Packaging mold for high-power triode production

Abstract

The utility model provides a packaging mould for high-power triode production, which relates to the technical field of triode production and comprises a fixing frame, a driving mechanism is arranged in the fixing frame and comprises an upper mould, a first electric push rod and a lower mould, the first electric push rod is fixedly connected to the inner side wall of the fixing frame, and the lower mould is fixedly connected to the inner bottom wall of the fixing frame. The telescopic end of the first electric push rod is fixedly connected with a push frame. A cleaning mechanism is arranged in the fixing frame and comprises a rack, a sliding block, a cleaning frame fixedly connected to the inner top wall of the fixing frame and a Z-shaped rod rotationally connected to the inner top wall of the fixing frame. According to the packaging mold for high-power triode production, through the arrangement of the cleaning mechanism, cooling fins on a high-power triode package can be cleaned during demolding of the high-power triode package, the situation that plastic attached to the cooling fins cannot be cleaned during injection molding is avoided, and it is guaranteed that the surfaces of the cooling fins on the high-power triode are clean.

Description

Technical Field

[0001] This utility model relates to a packaging mold for producing high-power transistors, specifically a packaging mold for producing high-power transistors, belonging to the field of transistor production technology. Background Technology

[0002] With the continuous development of electronic technology, high-power transistors are increasingly widely used in power supplies, amplifiers, motor control, and other fields. To ensure the stable performance and reliability of these transistors, the packaging process is particularly important. High-power transistors are packaged through injection molding, and the packaging mold, as a key tool in this process, directly affects the quality of the final product.

[0003] A forming mold for producing transistors is disclosed in Chinese Patent Application Publication CN215619623U. The device consists of a sleeve, a lifting rod, a threaded rod, an auxiliary gear, a driven gear, a top plate, a rotating rod, and a rotating knob. Rotating the knob causes the rotating rod to rotate, which in turn causes the driven gear to rotate. The driven gear then causes the auxiliary gear to rotate, which in turn causes the threaded rod to rotate. The threaded rod then causes the lifting rod to move, which in turn causes the top plate to move. The top plate then pushes the formed transistor out of the first cavity, making it easy to remove the transistor.

[0004] However, during the implementation of the above-mentioned patented technical solution, it is impossible to clean the plastic adhering to the heat sink of the high-power transistor when demolding the packaging mold. Due to its high power, the high-power transistor usually has a heat sink on the outside of the package. During the injection molding of the packaging mold, some plastic may adhere to the heat sink. The obstruction of the heat sink by this plastic will affect the heat dissipation effect of the high-power transistor and easily lead to the high-power transistor overheating and burning out.

[0005] Therefore, a packaging mold for the production of high-power transistors is proposed here. Utility Model Content

[0006] This invention proposes a packaging mold for the production of high-power transistors to solve the problem in the prior art that the plastic adhering to the heat sink of high-power transistors cannot be cleaned during demolding.

[0007] This utility model is achieved through the following technical solution: a packaging mold for producing high-power transistors, including a fixed frame, a driving mechanism is provided inside the fixed frame, the driving mechanism includes an upper mold, a first electric push rod fixedly connected to the inner side wall of the fixed frame, and a lower mold fixedly connected to the inner bottom wall of the fixed frame, and a push frame is fixedly connected to the telescopic end of the first electric push rod.

[0008] The fixed frame is equipped with a cleaning mechanism, which includes a rack, a sliding block, a cleaning frame fixedly connected to the top wall of the fixed frame, and a Z-shaped rod rotatably connected to the top wall of the fixed frame. A connecting frame is fixedly connected to the bottom surface of the rack, and the connecting frame is adapted to the cleaning frame. A gear is fixedly connected to the outer surface of the Z-shaped rod, and the gear meshes with the rack. A sliding frame is fixedly connected to the upper surface of the sliding block, and the Z-shaped rod is slidably connected to the inner wall of the sliding frame. A guide frame is fixedly connected to the bottom surface of the sliding block, and a scraper is slidably connected to the inner wall of the guide frame. A plurality of first springs arranged at equal intervals are fixedly connected to the upper surface of the scraper, and the top ends of the plurality of first springs are all fixedly connected to the inner top wall of the guide frame.

