Wafer scribing equipment
By using an XY platform and adjustable rack structure wafer scribing equipment, combined with a laser scribing module and vision components, the problems of low precision and low efficiency of traditional equipment have been solved, and high-precision scribing of various patterns has been achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-23
- Publication Date
- 2026-04-07
AI Technical Summary
Traditional wafer scribing equipment is not precise, has low efficiency, and can only scribing one type of pattern, which cannot meet market demands.
By adopting an XY platform and adjustable frame structure, combined with a laser scribing module and vision components, various patterns can be scribed. The scribing accuracy and stability are improved through the cooperation of fixtures and lens modules.
It achieves high precision and efficiency in scribing various patterns, improving the versatility and scribing accuracy of wafer scribing equipment.
Smart Images
Figure CN224088200U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of wafer processing technology, and in particular to a wafer scribing device. Background Technology
[0002] Silicon wafers, also known as silicon wafers, require pre-marking on the cutting surface before laser cutting and other processing operations to improve processing accuracy. Traditional marking equipment suffers from low accuracy, low efficiency, and can only mark one type of pattern, failing to meet the growing market demand. Utility Model Content
[0003] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a wafer scribing device that can scribing various patterns and has high scribing accuracy.
[0004] The embodiments of this utility model are achieved through the following technical solutions:
[0005] A wafer scribing device includes: an XY platform; a first adjustment frame movably disposed on the XY platform along a first direction; a second adjustment frame movably disposed on the first adjustment frame along a second direction, the second adjustment frame being equipped with a clamp for fixing a wafer; the second direction being perpendicular to the first direction; a laser scribing module and a vision component are mounted on the XY platform, the vision component being used to acquire wafer position data, and the laser scribing module being used to scribble lines on the wafer.
[0006] According to a preferred embodiment, the vision component includes a first lens module and a second lens module, which are located on the same side of the wafer. The laser scribing module is correspondingly disposed with respect to the second lens module, and the wafer is located between the laser scribing module and the second lens module. A first through hole is provided through the XY platform, a second through hole is provided through the first adjustment frame plate, and a third through hole is provided through the second adjustment frame plate. The fixture is disposed at the end of the third through hole near the laser scribing module. Both the first lens module and the second lens module can sequentially pass through the first through hole, the second through hole, and the third through hole to obtain the wafer on the fixture.
[0007] According to a preferred embodiment, the fixture includes a support ring, which is mounted on the end of the third through hole; the end of the support ring facing the laser scribing module is provided with a negative pressure hole for adsorbing the wafer; and the support ring is provided with a plurality of limiting blocks at circumferential intervals.
[0008] According to a preferred embodiment, a clamping block is provided on the periphery of the support ring, and the clamping block is capable of moving radially along the support ring.
[0009] According to a preferred embodiment, the end of the clamping block facing the center of the support ring is provided with an arc-shaped surface adapted to the wafer.
[0010] According to a preferred embodiment, a base is mounted on the XY platform, and a guide cavity is provided on one side of the base facing the support ring. A guide block is slidably installed in the guide cavity. A drive screw is provided through the bottom sidewall of the guide cavity. The drive screw is rotatably connected to the bottom sidewall of the guide cavity. The drive screw is threadedly connected to the guide block. A crank plate is provided at the end of the drive screw away from the guide block, and a handle is mounted on the crank plate.
[0011] According to a preferred embodiment, the support ring is provided with a guide notch, and the clamping block is provided with a guide protrusion corresponding to the guide notch, the guide protrusion being able to extend into the guide notch.
[0012] According to a preferred embodiment, the second lens module includes a first adapter plate, a second adapter plate, and a second lens. The first adapter plate is fixedly installed on the XY platform and corresponds to the first through hole. The second adapter plate is an L-shaped plate and is located inside the first through hole. The first section of the second adapter plate is adjustablely mounted on the first adapter plate via a first adjusting slide. The second lens is adjustablely mounted on the second section of the second adapter plate via a second adjusting slide.
