Microminiature array anti-interference processing all-in-one machine
By combining the design of inclined heat dissipation holes, thermal conductive substrate and fins with a sealing structure, the heat dissipation and waterproofing problems of array anti-interference equipment in extreme environments are solved, and the equipment achieves efficient heat dissipation and stable operation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-29
- Publication Date
- 2026-04-03
AI Technical Summary
Existing array anti-interference processing equipment is prone to performance degradation and component damage due to heat accumulation in extreme environments, and its open heat dissipation structure is susceptible to rainwater intrusion, which can lead to short circuits or corrosion.
The heat dissipation structure, consisting of a tilted heat dissipation hole group, a heat-conducting substrate, and heat dissipation fins, combined with a sealing structure and groove design, prevents foreign objects from entering and improves heat dissipation efficiency, ensuring stable operation of the equipment.
It effectively improves heat dissipation efficiency, prevents moisture from entering, ensures stable operation of equipment in humid environments, and avoids performance degradation and component damage.
Smart Images
Figure CN224083540U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of communication equipment technology, and in particular to an ultra-small array anti-interference processing all-in-one machine. Background Technology
[0002] An array anti-interference processing unit is a highly integrated electronic device designed to receive target signals and suppress interference in complex electromagnetic environments. This device achieves efficient signal acquisition, real-time processing, and anti-interference output through an integrated solution of array antennas, algorithms, and hardware. Because it integrates multiple high-power components, it generates a significant amount of heat during operation. Excessive heat buildup can lead to performance degradation and even component damage.
[0003] Currently, most devices on the market use open cooling structures such as cooling fans and ventilation holes for heat dissipation. However, these devices typically operate in extreme environments, such as on vehicle roofs or other open-air locations. While existing cooling structures can effectively remove heat, their open design allows rainwater to easily seep into the device through ventilation holes or gaps in the casing, potentially causing short circuits, corrosion, or damage to circuits, components, and other sensitive parts. Especially when exposed to rain, humidity, and other harsh weather conditions for extended periods, the stability and reliability of the equipment will be severely affected. Utility Model Content
[0004] To address the problems mentioned above in the background technology, this utility model provides an ultra-small array anti-interference processing all-in-one machine.
[0005] The solution adopted by this utility model to solve its technical problem is: an ultra-small array anti-interference processing integrated machine, including a housing, an antenna array, an anti-interference processing module and a heat dissipation structure;
[0006] The housing is provided with heat dissipation holes on both sides. The axis of the heat dissipation holes is inclined at an angle to the horizontal plane to prevent foreign objects from entering the housing.
[0007] The heat dissipation structure includes a thermally conductive substrate and heat dissipation fins. The thermally conductive substrate is attached to the bottom of the anti-interference processing module and extends to the side wall of the housing, and is connected to the heat dissipation fins. The heat dissipation fins are connected to the inside of the heat dissipation hole group to form a heat conduction path.
[0008] The inner wall of the housing is provided with a groove, and the antenna array and the anti-interference processing module are both disposed in the groove. A sealing structure is provided around the groove to seal the antenna array and the anti-interference processing module into the groove.
[0009] In one possible implementation, the sealing structure includes a sealing groove surrounding the recess and an elastic sealing ring embedded in the groove, with the thermally conductive substrate attached to the elastic sealing ring to isolate and seal the recess. In another possible implementation, a thermally conductive medium is filled between the thermally conductive substrate and the anti-interference processing module.
[0010] In one possible implementation, the housing sidewall is further provided with an expansion interface, through which the housing is connected to an external structure.
[0011] In one possible implementation, the external structure is a power supply box with plug terminals that match the expansion interface.
[0012] In summary, the beneficial effects of this utility model are as follows:
[0013] This application utilizes inclined ventilation holes on both sides of the housing to effectively guide airflow and create natural convection ventilation. Combined with the internal heat dissipation structure consisting of a thermally conductive substrate and heat dissipation fins that adhere to the anti-interference processing module, this significantly improves heat dissipation efficiency. Furthermore, the inclined holes prevent the entry of substances such as water droplets and dust into the device. The recessed areas within the housing house the antenna array and anti-interference processing module, while the sealing structure (such as sealing rings and gaskets) works in conjunction with the thermally conductive substrate to effectively isolate external moisture, ensuring stable operation even in humid environments.
[0014] The above description is merely an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the structure of this embodiment;
[0016] Figure 2 This is an internal schematic diagram of this embodiment;
[0017] Figure 3 This is a structural breakdown diagram of this embodiment.
