Ceramic substrate
By setting staggered conical laser grooves on both sides of the ceramic substrate, the problem of stress asymmetry during ceramic substrate separation is solved, achieving edge flatness and consistency of the packaging substrate, and avoiding burr defects and subsequent processing damage.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-22
- Publication Date
- 2026-04-03
AI Technical Summary
During the separation of existing ceramic substrates, asymmetrical stress concentration leads to inclined extension of cracks, poor edge flatness, and easy generation of burr defects, which can cause damage in subsequent processing.
Multiple first and second pre-cut grooves are set on both sides of the ceramic substrate to form staggered pre-cutting routes, and conical grooves are formed by laser processing to ensure uniform stress transmission, accurate positioning, and avoid asymmetrical cracks.
It improves the consistency of the size of the front and back sides of the packaged substrate after slitting, has good edge flatness, eliminates burr defects, and avoids damage in subsequent processing.
Smart Images
Figure CN224083775U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of LED product technology, specifically to a ceramic substrate. Background Technology
[0002] Existing ceramic substrates typically employ a single-sided pre-cutting process, creating a V-shaped pre-cut groove on one side of the substrate. During the separation process, the stress propagation path on the stressed side of the ceramic substrate exhibits an asymmetrical distribution, easily causing cracks to extend obliquely during separation. This results in poor edge smoothness and a high rate of burr formation on the separated ceramic substrate. Furthermore, the irregular edge structure can cause material jamming during subsequent processing, leading to product damage. Utility Model Content
[0003] In view of this, this application provides a ceramic substrate with good edge flatness after cracking, which can eliminate burr defects and avoid damage during subsequent processing.
[0004] To achieve the above objectives, this application provides the following technical solution:
[0005] A ceramic substrate includes a substrate body and at least one pre-cutting route disposed on the substrate body. The pre-cutting route includes a plurality of first pre-cutting grooves disposed on a first side of the substrate body and arranged along the extension direction of the pre-cutting route, and a plurality of second pre-cutting grooves disposed on a second side of the substrate body and arranged along the extension direction of the pre-cutting route.
[0006] Optionally, the pre-cutting route further includes at least one pre-cutting hole penetrating through a first side and a second side of the substrate body, the at least one pre-cutting hole being arranged along the extension direction of the pre-cutting route.
[0007] Optionally, the first pre-cut groove and the second pre-cut groove are configured as tapered laser grooves.
[0008] Optionally, the included angle formed by the opposite side walls of the conical laser groove is 10-20 degrees.
[0009] Optionally, the thickness of the substrate body does not exceed 2 mm, the center distance between two adjacent first pre-cut grooves is 0.1-0.2 mm, and the center distance between two adjacent second pre-cut grooves is 0.1-0.2 mm.
[0010] Optionally, the width of the first pre-cut groove is 0.1-0.11 mm, and the width of the second pre-cut groove is 0.1-0.11 mm.
[0011] Optionally, the depth of the first pre-cut groove is 20-30% of the thickness of the substrate body, and the depth of the second pre-cut groove is 20-30% of the thickness of the substrate body.
[0012] Optionally, at least two pre-cut holes are provided, and the center distance between two adjacent pre-cut holes is 5-8 mm.
[0013] Optionally, the plurality of first pre-cut grooves and the plurality of second pre-cut grooves are arranged one-to-one, and the positional deviation between the relative first pre-cut grooves and second pre-cut grooves does not exceed 10 micrometers.
[0014] Optionally, the pre-cutting routes are provided in multiple ways, including at least one first route and at least one second route, wherein the first route and the second route are arranged in a crisscross pattern.
[0015] The ceramic substrate provided in this application, when slicing the substrate body, has multiple first pre-cut grooves and multiple second pre-cut grooves respectively set on both sides of the substrate body, and the pre-cutting path is also located on both sides of the substrate body. The stress on both sides of the substrate body is transmitted on the pre-cutting path, which can accurately locate the slicing position of the substrate body. The slicing results in good size consistency on both sides of the encapsulation substrate, good edge flatness, and can also eliminate burr defects, avoiding damage in subsequent processing. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.
