Circuit board fault positioning equipment
By using circuit board fault location equipment to precisely heat the target chip, the problem of high-temperature testing being unable to locate faults in traditional methods is solved, enabling rapid fault diagnosis and improving the production efficiency and safety of avionics equipment.
Patent Information
- Application Number
- CN202520106211.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-16
- Publication Date
- 2026-04-03
- Estimated Expiration
- 2035-01-16
AI Technical Summary
Traditional avionics equipment cannot accurately locate faulty electronic components during high-temperature testing, making it difficult to reproduce faults during production and use, thus affecting production progress and safety.
A circuit board fault location device was designed, including a power module, a temperature regulation device, a heating element and a housing. It uses a thin-film electric heating unit and a PID temperature controller to achieve precise heating and temperature control of the target chip, and is equipped with an overheat protection device to prevent damage.
It enables rapid location of circuit board faults, reduces troubleshooting time, improves production efficiency, avoids the cost and lifespan damage caused by repeated testing and component replacement, and ensures the safety and reliability of the equipment.
Smart Images
Figure CN224081756U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of avionics technology, and specifically relates to a circuit board fault location device. Background Technology
[0002] In traditional avionics equipment, some electronic components may malfunction at high temperatures during production and use, while functioning normally at room temperature. During high-temperature testing in high-temperature chambers, various anomalies may occasionally occur, yet the products function normally at room temperature. Since the products are in a high-temperature chamber when anomalies occur, effective monitoring is impossible to identify the problematic electronic components. This can disrupt production and delivery schedules, ultimately requiring experience to replace potentially faulty components and repeating the high-temperature test. This method typically requires multiple tests to remove the faulty component, and repeated component replacements can affect the reliability of the circuit board. During use, due to the occasional anomalies of electronic components at high temperatures, the aircraft may report intermittent malfunctions, which then return to normal. After landing and troubleshooting, all indicators may appear normal, making it impossible to determine whether the problem stems from a specific electronic device malfunction or the complex onboard environment. In such cases, troubleshooting becomes difficult, and continuing flight could pose safety risks. To address the aforementioned issues, there is an urgent need for a device that can individually heat a specific electronic component on a circuit board to a certain temperature. This would solve the problem of being able to reproduce the issue only in a high-temperature chamber. Heating a single electronic component would not affect the monitoring and measurement of the circuit board, and would also allow for the accurate location of the problematic electronic component. Utility Model Content
[0003] Purpose of the utility model: In order to overcome the current situation where traditional avionics equipment fails high-temperature testing during the production process, and the product is tested in a high-temperature chamber, making it inconvenient to debug and impossible to accurately locate the fault, this utility model provides a circuit board fault location device that can directly heat a target chip on the circuit board to the expected temperature, measure the current working status of electronic components under high-temperature conditions, and quickly locate the faulty device.
[0004] Technical solution:
[0005] A circuit board fault location device includes: a power module, a temperature regulation device, a heating element, and a housing;
[0006] The power module is used to convert AC power to DC power and to power the temperature regulation device and heating components.
[0007] The heating element is attached to the target electronic component on the circuit board and is used to heat the target electronic component.
[0008] The temperature regulating device is used to collect the temperature of the heating element and maintain the temperature of the heating element at a set temperature.
[0009] Furthermore, the heating element includes a series of thin-film heating units of varying areas, which are fabricated by etching and attaching a resistance heating material onto an aluminum foil. The advantage of this type of thin-film heating unit is that the heating process of the heating element is more uniform and stable.
[0010] Furthermore, the heating element is surrounded by heat-insulating material. This prevents heat from the heating element from being conducted to other electronic components on the circuit board, which could lead to inaccurate judgments.
[0011] Furthermore, the thermal insulation material is a nanoporous aerogel composite thermal insulation material.
[0012] Furthermore, the temperature regulating device is a PID temperature controller. Compared to ON / OFF temperature controllers, PID temperature controllers can respond quickly to temperature changes, automatically correct deviations, and provide better steady-state performance.
