protrusions protrude from the outer peripheral surface. The protruding protrusions press against the inner surface of the film roll core. Thus, the film roll is secured.

[0092] The delivery unit may have a roll-out detection component that detects when the entire length of the roll film has been delivered from the delivery roller and when there is no roll film left on the delivery roller. There are no particular limitations on the roll-out detection component; for example, a sensor (e.g., an optical sensor) may be used.

[0093] The delivery unit may have a serpentine correction member for correcting the serpentine pattern of the original roll of film delivered from the delivery roller. The serpentine correction member may include, for example, a serpentine detection sensor and a serpentine correction roller. For instance, when the serpentine detection sensor detects a serpentine pattern in the original roll of film, the serpentine correction roller, which is in contact with the original roll of film, moves in the direction of the rotation axis to correct the serpentine pattern, thereby correcting the serpentine pattern.

[0094] The feeding unit may have a rotation suppression member to suppress the rotation of the feeding roller. Examples of rotation suppression members include magnetic powder brakes, electromagnetic brakes, and disc brakes.

[0095] The feeding unit may have a tension adjusting member that adjusts the tension of the original roll of film fed from the feeding roller. For example, a tension adjusting roller capable of moving in a direction orthogonal to the rotation axis can be considered as a tension adjusting member.

[0096] <Initiation Unit and Initiation Process>

[0097] The cutting unit is a unit that forms a functional layer by making a cut in the functional film of the original roll film delivered by the delivery unit.

[0098] The cutting process is a process of forming a functional layer by making a cut in the functional film of the original roll film sent out by the delivery process.

[0099] There are no particular restrictions on the shape of the cut, as long as it can form a functional layer in the resulting laminated film.

[0100] A functional layer can be formed by one cut or by two cuts.

[0101] As an example of the shape of a cut when a functional layer is formed by a single cut, a closed loop shape can be considered. In this case, the region inside the closed loop cut becomes the functional layer.

[0102] As for the shape of each cut when a functional layer is formed by two cuts, a line shape extending from one end of the functional membrane to the other can be cited as an example. By forming two such cuts, the area sandwiched between the two cuts becomes the functional layer. As a line shape, an arc shape can be cited as an example. For example, by forming two arc-shaped cuts with the inner sides of their respective arcs facing each other, a functional layer is formed in the area sandwiched between the two cuts.

[0103] An example of a dicing unit and dicing process is described when the original roll film is a chip bonding original roll film.

[0104] The cutting unit is a unit that forms a cut in the second release film and the chip bonding film from the second release film side for the chip bonding original roll film delivered by the delivery unit, thereby forming an inner second release film in the second release film and forming a chip bonding layer in the chip bonding film.

[0105] The cutting process involves forming a cut in the second release film and the chip bonding film from the second release film side on the chip bonding original roll film sent out by the delivery process, thereby forming an inner second release film in the second release film and forming a chip bonding layer in the chip bonding film.

[0106] The cutting unit is a unit that forms a closed-loop cut from the second release film side to the chip bonding original roll film delivered by the delivery unit, separating the second release film and the chip bonding film. This forms an inner second release film inside the cut in the second release film and a chip bonding layer inside the cut in the chip bonding film.

[0107] The cutting process involves forming a closed-loop cut from the second release film side to the chip bonding film sent out by the delivery process, separating the second release film and the chip bonding film, thereby forming an inner second release film inside the cut in the second release film, and forming a chip bonding layer inside the cut in the chip bonding film.

[0108] The cutting unit, for example, has a cutter that forms a cut.

[0109] In the cutting process, for example, a cut is formed in the functional membrane by a cutter that forms a cut.

[0110] The cutter is preferably a cutter used to form a closed-loop cut.

[0111] The cutting unit, for example, has a cutting roller and a support roller. The cutting roller has a cutter for forming a cut. The support roller supports the original roll of film when the cut is formed.

[0112] The support roller is rotated, for example, by a servo motor. The rotation of the cutting roller is synchronized with the rotation of the support roller. Synchronization is achieved, for example, by gears.

[0113] There are no particular restrictions on the diameter of the cutting roller, but it is preferably 100mm to 200mm.

[0114] There are no particular restrictions on the diameter of the support roller, but it is preferably 150mm to 200mm.

[0115] The cutting unit preferably has a heating element.

[0116] The cutting process preferably includes heat treatment.

[0117] The heating component is the component used to heat the original roll film.

[0118] Heat treatment is a process of heating the original roll of film.

[0119] Heating the original roll film can prevent the film (especially functional films such as chip bonding films) from cracking.

[0120] Heating of the original roll film is preferably achieved by blowing warm air onto the original roll film.

[0121] The heating element includes, for example, a warm air supply pipe and a warm air outlet. The warm air supply pipe is a pipe used to share warm air with the warm air outlet. The warm air outlet is an outlet used to allow warm air to contact the original rolled film. The warm air outlet is preferably made of transparent resin. This allows for visual inspection to confirm whether there are any defects in the original rolled film below the warm air outlet.

[0122] There are no particular restrictions on the distance between the warm air outlet and the cutting roller, but it is preferably 200mm to 250mm. This distance refers to the distance between the center of the warm air outlet and the center of the cutting roller.

[0123] Warm air is generated, for example, by a warm air generator. A warm air generator, for example, produces warm air by heating air with steam.

[0124] Regarding the heating temperature of the original roll film, if the functional film has thermosetting properties, it is preferable to be 80°C or lower, more preferably 40°C or lower, from the perspective of preventing the curing reaction of the functional film. On the other hand, from the perspective of making the functional film flexible, the heating temperature of the original roll film is preferably 30°C or higher.

[0125] The heating of the original roll film is preferably performed before the functional film is cut.

[0126] By heating the original roll of film, it is possible to prevent the functional film from rupturing when an incision is formed. For example, if the functional film is hard, there is a possibility of rupture when an incision is formed. In this case, by heating the original roll of film, the functional film becomes appropriately soft, thus preventing rupture when an incision is formed.

[0127] Other embodiments of the heating element include, for example, a heating platform that allows warm water to circulate inside, an electric heater, etc.

[0128] The cutting unit preferably has a re-fitting component.

[0129] The cutting process preferably includes a re-lamination process.

[0130] For example, in the case where the original roll film has a release film in contact with the functional film in addition to the first film and the functional film, the re-lamination component is a component that temporarily peels off the release film from the functional film of the original roll film and re-lamps the peeled release film onto the functional film.

[0131] For example, if the original roll film has a release film in contact with the functional film in addition to the first film and the functional film, the re-lamination process is a process of temporarily peeling off the release film from the functional film of the original roll film and re-laminating the peeled release film to the functional film.

[0132] The re-lamination of the original roll film is performed before the cuts are made in the release film and the functional film.

[0133] When the release film is adhered to the functional film with a peeling force greater than the intended peeling force, re-adhesion makes it easier to peel the release film from the functional film later.

[0134] In addition, if the original roll film is warped, the warping can be eliminated by re-laminating it.

[0135] In the cutting unit, the positional relationship between the heating component and the re-laminating component is not particularly limited. For example, in the original film conveying direction, the re-laminating component can be arranged on the upstream side and the heating component on the downstream side, or the heating component can be arranged on the upstream side and the re-laminating component on the downstream side.

[0136] <Removal Unit and Removal Process>

[0137] A removal unit is a unit that removes at least a portion of the area outside the functional layer from the original roll of film.

[0138] The removal process is a process of removing at least a portion of the area outside the functional layer from the original roll of film.

[0139] An example of a removal unit and removal process is described when the original roll film is a chip-bonded original roll film.

[0140] The removal unit is a unit that removes at least a portion of the outer region of the cut in the chip bonding film and the inner second peeling film from the chip bonding original roll film.

[0141] The removal process is a process of removing at least a portion of the outer region of the cut in the chip bonding film and the inner second release film from the chip bonding original roll film.

[0142] The removal unit may include, for example, an adhesive tape feeding member, an adhesive tape contact member, an adhesive tape peeling member, and an adhesive tape take-up member.

[0143] An adhesive tape feeder is a component that feeds out adhesive tape, such as a feed roller.

[0144] Adhesive tape contact components are components that bring the adhesive tape into contact with the original roll of film, such as a pair of clamping rollers.

[0145] An adhesive tape contact member is, for example, a member that makes contact between the adhesive tape and at least a portion of the area outside the functional layer in the functional film.

[0146] The adhesive tape contact member is, for example, a member that contacts at least a portion of the outer region of the cut in the chip bonding film and the inner second release film.

[0147] An adhesive tape peeling component is a component that peels off adhesive tape, such as a peeling roller.

[0148] An adhesive tape take-up component is a component that takes up adhesive tape, such as a take-up roller.

[0149] There are no particular restrictions on the diameter of the feed roller, but it is preferably 70mm to 80mm.

[0150] The feed roller is, for example, an air shaft.

[0151] There are no particular limitations on the diameter of each of the pair of clamping rollers, but for example, it is 50mm to 150mm, preferably 90mm to 110mm.

