Wafer cutting waste recycling device

Abstract

The utility model discloses a wafer cutting waste recycling device, and relates to the technical field of wafer waste recycling. A wafer cutting waste recycling device comprises a bottom plate, a fixing seat is fixedly connected to the center of the upper end of the bottom plate, a pulverizer is fixedly connected to the upper end of the fixing seat, a dust suction hood is arranged above the pulverizer, the rear side of the dust suction hood is communicated with a dust suction pipe, the dust suction pipe is externally connected with dust suction equipment, and the dust suction equipment is connected with the dust suction hood. Supporting beams are fixedly connected to the two sides of the upper end of the bottom plate, a shell and a lifting assembly are fixedly connected to the upper ends of the supporting beams, and the lifting assembly is located in the shell and used for driving the dust suction hood to move up and down. The technical problems that an existing smashing device does not have the dust removal function, when people use the smashing device, dust generated by wafer smashing is likely to fly out upwards, the surrounding environment is likely to be affected, and the body of an operator is injured are solved.

Description

Technical Field

[0001] This utility model relates to the field of wafer waste recycling and reuse technology, and in particular to a device for recycling and reusing wafer dicing waste. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seed crystals, and then slowly pulled out to form a cylindrical single-crystal silicon. After grinding, polishing and cutting, the silicon crystal rod is formed into a silicon wafer, or wafer. A large amount of waste is generated during wafer cutting, which requires the use of crushing equipment to crush and recycle it.

[0003] However, existing technologies have some problems: existing crushing devices do not have dust removal functions. When people use the crushing devices, the dust from the wafer crushing is easily thrown upwards, which can affect the surrounding environment and cause harm to the operator. Therefore, it is necessary to provide a wafer cutting waste recycling and reuse device to solve the above technical problems. Utility Model Content

[0004] This utility model provides a device for recycling and reusing wafer dicing waste, which solves the technical problem that existing crushing devices do not have a dust removal function. When people use the crushing device, the dust from the wafer crushing is easily thrown upwards, which can easily affect the surrounding environment and cause harm to the operator.

[0005] To solve the above-mentioned technical problems, this utility model provides a wafer dicing waste recycling and reuse device, comprising:

[0006] The base plate has a fixed base at the center of its upper end, a crusher fixedly connected to the upper end of the fixed base, a dust collection hood above the crusher, a dust collection pipe connected to the rear side of the dust collection hood, a dust collection device connected to the outside of the dust collection pipe, and support beams fixedly connected to both sides of the upper end of the base plate, with an outer shell fixedly connected to the upper end of the support beams.

[0007] A lifting assembly, located within the housing, is used to drive the vacuum hood to move up and down.

[0008] Preferably, the lifting assembly includes a motor, the output end of which is fixedly connected to a lead screw, and the upper end of the lead screw surface is threadedly connected to a nut seat.

[0009] Preferably, a fixing block is fixedly connected to both the front and rear sides of the nut seat, a fixing post is fixedly connected to the upper end of the fixing block, and the upper end of the fixing post extends through to the upper end of the outer shell and is fixedly connected to a support plate.

[0010] Preferably, a mounting plate is fixedly connected to the center of the lower end of the support plate, and the lower end of the mounting plate is fixedly connected to the upper end of the dust collection hood.

[0011] Preferably, a bearing seat is sleeved on the upper end of the lead screw, and the upper end of the bearing seat is fixedly connected to the upper end of the inner shell.

[0012] Preferably, a guide block is fixedly connected to the fixed block, and a guide rod is slidably connected inside the guide block, the guide rod being vertically fixedly connected to the outer shell.

[0013] Compared with related technologies, the wafer dicing waste recycling device provided by this utility model has the following beneficial effects:

[0014] This utility model provides a device for recycling and reusing wafer cutting waste. The fixed base helps to stabilize the crusher during use and prevents it from shaking.

[0015] This utility model provides a device for recycling and reusing wafer cutting waste. The bearing seat design helps to prevent vibration of the lead screw during use, thus solving the problem of vibration that easily occurs during lead screw operation.

[0016] This utility model provides a device for recycling and reusing wafer dicing waste. By utilizing the cooperation of guide blocks and guide rods, the fixed block can move smoothly up and down during use, preventing the fixed block from moving and shaking easily during use. Attached Figure Description

[0017] Figure 1 A schematic diagram of a preferred embodiment of a wafer dicing waste recycling and reuse device provided by this utility model;

[0018] Figure 2 This is a side view of the base plate structure of this utility model;

[0019] Figure 3 This is a side sectional view of the outer shell structure of this utility model.

[0020] The following are the labels in the diagram: 1. Base plate; 2. Fixed seat; 3. Crusher; 4. Dust hood; 5. Support beam; 6. Outer shell; 7. Lifting assembly; 71. Motor; 72. Lead screw; 73. Nut seat; 74. Fixed block; 75. Fixed column; 8. Support plate; 9. Mounting plate; 10. Dust suction pipe; 11. Bearing seat; 12. Guide block; 13. Guide rod. Detailed Implementation

[0021] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0022] Example 1:

[0023] Please see Figure 1-3 This utility model provides a technical solution: a wafer cutting waste recycling and reuse device, comprising: a base plate 1, a fixed seat 2 fixedly connected to the center of the upper end of the base plate 1, a crusher 3 fixedly connected to the upper end of the fixed seat 2, a dust collection hood 4 arranged above the crusher 3, a dust collection pipe 10 connected to the rear side of the dust collection hood 4, a dust collection device connected to the outside of the dust collection pipe 10, support beams 5 fixedly connected to both sides of the upper end of the base plate 1, a housing 6 fixedly connected to the upper end of the support beams 5, and a lifting assembly 7 located in the housing 6. The lifting assembly 7 is used to drive the dust collection hood 4 to move up and down.

