Radiating device and electronic equipment

Abstract

The utility model provides a heat dissipation device and electronic equipment. The heat dissipation device comprises a plate body, the plate body is provided with a closed inner cavity used for being filled with working substances, and the closed inner cavity comprises a steam channel and a liquid channel which are arranged in a separated mode; the steam channel comprises an evaporation area and a condensation area, the evaporation area is communicated with one end of the liquid channel, and the condensation area is communicated with the other end of the liquid channel, so that the working substance can be subjected to gas-liquid two-phase circulation between the steam channel and the liquid channel. A first flow guide structure is arranged in the plate body, located in the condensation area and used for guiding steam located in the condensation area to flow in the direction away from the evaporation area. Steam is condensed into liquid and then returns to the liquid channel, water returning is facilitated, and the problems that steam is difficult to diffuse and water returning is blocked in the prior art are solved.

Description

Technical Field

[0001] This disclosure relates to the field of electronic heat dissipation technology, and in particular to a heat dissipation device and electronic device. Background Technology

[0002] In the field of electronic heat dissipation, especially as portable electronic devices such as mobile phones and tablets gradually become thinner and lighter, the problem of effective heat dissipation under limited size has become increasingly serious. As a phase change heat conduction element, ultra-thin heat dissipation plates are widely used in the heat dissipation of portable electronic devices due to their excellent heat transfer performance and temperature uniformity.

[0003] However, with the trend towards thinner and lighter designs, vapor chambers are becoming increasingly thinner. Currently, the ultra-thin vapor chambers commonly used in mobile phones are quite thin and irregularly shaped. This extreme thinness enhances the vapor chamber's carrying capacity, thus hindering gas-liquid circulation. Furthermore, the irregular shape makes it difficult for vapor to diffuse in certain areas, and water return is also limited. Due to these limitations, the temperature distribution performance of current ultra-thin, irregularly shaped vapor chambers is gradually becoming insufficient to meet the heat dissipation requirements of portable electronic devices. Utility Model Content

[0004] This disclosure provides a heat dissipation device and an electronic device to solve at least some of the related technical problems.

[0005] In a first aspect, embodiments of this disclosure provide a heat dissipation device, including a plate having a closed inner cavity for filling a working substance, the closed inner cavity including a vapor channel and a liquid channel separated from each other; the vapor channel includes an evaporation zone and a condensation zone, the evaporation zone being connected to one end of the liquid channel, and the condensation zone being connected to the other end of the liquid channel, so that the working substance can circulate in a two-phase gas-liquid cycle between the vapor channel and the liquid channel;

[0006] The plate body is provided with a first flow guiding structure, which is located in the condensation zone and is used to guide the steam in the condensation zone to flow away from the evaporation zone.

[0007] Optionally, the first flow guiding structure includes a plurality of protrusions protruding from the inner wall of the plate, the plurality of protrusions being arranged in an array to form a flow guiding channel, and the end of the protrusion near the evaporation zone having a flow guiding arc surface and a size smaller than the size of the end of the protrusion away from the evaporation zone.

[0008] Optionally, the cross-section of the protrusion is fin-shaped or swallowtail-shaped.

[0009] Optionally, the inner wall of the plate is further provided with a second flow guiding structure, which is located in the liquid channel and is used to guide the liquid in the liquid channel to flow from one end to the other; or

[0010] The inner wall of the plate is also provided with a second flow guiding structure, which is located in the liquid channel and the evaporation zone, and is used to guide the liquid in the liquid channel to flow to the evaporation zone.

[0011] Optionally, the second flow guiding structure includes a plurality of strip-shaped grooves arranged side by side, the extension direction of the strip-shaped grooves being consistent with the extension direction of the liquid channel and facing the evaporation zone.

[0012] Optionally, the plate body includes an upper cover and a lower cover, the upper cover and the lower cover are sealed together and enclose the closed inner cavity; the first flow guiding structure and the second flow guiding structure are both disposed on the inner wall of the lower cover.