[0013] The technical solution of this utility model embodiment has at least the following advantages and beneficial effects:
[0014] The first adjusting plate of this invention works in conjunction with the second adjusting plate to drive the wafer to move in the horizontal plane, enabling the wafer scribing equipment to achieve various scribing patterns, thereby improving the versatility of the wafer scribing equipment. The fixture moves relative to the laser scribing module under the drive of the first and second adjusting plates, that is, the laser scribing module and the XY platform remain relatively stationary, providing stability of light output and helping to improve the scribing accuracy of the wafer scribing equipment. Attached Figure Description
[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0016] Figure 1 A three-dimensional structural schematic diagram of the wafer scribing equipment provided in this embodiment of the utility model;
[0017] Figure 2 A three-dimensional structural diagram of the wafer scribing equipment after the rack has been removed, as provided in an embodiment of this utility model;
[0018] Figure 3 A three-dimensional structural diagram of the first lens module provided for an embodiment of this utility model;
[0019] Figure 4 A schematic diagram of the assembly structure of the XY platform, the first adjustment frame plate, and the second adjustment frame plate provided in an embodiment of this utility model;
[0020] Figure 5 A three-dimensional structural diagram of a fixture for assembling wafers provided in an embodiment of this utility model;
[0021] Figure 6 A three-dimensional structural diagram of the clamp provided in the embodiment of this utility model;
[0022] Figure 7 for Figure 6 A magnified view of the structure at point D.
[0023] Icons: 1-Rack, 2-XY Platform, 21-Extension Frame, 211-Third Lens Module, 212-Fourth Lens Module, 22-First Through Hole, 3-Laser Marking Module, 31-Galvanometer, 32-Main Body, 4-First Adjustment Plate, 41-Second Through Hole, 5-Second Adjustment Plate, 51-Third Through Hole, 6-Clamp, 61-Support Ring, 611-Guide Notch, 62-Limit Block, 63-Clamping Block, 631-Guide Protrusion, 64-Base, 65-Guide Block, 66-Drive Screw, 661-Crank Plate, 662-Handle, 7-Wafer, 81-First Lens Module, 82-Second Lens Module, 821-First Adapter Plate, 822-Second Adapter Plate, 823-First Adjustment Slide, 824-Second Adjustment Slide, 825-Second Lens, A-First Direction, B-Second Direction. Detailed Implementation
[0024] To better understand and implement this invention, the technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings.
[0025] In the description of this utility model, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
[0027] Please refer to Figures 1 to 7 A wafer scribing apparatus includes a frame 1, an XY platform 2, a first adjusting plate 4, and a second adjusting plate 5. The XY platform 2 is mounted on the frame 1. The first adjusting plate 4 is movably mounted on the XY platform 2 along a first direction A. The second adjusting plate 5 is movably mounted on the first adjusting plate 4 along a second direction B. A clamp 6 is disposed on the second adjusting plate 5 for fixing a wafer 7. The second direction B is perpendicular to the first direction A. A laser scribing module 3 and a vision component are mounted on the XY platform 2. The vision component is used to acquire the position data of the wafer 7, and the laser scribing module 3 is used to scribble lines on the wafer 7. In this embodiment, both the first direction A and the second direction B are parallel to the horizontal plane, and the XY platform 2, the first adjusting plate 4, and the second adjusting plate 5 are all parallel to the horizontal plane. Optionally, the first adjustment plate 4 is slidably connected to the XY platform 2 via a slide rail slider assembly and is driven by a cylinder or linear module mounted on the XY platform 2; the second adjustment plate 5 is slidably connected to the first adjustment plate 4 via a slide rail slider assembly and is driven by a cylinder or linear module mounted on the first adjustment plate 4. In use, the wafer 7 is mounted on the fixture 6. After the vision component acquires the position of the wafer 7, it matches the position information with the driving components (cylinders or linear modules) that drive the first and second adjustment plates 4 and 5, as well as the laser scribing module 3. The first adjustment plate 4, in conjunction with the second adjustment plate 5, drives the wafer 7 to move in the horizontal plane, enabling the wafer scribing equipment to achieve various scribing patterns, thereby improving the versatility of the wafer scribing equipment. Here, the fixture 6 moves relative to the laser scribing module 3 under the drive of the first and second adjustment plates 4 and 5, meaning the laser scribing module 3 remains relatively stationary with respect to the XY platform 2, providing stability in light output and improving the scribing accuracy of the wafer scribing equipment.
