Surface copper thickness detection device for PCB substrate copper foil

Abstract

The utility model relates to the technical field of surface copper thickness online detection, and particularly discloses a surface copper thickness detection device of a PCB substrate copper foil. The surface copper thickness detection device comprises a carrying table for placing a PCB substrate to be detected, wherein the carrying table is connected with a circulating conveying line; downward pressing pieces are arranged on the two sides of the carrying table; supports are arranged on the two sides of the circulating conveying line, a lifting frame is connected between the two supports in an up-down sliding mode, the lifting frame is located above the circulating conveying line, and a plurality of copper thickness detection heads are arranged on the lifting frame at intervals; the two ends of the lifting frame are connected with curved-surface blocks correspondingly, and the bottom faces of the curved-surface blocks are connected with the supports through elastic assemblies. And the pressing piece can be in sliding or rolling contact with the curved surface block on the same side to push the curved surface block to move downwards, so that the copper thickness detection head is in contact with the upper surface of the PCB substrate carried by the carrying table. The surface copper thickness detection device of the PCB substrate copper foil can improve the surface copper thickness detection efficiency.

Description

Technical Field

[0001] This utility model relates to the field of online detection technology of copper foil thickness, and in particular to a device for detecting the copper foil thickness of PCB substrate. Background Technology

[0002] Existing online copper thickness measurement devices are generally positioned above the PCB substrate conveyor line and include a copper thickness measuring head and a lifting cylinder that drives the measuring head up and down. In use, the PCB substrate conveyor line transports the PCB substrate to be inspected to the inspection position; the lifting cylinder drives the copper thickness measuring head downwards, bringing it into contact with the PCB substrate surface; after inspection, the PCB substrate conveyor line continues to transport the PCB substrate forward. However, because the PCB substrate needs to pause at the measurement position, the inspection efficiency is relatively low. Summary of the Invention

[0003] The purpose of this invention is to provide a device for detecting the surface copper thickness of copper foil on a PCB substrate, which can improve the efficiency of surface copper thickness detection.

[0004] To achieve this objective, the present invention adopts the following technical solution:

[0005] A device for detecting the surface copper thickness of copper foil on a PCB substrate includes a platform for placing the PCB substrate to be tested, the platform being connected to a circulating conveyor line; and pressing members are provided on both sides of the platform.

[0006] Supports are provided on both sides of the circulating conveyor line, and a lifting frame is slidably connected between the two supports. The lifting frame is located above the circulating conveyor line, and several copper thickness detection heads are spaced apart on the lifting frame.

[0007] Curved blocks are connected to both ends of the lifting frame. The bottom surface of the curved blocks is connected to the support through an elastic component. The pressing component can slide or roll in contact with the curved blocks located on the same side to push the curved blocks downward, thereby making the copper thickness detection head contact the upper surface of the PCB substrate supported by the platform.

[0008] Furthermore, the top surface of the curved block is provided with an arc-shaped surface that is high in the middle and low at both ends; and the height difference of the arc-shaped surface is equal to the height distance between the copper thickness detection head and the detection point of the PCB substrate.

[0009] Furthermore, the elastic component includes two springs symmetrically arranged with respect to the center of the curved block. A guide rod is provided inside the spring. One end of the guide rod is connected to the curved block, and the other end is movably disposed in a guide hole opened in the support and connected to a limit nut.

[0010] Furthermore, the mounting position of the pressing member on the platform is adjustable along the PCB substrate conveying direction.

[0011] Furthermore, the pressing component is a roller rotatably mounted on the platform.

[0012] Furthermore, the top surface array of the stage has several vacuum adsorption holes.

[0013] Furthermore, the mounting position of each copper thickness detection head on the lifting frame is adjustable along the vertical PCB substrate conveying direction.

