Host of electronic equipment and frequency interferometer

Abstract

The utility model relates to a host of electronic equipment and a frequency interferometer. The host comprises a shell with an accommodating cavity; the functional module is arranged in the accommodating cavity; the radiator is arranged in the containing cavity and makes contact with the function module, the radiator is provided with an air flow channel communicated with the outside, and the radiator is configured to isolate the air flow channel from other spaces, except the radiator, in the containing cavity. According to the utility model, the heat radiator is arranged in the accommodating cavity, and the heat radiator is in thermal contact with the functional module in the accommodating cavity, so that heat generated by the functional module is transferred into the air flow channel through the side wall of the heat radiator, and heat exchange with air in the air flow channel is realized; the heat radiator in the host can effectively isolate the containing cavity from the airflow channel, when heat exchange is carried out, water vapor, dust and the like which possibly enter along with gas are isolated in the airflow channel, and the heat radiator with the arrangement can meet the waterproof and dustproof requirements of the host while effectively radiating heat of the functional module.

Description

[0001] This application claims priority to Chinese Patent Application No. 202411591255.X, filed on November 8, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This utility model relates to the field of heat dissipation technology for jammers, and in particular to a host computer and frequency jammer for an electronic device. Background Technology

[0003] In scenarios such as bomb disposal, counter-terrorism, technical reconnaissance, and preventing cheating in examinations, it is often necessary to use signal jammers, such as frequency jammers, to interfere with the signals of illegal devices and shield them from signals.

[0004] Frequency jammers in related technologies need to be adapted to various usage scenarios. Outdoor frequency jammers face harsher environmental conditions and must meet higher waterproof and dustproof standards. This is especially true for power amplifiers with significant internal heat dissipation. Since the ventilation system of the power amplifier is open to the outside, rainwater can easily enter the frequency jammer through the ventilation structure, affecting the normal operation of its internal components. Therefore, effectively dissipating heat from the heat-generating components within the frequency jammer and preventing excessive moisture from entering the device are urgent problems that need to be solved. Utility Model Content

[0005] Therefore, it is necessary to address the problem that when heat dissipating a frequency jammer in related technologies, it is impossible to effectively prevent a large amount of water vapor from entering the frequency jammer, and to provide a host computer and a frequency jammer for an electronic device.

[0006] This utility model embodiment first provides a host computer for an electronic device, the host computer comprising:

[0007] The shell has a receiving cavity;

[0008] The functional module is located within the receiving cavity;

[0009] A radiator is disposed within the receiving cavity and in contact with the functional module. The radiator has an airflow channel communicating with the outside. The radiator is configured to isolate the airflow channel from other spaces within the receiving cavity other than the radiator.

[0010] In one embodiment, the heat sink includes:

[0011] A ventilation housing, the sidewall of which is in contact with the functional module, an airflow channel is formed inside the ventilation housing, and an air inlet and an air outlet communicating with the airflow channel are provided at opposite ends of the ventilation housing;

[0012] A ventilation fan is provided at the air inlet and / or the air outlet and is connected to the end of the ventilation housing.

[0013] In one embodiment, the radiator further includes at least one set of heat sinks located within the airflow channel.

[0014] In one embodiment, the radiator includes two sets of heat sinks, which are respectively disposed on adjacent side walls of the ventilation housing.

[0015] In one embodiment, the housing has a connection port at the connection point with the end of the radiator, and the ventilation shell is disposed through the connection port;

[0016] The connection port is equipped with a sealing ring, and the ventilation shell is sealed to the housing through the sealing ring.

[0017] In one embodiment, the functional module includes at least one power amplifier unit with a groove formed on the side wall of the heat sink facing the heat sink. The groove is used to place a heat pipe, which contacts the side wall of the heat sink.

[0018] In one embodiment, the power amplifier unit is provided with a heating element;

[0019] The groove has a through hole that connects to the inside of the power amplifier unit, and the heat pipe is in contact with the heating element located at the through hole.

[0020] In one embodiment, the sidewall of the housing is provided with at least one vent, and the vent is provided with a waterproof and breathable material.

[0021] In one embodiment, the host further includes a support member disposed outside the housing, the support member having a hollow cavity;

[0022] One end of the support member is covered by the vent and fixedly connected to the housing, while the other end of the support member is connected to the outside.

[0023] In one embodiment, the vent is formed at the top of the main unit;

[0024] The support includes a support shell, with an opening on one side wall facing the vent, and an air outlet on the other end of the support shell facing the bottom of the main unit.

[0025] In one embodiment, at least one of the remaining sides of the housing other than the vent is provided with an air inlet, the air inlet is connected to the vent, and the inlet is provided with a waterproof and breathable material;

[0026] An exhaust fan is provided at the air inlet and / or the ventilation opening.

[0027] In one embodiment, the host further includes a power module, a heat dissipation device, and a heat sink;

[0028] The housing has an opening on the side wall corresponding to the power module, and the heat sink is covered by the opening;

[0029] The power module and the heat dissipation device are located inside the receiving cavity, with the power module located on the output side of the heat dissipation device.

[0030] In one embodiment, the power module is located between the heat dissipation device and the heat sink;

[0031] The area of ​​the opening is larger than the surface area of ​​the power module facing the opening.

