Plating pot device and coating equipment

Abstract

The utility model relates to the technical field of semiconductor manufacturing, and provides a plating pot device and coating equipment, and the plating pot device comprises a base body, a plating pot unit and a shielding unit, the plating pot unit comprises a plurality of plating pot assemblies, the plating pot assemblies are arranged on the base body, and each plating pot assembly is arranged around a reference axis; the shielding unit comprises a shielding piece, and the shielding piece is arranged on the base body; and in the circumferential direction of the reference axis, at least one part of a gap between the adjacent plating pot assemblies is shielded by at least one shielding piece. The plating pot device reduces the escape proportion of atoms or molecules of raw materials and effectively improves the material utilization rate.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a plating pot device and a coating equipment. Background Technology

[0002] Electron beam evaporation deposition (PVD) is a physical vapor deposition technique based on high-energy electron beam bombardment of target materials. By heating high-purity materials (such as metals and oxides) to an evaporation or sublimation state in a vacuum environment, the atoms or molecules of the material are deposited on the surface of a substrate, forming a highly dense and pure functional thin film. This technology is widely used in the semiconductor field.

[0003] Currently widely used electron beam evaporation coating systems suffer from significant material waste. Specifically, due to limitations in their process chambers, the number of coating pots is usually small, the pots are sparsely spaced, and the gaps between adjacent pots are large. This results in a high proportion of evaporated atoms or molecules escaping, leading to low material utilization.

[0004] Therefore, how to improve the material utilization rate of existing electron beam evaporation coating systems while maintaining the existing equipment infrastructure has become a technical problem that urgently needs to be solved in this field. Utility Model Content

[0005] The purpose of this invention is to provide a plating pot device and a coating equipment, which reduces the escape rate of atoms or molecules of raw materials and effectively improves material utilization.

[0006] This utility model provides a plating pot device, including: a substrate, a plating pot unit, and a shielding unit;

[0007] The plating pot unit includes multiple plating pot components, which are disposed on the substrate and arranged around a reference axis.

[0008] The shielding unit includes a shielding member, which is disposed on the substrate;

[0009] In the circumferential direction about the reference axis, at least a portion of the gap between adjacent plating pot assemblies is blocked by at least one of the shielding members.

[0010] Optionally, the plating pot unit includes n plating pot components, where n is an integer greater than 3.

[0011] Optionally, the plating pot assembly includes a plating pot, and the shielding member shields the gap between two adjacent plating pots along the circumferential direction.

[0012] Optionally, one side of the plating pan along the reference axis is the vapor deposition surface;

[0013] Along the direction of the reference axis, the shielding member is located on the side of the plating pot away from the vapor deposition surface.

[0014] Optionally, the plating pot assembly further includes a first connector;

[0015] The first connector includes a first connecting part and a second connecting part that are connected to each other, and the first connecting part and the second connecting part are arranged at an included angle.

[0016] The first connecting part is connected to the substrate, and the second connecting part is connected to the plating pot.

[0017] Optionally, the plating pot assembly further includes a rolling element, which is rotatably connected to the plating pot;

[0018] The plating pot device further includes a track unit, which includes a circular ring. The central axis of the circular ring is collinear with the reference axis, and the rolling element rolls in cooperation with the circular ring along its circumferential direction.

[0019] Optionally, a portion of the plating pot is located outside the annulus when projected along the direction of the reference axis.

[0020] And / or, the blocking element is located on one side of the annulus along the direction of the reference axis;

[0021] And / or, the annulus and the base are arranged along the direction of the reference axis;

[0022] And / or, the substrate is annular, and the substrate and the annular body are coaxially arranged.

[0023] Optionally, the track unit further includes a second connector connected to the annulus, the second connector being used to connect the annulus to the stationary part of the coating equipment, so that the annulus and the substrate are positioned relative to each other along the direction of the reference axis.

[0024] Optionally, the plating pot device further includes a power connection unit, which is connected to the substrate and is used to connect to a power source to drive the substrate to rotate about the reference axis.

[0025] This utility model also provides a coating equipment, which includes the coating pot device described above.

[0026] In summary, the plating pot apparatus includes: a substrate, a plating pot unit, and a shielding unit; the plating pot unit includes multiple plating pot components, which are disposed on the substrate, and each of the plating pot components is arranged around a reference axis; the shielding unit includes a shielding member, which is disposed on the substrate; in the circumferential direction around the reference axis, at least a portion of the gap between adjacent plating pot components is shielded by at least one of the shielding members.