[0013] Optionally, the inner wall of the upper cover is provided with a plurality of support columns corresponding to the steam channel, and the support columns abut against the lower cover.

[0014] Optionally, it also includes a capillary structure disposed in the liquid channel for guiding the liquid in the condensation zone to the evaporation zone via the liquid channel.

[0015] Optionally, the capillary structure includes an extension that extends into the evaporation zone; and / or

[0016] The capillary structure includes a reflux section that extends from the liquid channel to one end of the condensation zone away from the evaporation zone.

[0017] Optionally, the capillary structure includes a primary capillary structure and a secondary capillary structure stacked along the thickness direction of the plate.

[0018] The extension includes a first extension and a plurality of second extensions arranged side by side. The first extension is disposed on the primary capillary structure, completely covering the evaporation zone. The plurality of second extensions are disposed on the secondary capillary structure and cover at least a portion of the evaporation zone; and / or

[0019] The reflux section is located in the main stage capillary structure.

[0020] Optionally, the plate includes an upper cover and a lower cover, which are sealed together and enclose the closed inner cavity; the first flow guiding structure is disposed on the inner wall of the lower cover.

[0021] Optionally, the inner wall of the upper cover is provided with a plurality of support columns corresponding to the steam channel, and the support columns abut against the lower cover.

[0022] Optionally, a barrier is provided between the upper cover and the lower cover, and the barrier is located between the liquid channel and the steam channel.

[0023] Optionally, the evaporation zone and the condensation zone are arranged along a first direction, and the liquid channel and the vapor channel are arranged along a second direction perpendicular to the first direction; the condensation zone is located on one side of the evaporation zone along the first direction, and at least a portion of the liquid channel extends to the other side of the evaporation zone along the first direction.

[0024] In a second aspect, embodiments of this disclosure provide an electronic device, including a mid-frame, a heat source, and a heat dissipation device as described in the first aspect, wherein the heat dissipation device is disposed in the mid-frame; the heat source is disposed within the evaporation zone or the heat source is disposed in the mid-frame and corresponds to the position of the evaporation zone.

[0025] The technical solutions provided by the embodiments of this disclosure can achieve at least the following beneficial technical effects:

[0026] The heat dissipation device disclosed herein guides the steam located in the condensation zone to flow away from the evaporation zone by setting a first flow guiding structure on the inner wall of the plate. After the steam condenses into liquid, it returns to the liquid channel, which is beneficial for water return and solves the problems of steam diffusion difficulty and water return obstruction in the prior art.

[0027] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the structure of an electronic device according to an exemplary embodiment of the present disclosure.

[0030] Figure 2 and Figure 3 yes Figure 1 Cross-sectional view of plane AA.

[0031] Figure 4 This is a schematic diagram of the structure of the top cover of a heat dissipation device according to an exemplary embodiment of the present disclosure.

[0032] Figure 5 This is a schematic diagram of the structure of the lower cover of a heat dissipation device according to an exemplary embodiment of the present disclosure.

[0033] Figure 6 yes Figure 5 Enlarged diagram of point A in the middle.

[0034] Figure 7 yes Figure 6 A magnified view of a portion of the image.

[0035] Figure 8 yes Figure 5 Enlarged diagram of point B in the middle.

[0036] Figure 9 This is an exploded view of a heat dissipation device according to an exemplary embodiment of this disclosure.

[0037] Figure 10 This is a schematic diagram of the structure of a heat dissipation device according to an exemplary embodiment of the present disclosure.

[0038] Figure 11 yes Figure 10 Cross-sectional view of the middle BB surface. Detailed Implementation

[0039] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure.