[0032] In one embodiment, the heat sink portion is in contact with the power module;

[0033] At least one heat dissipation hole is provided on the surface of the heat sink.

[0034] This utility model embodiment also provides a frequency jammer, including the host described in the above embodiment.

[0035] The host and frequency jammer of the aforementioned electronic device utilize a heat sink installed within a housing cavity, ensuring thermal contact between the heat sink and the functional modules within the cavity. This allows heat generated by the functional modules to be transferred through the sidewall of the heat sink to the airflow channel, where it exchanges heat with the gas, thus achieving timely heat dissipation. Furthermore, the heat sink provided in this example effectively isolates the airflow channel from other spaces within the housing cavity besides the heat sink. When the gas in the airflow channel exchanges with the outside air, any moisture, dust, or other contaminants that might enter with the gas are also contained within the airflow channel and prevented from entering the housing cavity. This type of heat sink effectively dissipates heat from the functional modules while also meeting the waterproof and dustproof requirements of the host device. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the overall structure of the host of an electronic device provided according to some embodiments of the present invention.

[0037] Figure 2 This is a schematic diagram of the main unit with its outer casing removed according to some embodiments of the present invention.

[0038] Figure 3 This is a cross-sectional structural diagram of a host provided according to some embodiments of the present invention.

[0039] Figure 4 This is a side sectional view of a host computer provided according to some embodiments of the present invention.

[0040] Figure 5 This is a top sectional view of the host provided according to some embodiments of the present invention.

[0041] Figure 6 This is a front sectional view of a host computer provided according to some embodiments of the present invention.

[0042] Figure 7 for Figure 6 A magnified schematic diagram of the structure at point A in the middle.

[0043] Figure 8 This is a schematic diagram of the disassembly structure of a heat sink provided according to some embodiments of the present invention.

[0044] Figure 9 This is a cross-sectional structural diagram of a heat sink provided according to some embodiments of the present invention.

[0045] Figure 10 This is a schematic diagram of the structure of a power amplifier unit provided according to some embodiments of the present invention.

[0046] Figure 11 This is an exploded view of a power amplifier unit provided according to some embodiments of the present invention.

[0047] Figure 12 This is an exploded view of the heat sink and housing of the host according to some embodiments of the present invention.

[0048] Figure 13 This is a schematic diagram of the structure of the ventilation opening on the host according to some embodiments of the present utility model.

[0049] Figure 14 This is a schematic diagram of the structure of the support member and the shell according to some embodiments of the present utility model.

[0050] Figure 15 This is a structural schematic diagram of a support member provided according to some embodiments of the present utility model.

[0051] Icon labels:

[0052] 100. Housing; 110. Receiving cavity; 120. Vent; 130. Air inlet; 140. Opening;

[0053] 200. Functional module; 210. Power amplifier unit; 201. First power amplifier section; 202. Second power amplifier section; 211. Groove; 212. Through hole; 220. Heat pipe;

[0054] 300, Radiator; 310, Ventilation housing; 311, Air inlet; 312, Air outlet; 320, Ventilation fan; 330, Heat sink; 3301, First heat sink; 3302, Second heat sink; 301, Airflow channel; 340, Sealing ring;

[0055] 400. Power supply module;

[0056] 500. Heat dissipation device;

[0057] 600. Heat sink; 601. Heat dissipation vent;

[0058] 700, Support component; 710, Support shell; 711, Opening; 712, Air outlet; 713, Horizontal section; 714, Vertical section. Detailed Implementation

[0059] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0060] In the description of this utility model, it should be understood that if terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0061] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0062] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0063] In this utility model, unless otherwise explicitly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact, or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0064] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this invention are for illustrative purposes only and do not represent the only possible implementation.

[0065] The frequency jammers provided by related technologies can operate in various environments. Outdoor frequency jammers, however, face more demanding environmental conditions and must meet higher waterproof and dustproof standards. This is especially true for power amplifiers with significant internal heat dissipation. Since the ventilation structure of the power amplifier is open to the outside, rainwater can easily enter the frequency jammer through the ventilation system, affecting the normal operation of its internal components. Therefore, effectively dissipating heat from the heat-generating components within the frequency jammer and preventing excessive moisture from entering the device are urgent problems that need to be solved.

[0066] Based on the above-mentioned problems, this utility model provides a host computer and frequency jammer for an electronic device. The heat sink installed inside the device can effectively dissipate heat from the functional modules, and can also isolate the airflow channel from the housing cavity, thereby preventing moisture from entering the frequency jammer.

[0067] See Figure 1-3 As shown, one embodiment of the present invention first provides a host of an electronic device, which may include a housing 100, a functional module 200 and a heat sink 300.

[0068] The housing 100 has a receiving cavity 110. The functional module 200 is disposed within the receiving cavity 110. The heat sink 300 is disposed within the receiving cavity 110 and is in contact with the functional module 200. The heat sink 300 has an airflow channel 301 communicating with the outside. The heat sink 300 is configured to isolate the airflow channel 301 from other spaces within the receiving cavity 110 except for the heat sink 300.

[0069] It is understood that the host device in this embodiment can be applied to various electronic devices. Electronic devices, such as frequency jammers and communication devices, are those that generate heat during operation. The host device may include the main components required for the operation of the electronic device, such as a power supply, transceiver circuits, and a controller. It is understood that the electronic device may consist only of the host device, or it may include the host device and other auxiliary components (such as an antenna).

