I-shaped energy-saving bus duct with heat pipe heat dissipation module

Abstract

The utility model discloses an I-shaped energy-saving bus duct with a heat pipe heat dissipation module, which comprises a bus duct main body, a semiconductor chilling plate is fixedly connected outside the bus duct main body, a fixed heat pipe is fixedly connected at the refrigeration end of the semiconductor chilling plate, a movable heat pipe is sleeved outside the fixed heat pipe, and the movable heat pipe is in sliding connection with the fixed heat pipe. And the outside of the bus duct main body is rotatably connected with heat dissipation fins. According to the I-shaped energy-saving bus duct with the heat pipe heat dissipation module, a semiconductor chilling plate is started, the semiconductor chilling plate conducts heat dissipation and cooling on heat dissipation fins through a fixed heat pipe and a movable heat pipe, and therefore the heat dissipation effect is improved; the rotating disc drives a connecting plate and a movable heat pipe on the connecting plate to move back and forth through a second sliding groove and a second sliding rod, the movable heat pipe finally drives heat dissipation fins to swing back and forth through a first sliding groove and a first sliding rod, air between every two adjacent heat dissipation fins can flow, and the heat dissipation effect is further improved.

Description

Technical Field

[0001] This utility model relates to the field of busbar technology, and more specifically, to an I-shaped energy-saving busbar with a heat pipe heat dissipation module. Background Technology

[0002] Busbar trunking is a closed metal device made of copper or aluminum busbars, used to distribute large amounts of power to various components in a distributed system. It is increasingly replacing electrical wires and cables in indoor low-voltage power transmission trunk line projects.

[0003] Currently, some existing I-shaped energy-saving busbar trunking systems generate heat during operation, requiring heat dissipation. However, most heat dissipation structures involve adding heat dissipation fins to the outside of the busbar trunking. These fins are closely arranged together, and when air passes through, it carries away the heat generated by the busbar trunking during operation. Although this achieves the purpose of heat dissipation, the heat dissipation effect is relatively poor. Therefore, we provide I-shaped energy-saving busbar trunking systems with heat pipe cooling modules. Utility Model Content

[0004] The purpose of this invention is to provide an I-shaped energy-saving busbar trunking with a heat pipe cooling module to solve the problems mentioned in the background art.

[0005] Currently, some existing I-shaped energy-saving busbar trunking systems generate heat during operation, requiring heat dissipation. However, most heat dissipation structures involve adding heat dissipation fins to the outside of the busbar trunking. These fins are closely arranged together, and when air passes through, it carries away the heat generated by the busbar trunking during operation. Although this achieves the purpose of heat dissipation, the heat dissipation effect is relatively poor.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] An I-shaped energy-saving busbar trunking with a heat pipe cooling module includes a busbar trunking body. A semiconductor refrigeration chip is fixedly connected to the outside of the busbar trunking body. A fixed heat pipe is fixedly connected to the cooling end of the semiconductor refrigeration chip. A movable heat pipe is sleeved on the outside of the fixed heat pipe and is slidably connected to the fixed heat pipe. A heat dissipation fin is rotatably connected to the outside of the busbar trunking body. A through groove is opened inside the heat dissipation fin. The movable heat pipe passes through the through groove and extends to the other side of the heat dissipation fin. A first sliding groove is opened inside the heat dissipation fin. A first sliding rod is slidably connected inside the first sliding groove and is fixedly connected to the movable heat pipe.

[0008] Preferably, a connecting plate is fixedly connected to the outside of the movable heat pipe, and an mounting plate is fixedly connected to the outside of the main body of the busbar trunking. A motor is fixedly connected to one side of the mounting plate, and the output shaft of the motor passes vertically through the mounting plate and extends to the other side of the mounting plate. The output shaft of the motor is rotatably connected to the mounting plate, and a turntable is fixedly connected to the output end of the motor. A second sliding groove is opened inside the connecting plate, and a second sliding rod is slidably connected inside the second sliding groove. The second sliding rod is fixedly connected to the turntable.

[0009] Preferably, the outer wall of the second slide rod is in contact with the inner wall of the second slide groove.

[0010] Preferably, a limiting groove is formed inside the connecting plate, a limiting plate is slidably connected inside the limiting groove, and the limiting plate is fixedly connected to the main body of the busbar.

[0011] Preferably, both the limiting groove and the limiting plate are L-shaped structures.