[0013] Furthermore, the circuit board fault location device also includes: an overheat protection device and a microcontroller; the microcontroller is located between the power module and the heat-generating component. When the temperature of the heat-generating component exceeds the set temperature and the temperature regulation device fails to adjust it in time, the overheat protection device controls the microcontroller to disconnect, so as to avoid damage to electronic components due to excessive temperature.
[0014] Beneficial effects:
[0015] a) This utility model designs a heating device for a certain chip on a circuit board, which solves the problem that it is not easy to solve the problem when a fault is found in the high temperature test of the circuit board after production. Since it is inconvenient to measure when the fault of the circuit board is reproduced in the high temperature chamber, it is impossible to capture the problematic electronic components. This utility model effectively reduces the troubleshooting time of the circuit board and improves the production efficiency of avionics equipment.
[0016] b) The circuit board fault location device designed in this utility model has a heating component that can be replaced according to the shape of the specific target electronic component, which facilitates the measurement of various commonly used electronic components. At the same time, the heating component is surrounded by heat insulation material to prevent the heating component from damaging the non-target electronic components next to it. The heating component of the device designed in this utility model can be flexibly replaced, which facilitates the rapid testing of various electronic devices that work in high-temperature environments and has a wide range of applications.
[0017] c) The circuit board fault location device designed in this utility model consists of a power module, a temperature regulation device, a heating component, a temperature overheat protection device, a housing, etc. It has the characteristics of simple structure, simple use, low cost, easy portability, and easy large-scale application. It is convenient to use in various environments, can realize rapid fault location, and improve the troubleshooting efficiency of avionics equipment.
[0018] d) The circuit board fault location device designed in this utility model avoids the need for repeated high-temperature tests or repeated replacement of electronic components during the troubleshooting process of traditional circuit boards, which reduces the lifespan of the circuit board, saves costs, and increases the reliability of the product. Attached Figure Description
[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 This is a schematic diagram of a circuit board fault location device.
[0021] Figure 2 This is a schematic diagram showing the correspondence between electronic components of different sizes and heat-generating parts on a circuit board.
[0022] Figure 3 Schematic diagrams of heating components of different sizes;
[0023] Figure 4 This is a schematic diagram of the temperature control for the heating element. Detailed Implementation
[0024] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0025] A circuit board fault location device can heat a specific component on the circuit board to a predetermined temperature, enabling rapid fault location on the circuit board. This solves the problem of a specific electronic component on a traditional circuit board malfunctioning under high temperatures, saving resource costs, labor costs, and time costs, and greatly improving the troubleshooting efficiency of the circuit board.
[0026] like Figure 1 As shown, it consists of a power module, a temperature regulation device, a heating element, an overheat protection device, and a casing.
[0027] The main function of the power module is to maintain a stable voltage output, preventing damage to the chip caused by sudden changes in external power supply. At the same time, it converts the commonly used 220V AC power into a stable DC output to provide power to the temperature regulation device and heat-generating components.
[0028] The heating element uses a thin-film electrothermal element, in which resistance heating material is etched and bonded to an aluminum foil. The advantage of this heating material is that the heating process of the heating element is more uniform and stable, mainly providing heat to the expected set temperature. The heating element is a replaceable part and can be replaced according to the shape of the target chip being tested. The heating element can be completely attached to the target electronic component, allowing the target electronic component to be fully heated. Furthermore, the heating element is surrounded by heat insulation material, which is a nanoporous aerogel composite insulation product, to prevent the heat from the heating element from being conducted to other electronic components on the circuit board, thus avoiding inaccurate judgment of the results.