[0040] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to limit the disclosure. Unless otherwise defined, the technical or scientific terms used in this disclosure should be understood in their ordinary sense by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “a” or “one,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one, which will be separately stated if referring only to “a.” “A plurality” or “several” means two or more. Unless otherwise indicated, the terms “front,” “rear,” “lower,” and / or “upper,” “top,” “bottom,” and similar terms are for ease of description only and are not limited to a location or spatial orientation. The terms “comprising” or “including,” and similar terms, mean that the elements or objects preceding “comprising” or “including” encompass the elements or objects listed following “comprising” or “including” and their equivalents, but do not exclude other elements or objects. The word “connection” or “link” is not limited to physical or mechanical connections, but can also include electrical connections, whether direct or indirect.

[0041] The heat dissipation device and electronic device of this disclosure will now be described in detail with reference to the accompanying drawings. Unless otherwise specified, the features of the following embodiments and implementations can be combined with each other.

[0042] See Figure 1 As shown, this disclosure provides an electronic device, which can be a smartphone, tablet computer, laptop, or similar device. The electronic device includes a mid-frame 90, a heat source 91, and a heat dissipation device 100, with the heat dissipation device 100 disposed on the mid-frame 90. The mid-frame 90 may also house devices such as a camera 92, or the mid-frame 90 may be an integral structure with the back panel of the electronic device, with the camera 92 disposed on this integral structure. The heat dissipation device 100 can be a vapor chamber or an ultra-thin loop heat pipe, serving as a phase change heat conduction element with excellent heat transfer performance and temperature uniformity. The heat source 91 can be a System-on-a-Chip (SoC).

[0043] See Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, the heat dissipation device 100 includes a plate 10, and the periphery of the plate 10 may be formed with skirts 19. The plate 10 is fixed to the middle frame 90 with a central opening by means of overlapping skirts 19 (e.g., Figure 2 Alternatively, the plate 10 can be directly attached to the middle frame 90 via the skirt 19 (e.g.) Figure 3 ).

[0044] See Figure 4 and Figure 5 As shown, the plate 10 has a closed inner cavity with a low vacuum for filling the working substance. The closed inner cavity includes a vapor channel 11 and a liquid channel 12 separated from each other. The vapor channel 11 includes an evaporation zone 111 and a condensation zone 112. A heat source 91 is disposed in the evaporation zone 111, or the heat source 91 is disposed in the middle frame 90 and corresponds to the position of the evaporation zone 111. The evaporation zone 111 is connected to one end of the liquid channel 12, and the condensation zone 112 is connected to the other end of the liquid channel 12, so that the working substance can circulate in both gas and liquid phases between the vapor channel 11 and the liquid channel 12.

[0045] The plate 10 is provided with a first flow guiding structure 13, which is located in the condensation zone 112 and is used to guide the vapor in the condensation zone 112 to flow away from the evaporation zone 111. The first flow guiding structure 13 can be understood as a self-driven microstructure. Optionally, the first flow guiding structure 13 can be provided on the inner wall of the plate 10. Alternatively, the first flow guiding structure 13 can be a suspended flow guiding structure, spaced apart from the inner wall of the plate 10.

[0046] The heat dissipation device 100 may further include a capillary structure 20, which is disposed in the liquid channel 12 and is used to guide the liquid in the condensation zone 112 to the evaporation zone 111 through the liquid channel 12. The capillary structure 20 may be one or more of sintered copper mesh, stainless steel mesh, etched metal mesh, powder sintered metal mesh, foamed metal, and stamped metal mesh.

[0047] The working principle of the heat dissipation device 100 is as follows: the liquid working substance in the closed inner cavity is heated by the heat source 91 in the evaporation zone 111 and evaporates into steam. The steam diffuses to the condensation zone 112 and condenses into liquid. The liquid is absorbed by the capillary structure 20 through capillary effect into the liquid channel and then flows back to the evaporation zone 111. This gas-liquid circulation achieves uniform temperature. The first guiding structure 13 guides the steam in the condensation zone 112 to flow away from the evaporation zone 111, allowing the steam to return to the liquid channel 12 more quickly after condensation, which is beneficial for water return and solves the problems of difficult steam diffusion and obstructed water return in the prior art. Furthermore, the above scheme makes the steam flow smoother, reduces gas flow resistance, achieves more efficient overall heat dissipation, improves the efficiency of internal gas-liquid circulation, and achieves effective heat dissipation of the main chip heat source area within the limited space inside the electronic device. Therefore, the thickness of the board 10 can be further reduced to below 0.25mm to meet the application requirements of ultra-thin portable devices.