[0027] With this configuration, the shielding element in this invention can prevent evaporated atoms or molecules from escaping between adjacent plating pot components. This improves the situation where material adheres to the top of the inner wall of the process chamber and also helps to block evaporated atoms or molecules on the deposition surface of the plating pot component, increasing the proportion of atoms or molecules in contact with the substrate on the plating pot component, thus improving material utilization and reducing coating costs. Furthermore, the shielding element also causes some atoms or molecules that would otherwise escape to adhere to it, facilitating cleaning and raw material recycling, further improving raw material utilization and reducing coating costs. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the plating pot device according to an embodiment of the present invention;

[0029] Figure 2 This is a bottom view of the plating pot device according to an embodiment of the present invention;

[0030] Figure 3 This is a partial structural schematic diagram of a plating pot device according to an embodiment of the present invention;

[0031] Figure 4 This is a partial top view of the plating pot device according to an embodiment of the present invention;

[0032] Figure 5 This is a partial cross-sectional view of a plating pot device according to an embodiment of the present invention;

[0033] Figure 6 This is a partial side view of a plating pot device according to an embodiment of the present invention.

[0034] In the attached diagram:

[0035] 10-Matrix;

[0036] 20-Soaking pot unit;

[0037] 21-Glazing pot assembly;

[0038] 211-Glazing pot;

[0039] 212-First connector; 2121-First connecting part; 2122-Second connecting part;

[0040] 213 - Rolling element;

[0041] 214 - Mounting shaft; 2141 - Large diameter section; 2142 - First small diameter section; 2143 - Second small diameter section;

[0042] 215 - Bushing; 2151 - Limiting flange;

[0043] 216-Bearing;

[0044] 217 - Housing; 2171 - Positioning step; 2172 - Spring washer; 2173 - Connecting flange;

[0045] 218-Limiting sleeve;

[0046] 219 - Locking nut;

[0047] 30 - Blocking unit; 31 - Blocking component;

[0048] 40 - Track unit; 41 - Ring body; 42 - Second connector;

[0049] 50 - Power Connection Unit;

[0050] a-Reference axis. Detailed Implementation

[0051] The plating pot apparatus of this utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of this utility model will become clearer from the following description. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of this utility model.

[0052] As used in this invention, the singular forms “a,” “an,” and “the” include plural objects; the term “or” is generally used to mean “and / or”; the term “a number” is generally used to mean “at least one”; and the terms “at least two” or “more than” are generally used to mean “two or more”. Furthermore, the terms “first,” “second,” and “third” are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with “first,” “second,” or “third” may explicitly or implicitly include one or at least two of that feature. Furthermore, the terms "installed," "connected," and "attached," as used in this utility model, and the term "set" on one element from another, should be interpreted broadly. They generally only indicate a connection, coupling, cooperation, or transmission relationship between the two elements, which can be direct or indirect through an intermediate element. They should not be construed as indicating or implying a spatial positional relationship between the two elements, meaning one element can be located inside, outside, above, below, or to one side of the other element, unless otherwise explicitly stated. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances. Additionally, directional terms such as above, below, up, down, upward, downward, left, and right are used relative to exemplary embodiments as shown in the figures, with upward or up direction pointing towards the top of the corresponding figure, and downward or down direction pointing towards the bottom of the corresponding figure.

[0053] This embodiment provides a plating pot device, including: a substrate 10, a plating pot unit 20, and a shielding unit 30.

[0054] Combination Figure 1 As shown, in this embodiment, the substrate 10 is configured as an annular shape to adapt to the circumferential layout and movement mode of the plating pot unit 20.

[0055] The substrate 10 serves as the mounting base for the plating pot unit 20 and the shielding unit 30. Both the plating pot unit 20 and the shielding unit 30 are mounted on the substrate 10, allowing material atoms or molecules to be deposited on the substrate surface during the coating process.

[0056] Simultaneously, the substrate 10 is also used to connect to an external power source, providing power for the movement of the plating pot unit 20 during the coating process. In this embodiment, the plating pot unit 20 revolves during the coating process, so the plating pot device in this embodiment also includes a track unit 40 and a power connection unit 50. The track unit 40 provides guidance for the rotational movement of the plating pot unit 20, and the power connection unit 50 is connected to the substrate 10. The power connection unit 50 is used to connect to a power source to drive the substrate 10 to rotate, thereby driving the plating pot unit 20 to revolve.