[0070] Functional module 200 mainly refers to components inside the electronic device that generate heat, such as the power supply section or the power amplifier section. This example uses the power amplifier section as an example. When the power amplifier section is working, the current passing through the electronic components inside the power amplifier section generates a large amount of heat. If the heat is not dissipated in time, the ambient temperature in the area where the power amplifier section is located will be high, thereby affecting the working performance of the power amplifier section itself, and thus hindering the normal operation of the electronic device. In other embodiments, the above-mentioned functional module 200 can be other heat-generating components inside the electronic device (such as power supply, processor, transceiver circuit, etc.), which is not limited here. The functional module 200 is located in the space inside the receiving cavity 110 other than the heat sink 300, that is, the functional module 200 and the heat sink 300 are located in different positions within the receiving cavity 110.

[0071] The heat sink 300 provided in this example can dissipate heat to the outside. The heat sink 300 is located inside the receiving cavity 110 and can make thermal contact with the functional module 200. This arrangement facilitates the timely conduction of heat generated by the functional module 200 to the heat sink 300 and heat exchange with the gas in the airflow channel 301, so as to realize the timely dissipation of heat generated by the functional module 200.

[0072] Furthermore, to prevent the airflow channel 301, which connects to the outside, from carrying moisture, dust, and other contaminants into the other spaces within the housing cavity 110 besides the radiator 300 during its flow, the radiator 300 in this example isolates the airflow channel 301 from the other spaces within the housing cavity 110. The other spaces within the housing cavity 110 besides the radiator 300 can accommodate other components, such as the functional module 200. Therefore, the airflow channel 301 only communicates with the outside, not with the other spaces within the housing cavity 110 besides the radiator 300; that is, the space within the housing cavity 110 outside the radiator 300 is not connected to the outside. For example, the radiator 300 is a heat dissipation pipe that runs through the housing 100. The two ends of the heat dissipation pipe are connected to opposite side walls of the housing 100, and the connection between the outer side wall of the heat dissipation pipe and the side wall of the housing 100 is sealed, effectively preventing external dust, moisture, and other contaminants from entering the other spaces within the housing cavity 110 besides the radiator 300. When the gas flows through the airflow channel 301, even if it carries rainwater, dust, or other substances, these substances will only enter the radiator 300 with the gas and will not enter any other space inside the housing cavity 110 of the casing 100 other than the radiator 300, thus preventing them from reaching the functional module 200. This satisfies the host's requirements for waterproofing and dustproofing, and ensures the normal operation of the functional module 200 inside the host.

[0073] The structure of the aforementioned heat sink 300 can be adapted to the shape of the functional module 200 so that at least one side wall of the heat sink 300 can contact a larger area of ​​the functional module 200, thereby maximizing the transfer of heat dissipated by the functional module 200 to the heat sink 300. The airflow within the airflow channel 301 of the heat sink 300 can be facilitated by natural external wind. Alternatively, a gas flow device (such as a fan structure) can be installed in the heat sink 300 to blow or draw air into the airflow channel 301, thereby achieving forced air cooling of the functional module 200.

[0074] In this embodiment of the invention, a heat sink 300 is installed inside the receiving cavity 110, and the heat sink 300 is in thermal contact with the functional module 200 inside the receiving cavity 110. This allows the heat generated by the functional module 200 to be transferred through the side wall of the heat sink 300 to the airflow channel 301, where it exchanges heat with the gas inside the airflow channel 301, thus achieving timely heat dissipation from the functional module 200. Furthermore, the heat sink 300 provided in this example effectively isolates the space inside the receiving cavity 110 other than the heat sink 300 from the airflow channel 301. When the gas inside the airflow channel 301 exchanges with the outside air, moisture, dust, etc., that may enter the airflow channel 301 with the gas are also isolated within the airflow channel 301. This type of heat sink 300 effectively dissipates heat from the functional module 200 while also meeting the waterproof and dustproof requirements of the host unit.

[0075] Below, we will combine the appendix Figure 1 -Appendix Figure 15 The specific structure of the host of the electronic device provided in the embodiments of this utility model will be described.

[0076] like Figure 3 , Figure 5 As shown, in some embodiments, the radiator 300 may include a ventilation housing 310 and a ventilation fan 320. The sidewall of the ventilation housing 310 is in contact with the functional module 200, and an airflow channel 301 is formed inside the ventilation housing 310. The ventilation housing 310 has an air inlet 311 and an air outlet 312 at opposite ends that communicate with the airflow channel 301. The ventilation fan 320 is disposed at the air inlet 311 and / or the air outlet 312 and is connected to the end of the ventilation housing 310.

[0077] Specifically, the shape of the ventilation housing 310 can be designed according to the structure of the actual host housing 100. For example, it can be set as a hollow rectangular structure. At least one side wall of the rectangular ventilation housing 310 is used for thermal contact with the functional module 200, so that the heat emitted by the functional module 200 can be transferred through the shell wall of the ventilation housing 310 to the airflow channel 301, thereby exchanging heat with the gas in the airflow channel 301.