[0029] The temperature regulation device uses a PID temperature controller. Compared with an ON / OFF temperature controller, the PID temperature controller can respond quickly to temperature changes, automatically correct deviations, and provide better steady-state performance. The thermistor 1 included in the heating element can acquire the temperature of the heating element in real time and convert the temperature signal into an electrical signal so that the PID temperature controller can react quickly and make the heating element reach the expected set temperature. When the target temperature is lower than the expected temperature, it will heat up quickly. When the temperature reaches the specified temperature, it will keep the temperature constant.
[0030] The function of the overheat protection device is to monitor the temperature of the heating component in real time. When the temperature of the heating component is higher than the expected temperature, the temperature regulation device fails to adjust in time. In order to avoid damage to electronic components due to excessive temperature, the thermistor 2 on the heating component transmits the collected temperature to the microcontroller. The microcontroller makes a timely decision to cut off the power supply and reduce the temperature of the heating component.
[0031] Example
[0032] a) During the production process, it was discovered that a newly manufactured circuit board works normally at room temperature, but exhibits abnormal behavior at high temperatures. A typical example of this is... Figure 2 As shown on the left, select potentially faulty electronic components based on the fault symptoms. Electronic components may come in various shapes and sizes. Figure 2 As shown on the right, eight different shapes were selected. Figure 2 Select the appropriate size heating element from serial numbers 1 to 8 and install it into the fault location device. The heating element can be selected according to the size of the target electronic component.
[0033] b) Power on the fault location equipment. After power-on, preset the temperature. The temperature regulation device will collect data on the heating component in real time. If the heating component temperature is lower than the set value, the current will be increased for rapid preheating. When the actual temperature of the heating component is close to the preset temperature, the temperature regulation device will appropriately reduce the current to maintain a constant heating component temperature. The commonly used high temperatures for avionics equipment are 55℃, 70℃, or 85℃. Wait a moment for the heating component to preheat. Then, align the heating component with the target electronic component for heating. This equipment is designed with an overheat protection device to prevent the heating component from overheating and damaging the target electronic component. Figure 4 As shown.
[0034] c) According to Figure 3 As shown, Figure 3 Numbers 1 to 8 are heating components of different shapes. Each heating component is surrounded by a heat insulation layer (see number 9). This ensures that the heating process is limited to the target electronic component and does not affect other components around it on the circuit board. After heating, an oscilloscope can be used to check the working status of the circuit board and confirm the cause of the fault. If the circuit board does not work properly after heating, the target electronic component can be replaced. Otherwise, proceed with steps a) to c) to operate on the next suspected electronic component.
[0035] The above description is merely a specific embodiment of this utility model, providing a detailed description of the utility model. Parts not covered in detail are conventional techniques. However, the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this utility model should be included within the protection scope of this utility model. The protection scope of this utility model should be determined by the scope of the claims.
Claims
1. A circuit board fault location device, characterized in that: The device includes: a power module, a temperature control device, a heating element, and a housing; The power module is used to convert AC power to DC power and to power the temperature regulation device and heating components. The heating element is attached to the target electronic component on the circuit board and is used to heat the target electronic component. The temperature regulating device is used to collect the temperature of the heating element and maintain the temperature of the heating element at a set temperature.
2. The circuit board fault location device according to claim 1, characterized in that: The heating element includes a series of thin-film electric heating units of different areas, which are made by etching and attaching a resistance heating material onto an aluminum foil.
3. The circuit board fault location device according to claim 2, characterized in that: The heating element is surrounded by heat-insulating material.
4. The circuit board fault location device according to claim 3, characterized in that: The thermal insulation material is a nanoporous aerogel composite thermal insulation material.
5. The circuit board fault location device according to claim 4, characterized in that: The temperature control device is a PID temperature controller.
6. The circuit board fault location device according to claim 5, characterized in that: The circuit board fault location device also includes: an overheat protection device and a microcontroller; The microcontroller is positioned between the power module and the heat-generating component. When the temperature of the heat-generating component exceeds the set temperature and the temperature regulation device fails to adjust it in time, the overheat protection device controls the microcontroller to disconnect.