[0057] In other alternative embodiments, the specific shape of the substrate 10 can be adaptively adjusted based on the layout and movement of the plating pot unit 20. Simultaneously, the track unit 40 and the power connection unit 50 can be adaptively added or removed based on actual coating requirements. For example, during the coating process, when the plating pot unit 20 does not need to move, the track unit 40 and the power connection unit 50 may not be configured.

[0058] Please continue to refer to this. Figure 1 As shown, the plating pot unit 20 includes a plurality of plating pot components 21, which are disposed on the substrate 10, and each of the plating pot components 21 is arranged around a reference axis a.

[0059] In this embodiment, the reference axis a is collinear with the central axis of the substrate 10, that is, the substrate 10 is driven to rotate around its own central axis, and drives the plating pot assembly 21 to rotate synchronously around the reference axis a.

[0060] The aforementioned plating pot components 21 are symmetrically arranged around the reference axis a, which ensures that material atoms or molecules are in uniform contact with the plating pot components 21, so as to achieve uniform deposition on the substrate. A certain gap is provided between adjacent plating pot components 21 in the circumferential direction around the reference axis a to avoid mutual interference between the plating pot components 21.

[0061] When the material to be evaporated is bombarded by an electron beam, it is heated to an evaporation state, turning it into a gaseous state. These evaporated atoms or molecules are precisely guided to the surface of the substrate mounted on the plating bath assembly 21. Specifically, the evaporated atoms or molecules... Figure 1 The particles are guided to move from bottom to top and come into contact with the substrate mounted on the plating pot assembly 21. Because there are gaps between adjacent plating pot assemblies 21, the evaporated atoms or molecules can easily escape upwards through the gaps and then adhere to the inner surface of the process chamber.

[0062] Based on this, a shielding unit 30 is provided in this embodiment. The shielding unit 30 includes a shielding member 31, which is disposed on the base 31.

[0063] In the circumferential direction about the reference axis a, at least a portion of the gap between adjacent plating pot assemblies 21 is blocked by at least one of the shielding members 31.

[0064] like Figure 1As shown, in this embodiment, a shielding member 31 is provided between each adjacent plating pot assembly 21 to form a shield. The proportion of the gap blocked by the shielding member can be adjusted based on the actual structure, with the standard that the shielding member 31 does not interfere with the inner wall of the process cavity or other components after shielding. Therefore, in this embodiment, to avoid interference, the shielding member 31 only shields a portion of the gap. In other alternative embodiments, the shielding member 31 can completely shield the gap without interference or affecting other components. Furthermore, in other alternative embodiments, multiple (e.g., two, three, or more) shielding members 31 can be provided between each adjacent plating pot assembly 21 for shielding.

[0065] In this embodiment, the shielding member 31 can be used to prevent evaporated atoms or molecules from escaping between adjacent plating pot assemblies 21. On the one hand, this can improve the phenomenon of material adhering to the top of the inner wall of the process chamber, and on the other hand, it can also help to block the evaporated atoms or molecules on the evaporation surface side of the plating pot assembly 21. Figure 1 The shielding element 31 is located below the plating pot assembly 21 to increase the proportion of atoms or molecules in contact with the substrate on the plating pot assembly 21, thereby improving material utilization and reducing coating costs. In addition, the shielding element 31 also causes some atoms or molecules that would otherwise escape to adhere to the shielding element 31, making cleaning easier and facilitating the recycling of raw materials, further improving raw material utilization and reducing coating costs.

[0066] Furthermore, the plating pot unit 20 includes n plating pot components 21, where n is an integer greater than 3, and preferably an even number. Combined with... Figure 1 and Figure 2 As shown, in this embodiment, four plating pot assemblies 21 are provided, and the four plating pot assemblies 21 are symmetrically arranged around the reference axis a. An even number of plating pot assemblies 21 can not only form a centrally symmetrical layout, but also a planar symmetrical layout. Furthermore, the plating pot assemblies 21 can rotate around the reference axis a along with the substrate 10. Therefore, even if the concentration of atoms or molecules of the material in the process chamber is uneven, or the temperature field distribution is uneven, the symmetrical layout and rotational movement of the plating pot assemblies 21 can compensate for these defects, ensuring uniform contact between the substrate on each plating pot assembly 21 and the atoms or molecules of the material in the process chamber, thereby ensuring the consistency of the coating quality and improving the coating yield. Moreover, the above-mentioned layout of the plating pot assemblies 21 also helps to improve the phenomenon of uneven temperature field distribution in the cavity caused by the superposition effect of heat load during simultaneous evaporation of multiple plating pots, promoting a uniform temperature field distribution and thus improving product yield.