[0152] There are no particular restrictions on the diameter of the stripping roller, but it is preferably 15 mm to 25 mm.

[0153] There are no particular restrictions on the diameter of the take-up roller, but it is preferably 70mm to 80mm.

[0154] The removal process can be performed using adhesive tape delivery components, adhesive tape contact components, adhesive tape peeling components, and adhesive tape take-up components, for example.

[0155] The removal process is performed, for example, by using an adhesive tape contact member to bring at least a portion of the adhesive tape delivered from the adhesive tape delivery member into contact with the area outside the functional layer in the functional film, then using an adhesive tape peeling member to peel off the adhesive tape, and then using an adhesive tape winding member to wind up the adhesive tape.

[0156] An example of the removal process is described when the original roll film is a chip bonding original roll film.

[0157] The removal process is performed, for example, by using an adhesive tape contact member to bring the adhesive tape delivered from the adhesive tape delivery member into contact with at least a portion of the outer region of the cut in the chip bonding film and the inner second release film, then using an adhesive tape peeling member to peel off the adhesive tape, and using an adhesive tape winding member to wind up the adhesive tape.

[0158] When peeling off the adhesive tape, the peeling angle is preferably less than 90° in the angle formed by the adhesive tape and the upstream side of the transport direction. This prevents warping, shaking, and misalignment of the laminated film in the transport direction. Furthermore, it prevents the chip bonding layer from being removed by the peeled adhesive tape.

[0159] For example, the adhesive tape peeling member is positioned downstream of the component (e.g., guide roller or take-up roller) that the adhesive tape contacts after the adhesive tape peeling member contacts the adhesive tape. Therefore, the peeling angle is less than 90° in the angle between the adhesive tape and the upstream side of the conveying direction.

[0160] The adhesive tape delivery member may have a tape exhaustion detection member that detects the exhaustion of the entire length of adhesive tape when it has been delivered from the adhesive tape delivery member and when there is no adhesive tape left in the adhesive tape delivery member. There are no particular limitations on the tape exhaustion detection member; for example, a sensor (e.g., an optical sensor) may be used.

[0161] The removal unit may have a serpentine correction member for correcting the serpentine pattern of the adhesive tape fed from the adhesive tape feeder. The serpentine correction member may include, for example, a serpentine detection sensor and a serpentine correction roller. For instance, when the serpentine detection sensor detects a serpentine pattern in the adhesive tape, the serpentine correction roller, which is in contact with the adhesive tape, moves in the direction of the rotation axis to correct the serpentine pattern, thereby correcting the serpentine pattern.

[0162] The feed roller, which serves as the adhesive tape feeding member, the pair of clamping rollers, which serve as the adhesive tape contact member, the peeling roller, which serves as the adhesive tape peeling member, and the take-up roller, which serves as the adhesive tape take-up member, may each have a rotation suppression member for suppressing rotation. Examples of rotation suppression members include magnetic powder brakes, electromagnetic brakes, and disc brakes.

[0163] The take-up roller, which serves as the adhesive tape take-up component, can be rotated by a speed control motor capable of changing its rotational speed.

[0164] The take-up roller, which is an adhesive tape take-up component, may be equipped with a magnetic powder clutch for controlling the tension of the take-up adhesive tape.

[0165] When the original roll film is a chip bonding original roll film and the film manufacturing apparatus has a second removal unit, the removal unit is, for example, the following unit: after the chip bonding original roll film has been removed from the second release film (excluding the inner second release film), at least a portion of the outer region of the cut in the chip bonding film and the inner second release film are removed in such a way that a plurality of chip bonding layers are separately disposed on the release film and the inner second release film is peeled off from the chip bonding layers.

[0166] When the original roll film is a chip bonding original roll film and the film manufacturing method has a second removal step, the removal step is, for example, the following step: after the chip bonding original roll film is removed from the second release film (excluding the inner second release film), at least a portion of the outer region of the cut in the chip bonding film and the inner second release film are removed in such a way that a plurality of chip bonding layers are separately disposed on the release film and the inner second release film is peeled off from the chip bonding layers.

[0167] <Paste unit and paste procedure>

[0168] The bonding unit is a unit that bonds a second membrane to a functional layer disposed on a first membrane to obtain a laminated membrane.

[0169] The bonding process is a process of bonding a second film onto a functional layer set on a first film to obtain a laminated film.

[0170] An example of a bonding unit and bonding process is described in the case where the original roll film is a chip bonding original roll film and the laminated film is a diced / chip bonding film.

[0171] The bonding unit is a unit that bonds a dicing / die bonding film by bonding multiple die bonding layers disposed on a release film in a phase-separated manner with the die bonding layers in contact with the adhesive layer.

[0172] The bonding process is a process of bonding a dicing film to multiple chip bonding layers that are separately disposed on a release film in a manner in which the chip bonding layers contact the adhesive layer.

[0173] The bonding unit, for example, has a second membrane delivery member and a second membrane bonding member.

[0174] The second membrane delivery component is the component that delivers the second membrane, such as a delivery roller.

[0175] The second membrane bonding component is a component that bonds the second membrane to the functional layer in a manner that the second membrane contacts the functional layer, such as a pair of clamping rollers.

[0176] In the case where the original roll film is a chip bonding original roll film and the laminated film is a dicing / chip bonding film, the second film bonding member is, for example, a member that bonds the dicing film to a plurality of chip bonding layers that are separately disposed on the release film in a manner in which the chip bonding layer contacts the adhesive layer.

[0177] There are no particular restrictions on the diameter of the feed roller, but it is preferably 70mm to 80mm.

[0178] The feed roller is, for example, an air shaft.

[0179] There are no particular limitations on the diameter of each of the pair of clamping rollers, but for example, it is 50mm to 150mm, preferably 90mm to 110mm.

[0180] The bonding process can be performed, for example, using a second membrane delivery component and a second membrane bonding component.

[0181] The bonding process is performed, for example, by using a second membrane bonding member to bond a second membrane delivered from a second membrane delivery member to a functional layer in such a way that the second membrane comes into contact with the functional layer.

[0182] An example of the bonding process is described in the case where the original roll film is a chip bonding original roll film and the laminated film is a diced / chip bonding film.

[0183] The bonding process is performed, for example, by using a second film bonding member to bond a cut film delivered from a second film delivery member to a plurality of chip bonding layers disposed separately on a release film in such a manner that the chip bonding layer and the adhesive layer come into contact.

[0184] The second membrane delivery member may have a membrane depletion detection member that detects when the entire length of the second membrane is delivered from the second membrane delivery member and when the second membrane delivery member does not have a second membrane. There are no particular limitations on the membrane depletion detection member; for example, a sensor (optical sensor) may be used.

[0185] <Winding unit and winding process>

[0186] A take-up unit is a unit that takes the laminated film obtained from the bonding unit and rolls it into a roll.

[0187] The winding process is the process of winding the laminated film obtained from the bonding process into a roll.

[0188] The winding unit, for example, has a winding roller.

[0189] The winding process is performed, for example, by winding the laminated film onto a winding roller.

[0190] There are no particular restrictions on the diameter of the take-up roller, but it is preferably 70mm to 80mm.

[0191] The take-up roller is, for example, an air shaft.

[0192] The take-up unit may have a serpentine correction member for correcting the serpentine shape of the laminated film wound on the take-up roller. The serpentine correction member may include, for example, a serpentine detection sensor and a serpentine correction roller. For instance, when the serpentine detection sensor detects a serpentine shape in the laminated film, the serpentine correction roller, which is in contact with the laminated film, moves in the direction of rotation to correct the serpentine shape of the laminated film, thereby correcting the serpentine shape.

[0193] The take-up unit may have a rotation suppression member that suppresses the rotation of the take-up roller. Examples of rotation suppression members include magnetic powder brakes, electromagnetic brakes, and disc brakes.

[0194] The take-up roller can be rotated by a speed control motor that can change the rotation speed.

[0195] The take-up roller may be equipped with a magnetic powder clutch, which is used to control the tension of the laminated film being taken up.

[0196] <Conveying Units and Conveying Processes>

[0197] The conveying unit is a unit located between the delivery unit and the winding unit, which conveys the laminate before the original roll film is used to obtain the laminated film.

[0198] The conveying process is the process of conveying the laminated body before obtaining the laminated film using the original roll film.

[0199] The conveying unit preferably has a pair of clamping rollers. When the laminate is conveyed by clamping with a pair of clamping rollers, the laminate will not bend compared with the case of conveying the laminate by driving rollers and guide rollers, thus preventing the films (especially functional films (e.g., chip bonding films) and functional layers (e.g., chip bonding layers)) from breaking.

[0200] Typically, multiple pairs of clamping rollers are arranged along the conveying path. In this case, the rotation of multiple pairs of clamping rollers is preferably synchronized by a servo motor.

[0201] The pair of clamping rollers are preferably synchronized with the cutting rollers via a servo motor.

[0202] The pair of clamping rollers preferably have a structure in which the upper roller presses against the lower roller. In this case, the upper roller is pressed against the lower roller by a pressing unit. The pressing unit can be, for example, a lifting cylinder. The cylinder can be, for example, a lifting cylinder, a hydraulic cylinder, etc.