[0048] See Figure 5 , Figure 6 and Figure 7 As shown, in some optional embodiments, the first flow guiding structure 13 includes a plurality of protrusions 131 extending from the inner wall of the plate 10. These protrusions 131 are arranged in an array to form a flow guiding channel 132. The end of each protrusion 131 near the evaporation zone 111 has a flow guiding arc surface 133, and its size is smaller than the size of the end of the protrusion 131 away from the evaporation zone 111. During the gas-liquid circulation of the working substance, the flow guiding channel 132 and the flow guiding arc surface 133 can guide the vapor and the liquid formed by vapor condensation to flow away from the evaporation zone 111, returning to the liquid channel, accelerating the gas-liquid two-phase circulation of the working substance, and improving heat dissipation efficiency. In this embodiment, the upper end of the protrusion 131 is smaller than the lower end. Optionally, the cross-section of the protrusion 131 is fin-shaped, swallowtail-shaped, or other shapes that facilitate fluid movement. The flow channel 132 can be a micron-sized irregular channel. By adjusting various shape parameters of the channel, the gas-liquid separation effect can be achieved, the gas-liquid circulation efficiency can be increased, and the thickness of the heat spreader or ultra-thin loop heat pipe can be effectively reduced.

[0049] See Figure 4 , Figure 5 and Figure 8As shown, in some optional embodiments, the inner wall of the plate 10 is further provided with a second flow guiding structure 14. The second flow guiding structure 14 is located in the liquid channel 12 and is used to guide the liquid in the liquid channel 12 to flow from one end to the other end. This helps the capillary structure 20 to draw the liquid from the condensation zone 112 back to the evaporation zone 111, strengthens the capillary force of the capillary structure 20 in the liquid channel 12, and improves the effect of the capillary effect. Alternatively, the second flow guiding structure 14 is located in both the liquid channel 12 and the evaporation zone 111, and is used to guide the liquid in the liquid channel 12 to flow to the evaporation zone 111, further improving the capillary effect of the capillary structure 20. Optionally, the second flow guiding structure 14 can also be further located in a portion of the condensation zone 112 adjacent to the evaporation zone 111, which can ensure that there is sufficient capillary force around the evaporation zone 111 to attract liquid, preventing the liquid in the evaporation zone 111 from being heated and evaporated without replenishment, thus preventing dry burning and a rapid rise in the temperature of the evaporation zone 111. Optionally, the second flow guiding structure 14 includes a plurality of strip-shaped grooves 141 arranged side by side, the extension direction of the strip-shaped grooves 141 being consistent with the extension direction of the liquid channel 12 and facing the evaporation zone 111.

[0050] See Figures 9 to 11 As shown, in some optional embodiments, the plate 10 includes an upper cover 15 and a lower cover 16, which are sealed together and form the closed inner cavity. The inner wall of the upper cover 15 is provided with multiple support pillars 17 corresponding to the steam channel 11. These support pillars 17 abut against the lower cover 16. The support pillars 17 not only enhance the connection reliability between the upper cover 15 and the lower cover 16, but also form a cavity between adjacent support pillars 17 for steam flow. The support pillars 17 can be formed by an etching process, allowing steam to diffuse freely within the cavity.