[0067] In other alternative embodiments, the number of plating pot assemblies 21 can be adjusted based on actual usage requirements; for example, the number of plating pot assemblies 21 can be five, six, or more.

[0068] Please continue to refer to this. Figure 1 and Figure 2 As shown, in this embodiment, the plating pot assembly 21 includes a plating pot 211, and the shielding member 31 shields the gap between two adjacent plating pots 211 along the circumferential direction.

[0069] In this embodiment, the plating pot 211 is a disc-shaped object with an approximate spherical surface. The plating pot 211 is provided with six evaporation positions, each of which is a through hole opened on the plating pot 211. The six evaporation positions are symmetrically arranged around the central axis of the plating pot 211 itself.

[0070] In other alternative embodiments, the specific shape of the plating pan 211 and the number of evaporation positions provided in the plating pan 211 can be adaptively adjusted based on actual coating requirements. For example, the plating pan 211 can be set as an ellipsoid, a regular polygon or other irregular shape, and the number of evaporation positions can be set to five, seven, eight, nine or fewer or more.

[0071] Please continue to refer to this. Figure 1 and Figure 2 As shown, in this embodiment, the central axis of the plating pot 211 is set at an angle to the reference axis a. This angle serves as the installation angle of the plating pot 211. The central axis of the plating pot 211 intersects the reference axis a (the central axis of the substrate 10), and the central axes of each plating pot 211 intersect the reference axis a at a single point. Based on the size of the process cavity's accommodating space, by reasonably configuring the outer diameter of the substrate 10, the outer diameter of the plating pot 211, and the installation angle of the plating pot 211, four plating pots 211 can be installed within the existing process cavity's accommodating space, thereby increasing the physical upper limit of substrate loading in a single vapor deposition operation.

[0072] The existing 211 three-pot deposition machine (each pot has six deposition positions) has a limited number of pots, allowing for the deposition of metal thin films on only 18 substrates per cycle. Production data shows its theoretical maximum capacity is 3300 wafers / hour, which is 8.9% below the required benchmark capacity of 3600 wafers / hour. Existing improvement plans focus on increasing equipment capacity or fine-tuning process parameters, such as adding parallel production lines or shortening process cycle time. However, these methods significantly increase equipment investment costs and factory space requirements.

[0073] The plating pot device in this embodiment is equipped with four plating pot components 21, which can increase the production capacity from 18 pieces to 24 pieces in a single operation, representing a 33% increase. A single machine can save hundreds of thousands of yuan in costs per year, and with the simultaneous modification of dozens of machines, the annual cost savings can reach millions to tens of millions of yuan. This plating pot device is based on the improvement of a single machine, and the increase in equipment investment cost and factory space occupation is not significant.

[0074] Figure 1 One side of the plating pan 211 along the reference axis a is concave, which serves as the evaporation surface. When the material to be evaporated is bombarded by an electron beam, the evaporated material... Figure 1 The material moves from bottom to top and contacts the vapor deposition surface, thereby contacting the lower surface of the substrate located on the deposition pan 211 to achieve uniform coating.

[0075] In this embodiment, along the direction of the reference axis a, the shielding member 31 is located on the side of the plating pot 211 away from the vapor deposition surface. Figure 1 In this design, the lower side of the plating pan 211 is the vapor deposition surface, and the shielding member 31 is located above the plating pan 211. That is, the shielding member 31 is not positioned between adjacent plating pans 211, but rather arranged along the reference axis a. This arrangement avoids interference between the material molecules or atoms below and the vapor deposition surface of the plating pan 211. It also facilitates the arrangement of the shielding member 31, as its size is not constrained by the gap between adjacent plating pans 211, allowing for a larger shielding effect. Furthermore, the shielding member 31 does not occupy space between adjacent plating pans 211, enabling a more compact arrangement of the plating pans 211 in the circumferential direction, thus accommodating more plating pans and increasing the single-batch substrate processing capacity.

[0076] Please refer to Figure 1 and Figure 3 As shown, in this embodiment, the shielding member 31 has a plate-like structure and a bent structure. One side is a horizontal edge that is attached to the upper axial end of the base 10 and fastened with bolts. The other side is a bent edge that bends downwards to shield the area between adjacent plating pans 211. Preferably, the bent edge of the shielding member 31 is perpendicular to the central axis of the plating pan 211, so that the shielding member 31 is approximately parallel to the gap between adjacent plating pans 211, thereby improving the shielding effect. Figure 2 As shown in this embodiment, since the edge of the plating pot 211 is arc-shaped, the gap between adjacent plating pots 211 has a gradual structure, with the gap being narrow in the middle and wide at both ends. The width of the shielding member 31 is greater than the maximum width of the gap, so that the shielding member 31 can completely cover the gap and form a complete shielding effect.