[0203] There are no particular restrictions on the material of the pair of clamping rollers, but considering the difficulty of bonding the conveyed laminate, rollers made of silicone resin are preferred as a pair of clamping rollers.

[0204] The diameter of each roller, which is a pair of clamping rollers, is not particularly limited, but is, for example, 50 mm to 150 mm, preferably 90 mm to 110 mm.

[0205] <Second Removal Unit and Second Removal Process>

[0206] The second removal unit is a unit present in a film manufacturing apparatus, for example, when the original roll film is a chip-bonded original roll film and the laminated film is a cut / chip-bonded film.

[0207] The second removal process is a process present in the film manufacturing method, for example, when the original roll film is a chip bonding original roll film and the laminated film is a dicing / chip bonding film.

[0208] The second removal unit is a unit that removes the second release film, excluding the inner second release film, from the chip bonding original roll film with slits.

[0209] The second removal process is the process of removing the second release film, excluding the inner second release film, from the chip bonding original roll film with slits.

[0210] The second removal unit, for example, has a stripping roller and a take-up roller.

[0211] The second removal process is performed, for example, by using a peeling roller to peel off the second peeling film other than the inner second peeling film and using a take-up roller to take it up.

[0212] The stripping roller and the take-up roller can be rotated by speed control motors that can change their rotation speed.

[0213] The peeling roller and the take-up roller may be equipped with a magnetic powder clutch, which is used to control the tension of the unwanted film being taken.

[0214] There are no particular restrictions on the diameter of the stripping roller, but it is preferably 15mm to 25mm.

[0215] There are no particular restrictions on the diameter of the take-up roller, but it is preferably 70mm to 80mm.

[0216] The take-up roller is, for example, an air shaft.

[0217] <Electrostatic removal unit and electrostatic removal process>

[0218] The de-energizing unit is a unit that de-energizes at least one of the laminates before obtaining the laminated film using the original roll film, for example, having an ion generator.

[0219] The static removal process is a process of removing static electricity from at least one of the laminates before obtaining the laminate from the original roll film, for example, by using an ion generator.

[0220] If the laminate is charged, the peeling force when separating the individual films from the laminate will vary depending on the amount of charge (electrostatic charge). In this case, the manufacturing of the laminated film may be unstable. Therefore, by removing the charge from each layer of the laminate, the manufacturing process of the laminated film can be stabilized.

[0221] Furthermore, if the laminates are charged, electrical sparks generated between them can cause ruptures, abnormal adhesion, and poor appearance in the laminated film. Therefore, by de-energizing each laminate, ruptures, abnormal adhesion, and poor appearance in the laminated film can be prevented.

[0222] An ion generator supplies ions to the laminate. The ion generator can supply both positive (plus) and negative (minus) ions to the laminate. The supply of positive and negative ions is controlled by a control device.

[0223] The ion generator includes, for example, discharge needles for positive and negative ions. By applying voltage to each discharge needle, corona discharge is generated, and the resulting positive or negative ions are supplied to the laminate via an ion supply port. By orienting the ion generator's supply port toward the laminate, the laminate being transported is de-electrolyzed using the ions supplied from the ion supply port.

[0224] The concentration of positive or negative ions can be adjusted manually or automatically.

[0225] The concentration of ions supplied from the ion generator to the laminate is adjusted according to the charge on the laminate. Static electricity is removed from the laminate by supplying deionized ions to the laminate being transported.

[0226] Alternatively, for example, a sensor for detecting the charge level can be placed within the transport path, and the signal from the sensor can be processed so that the detection circuit can determine the charge level of the laminate, and the supply of positive and negative ions can be adjusted based on the charge level determined by the detection circuit.

[0227] In order to disperse the ions as uniformly as possible relative to the laminate, air containing the ions can be supplied at a given wind pressure.

[0228] <Two-end removal unit and two-end removal process>

[0229] The two-end removal unit is a unit that cuts off both ends of the laminated film in the width direction before the laminated film obtained by the bonding unit is wound up using the winding unit.

[0230] The end removal process is a process of cutting off both ends of the laminated film in the width direction before the laminated film obtained by the bonding process is wound up in the winding process.

[0231] The lamination of the laminated film is uneven at both ends in the width direction due to positional misalignment during film stacking. Therefore, by cutting off both ends of the laminated film in the width direction before winding, the lamination at both ends becomes uniform.

[0232] The width of each of the two ends being cut can be, for example, 10mm to 20mm.

[0233] The two-end removal unit, for example, has an end take-up roller and a cutting member. The end take-up roller is a roller that takes up the two ends to be cut. The cutting member is a member that cuts off the two ends of the laminated film in the width direction, for example, a cutting blade. The cutting blade is, for example, a disc-shaped razor.

[0234] The end take-up roller can be rotated by a speed control motor that can change the rotation speed.

[0235] The end take-up roller is preferably movable along the rotation axis. This prevents the taken-up end from concentrating in a certain part of the end take-up roller.

[0236] There are no particular restrictions on the diameter of the end take-up roller, but it is preferably 70mm to 80mm.

[0237] The end take-up roller is, for example, an air shaft.

[0238] <Other Units and Other Processes>

[0239] Other examples of such units include a marking unit and a marking detection unit.

[0240] Other examples include the marking process and the marking inspection process.

[0241] In cases where the original roll film has a release film in addition to the first film and the functional film, markings are, for example, added to the release film.

[0242] In the case where the original roll film is a chip bonding original roll film, markings are, for example, affixed to the second release film.

[0243] A marking unit is a unit that adds markings to the release film of the original roll film. A marking unit may have, for example, an ink-applying component. Examples of ink-applying components include pens, inkjet heads, etc. The inkjet head ejects ink.

[0244] The marking process is the process of adding marks to the release film of the original roll of film. The marking process is, for example, performed by applying ink to the release film of the original roll of film.

[0245] For example, markings are added by having a pen come into contact with the release film of the original roll film at certain intervals.

[0246] For example, ink is ejected from the inkjet head at certain intervals to coat the release film of the original roll film in a non-contact manner.

[0247] Markings, for example, are attached to the peeling film of the original roll of film before the incision is formed.

[0248] As a symbol, a straight line of a certain length can be given as an example.

[0249] A mark detection unit is a unit that detects marks attached to a release film. A mark detection unit may include, for example, a mark detection sensor (e.g., an optical sensor) that detects the marks.

[0250] The marking inspection process is the process of inspecting the markings attached to the release film.

[0251] The detection of markings is performed, for example, after the adhesive tape is peeled off from the original roll of film. If a marking is detected at this time, it can be confirmed that the release film that should have been peeled off has not been peeled off and remains, thus detecting a process defect.

[0252] <Chip-to-Original Roll Film>

[0253] The chip bonding original roll film, as an example of the original roll film, will be described.

[0254] like Figure 1 As shown, the chip bonding original roll film 1010 is a laminated film consisting of a release film 1011, a chip bonding film 1012, and a second release film 1013 stacked sequentially.

[0255] The release film 1011 functions as a protective material to protect the die bonding layer until it is ready for practical use. The release film 1011 acts as a support substrate during the manufacturing process of the dicing / die bonding film. The release film 1011 is typically peeled off when a workpiece is bonded to the die bonding layer of the dicing / die bonding film.

[0256] Examples of release films 1011 include plastic films obtained by coating the surface of a release agent such as polyethylene, polypropylene, fluorinated release agent, or long-chain alkyl acrylate release agent.

[0257] The thickness of the release film 1011 is not particularly limited, but for example, it is 5 μm or more and 100 μm or less, preferably 10 μm or more and 50 μm or less.

[0258] The chip bonding film 1012 is processed into a chip bonding layer during the manufacture of the dicing / chip bonding film. When a workpiece (semiconductor wafer, etc.) pressed onto the chip bonding layer is diced into a chip shape, the chip bonding layer is closely adhered to and supported by the workpiece. Furthermore, when the chip-shaped workpiece (semiconductor chip, etc.) is mounted as a diced piece, the chip bonding layer functions as an adhesive layer to fix the chip-shaped workpiece to the semiconductor element (substrate, chip, etc.).

[0259] The die bonding film 1012 can be formed using a conventional die adhesive. Preferably, the die adhesive is in sheet form. Specifically, die adhesives comprising thermoplastic resins or thermosetting resins are preferred. The die adhesive can be used alone or in combination of two or more. Furthermore, the die bonding film 1012 is preferably able to bond to workpieces such as semiconductor wafers and dicing rings at temperatures below 70°C. It is further preferred that it can bond at room temperature.

[0260] Examples of thermoplastic resins (thermoplastic chip adhesives) used as chip adhesives include saturated polyester resins, thermoplastic polyurethane resins, amide resins (nylon resins), and imide resins. Examples of thermosetting resins (thermosetting chip adhesives) include epoxy resins, unsaturated polyester resins, thermosetting acrylic resins, and phenolic resins. Thermosetting resins that have undergone desolvation, sheet forming, and B-stage modification are preferred. It should be noted that mixtures of these thermosetting and thermoplastic resins can also be used in the B-stage modified state. Furthermore, in this invention, silicone-based, rubber-based, urethane-based, imide-based, and acrylic resins with high glass transition temperatures can also be used as chip adhesives.