[0012] Preferably, the connecting plate has a T-shaped structure.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] The semiconductor cooling chip is activated, and it cools the heat sink fins through fixed and movable heat pipes, thereby improving the heat dissipation effect. At the same time, the motor is activated to drive the turntable to rotate. The turntable drives the connecting plate and the movable heat pipe on the connecting plate to move back and forth through the second slide groove and the second slide rod. Finally, the movable heat pipe drives the heat sink fins to swing back and forth through the first slide groove and the first slide rod, so that the air between two adjacent heat sink fins can flow, further improving the heat dissipation effect. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0016] Figure 2 This is a schematic diagram of the limiting plate of this utility model.

[0017] Figure 3 This is a schematic diagram of the structure of the turntable of this utility model.

[0018] Figure 4 This is a schematic diagram of the connecting plate of this utility model.

[0019] Figure 5 This is a schematic diagram of the structure of the heat dissipation fins of this utility model.

[0020] The following are the labels in the diagram: 1. Busbar trunking body; 2. Semiconductor cooling chip; 3. Fixed heat pipe; 4. Movable heat pipe; 5. Heat dissipation fins; 6. Through groove; 7. First sliding groove; 8. First sliding rod; 9. Connecting plate; 10. Mounting plate; 11. Motor; 12. Turntable; 13. Second sliding groove; 14. Second sliding rod; 15. Limiting groove; 16. Limiting plate. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figures 1 to 5 An I-shaped energy-saving busbar trunking with a heat pipe cooling module includes a busbar trunking body 1. A semiconductor cooling chip 2 is fixedly connected to the outside of the busbar trunking body 1. The semiconductor cooling chip 2 cools and dissipates heat from heat dissipation fins 5 through a fixed heat pipe 3 and a movable heat pipe 4. The cooling end of the semiconductor cooling chip 2 is fixedly connected to the fixed heat pipe 3. A movable heat pipe 4 is sleeved on the outside of the fixed heat pipe 3 and is slidably connected to the fixed heat pipe 3. Heat dissipation fins 5 are rotatably connected to the outside of the busbar trunking body 1. A through groove 6 is opened inside the heat dissipation fins 5. The movable heat pipe 4 passes through the through groove 6 and extends to the other side of the heat dissipation fins 5. A first sliding groove 7 is opened inside the heat dissipation fins 5. A first sliding rod 8 is slidably connected inside the first sliding groove 7 and is fixedly connected to the movable heat pipe 4. The movable heat pipe 4 can move back and forth, so that the movable heat pipe 4 drives the heat dissipation fins 5 to swing back and forth through the first sliding groove 7 and the first sliding rod 8, so that the air between two adjacent heat dissipation fins 5 can flow, thereby improving the heat dissipation effect.

[0023] Furthermore, a connecting plate 9 is fixedly connected to the outside of the active heat pipe 4, and a mounting plate 10 is fixedly connected to the outside of the busbar trunking body 1. A motor 11 is fixedly connected to one side of the mounting plate 10. The output shaft of the motor 11 passes vertically through the mounting plate 10 and extends to the other side of the mounting plate 10. The output shaft of the motor 11 is rotatably connected to the mounting plate 10. A turntable 12 is fixedly connected to the output end of the motor 11. A second sliding groove 13 is opened inside the connecting plate 9. A second sliding rod 14 is slidably connected inside the second sliding groove 13. The second sliding rod 14 is fixedly connected to the turntable 12. The motor 11 directly drives the turntable 12 to rotate. The turntable 12 drives the connecting plate 9 to move back and forth through the second sliding rod 14 and the second sliding groove 13.

[0024] Furthermore, the outer wall of the second slide rod 14 is in contact with the inner wall of the second slide groove 13. When the turntable 12 rotates, it will press the inner wall of the second slide groove 13 through the second slide rod 14, thereby driving the connecting plate 9 and the movable heat pipe 4 on the connecting plate 9 to move back and forth. Since the second slide rod 14 and the second slide groove 13 are in close contact, the connecting plate 9 can be driven to move immediately through the second slide groove 13 and the second slide rod 14 when the turntable 12 rotates, and the response speed is faster.

[0025] Furthermore, a limiting groove 15 is provided inside the connecting plate 9, and a limiting plate 16 is slidably connected inside the limiting groove 15. The limiting plate 16 is fixedly connected to the busbar trunking body 1. The connecting plate 9 is limited by the upper and lower sets of limiting grooves 15 and limiting plates 16, making the connecting plate 9 more stable when it moves back and forth.