[0018] In the diagram: 1. Housing; 11. Heat dissipation hole group; 13. Groove; 2. Antenna array; 3. Anti-interference processing module; 4. Heat dissipation structure; 41. Thermal conductive substrate; 42. Heat dissipation fins; 5. Sealing structure; 51. Sealing groove; 52. Elastic sealing ring; 6. Expansion interface; 7. Power supply box; 71. Wiring terminal. Detailed Implementation
[0019] To make the content of this utility model easier to understand, the present utility model will be further described below with reference to specific embodiments and accompanying drawings.
[0020] It should be noted that the terms "center," "upper," "lower," "front," "rear," "left," "right," "inner," and "outer" used herein to indicate the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Unless otherwise stated, "a plurality of" means two or more.
[0021] Unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0022] To address the problems in the background technology, the present invention proposes an ultra-small array anti-interference processing all-in-one machine, which includes a housing, an antenna array, an anti-interference processing module, and a heat dissipation structure;
[0023] The housing is provided with heat dissipation holes on both sides. The axis of the heat dissipation holes is inclined at an angle to the horizontal plane to prevent foreign objects from entering the housing.
[0024] The heat dissipation structure includes a thermally conductive substrate and heat dissipation fins. The thermally conductive substrate is attached to the bottom of the anti-interference processing module and extends to the side wall of the housing, and is connected to the heat dissipation fins. The heat dissipation fins are connected to the inside of the heat dissipation hole group to form a heat conduction path.
[0025] The inner wall of the housing is provided with a groove, and the antenna array and the anti-interference processing module are both disposed in the groove. A sealing structure is provided around the groove to seal the antenna array and the anti-interference processing module into the groove.
[0026] Combined with reference Figures 1 to 3 As shown, in this embodiment, the device housing integrates an antenna array, an anti-interference processing module, and other key components, forming an integrated anti-interference processing system capable of receiving, amplifying, down-converting, filtering, and anti-interference processing signals.
[0027] First, symmetrical heat dissipation holes are arranged on both sides of the casing, with the hole axis inclined at a certain angle to the horizontal plane. Here, the hole axis refers to the centerline of the heat dissipation hole, i.e., the direction in which the hole extends, while the horizontal plane refers to a reference plane parallel to the mounting surface. The inclination angle refers to the non-perpendicular and non-parallel angle formed between the centerline of the heat dissipation hole and the horizontal plane, such as 30°, 45°, or 60°. Specifically, this inclined design ensures that external air is effectively guided to enter from one side and hot air is exhausted from the other side, forming a natural unidirectional airflow convection, thereby improving heat dissipation efficiency. Furthermore, the inclined hole design prevents rainwater from directly entering the equipment. Due to the inclination of the hole direction, water droplets will slide off along the outer wall of the hole, making it less likely to enter the casing along the hole axis. Simultaneously, the inner wall of the hole can be coated with a hydrophobic coating, further reducing water droplet adhesion, ensuring unobstructed airflow, enhancing heat dissipation, and effectively blocking liquid water penetration, ensuring the technical effect of "air only, water not."
[0028] Secondly, to achieve efficient heat dissipation, the internal heat dissipation structure of the device includes a thermally conductive substrate and heat sink fins. The thermally conductive substrate, made of aluminum or copper alloy, is attached to the lower surface of the anti-interference processing module and extends to the inner edge of the housing sidewall, where it is fixedly connected to the aluminum finned heat sink fins. The heat generated by the anti-interference processing module is efficiently conducted to the heat sink fins through the thermally conductive substrate. The heat sink fins are exposed in the inner area of the heat dissipation hole group, in direct contact with the external air, forming a continuous heat conduction path from the core module to the external environment, ensuring that the device will not experience performance degradation or damage due to overheating during long-term operation.
[0029] In addition, the inner wall of the housing is provided with grooves, in which the antenna array and anti-interference processing module are housed. To prevent external moisture from penetrating into the device, a sealing structure is provided around the grooves. This sealing structure can be a sealing ring, sealing gasket, liquid sealant, foam sealing strip, etc., and is placed between the heat-conducting substrate and the grooves. It can effectively isolate external moisture and prevent water vapor from entering the grooves through gaps, ensuring that the device can work stably in humid environments.
[0030] In one possible implementation, the sealing structure includes a sealing groove surrounding the recess and an elastic sealing ring embedded in the groove, and the thermally conductive substrate is attached to the elastic sealing ring to isolate and seal the recess.
[0031] Combined with reference Figure 2 As shown, in this embodiment, the inner wall of the housing is provided with an annular sealing groove around the groove, and an X-shaped cross-section elastic sealing ring is embedded inside to form a sealing structure. When the heat-conducting substrate is pressed onto the sealing ring, the sealing ring is compressed and deformed, and the corner of the heat-conducting substrate is fixed to the housing by bolts. This can isolate the mounting cavity from the outside and can also directionally conduct the heat of the anti-interference module to the heat dissipation fins, ensuring heat dissipation efficiency.