[0261] The thickness of the chip bonding film 1012 is not particularly limited, but for example, it is 5 μm or more and 100 μm or less, preferably 10 μm or more and 50 μm or less.

[0262] The second release film 1013 functions as a protective material for the chip bonding film 1012. The second release film 1013 is peeled off before the cutting layer is bonded to the cutting film.

[0263] Examples of second release films 1013 include plastic films obtained by surface coating with release agents such as polyethylene, polypropylene, fluorinated release agents, and long-chain alkyl acrylate release agents.

[0264] The thickness of the second release film 1013 is not particularly limited, but for example, it is 5 μm or more and 100 μm or less, preferably 10 μm or more and 50 μm or less.

[0265] The peel strength when the second release film 1013 is peeled from the chip bonding film 1012 is preferably less than the peel strength when the release film 1011 is peeled from the chip bonding film 1012.

[0266] <Cutting membrane>

[0267] like Figure 2 As shown, the cutting film 1020 is a laminated film having an adhesive layer 1021 and a substrate 1022 stacked together.

[0268] There are no particular limitations on the adhesive used to form the adhesive layer 1021, but a radiation-curing adhesive that easily creates a difference in adhesive strength within the adhesive layer 1021 is preferred. Radiation-curing adhesives can easily reduce their adhesive strength by increasing their cross-linking degree through irradiation with radiation such as ultraviolet light. Therefore, by curing the radiation-curing adhesive layer correspondingly to the workpiece bonding portion, an adhesive layer 1021 with significantly reduced adhesive strength can be easily formed. Since the chip bonding layer is bonded to the cured adhesive layer 1021 with reduced adhesive strength, the interface between the adhesive layer 1021 and the chip bonding layer has the property of being easily peeled off during pickup. On the other hand, the portion not irradiated with radiation has sufficient adhesive strength, forming the adhesive layer 1021.

[0269] In the dicing / chip bonding film, the adhesive layer 1021, formed by an uncured radiation-cured adhesive, adheres to the chip bonding layer, ensuring holding force during dicing. Thus, the radiation-cured adhesive provides a good adhesion / peel balance for the chip bonding layer used to fix chip-shaped workpieces (such as semiconductor chips) to substrates, chip-shaped workpieces, and other adhered objects (referred to as semiconductor elements). In the dicing / chip bonding film, the adhesive layer 1021 can also fix wafer rings, etc.

[0270] The thickness of the adhesive layer 1021 is not particularly limited, but from the perspective of preventing defects on the chip cutting surface and ensuring the chip bonding layer is fixed, it is preferably 1 μm or more and 50 μm or less, more preferably 2 μm or more and 30 μm or less, and particularly preferably 5 μm or more and 25 μm or less.

[0271] Substrate 1022 serves as the strong matrix for the dicing / chip bonding film. Examples of its materials include, for instance, low-density polyethylene, linear polyethylene, medium-density polyethylene, high-density polyethylene, ultra-low-density polyethylene, random copolymer polypropylene, block copolymer polypropylene, homopolymer polypropylene, polybutene, polymethylpentene and other polyolefins, ethylene-vinyl acetate copolymers, ionomer resins, ethylene-(meth)acrylic acid copolymers, ethylene-(meth)acrylic acid (random, alternating) copolymers, ethylene-butene copolymers, ethylene-hexene copolymers, polyurethane, polyethylene terephthalate, polyethylene naphthalate and other polyesters, polycarbonate, polyimide, polyetheretherketone, polyimide, polyetherimide, polyamide, fully aromatic polyamide, polyphenylene sulfide, aromatic polyamide, glass, glass cloth, fluoropolymers, polyvinyl chloride, polyvinylidene chloride, cellulose resins, silicone resins, metals (foil), etc.

[0272] Furthermore, polymers such as cross-linked resins can be used as materials for the substrate 1022. The plastic film can be used without stretching, or a plastic film subjected to uniaxial or biaxial stretching treatment can be used as needed. By using a resin sheet that has been given heat-shrinkability through stretching treatment or the like, the bonding area between the adhesive layer 1021 and the chip bonding layer is reduced by heat shrinking the substrate after cutting, thereby facilitating the recycling of chip-shaped workpieces.

[0273] To improve adhesion and retention with adjacent layers, conventional surface treatments can be applied to the surface of the substrate 1022, such as chemical or physical treatments like chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, ionization radiation treatment, or coating treatment using a primer (such as an adhesive substance described later).

[0274] The substrate 1022 can be appropriately selected from the same or different substrates, and can use a mixture of multiple substrates as needed. Furthermore, to impart antistatic properties to the substrate 1022, a vapor-deposited layer containing a conductive material with a thickness of approximately 30 Å to 500 Å, including metals, alloys, and their oxides, can be formed on the substrate. The substrate 1022 can be a single layer or a multilayer of two or more materials. It should be noted that when the adhesive layer 1021 is radiation-cured, a substrate that allows at least a portion of radiation such as X-rays, ultraviolet rays, and electron beams to pass through is used.

[0275] The thickness of the substrate 1022 is not particularly limited and can be appropriately determined, but it is generally above 5μm and below 200μm.

[0276] <Cut / Chip Bonding Film>

[0277] An example of a dicing / chip bonding film, which is an example of a laminated film, will be described.

[0278] like Figure 3A and Figure 3B As shown, the dicing / chip bonding film 1000 is a laminated film having a dicing film 1020, multiple chip bonding layers 1012a and a release film 1011 stacked together.

[0279] Figure 3A This is a view of the dicing / chip bonding film 1000 as seen from the release film 1011 side. For convenience, the chip bonding layer 1012a is shown, but the chip bonding layer 1012a is disposed on the inside of the paper.

[0280] Figure 3B yes Figure 3A A-A' sectional view.

[0281] Multiple chip bonding layers 1012a are arranged separately along the length of the dicing / chip bonding film 1000.

[0282] The adhesive layer 1021 of the cutting film 1020 is in contact with the chip bonding layer 1012a.

[0283] Another example of a dicing / chip bonding film is illustrated.

[0284] like Figure 4A and Figure 4B As shown, the dicing / chip bonding film 1000 is a laminated film comprising a dicing film, multiple chip bonding layers 1012a, and a release film 1011. The dicing film has an adhesive layer and a substrate. The adhesive layer has a central adhesive layer region 1021a and two end adhesive layer regions 1021b. The substrate has a central substrate region 1022a and two end substrate regions 1022b.

[0285] Figure 4A This is a view of the dicing / chip bonding film 1000 from the substrate side.

[0286] Figure 4B yes Figure 4A A-A' sectional view.

[0287] Multiple chip bonding layers 1012a are arranged separately along the length of the dicing / chip bonding film 1000.

[0288] Multiple adhesive layer central regions 1021a are arranged separately along the length of the dicing / chip bonding film 1000. Each adhesive layer central region 1021a covers each chip bonding layer 1012a.

[0289] Multiple substrate central regions 1022a are arranged separately along the length of the dicing / chip bonding film 1000. Each substrate central region 1022a is stacked on top of a central region 1021a of an adhesive layer.

[0290] The adhesive layer end regions 1021b are formed at both ends of the dicing / chip bonding film 1000. The adhesive layer end regions 1021b are separated from the substrate central region 1022a.

[0291] Substrate end regions 1022b are formed at both ends of the dicing / chip bonding film 1000. Substrate end regions 1022b are laminated on top of adhesive layer end regions 1021b.

[0292] The adhesive layer 1021 of the cutting film 1020 is in contact with the chip bonding layer 1012a.

[0293] <Chip bonding laminate>

[0294] An example of a chip bonding laminate, which is one example of a laminated film, will be described.

[0295] like Figure 5Aand Figure 5B As shown, the chip bonding laminate 1100 is a laminated film having a release film 1011, multiple chip bonding layers 1012a and a release film 1111 stacked on top of each other.

[0296] Figure 5A This is a view of the chip bonding layer stack 1100 as seen from the release film 1011 side. For convenience, the chip bonding layer 1012a is shown, but the chip bonding layer 1012a is disposed on the inside of the paper.

[0297] Figure 5B yes Figure 5A A-A' sectional view.

[0298] Multiple chip bonding layers 1012a are arranged separately along the length of the chip bonding layer stack 1100.

[0299] <Implementation Method of Membrane Manufacturing Apparatus>

[0300] The embodiments of the membrane manufacturing apparatus are described using the accompanying drawings.

[0301] In addition, while describing the implementation of the membrane manufacturing apparatus, the membrane manufacturing method will also be described.

[0302] It should be noted that the implementation of the membrane manufacturing apparatus and the membrane manufacturing method will be explained using the example of manufacturing a dicing / chip bonding membrane.