[0028] like Figure 1 and Figure 2As shown, the vision component includes a first lens module 81 and a second lens module 82, which are located on the same side of the wafer 7. A laser scribing module 3 is correspondingly positioned to the second lens module 82, with the wafer 7 positioned between the laser scribing module 3 and the second lens module 82. A first through-hole 22 is provided through the XY platform 2, a second through-hole 41 is provided through the first adjustment bracket 4, and a third through-hole 51 is provided through the second adjustment bracket 5. A fixture 6 is positioned at the end of the third through-hole 51 near the laser scribing module 3. Both the first lens module 81 and the second lens module 82 can sequentially pass through the first through-hole 22, the second through-hole 41, and the third through-hole 51 to obtain the wafer 7 on the fixture 6. In this embodiment, the laser scribing module 3 includes a main body 32 and a galvanometer 31. The main body 32 is mounted on the XY platform 2 via an extension bracket 21. The galvanometer 31 is longitudinally adjustable on the main body 32 via a linear module, thereby adjusting the longitudinal distance between the galvanometer 31 and the wafer 7 to adapt to different processing scenarios. In this embodiment, the first through-hole 22 consists of two parts: a portion of the first through-hole 22 near the first lens module 81 and a portion of the first through-hole 22 near the second lens module 82. During use, after the wafer 7 is assembled onto the fixture 6, the second adjusting plate 5 moves along the second direction B, causing the third through-hole 51 to overlap with the second through-hole 41. The first adjusting plate 4 moves along the first direction A, causing the second through-hole 41 to overlap with the first through-hole 22 near the first lens module 81, so that the first lens module 81 can sequentially detect the wafer through the first through-hole 22, the second through-hole 41, and the third through-hole 51. 7. This allows for global identification of wafer 7, enabling initial positioning of wafer 7. Subsequently, under the action of the first adjustment plate 4, wafer 7 moves along the first direction A towards the second lens module 82, so that the second through-hole 41 overlaps with the first through-hole 22 near the second lens module 82. This allows the second lens module 82 to detect wafer 7 sequentially through the first through-hole 22, the second through-hole 41, and the third through-hole 51, identifying the scribing path of wafer 7. Finally, wafer 7 moves relative to the galvanometer 31 according to the scribing path under the action of the first adjustment plate 4 and the second adjustment plate 5 to achieve scribing. Optionally, the first lens module 81 is a wide-angle vision component, and the second lens module 82 is a CCD camera component. It should be noted that the Mark points of wafer 7 are oriented towards the first lens module 81 and the second lens module 82.
[0029] like Figure 5 and Figure 6As shown, the fixture 6 includes a support ring 61, which is detachably mounted to the end of the third through hole 51 by bolts or screws. A negative pressure hole is provided at the end of the support ring 61 facing the laser scribing module 3 for adsorbing the wafer 7. Multiple limiting blocks 62 are circumferentially spaced on the support ring 61. Optionally, there are four limiting blocks 62 for limiting the wafer 7. The limiting blocks 62 are detachably assembled with the support ring 61, and different specifications of limiting blocks 62 can be replaced as needed during use.
[0030] Furthermore, a clamping block 63 is provided on the periphery of the support ring 61, and the clamping block 63 can move radially along the support ring 61. Here, the clamping block 63 is used to cooperate with the limiting block 62 to position the wafer 7.
[0031] Preferably, the end of the clamping block 63 facing the center of the support ring 61 is provided with an arc-shaped surface adapted to the wafer 7. The arc-shaped surface can better adapt to the wafer 7, thereby increasing the contact area between the clamping block 63 and the wafer 7.
[0032] like Figure 7 As shown, a base 64 is mounted on the XY platform 2. A guide cavity is configured on the side of the base 64 facing the support ring 61. A guide block 65 is slidably installed in the guide cavity. A drive screw 66 is provided through the bottom sidewall of the guide cavity. The drive screw 66 is rotatably connected to the bottom sidewall of the guide cavity and threadedly connected to the guide block 65. A crank plate 661 is configured at the end of the drive screw 66 away from the guide block 65, and a handle 662 is mounted on the crank plate 661. In this embodiment, a clamping block 63 is disposed on the side of the guide block 65 facing the support ring 61. In use, the drive screw 66 is rotated by the handle 662 and the crank plate 661, thereby driving the guide block 65 to slide in the guide cavity to move closer to or away from the support ring 61.
[0033] Furthermore, the retaining ring 61 is provided with a guide notch 611, and the clamping block 63 is provided with a guide protrusion 631 corresponding to the guide notch 611. The guide protrusion 631 can extend into the guide notch 611. Here, the guide protrusion 631 increases the area of the clamping block 63 in the longitudinal direction. The setting of the guide notch 611 avoids interference between the clamping block 63 and the guide protrusion 631 and the retaining ring 61 during movement, thereby reliably and stably clamping the wafer 7 and preventing the clamping block 63 from failing to reliably abut the wafer 7 due to manufacturing or assembly errors.