[0077] Combination Figure 1 and Figure 3 As shown, in this embodiment, the shielding member 31 is formed by bending an equilateral trapezoidal plate structure, with its horizontal side corresponding to the narrow end of the shielding member 31 and its bent side corresponding to its wide end. Therefore, the shielding member 31 mainly achieves the shielding of the gap through its wide end, which not only ensures a good shielding effect, but also helps to save the material used in the shielding member 31, realizes lightweight design, and reduces material costs.

[0078] In other alternative embodiments, the shielding member 31 may adopt a curved thin-walled structure, a rectangular planar plate structure or other structures, and the specific structure of the shielding member 31 may be adjusted according to actual needs.

[0079] Combination Figure 1 and Figure 3 As shown, the plating pot assembly 21 also includes a first connector 212;

[0080] The first connector 212 includes a first connecting portion 2121 and a second connecting portion 2122 that are connected to each other, and the first connecting portion 2121 and the second connecting portion 2122 are arranged at an included angle;

[0081] The first connecting part is connected to the base 10, and the second connecting part is connected to the plating pot 211.

[0082] Combination Figure 3 As shown, in this embodiment, the first connector 212 has a long strip plate structure with one end being a horizontal edge, which is the first connecting part 2121. The first connecting part 2121 is horizontally arranged and attached to the upper axial end of the base 10 and fastened by bolts. The part of the first connector 212 other than the horizontal edge serves as the second connecting part 2122. The bending structure of the second connecting part 2122 can be used to adjust the installation angle of the plating pot 211.

[0083] like Figure 1 and Figure 3 As shown, in this embodiment, the second connecting portion 2122 of the first connector 212 is bent downwards and has a two-section bending structure. Preferably, the end of the second connecting portion 2122 ( Figure 1 and Figure 3 The lower end of the second connecting part 2122 is perpendicular to the axial direction of the plating pot 211 to facilitate the installation of the plating pot 211.

[0084] In other alternative embodiments, the first connector 212 may also be a single-bend structure or other bending structure, and the specific bending method of the first connector 212 may be adjusted based on the actual installation requirements of the plating pot 211.

[0085] In this embodiment, the number of first connectors 212 adapted to the plating pot 211 is set to four, and the four first connectors 212 and the four shielding members 31 are equidistantly alternated along the circumferential direction.

[0086] In this embodiment, the first connector 212 is formed by bending a rectangular plate structure, meaning the width of the first connector 212 is a uniform structure. In other alternative embodiments, the first connector 212 can be configured as a trapezoidal plate structure similar to the shield 31, or as another plate structure, or the first connector 212 can be configured as a rod or other shape. The specific shape of the first connector 212 can be adjusted based on the installation angle and installation strength requirements of the plating pot 211.

[0087] Please continue to refer to this. Figure 3 and Figure 4 As shown, the plating pot assembly 21 also includes a rolling element 213, which is rotatably connected to the plating pot 211;

[0088] The plating pot device also includes a track unit 40, which includes a ring 41. The central axis of the ring 41 is collinear with the reference axis a, and the rolling element 213 rolls in cooperation with the ring 41 in its circumferential direction.

[0089] Combination Figures 1 to 3 As shown, the base 10 and the annular body 41 are coaxially arranged, and the annular body 41 and the base 10 are arranged along the direction of the reference axis a. Specifically, as... Figure 1 As shown, the substrate 10 is located above the annular body 41. The plating pan 211 is inclined, with a part of the plating pan 211 located above the annular body 41 and between the substrate 10 and the annular body 41, and the other part of the plating pan 211 located below the annular body 41.

[0090] In addition, combined Figure 2 As shown, the projection along the reference axis a shows that a portion of the plating pot 211 is located outside the annular body 41. Specifically, the edge of the plating pot 211 extends slightly beyond the annular body 41. In actual assembly, the annular body 41 is coaxially mounted in a cylindrical process cavity, and there is a certain distance between the outer circumferential surface of the annular body 41 and the inner circumferential surface of the process cavity. Therefore, the slight extension of the edge of the plating pot 211 beyond the annular body 41 effectively utilizes the space between the outer circumferential surface of the annular body 41 and the inner circumferential surface of the process cavity, thereby improving space utilization and facilitating the arrangement of more than three plating pots 211 in the existing process cavity.