[0303] Figure 6A and Figure 6B The membrane manufacturing apparatus 1 shown has a feeding unit 2, a cutting unit 3, a removal unit 4, a pasting unit 5, a winding unit 6, and a conveying unit 7.

[0304] exist Figure 6A and Figure 6B In the membrane manufacturing apparatus 1 shown, various membranes are conveyed in the direction of the arrows (solid lines). It should be noted that the tip of the arrow is designated as the downstream side, and the root of the arrow is designated as the upstream side.

[0305] Figure 6A and Figure 6B The dashed arrows and symbols (i) to (v) are used to describe the state (structure) of the stacked body at the location indicated by the dashed arrow.

[0306] It should be noted that, in Figure 6A and Figure 6B The detailed structure of the stacked structure is omitted in the text. Therefore, chip bonding layers, etc., are not shown.

[0307] The delivery unit 2 has a delivery roller 21. The delivery roller 21 is rotatable. The delivery roller 21 is rotated, for example, by a drive device (e.g., a motor, not shown). During the manufacture of the dicing / chip bonding film 1000, a roll of chip bonding master film 1010 wound on a cylindrical core is mounted on the delivery roller 21. Specifically, the delivery roller 21, which serves as an air shaft, is inserted into the cylindrical core on which the chip bonding master film 1010 is wound, and protrusions are caused by the induction of air. The protruding protrusions press against the inner surface of the core, thereby fixing the roll of chip bonding master film 1010.

[0308] The cutting unit 3 includes a cutting roller 31a and a support roller 31b. Both the cutting roller 31a and the support roller 31b are rotatable. The cutting roller 31a and the support roller 31b are rotated, for example, by a drive device (not shown). The cutting roller 31a is equipped with a cutter for forming a closed-loop cut. Regarding a specific example of the cutting roller 31a, using... Figures 8A to 8C To be described later.

[0309] The removal unit 4 includes a feed roller 41 as an adhesive tape feeding member, a pair of clamping rollers 42 as adhesive tape contact members, a peeling roller 43 as an adhesive tape peeling member, and a take-up roller 44 as an adhesive tape take-up member. The feed roller 41, the pair of clamping rollers 42, the peeling roller 43, and the take-up roller 44 are each rotated, for example, by a drive device (not shown). During film manufacturing, a roll of adhesive tape 2000 wound around a cylindrical core is mounted on the feed roller 41. The adhesive tape 2000 is used to remove unwanted film.

[0310] The pasting unit 5 has a feed roller 51 and a pair of clamping rollers 52. The feed roller 51 and the pair of clamping rollers 52 are rotated, for example, by a drive device (not shown). During film manufacturing, a roll of cut film 1020 wound around a cylindrical core is mounted on the feed roller 51.

[0311] The take-up unit 6 has a take-up roller 61. The take-up roller 61 is rotatable. The take-up roller 61 is rotated, for example, by a drive device (not shown).

[0312] The conveying unit 7 has a pair of conveying rollers 71. The pair of conveying rollers 71 are in Figure 6A and Figure 6B The membrane manufacturing apparatus 1 shown has three locations. A pair of conveyor rollers 71 are rotated, for example, by a drive device (not shown). The pair of conveyor rollers 71 clamp the laminate between the two conveyor rollers 71 (clamping part) and rotate it, thereby conveying the laminate from the upstream side to the downstream side.

[0313] A pair of rollers can be rotated by one motor or by two motors.

[0314] The motors that rotate each roller can be independent or linked together via a control device.

[0315] There are no particular restrictions on the materials used for the feed roller 21, support roller 31b, feed roller 41, a pair of clamping rollers 42, peeling roller 43, winding roller 44, feed roller 51, a pair of clamping rollers 52, winding roller 61, and a pair of conveying rollers 71, but stainless steel (SUS) may be used for example.

[0316] These rollers are typically cylindrical in shape, and the length of the rollers (the length in the width direction of the chip bonding original roll film 1010 and the dicing / chip bonding film 1000) is typically longer than the width of the chip bonding original roll film 1010 and the dicing / chip bonding film 1000.

[0317] The following uses Figure 6A and Figure 6B An example of membrane manufacturing in the membrane manufacturing apparatus 1 shown will be described.

[0318] The chip bonding master roll film 1010 is fed out from the feed roller 21. A cross-sectional view of portion (i) of the fed chip bonding master roll film 1010 is shown. Figure 7 (Reference Figure 7 (i) in the middle.

[0319] The chip bonding master roll film 1010 is sandwiched between a pair of transport rollers 71 disposed between the delivery roller 21 and the cutting roller 31a in the transport path, and reaches the cutting roller 31a while passing through the pair of transport rollers 71. Then, when the chip bonding master roll film 1010 is sandwiched between the cutting roller 31a and the support roller 31b (clamping part), the cutting roller 31a forms a closed-loop cut a separate from the second release film 1013 and the chip bonding film 1012. Specifically, the cutter 312a of the cutting roller 31a bites into the second release film 1013 and the chip bonding film 1012 of the chip bonding master roll film 1010, thereby forming the cut a in the second release film 1013 and the chip bonding film 1012. As a result, an inner second release film 1013a is formed inside the cut a in the second release film 1013. A chip bonding layer 1012a is formed inside the notch a in the chip bonding film 1012. A schematic cross-sectional view and a schematic top view of the (ii) portion of the chip bonding original roll film 1010 with the notch a are shown. Figure 7 (Reference Figure 7 (ii) in the middle.

[0320] The die bonding master roll film 1010 with slits a is in contact with the adhesive tape 2000 fed from the feed roller 41 at the clamping portion of a pair of clamping rollers 42. Thus, the adhesive tape 2000 is adhered to the second release film 1013 of the die bonding master roll film 1010. A schematic cross-sectional view of portion (iii) of the resulting laminate is shown below. Figure 7 (Reference Figure 7 (iii) in the middle.

[0321] The adhesive tape 2000 adhered to the chip bonding master roll film 1010 is peeled off from the chip bonding master roll film 1010 by the peeling roller 43. During winding onto the take-up roller 44, unwanted film is removed from the chip bonding master roll film 1010. It should be noted that during the peeling of the adhesive tape 2000, the peeling angle is less than 90° in the angle formed by the adhesive tape 2000 and the upstream side of the transport direction. Unwanted film refers to the portion other than the second peeling film 1013 and the chip bonding layer 1012a in the chip bonding film 1012. A schematic cross-sectional view and a schematic top view of the laminate obtained by removing the unwanted film from the chip bonding master roll film 1010 at portion (iv) are shown. Figure 7 (Reference Figure 7 (iv) in the middle.

[0322] The laminate obtained by removing unwanted film from the chip bonding roll film 1010 comes into contact with the dicing film 1020 fed from the feed roller 51 between a pair of clamping rollers 52 (clamping portion). The laminate and the dicing film 1020 are stacked to obtain a dicing / chip bonding film 1000. A schematic cross-sectional view of the obtained dicing / chip bonding film 1000 at the (v) portion is shown below. Figure 7 (Reference Figure 7 (v) in the middle.

[0323] The resulting dicing / chip bonding film 1000 is wound into a roll by the winding roller 61.

[0324] <Cutting roller>

[0325] Next, the implementation method of the cutting roller will be described.

[0326] Figure 8A The cutting roller 31a shown has a roller body 311 and a sheet 312 with a cutter. The sheet 312 with the cutter is adhered to the circumferential surface of the roller body 311.

[0327] The roller body 311 is cylindrical. Preferably, the circumferential surface of the roller body 311 is a magnet.

[0328] A sheet 312 with a cutter is adhered to the circumferential surface of the roller body 311. The sheet 312 with the cutter is preferably made of a magnetic material. Since the circumferential surface of the roller body 311 is a magnet and the sheet 312 with the cutter is also a magnet, the sheet 312 with the cutter can be easily loaded and unloaded from the roller body 311.

[0329] like Figure 8B and Figure 8C As shown, a circular cutter 312a is provided on the sheet body 312b of the sheet 312 with a cutter. Figure 8B This is a top view of sheet 312 with a cutter. Figure 8C yes Figure 8B A-A' sectional view.

[0330] The sheet 312 with a cutter is preferably an etching blade (pointed blade) on which the blade is formed by etching. The etching blade (pointed blade) is formed on the sheet by etching, so the sheet body and the cutter are integrated.

[0331] Preferably, the sheet 312 with the cutter is affixed with an identification code 312c. Examples of identification codes 312c include barcodes, QR codes (registered trademarks), etc. With the identification code 312c, the desired sheet with the cutter can be easily identified from among sheets with various cutters, and incorrect installation of the sheet 312 with the cutter onto the roller body 311 can be prevented.

[0332] There are no particular restrictions on the shape of the cutting blade 312a, as long as it can form a cut. For example, the shape of a cutting blade that forms a closed-loop cut is circular.

[0333] There are no particular restrictions on the height of the 312a cutter, but it can be, for example, around 0.2mm to 0.7mm.