[0032] In one possible implementation, a thermally conductive medium is filled between the thermally conductive substrate and the anti-interference processing module. Specifically, a thermally conductive medium is filled between the thermally conductive substrate and the anti-interference processing module to improve heat conduction efficiency. This thermally conductive medium can be thermally conductive silicone, thermally conductive paste, thermally conductive oil, graphite sheets, etc., filling the space between them to effectively promote heat conduction. This ensures that the anti-interference processing module maintains a suitable temperature during operation, preventing performance degradation or damage due to overheating, thereby guaranteeing the stability of the device and its reliability during long-term operation.
[0033] In one possible implementation, the housing sidewall is further provided with an expansion interface, through which the housing is connected to an external structure.
[0034] Combined with reference Figure 3 As shown, in this embodiment, a modular expansion interface is provided on the back of the housing. The interface adopts a waterproof slot structure, integrating gold-plated metal contacts and a protective cover. The expansion interface is connected to the anti-interference processing module inside the housing via a flexible circuit board, supporting structures such as external power supply boxes, active cooling devices, and data storage units.
[0035] In one possible implementation, the external structure is a power supply box with plug-in terminals that match the expansion interface. Specifically, the plug-in terminals of the power supply box are made of gold-plated copper alloy, with an anti-oxidation coating on the terminal surface. Their shape precisely matches the guide groove within the expansion interface on the side wall of the housing, ensuring no misalignment occurs during insertion. The power supply box integrates a high-density lithium polymer battery and an intelligent voltage regulator circuit, providing a stable and reliable power supply to all components of the all-in-one machine within the housing.
[0036] In summary, the beneficial effects of this embodiment are as follows: By setting inclined heat dissipation holes on both sides of the housing, this embodiment effectively guides airflow, forming natural convection ventilation, thereby significantly improving heat dissipation efficiency. The interior of the housing is equipped with a heat dissipation structure consisting of a thermally conductive substrate and heat dissipation fins. Furthermore, the filling of the space between the thermally conductive substrate and the anti-interference processing module with a thermally conductive medium further improves heat conduction efficiency and effectively enhances heat dissipation performance. In addition, the inclined hole design effectively prevents water droplets, dust, and other external substances from entering the device. Combined with the recessed design inside the housing, the antenna array and anti-interference processing module are securely mounted. Simultaneously, the combined action of the sealing structure (such as sealing rings and gaskets) and the thermally conductive substrate effectively isolates external moisture, ensuring stable operation of the device even in humid environments. The device's expansion interface design supports connection to external structures (such as power supply boxes, active cooling devices, and data storage units), enabling the device to adapt to different usage requirements.
[0037] The embodiments described above are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and modifications made by those skilled in the art based on this utility model shall fall within the scope of protection of this utility model.
Claims
1. A miniature array anti-interference processing all-in-one machine, characterized in that, Includes housing, antenna array, anti-interference processing module and heat dissipation structure; The housing is provided with heat dissipation holes on both sides. The axis of the heat dissipation holes is inclined at an angle to the horizontal plane to prevent foreign objects from entering the housing. The heat dissipation structure includes a thermally conductive substrate and heat dissipation fins. The thermally conductive substrate is attached to the bottom of the anti-interference processing module and extends to the side wall of the housing, and is connected to the heat dissipation fins. The heat dissipation fins are connected to the inside of the heat dissipation hole group to form a heat conduction path. The inner wall of the housing is provided with a groove, and the antenna array and the anti-interference processing module are both disposed in the groove. A sealing structure is provided around the groove to seal the antenna array and the anti-interference processing module into the groove.
2. The ultra-small array anti-interference processing integrated machine according to claim 1, characterized in that, The sealing structure includes a sealing groove surrounding the groove and an elastic sealing ring embedded in the groove, and the heat-conducting substrate is attached to the elastic sealing ring to isolate and seal the groove.
3. The ultra-small array anti-interference processing integrated machine according to claim 1, characterized in that, A thermally conductive medium is filled between the thermally conductive substrate and the anti-interference processing module.
4. The ultra-small array anti-interference processing integrated machine according to claim 1, characterized in that, The housing sidewall is also provided with an expansion interface, through which the housing is connected to an external structure.
5. The ultra-small array anti-interference processing integrated machine according to claim 4, characterized in that, The external structure is a power supply box and has plug-in terminals that match the expansion interface.