[0009] Specifically, the driving mechanism further includes a second electric push rod fixedly connected to the bottom wall of the fixed frame. The telescopic end of the second electric push rod passes through the lower mold and is slidably connected to the lower mold. The telescopic end of the second electric push rod is fixedly connected to a demolding template. The demolding template is adapted to the lower mold. When the second electric push rod extends, it can push the demolding template upward to facilitate demolding.

[0010] Furthermore, the driving mechanism also includes a third electric push rod, which passes through the fixed frame and is fixedly connected to the fixed frame. The telescopic end of the third electric push rod is fixedly connected to the upper surface of the upper mold, and the telescopic movement of the third electric push rod can drive the upper mold to move up and down.

[0011] Preferably, the upper surface of the cleaning frame is fixedly connected to two fixing rods, both of which pass through the sliding block and are slidably connected to the sliding block. The fixing rods serve to guide the movement of the sliding block.

[0012] Preferably, an anti-detachment slider is fixedly connected to the upper surface of the rack, and an anti-detachment slide rail is slidably connected to the outer surface of the anti-detachment slider. The anti-detachment slide rail is fixedly connected to the inner top wall of the fixing frame, and the anti-detachment slide rail guides the movement of the anti-detachment slider and the rack.

[0013] Preferably, a second spring is fixedly connected to the outer surface of the connecting frame, and a fixing block is fixedly connected to the end of the second spring away from the connecting frame. The fixing block is fixedly connected to the inner top wall of the fixing frame, and the fixing block can drive the connecting frame to reset.

[0014] This utility model provides a packaging mold for the production of high-power transistors, which has the following beneficial effects:

[0015] 1. The packaging mold for high-power transistor production, through the setting of the cleaning mechanism, can clean the heat sink on the high-power transistor package during demolding, avoiding the plastic adhering to the heat sink during injection molding that cannot be cleaned, ensuring the cleanliness of the heat sink surface on the high-power transistor, thereby ensuring that the heat sink plays a better heat dissipation role during operation.

[0016] 2. The packaging mold for producing high-power transistors uses a drive mechanism to place components such as chips and pins into the lower mold. The lower mold is then sealed to the upper mold by extending the third electric push rod. High-temperature plastic is then injected into the upper mold through the injection port. After cooling, the third electric push rod is shortened to move the upper mold upward. Then, the second electric push rod is extended to push the high-power transistor package upward after it has been formed, making it easier to demold. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2 This is a schematic diagram of the separate structure of the lower mold and the release mold of this utility model;

[0019] Figure 3 This is a three-dimensional structural diagram of the cleaning frame and rack of this utility model;

[0020] Figure 4 This is a schematic diagram of the separate structure of the anti-detachment slider and anti-detachment rail of this utility model;

[0021] Figure 5 This is a schematic diagram of the separate structure of the Z-shaped rod, sliding frame, guide frame and scraper of this utility model.

[0022] Explanation of reference numerals in the attached figures

[0023] 1. Fixture;

[0024] 2. Drive mechanism; 21. First electric push rod; 22. Push frame; 23. Lower mold; 24. Second electric push rod; 25. Demolding plate; 26. Third electric push rod; 27. Upper mold;

[0025] 3. Cleaning mechanism; 31. Cleaning frame; 32. Rack; 33. Connecting frame; 34. Gear; 35. Z-shaped rod; 36. Sliding block; 37. Sliding frame; 38. Guide frame; 39. Scraper; 310. First spring; 311. Fixing rod; 312. Anti-detachment slider; 313. Anti-detachment slide rail; 314. Second spring; 315. Fixing block. Detailed Implementation

[0026] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0027] Please see Figures 1-5 The present invention proposes the following implementation scheme: a packaging mold for producing high-power transistors, including a fixed frame 1, a drive mechanism 2 is provided inside the fixed frame 1, the drive mechanism 2 includes an upper mold 27, a first electric push rod 21 fixedly connected to the inner side wall of the fixed frame 1, and a lower mold 23 fixedly connected to the inner bottom wall of the fixed frame 1. The telescopic end of the first electric push rod 21 is fixedly connected to a push frame 22. After injection molding and demolding the package, the extension of the first electric push rod 21 can push the high-power transistor package into the cleaning frame 31.