[0334] There are no particular restrictions on the shape of the blade tip of the cutter 312a, but for example, a shape in which triangles are arranged adjacently can be given as the shape when viewed from the side (see reference). Figure 8C (The cutting blade 312a-1), the shape of the pentagons arranged separately (refer to) Figure 8C (312a-2) cutter, straight shape (refer to) Figure 8C Cutting blade 312a-3, etc.

[0335] Other embodiments of the membrane manufacturing apparatus will be described using the accompanying drawings.

[0336] In addition, while describing other embodiments of the membrane manufacturing apparatus, the membrane manufacturing method will also be described.

[0337] It should be noted that, using the example of manufacturing a dicing / chip bonding film, other embodiments of the film manufacturing apparatus and the film manufacturing method will be described.

[0338] Figure 9A and Figure 9B The membrane manufacturing apparatus 1 shown has a feeding unit 2, a cutting unit 3, a removal unit 4, a pasting unit 5, a winding unit 6, and a conveying unit 7.

[0339] exist Figure 9A and Figure 9BIn the membrane manufacturing apparatus 1 shown, various membranes are conveyed in the direction of the arrows (solid lines). It should be noted that the tip of the arrow is designated as the downstream side, and the root of the arrow is designated as the upstream side.

[0340] Figure 9A and Figure 9B The dashed arrows and symbols (i) to (v) are used to describe the state (structure) of the stacked body at the location indicated by the dashed arrow.

[0341] It should be noted that, in Figure 9A and Figure 9B The detailed structure of the stacked structure is omitted in the text. Therefore, chip bonding layers, etc., are not shown.

[0342] It should be noted that, regarding Figure 9A and Figure 9B The membrane manufacturing apparatus 1 shown has a heating member 32 and a re-bonding member 33 in its cutting unit 3, which is consistent with... Figure 6A and Figure 6B The differences between the membrane manufacturing apparatus 1 shown are as follows. Other than this, the structure is similar to... Figure 6A and Figure 6B The membrane manufacturing apparatus shown is the same as 1.

[0343] The delivery unit 2 has a delivery roller 21. The delivery roller 21 is rotatable. The delivery roller 21 is rotated, for example, by a drive device (e.g., a motor, not shown). When manufacturing the dicing / chip bonding film 1000, a roll of chip bonding original film 1010 wound on a cylindrical core is mounted on the delivery roller 21.

[0344] The cutting unit 3 includes a cutting roller 31a and a support roller 31b. Both the cutting roller 31a and the support roller 31b are rotatable. The cutting roller 31a and the support roller 31b are rotated, for example, by a drive device (not shown). The cutting roller 31a is equipped with a cutter for forming a closed-loop cut.

[0345] The cutting unit 3 has a re-lamination member 33. The re-lamination member 33, from the upstream side of the conveying path towards the downstream side, includes a peeling roller 332, a central roller 331, and a re-lamination roller 333 (see reference). Figure 10 The central roller 331 is positioned above the separation from the conveying path. The peeling roller 332, the central roller 331, and the re-lamination roller 333 are rotated, for example, by a drive device (not shown).

[0346] The cutting unit 3 has a heating element 32. The heating element 32 has a flexible hose 321 that serves as a warm air supply pipe (see reference). Figure 11A and Figure 11B ), warm air outlet 322 (refer to) Figure 11A and Figure 11BThe heating element 32 is positioned in the conveying path between the delivery roller 21 and the cutting roller 31a.

[0347] The removal unit 4 includes a feed roller 41 as an adhesive tape feeding member, a pair of clamping rollers 42 as adhesive tape contact members, a peeling roller 43 as an adhesive tape peeling member, and a take-up roller 44 as an adhesive tape take-up member. The feed roller 41, the pair of clamping rollers 42, the peeling roller 43, and the take-up roller 44 are each rotated, for example, by a drive device (not shown). During film manufacturing, a roll of adhesive tape 2000 wound around a cylindrical core is mounted on the feed roller 41. The adhesive tape 2000 is used to remove unwanted film.

[0348] The pasting unit 5 has a feed roller 51 and a pair of clamping rollers 52. The feed roller 51 and the pair of clamping rollers 52 are rotated, for example, by a drive device (not shown). During film manufacturing, a roll of cut film 1020 wound around a cylindrical core is mounted on the feed roller 51.

[0349] The take-up unit 6 has a take-up roller 61. The take-up roller 61 is rotatable. The take-up roller 61 is rotated, for example, by a drive device (not shown).

[0350] The conveying unit 7 has a pair of conveying rollers 71. The pair of conveying rollers 71 are in Figure 9A and Figure 9B The membrane manufacturing apparatus 1 shown has three locations. A pair of conveyor rollers 71 are rotated, for example, by a drive device (not shown). The pair of conveyor rollers 71 clamp the laminate between the two conveyor rollers 71 (clamping part) and rotate it, thereby conveying the laminate from the upstream side to the downstream side.

[0351] A pair of rollers can be rotated by one motor or by two motors.

[0352] The motors that rotate each roller can be independent or linked together via a control device.

[0353] The following uses Figure 9A and Figure 9B An example of membrane manufacturing in the membrane manufacturing apparatus 1 shown will be described.

[0354] The chip bonding master roll film 1010 is fed out from the feed roller 21. A cross-sectional view of portion (i) of the fed chip bonding master roll film 1010 is shown. Figure 7 (Reference Figure 7 (i) in the middle.

[0355] The re-lamination of the original chip bonding roll film 1010 is performed by the re-lamination member 33. In the re-lamination, firstly, the original chip bonding roll film 1010 passes through the peeling roller 332 (see reference 332). Figure 10When the chip bonding film 1012 is peeled off, the second release film 1013 is peeled off. The peeled second release film 1013 changes its orientation upward and reaches the central roller 331. The second release film 1013 that reaches the central roller 331 changes its orientation downward after half a circumference around the central roller 331 and reaches the re-lamination roller 333. The second release film that reaches the re-lamination roller 333 is re-lamination onto the chip bonding film 1012 by the re-lamination roller 333.

[0356] The re-bonded chip bonding original roll film 1010 is heated by blowing warm air using heating element 32.

[0357] The die bonding master roll film 1010, heated by the heating member 32, is sandwiched between a pair of transport rollers 71 disposed between the delivery roller 21 and the cutting roller 31a in the transport path, and reaches the cutting roller 31a. Then, when the die bonding master roll film 1010 is sandwiched between the cutting roller 31a and the support roller 31b (clamping part), the cutting roller 31a forms a closed-loop cut a separate from the second release film 1013 and the die bonding film 1012. Specifically, the cutter 312a of the cutting roller 31a bites into the second release film 1013 and the die bonding film 1012 of the die bonding master roll film 1010, thereby forming the cut a in the second release film 1013 and the die bonding film 1012. As a result, an inner second release film 1013a is formed inside the cut a in the second release film 1013. A chip bonding layer 1012a is formed inside the notch a in the chip bonding film 1012. A schematic cross-sectional view and a schematic top view of the (ii) portion of the chip bonding original roll film 1010 with the notch a are shown. Figure 7 (Reference Figure 7 (ii) in the middle.

[0358] The die bonding master roll film 1010 with slits a is in contact with the adhesive tape 2000 fed from the feed roller 41 at the clamping portion of a pair of clamping rollers 42. Thus, the adhesive tape 2000 is adhered to the second release film 1013 of the die bonding master roll film 1010. A schematic cross-sectional view of portion (iii) of the resulting laminate is shown below. Figure 7 (Reference Figure 7 (iii) in the middle.

[0359] The adhesive tape 2000 adhered to the chip bonding master roll film 1010 is peeled off from the chip bonding master roll film 1010 by the peeling roller 43. During winding onto the take-up roller 44, unwanted film is removed from the chip bonding master roll film 1010. It should be noted that during the peeling of the adhesive tape 2000, the peeling angle is less than 90° in the angle formed by the adhesive tape 2000 and the upstream side of the transport direction. Unwanted film refers to the portion other than the second peeling film 1013 and the chip bonding layer 1012a in the chip bonding film 1012. A schematic cross-sectional view and a schematic top view of the laminate obtained by removing the unwanted film from the chip bonding master roll film 1010 at portion (iv) are shown. Figure 7 (Reference Figure 7 (iv) in the middle.

[0360] The laminate obtained by removing unwanted film from the chip bonding roll film 1010 comes into contact with the dicing film 1020 fed from the feed roller 51 between a pair of clamping rollers 52 (clamping portion). The laminate and the dicing film 1020 are stacked to obtain a dicing / chip bonding film 1000. A schematic cross-sectional view of the obtained dicing / chip bonding film 1000 at the (v) portion is shown below. Figure 7 (Reference Figure 7 (v) in the middle.

[0361] The resulting dicing / chip bonding film 1000 is wound into a roll by the winding roller 61.

[0362] <Refitted Components>

[0363] Next, the implementation method of re-fitting the components will be described.

[0364] Figure 10 The re-lamination member 33 shown has a peeling roller 332, a central roller 331, and a re-lamination roller 333 in sequence from the upstream side to the downstream side of the conveying path. The peeling roller 332, the central roller 331, and the re-lamination roller 333 are rotated, for example, by a drive device (not shown).