[0017] Figure 1 A top view of a ceramic substrate shown in some embodiments;
[0018] Figure 2 Cross-sectional views of ceramic substrates shown in some embodiments;
[0019] Figure 3 This is a partial cross-sectional schematic diagram of a first pre-cut groove and a second pre-cut groove shown in some embodiments.
[0020] Explanation of reference numerals in the attached drawings: 1. Pre-cutting route; 2. Substrate body; 11. First pre-cutting groove; 12. Second pre-cutting groove; 13. Pre-cutting hole. Detailed Implementation
[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0022] like Figures 1-3 As shown in the embodiment of this application, a ceramic substrate is provided, including a substrate body 2. The substrate body 2 has a first side and a second side facing each other. The material of the substrate body 2 can be ceramic materials such as alumina, aluminum nitride, and zirconium oxide. At least one pre-cutting line 1 is provided on the substrate body 2. Here, based on process requirements, there can be one pre-cutting line 1, which extends from one side of the substrate body 2 to the other side, so that the substrate body 2 can be cut into two packaging substrates for LED chip packaging; or there can be multiple pre-cutting lines 1, which intersect in a grid pattern. For example, the pre-cutting line 1 includes a first line extending laterally and a second line extending longitudinally. The first line and the second line are arranged in a staggered manner so that the substrate body 2 can be cut into four or more packaging substrates.
[0023] The pre-cutting route 1 includes multiple first pre-cutting grooves 11 and multiple second pre-cutting grooves 12. The number of first pre-cutting grooves 11 and second pre-cutting grooves 12 is adapted to the length and width of the substrate body 2, that is, the number of first pre-cutting grooves 11 and second pre-cutting grooves 12 increases with the increase of the length or width of the substrate body 2. For example, the number of first pre-cutting grooves 11 and second pre-cutting grooves 12 is set to 10-30. Depending on the different length and width dimensions of the substrate body 2, the number of first pre-cutting grooves 11 and second pre-cutting grooves 12 can be 12 or 22. The multiple first pre-cutting grooves 11 are formed on the first side of the substrate body 2 and arranged along the extension direction of the pre-cutting route 1. The multiple second pre-cutting grooves 12 are formed on the second side of the substrate body 2 and arranged along the extension direction of the pre-cutting route 1. In other words, the multiple first pre-cutting grooves 11 and the multiple second pre-cutting grooves 12 are respectively located on two opposite sides of the substrate body 2, forming the pre-cutting route 1.
[0024] When the substrate body 2 is cut, since multiple first pre-cut grooves 11 and multiple second pre-cut grooves 12 are respectively provided on both sides of the substrate body 2, the pre-cutting route 1 is also located on both sides of the substrate body 2. The stress on both sides of the substrate body 2 is transmitted on the pre-cutting route 1, which can accurately locate the cutting position of the substrate body 2. The size consistency of the front and back sides of the packaged substrate formed by cutting is good, the edge flatness is good, and the burr defect can be eliminated, avoiding damage in subsequent processing.
[0025] In this design, multiple first pre-cut grooves 11 and multiple second pre-cut grooves 12 are formed by laser processing. Due to the processing characteristics of laser, the first pre-cut grooves 11 and the second pre-cut grooves 12 are set as conical laser grooves. In this way, processing the first pre-cut grooves 11 and the second pre-cut grooves 12 by laser processing is convenient and quick, and is less likely to damage the substrate body 2. Moreover, the cross-section of the processed first pre-cut grooves 11 and the second pre-cut grooves 12 decreases with the increase of depth, which is beneficial to improving the internal structural strength of the substrate body 2 and improving the side cutting accuracy of the substrate body 2.