[0051] Optionally, both the first flow guiding structure 13 and the second flow guiding structure are located on the inner wall of the lower cover 16. Both the first flow guiding structure 13 and the second flow guiding structure can be formed on the lower cover 16 using an etching process. By adjusting the dimensions of the first flow guiding structure 13, spontaneous unidirectional flow of liquid in the condensation zone 112 can be achieved, promptly directing the droplets formed by the condensation of vapor in the cold zone to the liquid channel 12, effectively reducing flow resistance and improving overall thermal cycle efficiency. The upper cover 15 and the lower cover 16 can be welded together, using laser welding, brazing, or diffusion welding. The materials of the upper cover 15 and the lower cover 16 can be one or more of stainless steel, titanium alloy, aluminum alloy, pure copper, and alloy copper.

[0052] A barrier portion 18 is provided between the upper cover 15 and the lower cover 16. This barrier portion 18 is located between the liquid channel 12 and the steam channel 11, separating them to achieve gas-liquid separation and minimize the obstruction of gas-liquid circulation by the carryover effect. The barrier portion 18 can be a physical blocking structure, such as a baffle. Both ends of the barrier portion 18 can have connecting channels, through which fasteners such as screws pass to connect it to the upper cover 15 or the lower cover 16. Alternatively, the barrier portion 18 can also be welded to the inner wall of the upper cover 15 or the lower cover 16 to achieve connection.

[0053] In some alternative embodiments, the evaporation zone 111 and the condensation zone 112 are arranged along a first direction (transverse in the figure), and the liquid channel 12 and the vapor channel 11 are arranged along a second direction perpendicular to the first direction (longitudinal in the figure). The condensation zone 112 is located on one side of the evaporation zone 111 along the first direction (bottom side in the figure), and at least a portion of the liquid channel 12 extends to the other side of the evaporation zone 111 along the first direction (top side in the figure).

[0054] See Figure 4 and Figure 9 As shown, the capillary structure 20 includes an extension 23 that extends to the evaporation zone 111, i.e., the boundary region between the liquid channel 12 and the evaporation zone 111, facilitating the flow of liquid from the liquid channel 12 to the evaporation zone 111. In this embodiment, the extension 23 extends to the top side of the evaporation zone 111. The capillary structure 20 also includes a reflux section 24 that extends from the liquid channel 12 to the end of the condensation zone 112 away from the evaporation zone 111, facilitating the flow of liquid from the condensation zone 112 to the capillary structure 20. In this embodiment, the reflux section 24 extends to the bottom side of the condensation zone 112.

[0055] Combination Figure 9 and Figure 11 As shown, the capillary structure 20 includes a primary capillary structure 21 and a secondary capillary structure 22 stacked along the thickness direction of the plate 10. The primary capillary structure 21 abuts against the lower cover 16, and the secondary capillary structure 22 abuts against the upper cover 15. The reflux section 24 is provided on the primary capillary structure 21. The primary capillary structure 21 and the secondary capillary structure 22 can be one or more of sintered copper mesh, stainless steel mesh, etched metal mesh, powder sintered metal mesh, foamed metal, and stamped metal mesh.

[0056] The aforementioned extension 23 includes a first extension 231 and a plurality of second extensions 232 arranged side by side. The first extension 231 is located on the primary capillary structure 21 and completely covers the evaporation zone 111. The plurality of second extensions 232 are located on the secondary capillary structure 22 and cover at least a portion of the evaporation zone 111. The first extension 231 and the second extensions 232 together form a multi-layer water-controlling unidirectional structure, which, while preventing backflow of steam, can also directionally transport the water in the liquid channel 12 back to the evaporation zone 111 (i.e., the heat source area), achieving efficient gas-liquid circulation.

[0057] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosed embodiments herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and embodiments are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the claims.

[0058] It should be understood that the above description is only a preferred embodiment of this disclosure and is not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A heat dissipation device, characterized in that, The device includes a plate having a closed inner cavity for filling a working substance. The closed inner cavity includes a vapor channel and a liquid channel separated from each other. The vapor channel includes an evaporation zone and a condensation zone. The evaporation zone is connected to one end of the liquid channel, and the condensation zone is connected to the other end of the liquid channel, so that the working substance can circulate in a two-phase gas-liquid cycle between the vapor channel and the liquid channel. The plate body is provided with a first flow guiding structure, which is located in the condensation zone and is used to guide the steam in the condensation zone to flow away from the evaporation zone.