[0365] The central roller 331 is positioned above the separation point from the conveying path. Preferably, the central roller 331 is positioned at a distance of 20 mm or more above the surface of the chip bonding film 1012. This prevents the chip bonding film 1012 from contacting the central roller 331 even if the chip bonding film 1012 warps.

[0366] The central roller 331 can also move in the vertical direction.

[0367] The central roller 331 preferably has a release surface. This prevents the chip bonding film 1012 from adhering to the central roller 331 even when it warps and comes into contact with the central roller 331. Methods for making the surface of the central roller 331 a release surface include, for example, using a silicone or fluoropolymer-based roller, or performing a release treatment on the roller surface using a silicone or fluoropolymer-based release agent.

[0368] The distance (minimum distance) between the peeling roller 332 and the re-laminating roller 333 is preferably approximately the same as the diameter of the central roller 331. In this respect, the distance (minimum distance) is preferably more than 0.9 times and less than 1.1 times the diameter of the central roller 331.

[0369] The peeling roller 332, the central roller 331, and the re-lamination roller 333 are typically cylindrical in shape.

[0370] For example, the diameter of the stripping roller 332 can be between 5 mm and 15 mm.

[0371] The diameter of the central roller 331 can be, for example, 10 mm or more and 20 mm or less.

[0372] For example, the diameter of the re-lamination roller 333 can be between 5 mm and 10 mm.

[0373] <Heating Components>

[0374] Next, the implementation method of the heating component will be described.

[0375] Figure 11A The heating element 32 shown has a flexible hose 321 as a warm air supply pipe and a warm air outlet 322. Figure 11A The outlet end of the heating element 32 shown is narrower than the hose 321. That is, the end of the outlet 322 is tapered.

[0376] Figure 11B The heating element 32 shown has a flexible hose 321 as a warm air supply pipe and a warm air outlet 322. Figure 11B The blowing end portion 322a of the warm air outlet 322 in the heating element 32 shown is wider than the hose 321.

[0377] There are no particular restrictions on the size of the warm air outlet 322, which is the heating element 32.

[0378] The length of the blow-out end portion 322a in the conveying direction is not particularly limited, but is preferably less than 1m. If the warm air outlet 322 is too large and overheats the chip bonding original roll film 1010, the chip bonding film 1012 will become sticky. The stickiness of the chip bonding film 1012 may cause manufacturing defects in the dicing / chip bonding film 1000.

[0379] Other embodiments of the membrane manufacturing apparatus will be described using the accompanying drawings.

[0380] In addition, while describing other embodiments of the membrane manufacturing apparatus, the membrane manufacturing method will also be described.

[0381] It should be noted that the implementation of the membrane manufacturing apparatus and the membrane manufacturing method will be explained using the example of manufacturing a dicing / chip bonding membrane.

[0382] Figure 12A and Figure 12B The membrane manufacturing apparatus 1 shown includes a feeding unit 2, a cutting unit 3, a removal unit 4, an adhesive unit 5, a winding unit 6, a conveying unit 7, a second removal unit 8, a static electricity removal unit 9, and a two-end removal unit 10.

[0383] exist Figure 12A and Figure 12B In the membrane manufacturing apparatus 1 shown, various membranes are conveyed in the direction of the arrows (solid lines). It should be noted that the end of the arrow is designated as the downstream side, and the root of the arrow is designated as the upstream side.

[0384] Figure 12A and Figure 12B The dashed arrows and symbols (xi) to (xvii) are used to describe the state (structure) of the stacked body at the location indicated by the dashed arrow.

[0385] It should be noted that, in Figure 12A and Figure 12B The detailed structure of the stacked structure is omitted in the text. Therefore, chip bonding layers, etc., are not shown.

[0386] It should be noted that it is not necessary to simultaneously have a second removal unit, a current removal unit, and two end removal units.

[0387] The delivery unit 2 has a delivery roller 21. The delivery roller 21 is rotatable. The delivery roller 21 is rotated, for example, by a drive device (e.g., a motor, not shown). When manufacturing the dicing / chip bonding film 1000, a roll of chip bonding original film 1010 wound on a cylindrical core is mounted on the delivery roller 21.

[0388] The cutting unit 3 includes a cutting roller 31a and a support roller 31b. Both the cutting roller 31a and the support roller 31b are rotatable. The cutting roller 31a and the support roller 31b are rotated, for example, by a drive device (not shown). The cutting roller 31a is equipped with a cutter for forming a closed-loop cut.

[0389] The second removal unit 8 has a take-up roller 81 and a stripping roller 82. The take-up roller 81 and the stripping roller 82 are rotatable. The take-up roller 81 and the stripping roller 82 are rotated by a drive device (not shown).

[0390] The removal unit 4 includes a feed roller 41 as an adhesive tape feeding member, a pair of clamping rollers 42 as adhesive tape contact members, a peeling roller 43 as an adhesive tape peeling member, and a take-up roller 44 as an adhesive tape take-up member. The feed roller 41, the pair of clamping rollers 42, the peeling roller 43, and the take-up roller 44 are each rotated, for example, by a drive device (not shown). During film manufacturing, a roll of adhesive tape 2000 wound around a cylindrical core is mounted on the feed roller 41. The adhesive tape 2000 is used to remove unwanted film.

[0391] The pasting unit 5 has a feed roller 51 and a pair of clamping rollers 52. The feed roller 51 and the pair of clamping rollers 52 are rotated, for example, by a drive device (not shown). During film manufacturing, a roll of cut film 1020 wound around a cylindrical core is mounted on the feed roller 51.

[0392] The winding unit 6 has a winding roller 61. The winding roller 61 is rotatable. The winding roller 61 is rotated, for example, by a drive device (not shown). Additionally, the winding unit 6 has a second winding roller 62. The second winding roller 62 is rotatable. The second winding roller 62 is used when manufacturing a dicing / chip bonding film using a film manufacturing apparatus, where the film is divided into two parts in the width direction to manufacture two dicing / chip bonding films. In this case, one dicing / chip bonding film is wound up by the winding roller 61, and the other dicing / chip bonding film is wound up by the second winding roller 62.

[0393] The conveying unit 7 has a pair of conveying rollers 71. The pair of conveying rollers 71 are in Figure 12A and Figure 12B The membrane manufacturing apparatus 1 shown has three locations. A pair of conveyor rollers 71 are rotated, for example, by a drive device (not shown). The pair of conveyor rollers 71 clamp the laminate between the two conveyor rollers 71 (clamping part) and rotate it, thereby conveying the laminate from the upstream side to the downstream side.

[0394] A pair of rollers can be rotated by one motor or by two motors.

[0395] The motors that rotate each roller can be independent or linked together via a control device.

[0396] The electrostatic removal unit 9 includes an ion generator 91. The ion generator 91 is located in... Figure 12A and Figure 12B The membrane manufacturing apparatus 1 shown is installed in four locations.

[0397] The two-end removal unit 10 has an end take-up roller 101 and a cutting member 92. The two-end removal unit 10 is disposed between the pasting unit 5 and the take-up unit 6 in the conveying direction.

[0398] The following uses Figure 12A and Figure 12B An example of membrane manufacturing in the membrane manufacturing apparatus 1 shown will be described.

[0399] The chip bonding roll film 1010 is fed out from the feed roller 21. A cross-sectional view of the fed chip bonding roll film 1010 at the (xi) portion is shown. Figure 13 (Reference Figure 13 (xi) in the middle.

[0400] The chip bonding original roll film 1010 is de-electrolyzed by the ion generator 91, which serves as a de-electrode component, before reaching the cutting roller 31a.

[0401] The chip bonding master roll film 1010 is sandwiched between a pair of transport rollers 71 disposed between the delivery roller 21 and the cutting roller 31a in the transport path, and reaches the cutting roller 31a while passing through the pair of transport rollers 71. Then, when the chip bonding master roll film 1010 is sandwiched between the cutting roller 31a and the support roller 31b (clamping part), the cutting roller 31a forms a closed-loop cut a separate from the second release film 1013 and the chip bonding film 1012. Specifically, the cutter 312a of the cutting roller 31a bites into the second release film 1013 and the chip bonding film 1012 of the chip bonding master roll film 1010, thereby forming the cut a in the second release film 1013 and the chip bonding film 1012. As a result, an inner second release film 1013a is formed inside the cut a in the second release film 1013. A chip bonding layer 1012a is formed inside the notch a in the chip bonding film 1012. A schematic cross-sectional view and a schematic top view of the (xii) portion of the original chip bonding roll film 1010 with the notch a are shown below. Figure 13 (Reference Figure 13 (xii) in the middle.

[0402] The die bonding master roll film 1010 with slit a reaches the peeling roller 82. Using the peeling roller 82, the second peeling film 1013, excluding the inner second peeling film 1013a, is peeled off from the die bonding master roll film 1010. The peeled second peeling film 1013, excluding the inner second peeling film 1013a, is wound up by the take-up roller 81. A schematic cross-sectional view of the laminate (die bonding master roll film 1010) after the second peeling film 1013, excluding the inner second peeling film 1013a, is shown at portion (xiii). Figure 13 (Reference Figure 13 (xiii) in the middle.