[0026] like Figure 1 As shown, when the thickness of the substrate body 2 does not exceed 2 mm, for example, when the thickness of the substrate body 2 is 1 mm, the center distance a between two adjacent first pre-cut grooves 11 is 0.1-0.2 mm, and the center distance between two adjacent second pre-cut grooves 12 is 0.1-0.2 mm. By controlling the interval between the multiple first pre-cut grooves 11 and the multiple second pre-cut grooves 12, it can be ensured that the substrate body 2 does not crack during the slitting process, and the yield of the finished product can be guaranteed.
[0027] The width b of the first pre-cut groove 11 is set to 0.1-0.11 mm. When the opening of the first pre-cut groove 11 is circular, the diameter of the opening of the first pre-cut groove 11 is 0.1-0.11 mm. The width of the second pre-cut groove 12 is set to 0.1-0.11 mm. When the opening of the second pre-cut groove 12 is circular, the diameter of the opening of the second pre-cut groove 12 is 0.1-0.11 mm. In this way, the distance between two adjacent first pre-cut grooves 11 / second pre-cut grooves 12 is relatively close, and there may even be contact and overlap, so that multiple first pre-cut grooves 11 / second pre-cut grooves 12 can be connected to form a V-shaped groove, further improving the flatness of the edge after splitting.
[0028] like Figure 3 As shown, the included angle f between the opposite side walls of the conical laser hole is 10-20 degrees. Thus, the included angle between the opposite side walls of the V-shaped groove formed by the multiple first pre-cut grooves 11 / second pre-cut grooves 12 is 10-20 degrees, which can provide positioning for the cutting of the substrate body 2 without occupying too much side of the substrate body 2, thereby reducing the material waste of the substrate body 2.
[0029] The depth d1 of the first pre-cut groove 11 is 20-30% of the thickness of the substrate body 2, preferably 25%. The depth d2 of the second pre-cut groove 12 is 20-30% of the thickness of the substrate body 2, preferably 25%. For example, if the thickness of the substrate body 2 is set to 1 mm, the depths of both the first pre-cut groove 11 and the second pre-cut groove 12 are set to 0.25 mm. This helps to improve the structural strength of the substrate body 2 and the yield rate of the finished board.
[0030] Of course, in other solutions, the actual depth and angle of the first pre-cut groove 11 and the second pre-cut groove 12 can be appropriately adjusted according to the material, thickness and other parameters of the substrate body 2.
[0031] To ensure the consistency of the cleavage on both sides of the substrate body 2, multiple first pre-cut grooves 11 and multiple second pre-cut grooves 12 are arranged in a one-to-one manner, meaning the number of first pre-cut grooves 11 and second pre-cut grooves 12 is the same, and their positions correspond. In the optimal solution, the multiple first pre-cut grooves 11 and multiple second pre-cut grooves 12 are arranged in a mirror-symmetrical manner with respect to the substrate body 2. Of course, some deviation is inevitable during processing, but the positional deviation e relative to the first pre-cut grooves 11 and second pre-cut grooves 12 does not exceed 10 micrometers.
[0032] In some embodiments, as shown in Figure 2, the pre-cutting route 1 further includes pre-cutting holes 13. At least one pre-cutting hole 13 is provided, that is, the number of pre-cutting holes 13 can be one, two, or more than three. Each pre-cutting hole 13 penetrates the first side and the second side of the substrate body 2 and is arranged along the extension direction of the pre-cutting route 1, so that each pre-cutting hole 13 is located on the pre-cutting route 1, so as to facilitate the cutting of the substrate body 2 through the pre-cutting route 1. Here, the first pre-cut groove 11, the second pre-cut groove 12, and the pre-cut hole 13 are all arranged on the pre-cutting path 1. The pre-cut hole 13 and the first pre-cut groove 11 / second pre-cut groove 12 are arranged alternately on the pre-cutting path 1. When there are two or more pre-cut holes 13, the distance between two adjacent pre-cut holes 13 can be greater than the distance between two adjacent first pre-cut grooves 11 / second pre-cut grooves 12. For example, 8-10 first pre-cut grooves 11 / second pre-cut grooves 12 are set between two adjacent pre-cut holes 13. That is, every 8-10 first pre-cut grooves 11 / second pre-cut grooves 12, a pre-cut hole 13 connects one first pre-cut groove 11 and one second pre-cut groove 12. In this way, by adding pre-cut holes 13, the burrs caused by the positional deviation of the first pre-cut grooves 11 and the second pre-cut grooves 12 on both sides of the substrate body 2 can be avoided, further improving the edge flatness.