[0078] Based on the location of the ventilation fan 320 and the direction of air flow within the airflow channel 301, the two opposite ends of the ventilation housing 310 connected to the airflow channel 301 are defined as the air inlet 311 and the air outlet 312. It is understood that a ventilation fan 320 can be installed at the air inlet 311, which draws outside air into the airflow channel 301, where it undergoes heat exchange before being blown out from the air outlet 312. Alternatively, a ventilation fan 320 can be installed at the air outlet 312, which exhausts the air from the airflow channel 301 to the outside. When the pressure within the airflow channel 301 decreases, cold outside air will enter the airflow channel 301 from the air inlet 311 to participate in the heat exchange within the airflow channel 301. Furthermore, a ventilation fan 320 can be installed at both the air inlet 311 and the air outlet 312 simultaneously (e.g., ...). Figure 8 As shown, the airflow channel 301 achieves rapid exchange with the outside air through a combination of suction and exhaust, which can improve the heat dissipation efficiency of the functional module 200.

[0079] The ventilation fan 320 can be fixedly connected to the end of the ventilation housing 310 so that the ventilation fan 320 can draw as much outside air as possible into the airflow channel 301, thereby improving the exchange efficiency of gas and outside air in the airflow channel 301. In addition, the ventilation fan 320 is also isolated from other spaces in the housing cavity 110 except for the heat sink 300.

[0080] In one example, the ventilation fan 320 is a waterproof fan to prevent moisture or dust from entering the ventilation fan 320 or the airflow channel 301. Furthermore, the ventilation fan 320 can be fastened to the end of the ventilation housing 310 by bolts or the like. To improve the efficiency of the ventilation fan 320 in driving outside air into the airflow channel 301, the end of the ventilation housing 310 can also be sealed to the bracket of the ventilation fan 320 or the like.

[0081] like Figure 4 As shown, Figure 4 This is a side cross-sectional view of a host computer provided according to some embodiments of the present invention. To further improve the heat dissipation efficiency of the functional module 200, in some embodiments, the heat sink 300 further includes at least one set of heat sinks 330, which are located within the airflow channel 301.

[0082] Specifically, one or more sets of heat sinks 330 can be provided according to the thermal contact position between the functional module 200 and the ventilation housing 310. For example, if the functional module 200 only contacts one side wall of the ventilation housing 310, then one set of heat sinks 330 is provided on that side wall. If the functional module 200 contacts both sides of the ventilation housing 310 (usually adjacent side walls to save installation space), then one set of heat sinks 330 is provided on each of the corresponding two side walls (e.g., Figure 4 As shown, the heat emitted by the functional module 200 is conducted through the shell wall of the ventilation housing 310 to the heat sink 330, increasing the heat dissipation area inside the airflow channel 301. Then, the heat on the heat sink 330 is carried away by the ventilation fan 320 located at the air inlet 311 and air outlet 312 of the airflow channel 301, thereby improving the heat dissipation efficiency of the functional module 200.

[0083] One set of heat sinks 330 may include multiple heat dissipation fins, with one end of each fin fixed to the inner wall of the ventilation housing 310 and the other end extending into the airflow channel 301 or extending towards the opposite side wall of the ventilation housing 310. The multiple heat dissipation fins are spaced apart and extend along the gas flow direction within the airflow channel 301, so that the gas within the airflow channel 301 can carry away the heat from the heat sinks 330 in a timely manner during the flow process.

[0084] like Figure 4 and Figure 8 As shown, Figure 8 This is a disassembled structural diagram of a radiator 300 according to some embodiments of the present invention. In some embodiments, the radiator 300 includes two sets of heat sinks 330, which are respectively disposed on adjacent side walls of the ventilation housing 310.

[0085] Specifically, in this example, functional module 200 includes a power amplifier section, so as to... Figure 4 Taking the orientation as an example, the power amplifier section includes a first power amplifier section 201 arranged horizontally and a second power amplifier section 202 arranged vertically. It can also be understood that the first power amplifier section 201 and the second power amplifier section 202 are arranged in an L-shape within the receiving cavity 110. Then, the adjacent side walls of the ventilation housing 310 can respectively make thermal contact with the first power amplifier section 201 and the second power amplifier section 202, and heat sinks 330 are provided on the inner wall of the ventilation housing 310 (the side walls in thermal contact with the power amplifier section) to transfer the heat from the first power amplifier section 201 and the second power amplifier section 202 to the side walls of the ventilation housing 310 in a timely manner to the heat sinks 330, and the heat on the heat sinks 330 is quickly discharged to the outside of the housing 100 by the flow of gas in the airflow channel 301.