[0091] Combination Figure 2 and Figure 3As shown, the blocking member 31 is located on one side of the annular body 41 along the direction of the reference axis a. Specifically, the blocking member 31 is located above the annular body 41, and its projection along the direction of the reference axis a indicates that the blocking member 31 is located inside the annular body 41. That is, the blocking member 31 does not extend beyond the annular body 41, which on the one hand prevents the blocking member 31 from interfering with the annular body 41 itself and simplifies the spatial arrangement of the blocking member 31, and on the other hand, also avoids interference between the blocking member 31 and the inner wall of the process cavity during rotation.

[0092] In this embodiment, the cooperation between the rolling element 213 and the ring 41 is used to guide the combination of the base 10, the plating pot 211 and the first connecting member 212, so as to improve the stability of the plating pot 211 when it revolves.

[0093] In this embodiment, the rolling element 213 is mounted on the first connecting member 212. Figure 3 and Figure 4 As shown, each of the first connecting parts 212 is equipped with a rolling element 213. The rolling elements 213 are centrally symmetrically distributed around the reference axis a. All four rolling elements 213 can roll along the annular body 41 to ensure the stability of the plating pot 211.

[0094] In this embodiment, both the plating pot 211 and the rolling element 213 are mounted on the first connecting member 212 to simplify the structure of the plating pot device. In other alternative embodiments, the rolling element 213 may also be mounted separately on an arm connected to the base 10.

[0095] In this embodiment, the rolling element 213 and the annular body 41 are guided by a rolling engagement. In other alternative embodiments, a sliding element may be configured on the first connecting member 212, and the sliding element guides the movement of the plating pot assembly 21 by sliding circumferentially with the annular body 41.

[0096] In this embodiment, the rotation axis of the rolling element 213 is collinear with the central axis of the plating pot 211 to improve the integration of the rolling element 213 and the plating pot 211. In other alternative embodiments, the rotation axis of the rolling element 213 and the central axis of the plating pot 211 may not be collinear; for example, they may be parallel or at an angle. When the base 10 drives each plating pot 211 to rotate around the quasi-axis a, the installation angle of the rolling element 213 is sufficient to ensure that the rolling element 213 adaptably rolls along the annulus 41.

[0097] Combination Figure 5 As shown, in this embodiment, the plating pot assembly 21 also includes a mounting shaft 214, a bushing 215, a bearing 216, and a housing 217.

[0098] The mounting shaft 214 is a stepped shaft, which includes a large diameter section 2141 and a first small diameter section 2142 and a second small diameter section 2143 located at both ends of the large diameter section 2141 and coaxially arranged.

[0099] The bushing 215 is fitted over the first minor diameter section 2142. One end of the bushing 215 abuts against the shoulder of the major diameter section 2141. A positioning element (such as a positioning pin) is provided on the first minor diameter section 2142 to position the other end of the bushing 215. Therefore, the bushing 215 is axially positioned by the positioning element and the shoulder of the major diameter section 2141. The bushing 215 and the first minor diameter section 2142 can be fitted together by a spline, flat key, or other structure so that when the bushing 215 rotates, it can drive the first minor diameter section 2142 to rotate, thereby driving the entire mounting shaft 214 to rotate.

[0100] Bearing 216 is mounted on bushing 215. In this embodiment, bearing 216 is a deep groove ball bearing. In other alternative embodiments, the bearing type of bearing 216 can be selected based on its usage requirements, such as cylindrical roller bearings, needle roller bearings, etc.

[0101] In this embodiment, two bearings 216 are provided, and a limiting sleeve 218 is provided between the two bearings 216. The limiting sleeve 218 is fitted on the bushing 215 and is isolated between the two bearings 216.

[0102] The bushing 215 has a radially protruding limiting flange 2151 at one end near the large diameter section 2141, which abuts against one of the bearings 216. Figure 5 The axial end of the inner ring of the bearing located on the right side ( Figure 5 (Right end of the inner ring of the right-side bearing).

[0103] The rolling element 213 is fitted onto the bushing 215 and engages with the bushing 215 in a driving relationship; that is, when the rolling element 213 rolls, it drives the bushing 215 to rotate synchronously. One axial end of the rolling element 213 presses against another bearing 216. Figure 5 The axial end of the inner ring of the bearing located on the left side ( Figure 5 (The left end of the inner ring of the left bearing). Therefore, the inner rings of the two bearings are axially positioned by the rolling element 213, the limiting sleeve 218, and the limiting flange 2151.