[0026] Furthermore, both the limiting groove 15 and the limiting plate 16 are L-shaped structures. The L-shaped mechanism allows the limiting plate 16 to hook onto the connecting plate 9, preventing the connecting plate 9 from detaching from the limiting plate 16.

[0027] Furthermore, the connecting plate 9 has a T-shaped structure. The T-shaped structure makes the part of the connecting plate 9 directly connected to the movable heat pipe 4 relatively narrow, while the part near the turntable 12 is relatively wide, so that the turntable 12 and the connecting plate 9 can fit together, allowing the connecting plate 9 to move relatively stably.

[0028] The steps of using this utility model are as follows: When using this I-shaped energy-saving busbar trunking with heat pipe heat dissipation module, the heat dissipation fins 5 absorb the heat emitted by the main body 1 of the busbar trunking. When air passes through the heat dissipation fins 5, it carries away the heat to achieve the purpose of heat dissipation. The semiconductor cooling chip 2 is activated. The semiconductor cooling chip 2 dissipates heat and cools the heat dissipation fins 5 through the fixed heat pipe 3 and the movable heat pipe 4, thereby improving the heat dissipation effect. At the same time, the motor 11 is activated to drive the turntable 12 to rotate. The turntable 12 drives the connecting plate 9 and the movable heat pipe 4 on the connecting plate 9 to move back and forth through the second sliding groove 13 and the second sliding rod 14. Finally, the movable heat pipe 4 drives the heat dissipation fins 5 to swing back and forth through the first sliding groove 7 and the first sliding rod 8, so that the air between two adjacent heat dissipation fins 5 can flow, further improving the heat dissipation effect.

[0029] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. The I-shaped energy-saving bus duct with heat pipe heat dissipation module, including bus duct main body (1), the outside of bus duct main body (1) is fixedly connected with semiconductor refrigeration sheet (2), the refrigeration end of semiconductor refrigeration sheet (2) is fixedly connected with fixed heat pipe (3), it is characterized by: The outer part of the fixed heat pipe (3) is sleeved with a movable heat pipe (4), the movable heat pipe (4) is in sliding connection with the fixed heat pipe (3), the bus duct body (1) is rotatably connected with a heat dissipation fin (5), the heat dissipation fin (5) is internally provided with a through groove (6), the movable heat pipe (4) passes through the through groove (6) and extends to the other side of the heat dissipation fin (5), the heat dissipation fin (5) is internally provided with a first sliding groove (7), the first sliding groove (7) is in sliding connection with a first sliding rod (8) internally, and the first sliding rod (8) is fixedly connected with the movable heat pipe (4).

2. The I-beam energy bus duct with heat pipe cooling module according to claim 1, characterized in that: The outer part of the movable heat pipe (4) is fixedly connected with a connecting plate (9), the outer part of the bus duct body (1) is fixedly connected with a mounting plate (10), one side of the mounting plate (10) is fixedly connected with a motor (11), the output shaft of the motor (11) penetrates through the mounting plate (10) and extends to the other side of the mounting plate (10), the output shaft of the motor (11) is in rotary connection with the mounting plate (10), the output end of the motor (11) is fixedly connected with a rotating disc (12), the inner part of the connecting plate (9) is provided with a second sliding groove (13), the second sliding groove (13) is in sliding connection with a second sliding rod (14) internally, and the second sliding rod (14) is fixedly connected with the rotating disc (12).

3. The I-beam energy bus trunk with heat pipe cooling module of claim 2, wherein: The outer side wall of the second sliding rod (14) is attached to the inner side wall of the second sliding groove (13).

4. The I-beam energy bus trunking with heat pipe cooling module according to claim 2, characterized in that: The inner part of the connecting plate (9) is provided with a limiting groove (15), the limiting groove (15) is in sliding connection with a limiting plate (16) internally, and the limiting plate (16) is fixedly connected with the bus duct body (1).

5. The I-beam energy bus trunk with heat pipe cooling module of claim 4, wherein: The limiting groove (15) and the limiting plate (16) are both L-shaped structures.

6. The I-beam energy busway with heat pipe heat sink module of claim 2, wherein: The connecting plate (9) is a T-shaped structure.

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