[0086] like Figure 9 As shown, Figure 9This is a cross-sectional view of a radiator 300 according to some embodiments of the present invention. In some embodiments, taking the example of two sets of heat sinks 330 respectively provided on adjacent side walls of the ventilation housing 310, the ends of the two sets of heat sinks 330 away from the housing wall of the ventilation housing 310 extend into the airflow channel 301. In this embodiment, the two sets of heat sinks 330 are respectively a first heat sink 3301 and a second heat sink 3302. Figure 9 Taking the illustrated orientation as an example, the power amplifier section includes a first power amplifier section 201 disposed on the upper side of the ventilation housing 310 and a second power amplifier section 202 disposed on the left side of the ventilation housing 310. A first heat sink 3301 is disposed on the upper inner wall of the ventilation housing 310, with its free end extending downwards and spaced from the lower inner wall of the ventilation housing 310. A second heat sink 3302 is disposed on the left inner wall of the ventilation housing 310, with its free end extending to the right and spaced from the right inner wall of the ventilation housing 310. That is, the two sets of heat sinks 330 are arranged in an L-shape in the airflow channel 301, thus corresponding to the positions of the first power amplifier section 201 and the second power amplifier section 202 arranged in an L-shape on the outside of the heat sink 300. This allows the heat transferred from the first power amplifier section 201 and the second power amplifier section 202 to the side walls of the ventilation shell 310 to be guided to the gap between the heat sink fins of the two sets of heat sinks 330, so as to give full play to the heat dissipation function of the heat sinks 330.

[0087] In other embodiments, the end of the heat sink 330 facing away from the wall of the ventilation housing 310 may extend further to the opposite end of the wall of the ventilation housing 310. For example, the free end of the first heat sink 3301 may extend downward and abut against the lower inner wall of the ventilation housing 310, or the free end of the second heat sink 3302 may extend to the right and abut against the right inner wall of the ventilation housing 310, thereby increasing the heat exchange area between the airflow and the heat sink 330 and improving the heat exchange efficiency of the radiator 300. That is, the extension length of the heat sink 330 and its position on the inner wall of the ventilation housing 310 can be determined according to the positional relationship between the power amplifier and the ventilation housing 310 and / or the heat generation power, and are not specifically limited here.

[0088] like Figures 5-7 As shown, Figure 5 This is a top sectional view of the host provided according to some embodiments of the present invention. Figure 6 This is a front sectional view of a host computer provided according to some embodiments of the present invention. Figure 7 for Figure 6An enlarged structural diagram at point A. In some embodiments, the housing 100 has a connection port at the connection point with the end of the radiator 300. A ventilation shell 310 extends through the connection port, and a sealing ring 340 is provided at the connection point (i.e., the connection port) between the housing 100 and the ventilation shell 310, and the ventilation shell 310 is sealed to the housing 100 through the sealing ring 340.

[0089] Specifically, such as Figure 6 and Figure 9 As shown, connection ports for installing the ventilation housing 310 can be opened at opposite ends of the housing 100. The shape and size of the connection ports can be adapted to the cross-sectional shape and size of the ventilation housing 310, and are connected to the connection port of the ventilation housing 310 and the housing 100 by sealing rings 340, thereby achieving a sealed setting between the ventilation housing 310 and the housing 100, and thus achieving isolation between the airflow channel 301 and other spaces in the receiving cavity 110 except for the heat sink 300. When the gas in the airflow channel 301 exchanges with the outside air, water vapor, dust, etc. that may enter with the gas will also be isolated in the airflow channel 301. The heat sink 300 with this configuration can not only effectively dissipate heat from the functional module 200, but also meet the waterproof and dustproof requirements of the host.

[0090] like Figure 10 and Figure 11 As shown, Figure 10 This is a schematic diagram of the structure of the power amplifier unit 210 and the heat pipe 220 according to some embodiments of the present invention. In some embodiments, the functional module 200 includes at least one power amplifier unit 210, and the power amplifier unit 210 has a groove 211 on the side wall facing the heat sink 300. The groove 211 is used to place the heat pipe 220, and the heat pipe 220 is in contact with the side wall of the heat sink 300.

[0091] Specifically, heat pipe 220 can be a hollow copper tube with a circular or elliptical cross-section. It is filled with a heat dissipation medium (such as refrigerant) and can conduct heat by absorbing heat when the heat exchange medium is vaporized and releasing heat when it is liquefied.

[0092] The heat pipe 220, acting as a heat conductor, can quickly absorb the heat released by the power amplifier unit 210 and transfer it to the side wall of the heat sink 300. Heat exchange at the side wall is achieved through the airflow in the airflow channel 301 within the heat sink 300. The heat pipe 220 is embedded within the groove 211. Figure 11 As shown, Figure 11 This is a schematic diagram of the groove 211 on the power amplifier unit 210 according to some embodiments of the present invention. In some embodiments, a heating element is disposed inside the power amplifier unit 210. The groove 211 is configured with a through hole 212 communicating with the inside of the power amplifier unit 210, and the heat pipe 220 is in contact with the heating element located at the through hole 212.

[0093] Specifically, in this example, the heat-generating components (such as the power amplifier chip) that generate significant heat in the power amplifier unit 210 can be strategically placed in the groove 211 to facilitate heat exchange between the heat pipe 220 embedded in the groove 211 and the heat-generating components. Of course, to improve heat exchange efficiency, a through hole 212 connecting the interior of the power amplifier unit 210 can be provided in the groove 211. This through hole 212 allows direct contact between the heat pipe 220 and the heat-generating components, enabling the heat exchange medium inside the heat pipe 220 to vaporize and absorb heat. The absorbed heat is then transferred to the side wall of the heat sink 300 in contact with the heat pipe 220, and the heat is promptly dissipated outside the housing 100 through the airflow in the airflow channel 301 within the heat sink 300, thereby effectively improving the heat dissipation efficiency of the power amplifier unit 210. Furthermore, the specific shapes of the heat pipe 220, the groove 211, and the through hole 212 can be varied according to the internal structure of the frequency interference device or the distribution of the heat-generating components, and are not limited here.