[0104] The end of the bushing 215 away from the large diameter section 2141 has an external thread, and a lock nut 219 is threadedly connected at this position. The lock nut 219 abuts against the rolling element 213 and presses the rolling element 213 onto the bearing.

[0105] The outer casing 217 is fitted over the bushing 215, and the bearing 216 is located between the bushing 215 and the outer casing 217. The inner wall of the outer casing 217 has a positioning step 2171, which abuts against one of the bearings 216. Figure 5The axial end of the outer ring of the bearing located on the right side (in the middle) Figure 5 The right end of the outer ring of the right-side bearing). A spring washer 2172 is provided inside the housing 217, and the spring washer 2172 abuts against another bearing 216 ( Figure 5 The axial end of the outer ring of the bearing located on the left side ( Figure 5 (The left end of the outer ring of the left bearing). Therefore, the outer rings of the two bearings are axially positioned by the positioning step 2171, the limiting sleeve 218, and the spring washer 2172.

[0106] In addition, the outer wall of the housing 217 has a connecting flange 2173, which is similar to a flange structure. The first connecting member 212 has a connecting hole, the housing 217 is fitted inside the connecting hole, and the connecting flange 2173 is abutted against the first connecting member 212 and connected by bolts.

[0107] At this time, the combination consisting of mounting shaft 214, bushing 215, bearing 216 and housing 217 is mounted on the first connector 212, and housing 217 is fixed to the first connector 212. The combination consisting of rolling element 213, mounting shaft 214 and bushing 215 can rotate relative to housing 217.

[0108] Please continue to refer to this. Figure 5 As shown, the second minor diameter section 2143 of the mounting shaft 214 is used to mount the plating pot 211. A connecting hole is opened at the center of the plating pot 211, and the second minor diameter section 2143 is fitted inside the connecting hole. A locking nut is threaded onto the second minor diameter section 2143. The locking nut clamps the plating pot 211 with the shoulder of the major diameter section 2141, so that the plating pot 211 is fixedly mounted on the second minor diameter section 2143. Therefore, when the mounting shaft 214 rotates, it will drive the plating pot 211 to rotate.

[0109] Please continue to refer to this. Figure 5 As shown, the inner side of the annular body 41 has a right-angled track groove, and the rolling element 213 has a disc structure, with its outer circumference fitting into the track groove and able to roll along it. Therefore, when the substrate 10 is driven to rotate by the power connection unit 50 and causes the plating pot assembly 21 to revolve, the rolling element 213 rolls along the annular body 41 and causes the plating pot 211 to rotate. Through the rotation and revolution of the plating pot 211, it makes uniform contact with the material vapor in the process chamber, thereby improving the coating effect.

[0110] Please continue to refer to this. Figure 5 As shown, in this embodiment, the rolling element 213 and the plating pot 211 are disposed on both sides of the first connecting member 212. This arrangement facilitates the assembly of the rolling element 213 and the plating pot 211 with the mounting shaft 214 and the bushing 215.

[0111] The above embodiments provide an installation method for the rolling element 213, the plating pot 211, and the first connecting member 212. This installation method achieves a high degree of integration, and the rolling element 213 rotates synchronously with the plating pot 211, meaning that the rolling element 213 drives the plating pot 211 to rotate synchronously during its rotation. In other alternative embodiments, the rolling element 213, the plating pot 211, and the first connecting member 212 can be connected in a separate manner. For example, the rolling element 213 can be installed on the first connecting member 212 via a connecting component, and the plating pot 211 can be installed on the first connecting member 212 via another connecting component. The installation method can be adaptively adjusted based on actual needs.

[0112] Please refer to Figure 6 As shown, in this embodiment, the track unit 40 further includes a second connector 42 connected to the annular body 41. The second connector 42 is used to connect the annular body 41 to a stationary part of the coating equipment, such as to the inner wall of the process cavity of the coating equipment, so that the annular body 41 and the substrate 10 are positioned relative to each other along the direction of the reference axis a.

[0113] like Figure 6 As shown, the second connector 42 has an approximately Z-shaped linkage structure, with one end connected to the annular body 41 and the other end connected to the inner wall of the process cavity to fix the second connector 42. In addition, the power connection unit 50 has a rocker arm structure, with one end connected to the base 10 and the other end serving as the power end, coaxially arranged with the central axis (reference axis a) of the base 10. This power end is used to connect to an external power source, on the one hand to drive the base 10 to rotate around its own central axis, and on the other hand to support and connect the base 10, so that the base 10 is positioned in the axial direction of the reference axis a.