[0028] Please refer to this carefully. Figure 2 The drive mechanism 2 also includes a second electric push rod 24 fixedly connected to the bottom wall of the fixed frame 1. The telescopic end of the second electric push rod 24 passes through the lower mold 23 and is slidably connected to the lower mold 23. The telescopic end of the second electric push rod 24 is fixedly connected to a demolding template 25. The demolding template 25 is adapted to the lower mold 23. When the second electric push rod 24 extends, it can push the demolding template 25 to move upward, which facilitates demolding.

[0029] Please refer to this carefully. Figure 2 The drive mechanism 2 also includes a third electric push rod 26, which passes through the fixed frame 1 and is fixedly connected to the fixed frame 1. The telescopic end of the third electric push rod 26 is fixedly connected to the upper surface of the upper mold 27. The telescopic movement of the third electric push rod 26 can drive the upper mold 27 to move up and down.

[0030] Please refer to this carefully. Figure 3 and Figure 5 The cleaning mechanism 3 is provided inside the fixed frame 1. The cleaning mechanism 3 includes a rack 32, a sliding block 36, a cleaning frame 31 fixedly connected to the top wall of the fixed frame 1, and a Z-shaped rod 35 rotatably connected to the top wall of the fixed frame 1. A connecting frame 33 is fixedly connected to the bottom surface of the rack 32. The connecting frame 33 is adapted to the cleaning frame 31. A groove is reserved on the cleaning frame 31 to facilitate the passage of the connecting frame 33 and the pins of the high-power transistor.

[0031] Please refer to this carefully. Figure 3 and Figure 5A gear 34 is fixedly connected to the outer surface of the Z-shaped rod 35, and the gear 34 meshes with the rack 32. A sliding frame 37 is fixedly connected to the upper surface of the sliding block 36, and the Z-shaped rod 35 is slidably connected to the inner wall of the sliding frame 37. A guide frame 38 is fixedly connected to the bottom surface of the sliding block 36. The guide frame 38 can scrape and clean the heat sink on the high-power transistor package. A scraper 39 is slidably connected to the inner wall of the guide frame 38. Multiple first springs 310 arranged at equal intervals are fixedly connected to the upper surface of the scraper 39. When the scraper 39 contacts the heat sink on the package, the first springs 310 are in a compressed state. The tops of the multiple first springs 310 are fixedly connected to the inner top wall of the guide frame 38. The setting of the first springs 310 can ensure that the scraper 39 is in close contact with the heat sink of the high-power transistor. An inclined surface is provided at the reserved slot of the cleaning frame 31. When the scraper 39 moves to the outermost edge, the scraper 39 can slide onto the inclined surface of the cleaning frame 31.

[0032] Please refer to this carefully. Figure 5 Two fixing rods 311 are fixedly connected to the upper surface of the cleaning frame 31. Both fixing rods 311 pass through the sliding block 36 and are slidably connected to the sliding block 36. The fixing rods 311 guide the movement of the sliding block 36.

[0033] Please refer to this carefully. Figure 4 The upper surface of the rack 32 is fixedly connected to the anti-detachment slider 312, and the outer surface of the anti-detachment slider 312 is slidably connected to the anti-detachment slide rail 313. The anti-detachment slide rail 313 is fixedly connected to the inner top wall of the fixed frame 1, and the anti-detachment slide rail 313 plays a guiding role for the movement of the anti-detachment slider 312 and the rack 32.

[0034] Please refer to this carefully. Figure 4 A second spring 314 is fixedly connected to the outer surface of the connecting frame 33. A fixing block 315 is fixedly connected to the end of the second spring 314 away from the connecting frame 33. The fixing block 315 is fixedly connected to the inner top wall of the fixing frame 1. The setting of the fixing block 315 can drive the connecting frame 33 to reset.