[0034] like Figure 3As shown, the second lens module 82 includes a first adapter plate 821, a second adapter plate 822, and a second lens 825. The first adapter plate 821 is fixedly mounted on the XY platform 2 and corresponds to the first through hole 22. The second adapter plate is an L-shaped plate, and the second adapter plate 822 is located inside the first through hole 22. The first section of the second adapter plate 822 is adjustablely mounted to the first adapter plate 821 via a first adjusting slide 823. The second lens 825 is adjustablely mounted to the second section of the second adapter plate 822 via a second adjusting slide 824. The second lens 825 is a CCD camera. In this embodiment, there are two first adjusting slides 823, which are connected to each other and slide perpendicularly, so that the second adapter plate 822 can be adjusted in spatial position in the first direction A and the second direction B. The second lens 825 can be adjusted in spatial position relative to the second adapter plate 822 in the longitudinal direction via the second adjusting slide 824.
[0035] In another embodiment, a third lens module 211 and a fourth lens module 212 are mounted on the extension frame 21. In this embodiment, the Mark point of the wafer 7 is positioned facing the third lens module 211 and the fourth lens module 212 during use.
[0036] The technical means disclosed in this utility model are not limited to those disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications are also considered within the scope of protection of this utility model.
Claims
1. A wafer scribing device, characterized in that, include: XY platform; A first adjustment plate is movably disposed on the XY platform along a first direction; A second adjustment plate is movably disposed on the first adjustment plate along a second direction, and a clamp is provided on the second adjustment plate for fixing the wafer; the second direction is perpendicular to the first direction. The XY platform is equipped with a laser scribing module and a vision component. The vision component is used to acquire wafer position data, and the laser scribing module is used to scribble lines on the wafer.
2. The wafer scribing equipment according to claim 1, characterized in that, The vision component includes a first lens module and a second lens module, which are located on the same side of the wafer. The laser scribing module is correspondingly arranged with the second lens module, and the wafer is located between the laser scribing module and the second lens module. A first through hole is provided through the XY platform, a second through hole is provided through the first adjustment frame plate, and a third through hole is provided through the second adjustment frame plate. The fixture is located at the end of the third through hole near the laser scribing module. Both the first lens module and the second lens module can sequentially pass through the first through hole, the second through hole and the third through hole to obtain the wafer on the fixture.
3. The wafer scribing equipment according to claim 2, characterized in that, The clamp includes a support ring, which is mounted on the end of the third through hole; The end of the support ring facing the laser scribing module is provided with a negative pressure hole for adsorbing the wafer; The ring is provided with multiple limiting blocks at circumferential intervals.
4. The wafer scribing equipment according to claim 3, characterized in that, A clamping block is provided on the periphery of the support ring, and the clamping block can move radially along the support ring.
5. The wafer scribing equipment according to claim 4, characterized in that, The end of the clamping block facing the center of the support ring is provided with an arc-shaped surface adapted to the wafer.
6. The wafer scribing equipment according to claim 3, characterized in that, A base is mounted on the XY platform. A guide cavity is configured on one side of the base facing the support ring. A guide block is slidably installed in the guide cavity. A drive screw is provided through the bottom sidewall of the guide cavity. The drive screw is rotatably connected to the bottom sidewall of the guide cavity. The drive screw is threadedly connected to the guide block. A crank plate is configured at the end of the drive screw away from the guide block. A handle is mounted on the crank plate.
7. The wafer scribing equipment according to claim 4, characterized in that, The ring is provided with a guide notch, and the clamping block is provided with a guide protrusion corresponding to the guide notch, the guide protrusion being able to extend into the guide notch.
8. The wafer scribing equipment according to claim 2, characterized in that, The second lens module includes a first adapter plate, a second adapter plate, and a second lens. The first adapter plate is fixedly installed on the XY platform and corresponds to the first through hole. The second adapter plate is an L-shaped plate and is located inside the first through hole. The first section of the second adapter plate is adjustablely mounted on the first adapter plate via a first adjusting slide. The second lens is adjustablely mounted on the second section of the second adapter plate via a second adjusting slide.