[0094] like Figure 12 and Figure 13 As shown, Figure 12 This is a schematic diagram of the structure of the ventilation port 120 and heat sink 600 on the host according to some embodiments of the present utility model. Figure 13 This is a schematic diagram of the structure of a ventilation opening 120 on a host according to some embodiments of the present invention. In some embodiments, the side wall of the housing 100 is provided with at least one ventilation opening 120. Specifically, a waterproof and breathable material may be provided at the ventilation opening 120.

[0095] Understandably, when the main unit of the electronic device in this example is in use, part of the heat generated by its internal functional module 200 is dissipated by the aforementioned heat sink 300, while the other part of the heat is conducted upwards. Depending on the placement of the electronic device during use, the heat will be conducted upwards to the top of the main unit. The heat conducted to the top of the main unit will accumulate in the upper part of the receiving cavity 110. If this heat is not dissipated in time, it may affect the working performance of the functional module 200 inside the main unit.

[0096] Therefore, in this example, one or more vents 120 are opened on the top of the host according to the direction of heat flow in the receiving cavity 110, so that the hot air conducted upward in the receiving cavity 110 can be discharged to the outside through the vents 120.

[0097] In addition, to ensure the waterproofing of the main unit, waterproof and breathable materials, such as waterproof and breathable membranes, can be installed at the vent 120, but there are no specific restrictions.

[0098] like Figure 14 and Figure 15 As shown, Figure 14This is a structural schematic diagram of the support member 700 and the housing 100 according to some embodiments of the present invention. Figure 15 This is a schematic diagram of the structure of the support member 700 provided according to some embodiments of the present invention. In some embodiments, the main unit further includes the support member 700, which is disposed outside the housing 100 and is used to support the main unit. The support member 700 has a hollow cavity. One end of the support member 700 covers the vent 120 and is fixedly connected to the housing 100, while the other end of the support member 700 communicates with the outside.

[0099] Specifically, the support member 700 can provide support for the main unit in different states of use. In addition, in this example, by means of the hollow cavity of the support member 700, one end of the hollow cavity is covered by the vent 120, which can prevent rainwater and other substances from directly contacting the vent 120 and entering the receiving cavity 110.

[0100] like Figure 12 and Figure 15 As shown, in some embodiments, the vent 120 is formed at the top of the main unit. The support member 700 includes, for example, a support shell 710 with a corner support structure. The interior of the support shell 710 is a cavity. One end of the support shell 710 facing the vent 120 has an opening 711 on its sidewall, and the other end of the support shell 710 facing the bottom of the main unit has an air outlet 712.

[0101] Specifically, the support member 700 can be set in an L-shape. For example... Figure 15 As shown, the support shell 710 may include a horizontal section 713 and a vertical section 714 that are connected to each other. The horizontal section 713 has an opening 711 on its side wall facing the vent 120, and the vertical section 714 extends towards the bottom of the main unit, with an air outlet 712 at its bottom. The height of the air outlet 712 may be lower than the height of the opening 711. Hot air inside the main unit can enter the horizontal section 713 and the vertical section 714 sequentially through the vent 120 and the opening 711, and finally be discharged from the air outlet 712. In this embodiment, the air outlet 712 of the support shell 710 faces the bottom of the main unit, which can further prevent rainwater, dust and other impurities from entering the vent 120 along the hollow cavity, ensuring the isolation of the housing 110 from the outside world. This not only does not affect the heat dissipation efficiency of the vent 120, but also improves the waterproof performance of the main unit.

[0102] like Figures 12 to 15 As shown, in some embodiments, for the main unit, at least one of the remaining sides of the housing 100, excluding the vent 120, has an air inlet 130, which communicates with the vent 120. A waterproof and breathable material is provided at the air inlet 130. An exhaust fan is provided at the air inlet 130 and / or the vent 120.

[0103] Specifically, an air inlet 130 can be provided on one of the sides other than the top surface of the housing 100. This air inlet 130 can form a fluid channel with the vent 120 located on the top of the housing 100, which is beneficial for timely dissipation of heat accumulated inside the housing 100. Similarly, to ensure the isolation of the housing 110 from the outside world, a waterproof and breathable material, such as a waterproof and breathable membrane, is also provided at the air inlet 130 to improve the waterproof performance of the main unit.

[0104] In addition, to effectively dissipate the heat accumulated in the receiving cavity 110, an exhaust fan can be installed at the air inlet 130, the vent 120, or both at the air inlet 130 and the vent 120 of the housing 100. Alternatively, an exhaust fan can be installed at the air outlet 712 of the supporting shell 710, allowing outside air to quickly enter the receiving cavity 110 through the air inlet 130, exchange heat with the heat inside the receiving cavity 110, and then enter the supporting shell 710 through the vent 120 and the opening 711 before being discharged to the outside through the air outlet 712.

