Reflow soldering carrier device

Abstract

The utility model provides a reflow soldering carrier device which comprises a carrier body, a frame is arranged on the carrier body, two auxiliary plates are arranged on the frame in a sliding fit mode, pressing positioning structures are arranged on the auxiliary plates, a containing groove is formed in the carrier body, a circuit board is placed in the containing groove, and the pressing positioning structures correspond to the circuit board. A plurality of elastic buffer structures are arranged in the placement groove, correspond to the circuit board and comprise a plurality of elastic blocks. According to the circuit board welding device, the two auxiliary plates are installed on the frame in the sliding mode, the pressing-down positioning structures are installed on the auxiliary plates, the device can be suitable for circuit boards of different sizes by sliding the auxiliary plates, the application range of the device is expanded, and the welding cost of the different circuit boards is reduced; buffering can be carried out through the elastic buffering structure, so that electronic components are prevented from being damaged.

Description

Technical Field

[0001] This utility model relates to the field of carrier technology, specifically to a reflow soldering carrier device. Background Technology

[0002] Reflow soldering technology is frequently used in the electronics manufacturing industry. For example, components on various circuit boards used in computers are soldered onto the circuit boards using this process. This equipment has an internal heating circuit that heats air or nitrogen to a sufficiently high temperature and blows it onto the circuit board where components have already been attached. This melts the solder on both sides of the components, causing them to bond to the motherboard. The advantages of this process are that the temperature is easy to control, oxidation can be avoided during soldering, and manufacturing costs are easier to control. However, existing reflow soldering carriers have certain drawbacks. First, electronic components on the circuit board are easily squeezed when in contact with the carrier at the bottom, leading to potential damage. Second, different types of carriers are usually required for different circuit boards, necessitating carrier replacement and resulting in higher reflow soldering costs when soldering circuit boards of different sizes.

[0003] Therefore, this utility model provides a reflow soldering carrier device. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a reflow soldering carrier device to solve the problems mentioned in the background art. This utility model can be applied to circuit boards of different sizes, expand the applicability of the device, and reduce the cost of soldering different circuit boards; it can be buffered by an elastic buffer structure to prevent damage to electronic components.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution: a reflow soldering carrier device, including a carrier body, a frame mounted on the carrier body, two auxiliary plates slidably fitted on the frame, a pressing and positioning structure mounted on the auxiliary plates, a placement groove opened inside the carrier body, a circuit board placed in the placement groove, the pressing and positioning structure corresponding to the circuit board, and multiple elastic buffer structures mounted in the placement groove, each elastic buffer structure corresponding to the circuit board, the elastic buffer structure including multiple elastic blocks.

[0006] Furthermore, the main body of the vehicle is provided with multiple mounting holes, and the frame is provided with two positioning slots.

[0007] Furthermore, the frame has two sliding grooves, in which sliders slide and are fixedly connected to two auxiliary plates respectively.

[0008] Furthermore, a first screw is rotatably fitted inside the groove, and the first screw is threadedly engaged with the slider.

[0009] Furthermore, the pressing positioning structure includes a second screw, which is threadedly engaged with the auxiliary plate.

[0010] Furthermore, a rubber pad is fixed to one end of the second screw, and the rubber pad is in contact with the circuit board.

[0011] Furthermore, the elastic block includes a fixed block and a movable block, the fixed block and the movable block are elastically connected, the fixed block is fixed in the placement groove, and the movable block is in contact with the circuit board.

[0012] Furthermore, the movable block is made of rubber material, and the fixed block has a groove, with a spring fixed between the groove and the movable block.

[0013] The beneficial effects of this utility model are as follows: The reflow soldering carrier device of this utility model includes a frame; an auxiliary plate; a pressing and positioning structure; a placement groove; and an elastic buffer structure.

[0014] Two auxiliary plates are slidably mounted on the frame, and a pressure positioning structure is installed on the auxiliary plates. By sliding the auxiliary plates, the device can be adapted to circuit boards of different sizes, expanding the applicability of the device and reducing the cost of soldering different circuit boards. Multiple elastic buffer structures are installed in the placement slot, which can buffer the electronic components and prevent them from being damaged. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall assembly three-dimensional structure of the reflow soldering carrier device of this utility model;

[0016] Figure 2 This is a schematic diagram of the overall assembly cross-sectional structure of the reflow soldering carrier device of this utility model;

[0017] Figure 3 for Figure 2 A schematic diagram at point A in the middle;

[0018] Figure 4 for Figure 2 A schematic diagram at point B in the middle;