[0114] In this embodiment, the second connector 42 has an approximately Z-shaped linkage structure, which facilitates adjustment of the connection positions at both ends, making the connection more flexible. In other alternative embodiments, the second connector 42 can be configured as a straight rod structure or other structures.

[0115] In summary, the plating pot apparatus includes: a substrate, a plating pot unit, and a shielding unit; the plating pot unit includes multiple plating pot components, which are disposed on the substrate, and each of the plating pot components is arranged around a reference axis; the shielding unit includes a shielding member, which is disposed on the substrate; in the circumferential direction around the reference axis, at least a portion of the gap between adjacent plating pot components is shielded by at least one of the shielding members.

[0116] With this configuration, the shielding component in this invention can prevent evaporated atoms or molecules from escaping between adjacent plating pot components. On the one hand, this can improve the phenomenon of material adhering to the top of the inner wall of the process chamber, and on the other hand, it can help to block the evaporated atoms or molecules on the evaporation surface side of the plating pot component. Figure 1 Below the plating pan assembly, the proportion of atoms or molecules in contact with the substrate on the plating pan assembly is increased, improving material utilization and thus reducing coating costs. Furthermore, the shielding element causes some atoms or molecules that would otherwise escape to adhere to it, facilitating cleaning and raw material recycling, further improving raw material utilization and reducing coating costs.

[0117] In addition, this embodiment also provides a coating device, which includes the coating pot device described above.

[0118] In addition, the coating equipment also includes an electron gun, a process chamber, and a crucible. The electron gun generates a high-energy electron beam, which, through precise control of electric and magnetic fields, is guided and accelerated to impact the target material inside the crucible, converting its energy into heat energy. This rapidly heats the material to its evaporation temperature, and the evaporated atoms or molecules fly to the substrate surface on the coating pot in the vacuum environment of the process chamber, where they condense to form a thin film. The difference between the coating equipment in this embodiment and existing coating equipment lies in the structure of the aforementioned coating pot device; the remaining structure is consistent with existing structures and will not be described further here.

[0119] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0120] The above description is only a description of the preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. A plating pot apparatus, characterized in that, include: Substrate, plating pot unit, and shielding unit; The plating pot unit includes multiple plating pot components, which are disposed on the substrate and arranged around a reference axis. The shielding unit includes a shielding member, which is disposed on the substrate; In the circumferential direction about the reference axis, at least a portion of the gap between adjacent plating pot assemblies is blocked by at least one of the shielding members.

2. The plating pot apparatus as described in claim 1, characterized in that, The plating pot unit includes n plating pot components, where n is an integer greater than 3.

3. The plating pot apparatus as described in claim 1, characterized in that, The plating pot assembly includes a plating pot, and the shielding member shields the gap between two adjacent plating pots along the circumferential direction.

4. The plating pot apparatus as described in claim 3, characterized in that, The plating pot has a vapor deposition surface on one side along the reference axis; Along the direction of the reference axis, the shielding member is located on the side of the plating pot away from the vapor deposition surface.

5. The plating pot apparatus as described in claim 3, characterized in that, The plating pot assembly also includes a first connector; The first connector includes a first connecting part and a second connecting part that are connected to each other, and the first connecting part and the second connecting part are arranged at an included angle. The first connecting part is connected to the substrate, and the second connecting part is connected to the plating pot.

6. The plating pot apparatus as described in claim 3, characterized in that, The plating pot assembly also includes a rolling element, which is rotatably connected to the plating pot. The plating pot device further includes a track unit, which includes a circular ring. The central axis of the circular ring is collinear with the reference axis, and the rolling element rolls in cooperation with the circular ring along its circumferential direction.

7. The plating pot apparatus as described in claim 6, characterized in that, Projection along the direction of the reference axis, a portion of the plating pot is located outside the annulus. And / or, the blocking element is located on one side of the annulus along the direction of the reference axis; And / or, the annulus and the base are arranged along the direction of the reference axis; And / or, the substrate is annular, and the substrate and the annular body are coaxially arranged.

8. The plating pot apparatus as described in claim 6, characterized in that, The track unit further includes a second connector connected to the annular body. The second connector is used to connect the annular body to a stationary part of the coating equipment, so that the annular body and the substrate are positioned relative to each other along the direction of the reference axis.

9. The plating pot apparatus as described in claim 1, characterized in that, The plating pot device also includes a power connection unit, which is connected to the substrate and is used to connect to a power source to drive the substrate to rotate about the reference axis.

10. A coating apparatus, characterized in that, The coating equipment includes the coating pot apparatus according to any one of claims 1 to 9.

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