[0105] Regarding the heat accumulated in the receiving cavity 110, it can be understood that when the main unit of the electronic device in this example is in use, the heat generated inside, such as the functional module 200 and the power module 400 described below, is dissipated by the heat sink 300 and / or heat dissipation device 500 (see the following embodiments for details). If some heat is still not dissipated, depending on the placement of the electronic device during use, the heat will usually be conducted upwards to the top of the main unit. The heat conducted to the top of the main unit will accumulate in the upper part of the receiving cavity 110. If the heat is not dissipated in time, it may affect the working performance of the functional module 200 inside the main unit. In this example, outside air enters the receiving cavity 110 from the air inlet 130 on the side of the housing 100 and flows upwards to the top of the main unit to carry the accumulated heat out through the vent 120 at the top. The air flowing out of the receiving cavity 110 of the main unit will continue to enter the support shell 710 and be discharged to the outside environment from the air outlet 712 of the support shell 710.

[0106] like Figure 2 , Figure 3 and Figure 12 As shown, in some embodiments, the host also includes a power module 400, a heat dissipation device 500, and a heat sink 600. The housing 100 has an opening 140 on the side wall corresponding to the power module 400, and the heat sink 600 covers the opening 140. The power module 400 and the heat dissipation device 500 are located within the receiving cavity 110, with the power module 400 located on the output end side of the heat dissipation device 500.

[0107] It is understood that the power module 400 in this example may include an adapter in an electronic device. The main function of the adapter is to convert electrical energy. The components inside the adapter, such as transformers, diodes, capacitors, and inductors, all have a certain resistance. That is, when current flows through these resistive components, the adapter generates heat. Therefore, in order to dissipate the heat generated by the adapter in a timely manner, a heat dissipation device 500 is provided on one side of the adapter, and works in conjunction with a heat sink 600 installed on the side wall of the housing 100 to expel the heat accumulated at the adapter to the outside of the housing 100 in a timely manner.

[0108] like Figure 12 As shown, an opening 140 can be made on the side wall of the housing 100 corresponding to the power module 400, and the heat sink 600 can be sealed and covered at the opening 140. The heat dissipation device 500 can guide the heat dissipated by the power module 400 to the heat sink 600, so that the heat can be dissipated to the outside through the heat sink 600, thereby achieving effective heat dissipation of the power module 400.

[0109] For example, the heat dissipation device 500 includes a cooling fan that generates airflow to carry the heat dissipated by the power module 400 to the heat sink 600. The heat sink 600 dissipates the heat from the power module 400 through heat exchange with the outside environment. This arrangement improves the waterproof performance of the host without affecting the heat dissipation of the power module 400. The power module 400 is located on the air outlet side of the heat dissipation device 500.

[0110] like Figure 4 As shown, in some embodiments, the power module 400 is located between the heat dissipation device 500 and the heat sink 600, that is, the heat dissipation device 500 is located on the side of the power module 400 facing away from the heat sink 600. The area of ​​the opening 140 is larger than the surface area of ​​the power module 400 facing the opening 140.

[0111] Specifically, the area of ​​opening 140 is set to be larger than the surface area of ​​the power module 400 (such as the adapter) facing opening 140. When the heat dissipation device 500 blows air onto the power module 400, the heat generated by the power module 400 can be transferred to the heat sink 600 by the airflow, and the larger heat sink 600 is more conducive to dissipating heat in a timely manner. Here, the surface area of ​​the power module 400 facing opening 140 refers to the surface area of ​​the part of the power module 400 opposite to the opening 140, which can be: Figure 12 Taking the shown perspective as an example, the first side of the power module 400 faces away from the heat dissipation device 500, and all parts of the first side of the power module 400 are opposite to the opening 140. Therefore, the surface area of ​​the power module 400 facing the opening 140 is equal to the surface area of ​​the first side of the power module 400 (e.g., Figure 12 (As shown).

[0112] like Figure 12 As shown, in some embodiments, the heat sink 600 is in contact with the power module 400. At least one heat dissipation opening 601 is provided on the surface of the heat sink 600.

[0113] Specifically, the heat sink 600 can contact the power module 400 (adapter) to directly transfer the heat generated by the power module 400 to the outside. In addition, since the area of ​​the heat sink 600 is larger than that of the power module 400, the heat dissipation device 500 can guide the heat dissipated by the power module 400 to the edge area of ​​the heat sink 600, so as to dissipate it through heat exchange between the heat sink 600 and the outside.

[0114] In addition, to improve the heat dissipation efficiency of the heat sink 600, multiple heat dissipation fins can be provided on the outer surface of the heat sink 600. Alternatively, multiple heat dissipation vents 601 can be provided on the surface of the heat sink 600, which can correspond to the power module 400. The edges of the heat dissipation vents 601 can be sealed to the power module 400, or a waterproof and breathable membrane can be provided at the heat dissipation vents 601 to ensure effective heat transfer from the power module 400 to the outside while also improving the waterproof performance of the host.

[0115] It should be noted that the heat dissipation device 500 in this example can be a cooling fan. With the help of the air inlet 130 opened on the side wall of the housing 100 in the above embodiment, a fluid channel can be formed between the air inlet 130 and the heat dissipation port 601 by the cooling fan, thereby improving the heat dissipation efficiency of the power module 400.