[0024] In this embodiment, when the crusher 3 is crushing wafer waste, the motor 71 starts to run. The motor 71 drives the lead screw 72 to start rotating through the bearing seat 11. The rotation of the lead screw 72 drives the nut seat 73 to move downward. The nut seat 73 drives the fixing block 74 to move downward. The fixing block 74 drives the guide block 12 to slide on the guide rod 13. At the same time, the fixing block 74 drives the fixing column 75 to move downward.

[0025] Example 2:

[0026] Please see Figure 1-3 As shown, based on Embodiment 1, this utility model provides a technical solution: the lifting assembly 7 includes a motor 71, the output end of the motor 71 is fixedly connected to a lead screw 72, the upper end of the surface of the lead screw 72 is threadedly connected to a nut seat 73, the front and rear sides of the nut seat 73 are both fixedly connected to a fixing block 74, the upper end of the fixing block 74 is fixedly connected to a fixing column 75, the upper end of the fixing column 75 extends through to the upper end of the outer shell 6 and is fixedly connected to a support plate 8, the center of the lower end of the support plate 8 is fixedly connected to an mounting plate 9, the lower end of the mounting plate 9 is fixedly connected to the upper end of the dust collection hood 4, the upper end of the lead screw 72 is sleeved with a bearing seat 11, the upper end of the bearing seat 11 is fixedly connected to the upper end inside the outer shell 6, a guide block 12 is fixedly connected to the fixing block 74, a guide rod 13 is slidably connected inside the guide block 12, and the guide rod 13 is vertically fixedly connected in the outer shell 6.

[0027] In this embodiment: the fixed column 75 drives the support plate 8 to move downward, the support plate 8 drives the mounting plate 9 to move downward, and the mounting plate 9 drives the dust collection hood 4 to move downward, so that the dust collection hood 4 moves to the designated position. At this time, the external dust collection device pulls the dust collection hood 4 through the dust collection pipe 10, so that the dust collection hood 4 pulls the dust thrown out by the crusher 3.

[0028] The working principle of the wafer dicing waste recycling device provided by this utility model is as follows:

[0029] Implementation steps for the first innovation point:

[0030] Step 1: When the crusher 3 is crushing wafer waste, the motor 71 starts to run. The motor 71 drives the lead screw 72 to start rotating through the bearing seat 11. The rotation of the lead screw 72 drives the nut seat 73 to move downward.

[0031] Step 2: Nut seat 73 drives fixed block 74 to move downward, fixed block 74 drives guide block 12 to slide on guide rod 13, and at the same time fixed block 74 drives fixed column 75 to move downward.

[0032] Implementation steps for the second innovation point:

[0033] Step 1: The fixed column 75 drives the support plate 8 to move downward, the support plate 8 drives the mounting plate 9 to move downward, and the mounting plate 9 drives the dust hood 4 to move downward, so that the dust hood 4 moves to the designated position.

[0034] Step 2: At this time, the external vacuuming device uses the vacuum pipe 10 to pull the vacuum hood 4, so that the vacuum hood 4 can pull the dust thrown out by the crusher 3.

[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A device for recycling and reusing wafer dicing waste, characterized in that: include: A base plate (1) is fixedly connected to a fixed seat (2) at the center of the upper end of the base plate (1). A crusher (3) is fixedly connected to the upper end of the fixed seat (2). A dust collection hood (4) is provided above the crusher (3). A dust collection pipe (10) is connected to the rear side of the dust collection hood (4). A dust collection device is connected to the outside of the dust collection pipe (10). Support beams (5) are fixedly connected to both sides of the upper end of the base plate (1). A shell (6) is fixedly connected to the upper end of the support beams (5). Lifting assembly (7), which is located in the housing (6), is used to drive the vacuum hood (4) to move up and down.

2. The wafer dicing waste recycling device according to claim 1, characterized in that, The lifting assembly (7) includes a motor (71), the output end of which is fixedly connected to a lead screw (72), and the upper end of the surface of the lead screw (72) is threadedly connected to a nut seat (73).

3. The wafer dicing waste recycling device according to claim 2, characterized in that, The front and rear sides of the nut seat (73) are fixedly connected to a fixing block (74), and the upper end of the fixing block (74) is fixedly connected to a fixing post (75). The upper end of the fixing post (75) extends through to the upper end of the outer shell (6) and is fixedly connected to a support plate (8).

4. The wafer dicing waste recycling device according to claim 3, characterized in that, A mounting plate (9) is fixedly connected to the center of the lower end of the support plate (8), and the lower end of the mounting plate (9) is fixedly connected to the upper end of the dust collection hood (4).

5. The wafer dicing waste recycling device according to claim 2, characterized in that, The upper end of the lead screw (72) is fitted with a bearing seat (11), and the upper end of the bearing seat (11) is fixedly connected to the upper end inside the outer shell (6).

6. The wafer dicing waste recycling device according to claim 3, characterized in that, A guide block (12) is fixedly connected to the fixed block (74), and a guide rod (13) is slidably connected inside the guide block (12). The guide rod (13) is vertically fixedly connected in the outer shell (6).

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