[0403] Then, the laminate (the chip bonding original roll film 1010 after the second release film 1013 other than the inner second release film 1013a is peeled off) is de-electrolyzed by the second ion generator 91.

[0404] Next, the laminate (the chip bonding roll film 1010 after the second release film 1013, excluding the inner second release film 1013a, has been peeled off) comes into contact with the adhesive tape 2000 fed from the feed roller 41 at the clamping portion of a pair of clamping rollers 42. Thus, the adhesive tape 2000 adheres to the inner second release film 1013a and the chip bonding film 1012, excluding the chip bonding layer 1012a, of the chip bonding roll film 1010. A schematic cross-sectional view of the portion of the laminate thus obtained (xiv) is shown below. Figure 13 (Reference Figure 13 (xiv) in the middle.

[0405] Then, the laminate is de-electrolyzed by the third ion generator 19.

[0406] The adhesive tape 2000 adhered to the chip bonding master roll film 1010 is peeled off from the chip bonding master roll film 1010 by the peeling roller 43. During winding onto the take-up roller 44, unwanted film is removed from the chip bonding master roll film 1010. It should be noted that when peeling off the adhesive tape 2000, the peeling angle is less than 90° in the angle between the adhesive tape 2000 and the upstream side of the transport direction. Unwanted film refers to the portion other than the inner second peeling film 1013a and the chip bonding layer 1012a in the chip bonding film 1012. A schematic cross-sectional view and a schematic top view of the laminate obtained by removing the unwanted film from the chip bonding master roll film 1010 at the (xv) portion are shown below. Figure 13 (Reference Figure 13 (xv) in the middle.

[0407] The laminate obtained by removing unwanted film from the die bonding roll 1010 comes into contact with the dicing film 1020 fed from the feed roller 51 between a pair of clamping rollers 52 (clamping portion). This laminate and the dicing film 1020 are stacked to obtain a dicing / die bonding film 1000. A schematic cross-sectional view of the obtained dicing / die bonding film 1000 at the (xvi) portion is shown below. Figure 13 (Reference Figure 13 (xvi) in the middle.

[0408] The two ends of the resulting diced / chip bonding film 1000 are cut off by the cutting member 102. The cut ends are then wound up by the end winding roller 101. A schematic cross-sectional view of the diced / chip bonding film 1000 at portion (xvii) after the two ends have been cut off is shown below. Figure 13 (Reference Figure 13 (xvii) in the middle.

[0409] The cut / chip bonding film 1000, after being cut off at both ends, is de-electrolyzed by the fourth ion generator 91.

[0410] The resulting dicing / chip bonding film 1000 is wound into a roll by the winding roller 61.

[0411] The following is an example of the use of the dicing / chip bonding film 1000.

[0412] First, the release film 1011 disposed on the chip bonding layer 1012a is peeled off.

[0413] Next, the workpiece is pressed onto the chip bonding layer 1012a of the dicing / chip bonding film 1000, and the workpiece is adhered, held, and fixed on the chip bonding layer 1012a. The pressing is performed by conventional methods. Examples of workpieces include semiconductor wafers, multilayer substrates, and unified sealing modules, but semiconductor wafers are preferred.

[0414] Next, the workpiece is cut into chip shapes. Using a suitable unit based on a rotary cutter or the like, including a chip bonding layer 1012a, the workpiece is formed into a chip-shaped workpiece (semiconductor chip, etc.).

[0415] Next, the chip-shaped workpiece and the chip bonding layer 1012a are peeled off from the adhesive layer 1021. The picked-up chip-shaped workpiece is then bonded and fixed to a semiconductor device, which serves as the substrate, via the chip bonding layer 1012a. Examples of semiconductor devices include lead frames, TAB films, substrates, or separately fabricated chip-shaped workpieces. The substrate can be, for example, a deformable substrate that is easily deformable, or a non-deformable substrate that is difficult to deform (such as a semiconductor wafer). A semiconductor wafer is preferred as the substrate.

[0416] When the chip bonding layer 1012a is thermosetting, the workpiece is bonded and fixed to the substrate by heating and curing, thereby improving heat resistance. It should be noted that the component formed by bonding and fixing the chip-shaped workpiece to the substrate or the like via the chip bonding layer 1012a can be supplied for the reflow soldering process.

[0417] Symbol Explanation

[0418] 1: Membrane manufacturing equipment

[0419] 2: Sending Unit

[0420] 21: Feeding roller

[0421] 3: Entry Unit

[0422] 31a: Cutting roller

[0423] 31b: Support roller

[0424] 311: Roller body

[0425] 312: Sheet material with a cutter

[0426] 312a: Cutting knife

[0427] 312b: Sheet body

[0428] 312c: Identification code

[0429] 32: Heating component

[0430] 321: Hose

[0431] 322: Warm air blows out of the outlet

[0432] 322a: Blowout end section

[0433] 33: Re-fitting components

[0434] 332: Peeling roller

[0435] 331: Central Roller

[0436] 333: Re-lamination roller

[0437] 4: Remove Unit

[0438] 41: Feeding roller

[0439] 42: A pair of clamping rollers

[0440] 43: Peeling roller

[0441] 44: Take-up roller

[0442] 5: Paste Unit

[0443] 51: Feeding roller

[0444] 52: A pair of clamping rollers

[0445] 6: Winding unit

[0446] 61: Take-up roller

[0447] 62: Second take-up roller

[0448] 7: Conveying Unit

[0449] 71: A pair of conveyor rollers

[0450] 8: Second Removal Unit

[0451] 81: Take-up roller

[0452] 82: Peeling roller

[0453] 9: Electrostatic removal unit

[0454] 91: Ion Generator

[0455] 10: End Removal Unit

[0456] 101: End take-up roller

[0457] 102: Cutting components

[0458] 1000: Cutting / Chip Bonding Film

[0459] 1010: Chip bonding original roll film

[0460] 1011: Release membrane

[0461] 1012: Chip bonding film

[0462] 1012a: Chip bonding layer

[0463] 1012b: End of chip bonding film

[0464] 1013: Second peeling membrane

[0465] 1013a: Inner second peeling membrane

[0466] 1020: Cutting membrane

[0467] 1021: Adhesive layer

[0468] 1021a: Central area of ​​adhesive layer

[0469] 1021b: Adhesive layer end region

[0470] 1022: Substrate

[0471] 1022a: Central area of ​​substrate

[0472] 1022b: Substrate end region

[0473] 1100: Chip bonding laminate

[0474] 1111: Peel-off membrane

[0475] 2000: Adhesive tape

[0476] a: cut.

Claims

1. A film manufacturing apparatus, comprising: a feeding unit that feeds a raw roll film, the raw roll film having a first film and a functional film provided on the first film; a cutting-in unit that forms a functional layer by forming a cut in the functional film of the raw roll film fed by the feeding unit; a removing unit that removes at least a part of a region other than the functional layer in the functional film from the raw roll film; a pasting unit that pastes a second film on the functional layer provided on the first film to obtain a laminated film; a winding unit that winds the laminated film obtained by the pasting unit into a roll shape; and a conveying unit that is provided between the feeding unit and the winding unit and conveys a laminate before the laminated film is obtained using the raw roll film.

2. The film manufacturing apparatus according to claim 1, wherein the raw roll film is a die-bonding raw roll film having a release film as the first film and a die-bonding film as the functional film, the second film is a dicing film having a base material and an adhesive layer provided on the base material, the laminated film is a dicing / die-bonding film having the dicing film, a plurality of die-bonding layers as a plurality of the functional layers provided separately on the adhesive layer, and the release film provided on the die-bonding layers.

3. The film manufacturing apparatus according to claim 2, wherein the die-bonding raw roll film further has a second release film provided on the die-bonding film.

4. The film manufacturing apparatus according to claim 1, wherein the cutting-in unit has a cutter for forming the cut.

5. The film manufacturing apparatus according to claim 4, wherein the cutter is a knife for forming a cut in a closed loop shape.

6. The film manufacturing apparatus according to claim 1, wherein the removing unit has an adhesive tape feeding member that feeds an adhesive tape, an adhesive tape contacting member that contacts the adhesive tape with the raw roll film, an adhesive tape peeling member that peels the adhesive tape, and an adhesive tape winding member that winds the adhesive tape.

7. The film manufacturing apparatus according to claim 1, wherein the pasting unit has a second film feeding member that feeds the second film and a second film pasting member that pastes the second film to the functional layer with the second film in contact with the functional layer.

8. The film manufacturing apparatus according to claim 1, wherein the film manufacturing apparatus further has a destaticizing unit that destaticizes at least any one of the laminate before the laminated film is obtained using the raw roll film.

9. The film manufacturing apparatus according to claim 1, wherein the film manufacturing apparatus further has a both-end removing unit that removes both ends in a width direction of the laminated film before the laminated film obtained by the pasting unit is wound by the winding unit.

Images