[0033] When there are two or more pre-cut holes 13, the center distance c between two adjacent pre-cut holes 13 is 5-8 mm. For example, if the pre-cut holes 13 are circular holes, the center distance between two pre-cut holes 13 is the distance from the center of one pre-cut hole 13 to the center of the other pre-cut hole 13. In this way, by setting the spacing between adjacent pre-cut holes 13, both the structural strength of the substrate body 2 and the edge flatness after slitting can be ensured.
[0034] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.
[0035] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.
[0036] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.
[0037] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.
[0038] It should be understood that the qualifiers “first,” “second,” “third,” “fourth,” “fifth,” and “sixth” used in the description of the embodiments of this application are only used to more clearly illustrate the technical solutions and are not intended to limit the scope of protection of this application.
[0039] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.
Claims
1. A ceramic substrate, characterized by, The substrate body (2) and at least one pre-cut route (1) arranged on the substrate body (2), the pre-cut route (1) comprising a plurality of first pre-cut grooves (11) arranged on the first side of the substrate body (2) and along the extension direction of the pre-cut route (1), and a plurality of second pre-cut grooves (12) arranged on the second side of the substrate body (2) and along the extension direction of the pre-cut route (1).
2. The ceramic substrate of claim 1, wherein, The pre-cut route (1) further comprises at least one pre-cut hole (13) penetrating the first side and the second side of the substrate body (2), the at least one pre-cut hole (13) being arranged along the extension direction of the pre-cut route (1).
3. The ceramic substrate of claim 1, wherein, The first pre-cut groove (11) and the second pre-cut groove (12) are arranged as tapered laser grooves.
4. The ceramic substrate of claim 3, wherein, The included angle formed by the opposite two side walls of the tapered laser groove is 10-20 degrees.
5. The ceramic substrate of claim 1, wherein, The thickness of the substrate body (2) is not more than 2 millimeters, the center distance between two adjacent first pre-cut grooves (11) is 0.1-0.2 millimeters, and the center distance between two adjacent second pre-cut grooves (12) is 0.1-0.2 millimeters.
6. The ceramic substrate of claim 5, wherein, The slot width of the first pre-cut groove (11) is 0.1-0.11 millimeters, and the slot width of the second pre-cut groove (12) is 0.1-0.11 millimeters.
7. The ceramic substrate of claim 1, wherein, The depth of the first pre-cut groove (11) is 20-30% of the thickness of the substrate body (2), and the depth of the second pre-cut groove (12) is 20-30% of the thickness of the substrate body (2).
8. The ceramic substrate of claim 2, wherein, The pre-cut hole (13) is provided with at least two, the center distance between two adjacent pre-cut holes (13) is 5-8 millimeters.
9. The ceramic substrate of claim 1, wherein, The plurality of first pre-cut grooves (11) and the plurality of second pre-cut grooves (12) are arranged one by one, and the position deviation of the opposite first pre-cut groove (11) and the second pre-cut groove (12) is not more than 10 microns.
10. The ceramic substrate of claim 1, wherein, The pre-cut route (1) is provided with a plurality of, including at least one first route and at least one second route, the first route and the second route are arranged horizontally and vertically.