[0035] In use, this invention involves placing the chip, pins, and other components into the lower mold 23. The third electric push rod 26 extends, sealing the lower mold 23 with the upper mold 27. High-temperature plastic is then injected into the upper mold 27 through the injection port. After cooling, the third electric push rod 26 shortens, causing the upper mold 27 to move upwards. Then, the second electric push rod 24 extends, pushing the high-power transistor package upwards after it has been formed by the release plate 25. Finally, the first electric push rod 21 extends, pushing the package towards the cleaning frame 31 via the pusher 22. Furthermore, the encapsulation will drive the connecting frame 33 to move. Under the meshing action of the rack 32 and the gear 34, the Z-shaped rod 35 will rotate. Under the sliding action of the Z-shaped rod 35 and the sliding frame 37, the guide frame 38 will move back and forth, and the scraper 39 will scrape on the heat sink of the encapsulation, thereby cleaning the plastic adhering to the heat sink. When the encapsulation moves to the outside of the cleaning frame 31, the high-power transistor can be removed. This device can prevent the plastic adhering to the heat sink during injection molding from being unable to be cleaned, ensuring the cleanliness of the heat sink surface on the high-power transistor.

[0036] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A packaging mold for producing a high-power triode, comprising a fixing frame (1), characterized in that: The inside of the fixed frame (1) is provided with a driving mechanism (2), the driving mechanism (2) comprises an upper mold (27), a first electric push rod (21) fixedly connected to the inner side wall of the fixed frame (1) and a lower mold (23) fixedly connected to the inner bottom wall of the fixed frame (1), and the telescopic end of the first electric push rod (21) is fixedly connected with a push frame (22); The inside of the fixed frame (1) is provided with a cleaning mechanism (3), the cleaning mechanism (3) comprises a rack (32), a sliding block (36), a cleaning frame (31) fixedly connected to the inner top wall of the fixed frame (1) and a Z-shaped rod (35) rotatably connected to the inner top wall of the fixed frame (1), the bottom surface of the rack (32) is fixedly connected with a connecting frame (33), the connecting frame (33) is matched with the cleaning frame (31), the outer surface of the Z-shaped rod (35) is fixedly connected with a gear (34), the gear (34) is engaged with the rack (32), the upper surface of the sliding block (36) is fixedly connected with a sliding frame (37), the Z-shaped rod (35) is slidingly connected to the inner wall of the sliding frame (37), the bottom surface of the sliding block (36) is fixedly connected with a guide frame (38), the inner wall of the guide frame (38) is slidingly connected with a scraper (39), and the upper surface of the scraper (39) is fixedly connected with a plurality of first springs (310) arranged at equal distances, and the top ends of the plurality of first springs (310) are fixedly connected to the inner top wall of the guide frame (38).

2. The packaging mold for a high-power triode according to claim 1, wherein: The driving mechanism (2) further comprises a second electric push rod (24) fixedly connected to the inner bottom wall of the fixed frame (1), the telescopic end of the second electric push rod (24) penetrates through the lower mold (23) and is slidingly connected with the lower mold (23), and the telescopic end of the second electric push rod (24) is fixedly connected with a demolding plate (25) matched with the lower mold (23).

3. The packaging mold for a high-power triode according to claim 1, wherein: The driving mechanism (2) further comprises a third electric push rod (26), the third electric push rod (26) penetrates through the fixed frame (1) and is fixedly connected with the fixed frame (1), and the telescopic end of the third electric push rod (26) is fixedly connected to the upper surface of the upper mold (27).

4. The packaging mold for a high-power triode according to claim 1, wherein: The upper surface of the cleaning frame (31) is fixedly connected with two fixed rods (311), and the two fixed rods (311) penetrate through the sliding block (36) and are slidingly connected with the sliding block (36).

5. The packaging mold for a high-power triode according to claim 1, wherein: The upper surface of the rack (32) is fixedly connected with an anti-slip block (312), the outer surface of the anti-slip block (312) is slidingly connected with an anti-slip rail (313), and the anti-slip rail (313) is fixedly connected to the inner top wall of the fixed frame (1).

6. The packaging mold for a high-power triode according to claim 1, wherein: The outer surface of the connecting frame (33) is fixedly connected with a second spring (314), one end of the second spring (314) away from the connecting frame (33) is fixedly connected with a fixed block (315), and the fixed block (315) is fixedly connected to the inner top wall of the fixed frame (1).

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