[0116] This example illustrates the heat dissipation process for heat-generating components such as the functional module 200 and power module 400 within the host device. When the electronic device is operating, the internal functional module 200, especially its core components such as the power amplifier unit 210, generates a significant amount of heat. This heat is rapidly transferred to the heat sink 300 via the heat pipe 220. The heat sink 300 is tightly fitted to the functional module 200 to ensure efficient heat transfer. The air inlets 311 and outlets 312 at both ends of the ventilation housing 310, in conjunction with the ventilation fan 320, accelerate airflow, creating a strong breeze that penetrates the airflow channel 301. The heat sink 330 arranged within the airflow channel 301 expands the heat dissipation area, efficiently carrying away heat as air flows through it.

[0117] In addition, the air inlet 130 on the side wall of the housing 100, the multiple vents 120 on the top of the housing 100, and the opening 711 and air outlet 712 of the support shell 710 connected to the vents 120 together form a channel to dissipate the heat accumulated inside the housing 100, which is conducive to timely dissipation of any remaining heat inside the host.

[0118] Regarding the power module 400, a heat dissipation device 500 and a heat sink 600 are respectively installed on both sides of the power module 400. The heat dissipation device 500 promptly transfers the heat dissipated by the power module 400 to the heat sink 600 for dissipation. Through the coordinated operation of the above components, this example forms a complete and efficient heat dissipation system from the heat source to the middle of the heat dissipation process. This ensures that the internal components of the electronic device can operate stably within a suitable temperature range under various complex environments, effectively solving the problem of balancing heat dissipation with waterproofing and dustproofing, thus extending the service life of the electronic device.

[0119] This utility model embodiment also provides a frequency jammer, including the host in the above embodiment.

[0120] The frequency jammer provided in this example can be a portable frequency jammer, such as a trolley case-type frequency jammer, for easy transport to the place of use. The main unit of the frequency jammer has a box-like structure and may include a detachable and sealably connected upper and lower housing. The frequency jammer also includes an antenna assembly rotatably mounted on the main unit. The specific connection between the antenna assembly and the main unit can be understood with reference to relevant technologies and will not be described in detail here.

[0121] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0122] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A host computer for an electronic device, characterized in that, The host includes: The housing (100) has a receiving cavity (110); A functional module (200) is disposed within the receiving cavity (110); A radiator (300) is disposed within the receiving cavity (110) and in contact with the functional module (200). The radiator (300) has an airflow channel (301) communicating with the outside. The radiator (300) is configured to isolate the airflow channel (301) from other spaces within the receiving cavity (110) other than the radiator (300).

2. The host of the electronic device according to claim 1, characterized in that, The radiator (300) includes: Ventilation housing (310), the side wall of the ventilation housing (310) is in contact with the functional module (200), the airflow channel (301) is formed inside the ventilation housing (310), and the ventilation housing (310) has an air inlet (311) and an air outlet (312) communicating with the airflow channel (301) at opposite ends. A ventilation fan (320) is disposed at the air inlet (311) and / or the air outlet (312) and is connected to the end of the ventilation housing (310).

3. The host of the electronic device according to claim 2, characterized in that, The radiator (300) includes two sets of heat sinks (330), which are respectively disposed on the adjacent side walls of the ventilation shell (310), and both sets of heat sinks (330) are located in the airflow channel (301).

4. The host of the electronic device according to claim 2, characterized in that, The housing (100) has a connection port at the connection with the end of the radiator (300), and the ventilation housing (310) is provided through the connection port; The connection port is provided with a sealing ring (340), and the ventilation shell (310) is sealed to the shell (100) through the sealing ring (340).

5. The host of the electronic device according to any one of claims 1-4, characterized in that, The functional module (200) includes at least one power amplifier unit (210), which has a groove (211) on the side wall facing the heat sink (300) for placing a heat pipe (220) in contact with the side wall of the heat sink (300).

6. The host of the electronic device according to any one of claims 1-4, characterized in that, The housing (100) has at least one vent (120) on its side wall, and at least one of the other sides of the housing (100) excluding the vent (120) has an air inlet (130) which communicates with the vent (120). An exhaust fan is provided at the air inlet (130) and / or the ventilation opening (120).

7. The host of the electronic device according to claim 6, characterized in that, The host also includes a support member (700), which is disposed outside the housing (100) and has a hollow cavity; One end of the support member (700) is covered at the vent (120) and fixedly connected to the housing (100), while the other end of the support member (700) is connected to the outside.

8. The host of the electronic device according to claim 7, characterized in that, The ventilation opening (120) is located at the top of the main unit; The support member (700) includes a support shell (710), with a through opening (711) on one side wall facing the vent (120) and an air outlet (712) on the other side facing the bottom of the host.

9. The host of the electronic device according to any one of claims 1-4, characterized in that, The host also includes a power module (400), a heat dissipation device (500), and a heat sink (600). The housing (100) has an opening (140) on the side wall corresponding to the power module (400), and the heat sink (600) covers the opening (140). The power module (400) and the heat dissipation device (500) are located inside the receiving cavity (110), with the power module (400) located on the output side of the heat dissipation device (500).

10. The host of the electronic device according to claim 9, characterized in that, The power module (400) is located between the heat dissipation device (500) and the heat sink (600); The area of ​​the opening (140) is greater than the surface area of ​​the power module (400) facing the opening (140).

11. A frequency jammer, characterized in that, Includes the host as described in any one of claims 1-10.

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