2. The heat dissipation device according to claim 1, characterized in that, The first flow guiding structure includes a plurality of protrusions protruding from the inner wall of the plate. The plurality of protrusions are arranged in an array to form a flow guiding channel. The end of the protrusion near the evaporation zone has a flow guiding arc surface and its size is smaller than the size of the end of the protrusion away from the evaporation zone.

3. The heat dissipation device according to claim 2, characterized in that, The cross-section of the protrusion is fin-shaped or swallowtail-shaped.

4. The heat dissipation device according to claim 1, characterized in that, The inner wall of the plate is further provided with a second flow guiding structure, which is located in the liquid channel and is used to guide the liquid in the liquid channel to flow from one end to the other; or The inner wall of the plate is also provided with a second flow guiding structure, which is located in the liquid channel and the evaporation zone, and is used to guide the liquid in the liquid channel to flow to the evaporation zone.

5. The heat dissipation device according to claim 4, characterized in that, The second flow guiding structure includes a plurality of strip-shaped grooves arranged side by side, the extension direction of the strip-shaped grooves being consistent with the extension direction of the liquid channel and facing the evaporation zone.

6. The heat dissipation device according to claim 4, characterized in that, The plate includes an upper cover and a lower cover, which are sealed together and enclose the closed inner cavity; the first flow guiding structure and the second flow guiding structure are both disposed on the inner wall of the lower cover.

7. The heat dissipation device according to claim 6, characterized in that, The inner wall of the upper cover is provided with multiple support columns corresponding to the steam channel, and the support columns abut against the lower cover.

8. The heat dissipation device according to claim 1, characterized in that, It also includes a capillary structure disposed in the liquid channel for guiding the liquid in the condensation zone to the evaporation zone via the liquid channel.

9. The heat dissipation device according to claim 8, characterized in that, The capillary structure includes an extension that extends into the evaporation zone; and / or, The capillary structure includes a reflux section that extends from the liquid channel to one end of the condensation zone away from the evaporation zone.

10. The heat dissipation device according to claim 9, characterized in that, The capillary structure includes a primary capillary structure and a secondary capillary structure stacked along the thickness direction of the plate. The extension includes a first extension and a plurality of second extensions arranged side by side. The first extension is disposed on the primary capillary structure and completely covers the evaporation zone. The plurality of second extensions are disposed on the secondary capillary structure and cover at least a portion of the evaporation zone; and / or The reflux section is located in the main stage capillary structure.

11. The heat dissipation device according to claim 1, characterized in that, The plate includes an upper cover and a lower cover, which are sealed together and enclose the closed inner cavity; the first flow guiding structure is disposed on the inner wall of the lower cover.

12. The heat dissipation device according to claim 11, characterized in that, The inner wall of the upper cover is provided with multiple support columns corresponding to the steam channel, and the support columns abut against the lower cover.

13. The heat dissipation device according to claim 11, characterized in that, A barrier is provided between the upper cover and the lower cover, and the barrier is located between the liquid channel and the steam channel.

14. The heat dissipation device according to claim 1, characterized in that, The evaporation zone and the condensation zone are arranged along a first direction, and the liquid channel and the vapor channel are arranged along a second direction perpendicular to the first direction; the condensation zone is located on one side of the evaporation zone along the first direction, and at least a portion of the liquid channel extends to the other side of the evaporation zone along the first direction.

15. An electronic device, characterized in that, It includes a middle frame, a heat source, and a heat dissipation device as described in any one of claims 1 to 14, wherein the heat dissipation device is disposed in the middle frame; the heat source is disposed within the evaporation zone or the heat source is disposed in the middle frame and corresponds to the position of the evaporation zone.

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