[0019] In the diagram: 1. Vehicle body; 2. Mounting hole; 3. Frame; 4. Positioning groove; 5. Slide groove; 6. First screw; 7. Auxiliary plate; 8. Second screw; 9. Rubber pad; 10. Elastic block; 11. Fixed block; 12. Movable block; 13. Groove; 14. Spring; 15. Placement slot; 16. Slider. Detailed Implementation

[0020] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0021] Please see Figures 1 to 4 This utility model provides a technical solution: a reflow soldering carrier device, including a carrier body 1, a frame 3 mounted on the carrier body 1, two auxiliary plates 7 slidably fitted on the frame 3, a pressing positioning structure mounted on the auxiliary plates 7, a placement groove 15 opened in the carrier body 1, a circuit board placed in the placement groove 15, the pressing positioning structure corresponding to the circuit board, and multiple elastic buffer structures mounted in the placement groove 15, the elastic buffer structures corresponding to the circuit board, the elastic buffer structures including multiple elastic blocks 10.

[0022] In this embodiment, the main body 1 of the vehicle has multiple mounting holes 2, and the frame 3 has two positioning slots 4.

[0023] Specifically, the vehicle body 1 can be installed through the mounting hole 2, and the vehicle body 1 can be positioned through the positioning groove 4.

[0024] The frame 3 has two sliding grooves 5, and a slider 16 is slidably fitted in the sliding groove 5. The two sliders 16 are fixedly connected to two auxiliary plates 7 respectively. A first screw 6 is rotatably fitted in the sliding groove 5. The first screw 6 is threadedly fitted to the slider 16. The pressing positioning structure includes a second screw 8. The second screw 8 is threadedly fitted to the auxiliary plate 7. A rubber pad 9 is fixed to one end of the second screw 8. The rubber pad 9 is in contact with the circuit board.

[0025] Specifically, when different circuit boards need to be fixed, the circuit board is placed in the placement slot 15, and then the two first screws 6 are rotated so that the first screws 6 drive the slider 16 to slide, thereby driving the auxiliary plate 7 to slide, so that the auxiliary plate 7 can be adjusted to the upper side of the circuit board. Then, the second screw 8 is rotated so that the second screw 8 moves downward, so that the rubber pad 9 contacts the circuit board, thereby squeezing and fixing the circuit board.

[0026] The elastic block 10 includes a fixed block 11 and a movable block 12. The fixed block 11 and the movable block 12 are elastically connected. The fixed block 11 is fixed in the placement groove 15. The movable block 12 is in contact with the circuit board. The movable block 12 is made of rubber material. A groove 13 is provided in the fixed block 11. A spring 14 is fixed between the groove 13 and the movable block 12.

[0027] Specifically, when the circuit board is placed in the placement slot 15, pressing down on the circuit board will squeeze the movable block 12, thereby pressing down the spring 14, which can achieve a good buffering effect.

[0028] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A reflow soldering carrier device, comprising a carrier body (1), characterized in that, The vehicle body (1) is equipped with a frame (3), and two auxiliary plates (7) are slidably fitted on the frame (3). A pressing positioning structure is installed on the auxiliary plates (7). A placement slot (15) is opened in the vehicle body (1). A circuit board is placed in the placement slot (15). The pressing positioning structure corresponds to the circuit board. Multiple elastic buffer structures are installed in the placement slot (15). The elastic buffer structures correspond to the circuit board. The elastic buffer structures include multiple elastic blocks (10).

2. The reflow soldering carrier device according to claim 1, characterized in that: The main body (1) of the vehicle has multiple mounting holes (2), and the frame (3) has two positioning slots (4).

3. The reflow soldering carrier device according to claim 1, characterized in that: Two grooves (5) are provided on the frame (3), and sliders (16) are slidably fitted in the grooves (5). The two sliders (16) are fixedly connected to the two auxiliary plates (7) respectively.

4. The reflow soldering carrier device according to claim 3, characterized in that: The first screw (6) is rotatably fitted inside the groove (5), and the first screw (6) is threadedly fitted with the slider (16).

5. The reflow soldering carrier device according to claim 1, characterized in that: The pressing positioning structure includes a second screw (8), which is threadedly engaged with the auxiliary plate (7).

6. The reflow soldering carrier device according to claim 5, characterized in that: A rubber pad (9) is fixed to one end of the second screw (8), and the rubber pad (9) is in contact with the circuit board.

7. The reflow soldering carrier device according to claim 1, characterized in that: The elastic block (10) includes a fixed block (11) and a movable block (12). The fixed block (11) and the movable block (12) are elastically connected. The fixed block (11) is fixed in the placement groove (15), and the movable block (12) is in contact with the circuit board.

8. The reflow soldering carrier apparatus according to claim 7, characterized in that: The movable block (12) is made of rubber material, and a groove (13) is provided in the fixed block (11). A spring (14) is fixed between the groove (13) and the movable block (12).

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