[0014] The beneficial effects of this utility model are as follows: The copper thickness detection device for PCB substrate copper foil of this utility model uses a platform to support the PCB substrate to be tested. A circulating conveyor line transports the platform carrying the PCB substrate toward the detection position, so that the pressing component enters the arc surface of the curved block and slides or rolls along the arc surface, thereby causing the curved block to move downward first and then upward, while driving the lifting frame and each copper thickness detection head to move together. When the curved block moves to the lowest point, each copper thickness detection head contacts the upper surface of the PCB substrate to perform the copper thickness detection. The entire copper thickness detection process does not require interruption, thereby improving the detection efficiency of copper thickness. Attached Figure Description

[0015] Fig. 1 This is a schematic diagram of the structure of a PCB substrate copper foil surface copper thickness detection device provided by this utility model.

[0016] Fig. 2 This is a schematic diagram of the platform structure.

[0017] Fig. 3 This is a structural schematic diagram of the curved block and elastic components. Detailed Implementation

[0018] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0019] like Figs. 1 to 3As shown, a copper thickness detection device for a PCB substrate includes a platform 1 for placing a PCB substrate 10 to be tested, the platform 1 being connected to a circulating conveyor line 2; pressing members 3 are provided on both sides of the platform 1; supports 4 are provided on both sides of the circulating conveyor line 2, and a lifting frame 5 is slidably connected between the two supports 4, the lifting frame 5 being located above the circulating conveyor line 2, and a plurality of copper thickness detection heads 6 are spaced apart on the lifting frame 5; curved blocks 7 are respectively connected to both ends of the lifting frame 5, and the bottom surface of the curved blocks 7 is connected to the supports 4 through an elastic component 8; the pressing members 3 can slide or roll in contact with the curved blocks 7 located on the same side to push the curved blocks 7 downward, thereby making the copper thickness detection heads 6 contact the upper surface of the PCB substrate 10 supported by the platform 1.

[0020] Specifically, in this embodiment, as follows: Fig. 2 As shown, the top surface of the stage 1 has an array of vacuum adsorption holes 11. During the movement of the stage 1 along the circulating conveyor line 2, the PCB substrate 10 is adsorbed and fixed through each vacuum adsorption hole 11, thereby preventing the PCB substrate 10 from moving during the detection process. The circulating conveyor line 2 can be a chain conveyor line, and the stage 1 is connected to the chain of the chain conveyor line.

[0021] In this embodiment, the mounting position of each copper thickness detection head 6 on the lifting frame 5 is adjustable along the vertical PCB substrate conveying direction. The lifting frame 5 is equipped with a slide rail along its length, and each copper thickness detection head 6 is connected to a detection head bracket 61. The detection head bracket 61 is slidably connected to the slide rail and locked to the lifting frame 5 by locking screws. In use, the detection position is adjusted by adjusting the mounting position of the detection head bracket 61 on the lifting frame 5.

[0022] To prevent damage to the probe of the copper thickness detection head 6 during the detection process, a movable plate can be installed on the detection head bracket 61, and the movable plate is connected to the detection head bracket 61 by a set of springs; the copper thickness detection head 6 is mounted on the movable plate.

[0023] like Fig. 3 As shown, the top surface of the curved block 7 is provided with an arc-shaped surface 71 that is high in the middle and low at both ends; preferably, the height difference of the arc-shaped surface 71 is equal to the height distance between the copper thickness detection head 6 and the detection point of the PCB substrate.

[0024] like Fig. 3 As shown, the elastic component 8 includes two springs 81 arranged symmetrically with respect to the center of the curved block 7. A guide rod 82 is provided inside the spring 81. One end of the guide rod 82 is connected to the curved block 7, and the other end of the guide rod 82 is movably disposed in the guide hole opened in the support 4 and connected to a limit nut.

[0025] During the sliding or rolling contact between the pressing member 3 and the curved block 7 located on the same side, the curved block 7 first moves downward against the elastic force of the spring 81, and then moves upward to reset under the elastic force of the spring 81. When the pressing member 3 slides or rolls to the highest point in the middle of the arc surface 71 of the curved block 7, each copper thickness detection head 6 contacts the upper surface of the PCB substrate to detect the surface copper thickness. During the detection process, the PCB substrate 10 does not need to stop at the detection position, thereby improving the efficiency of surface copper thickness detection.

[0026] In this embodiment, the mounting position of the pressing member 3 on the stage 1 is adjustable along the PCB substrate conveying direction. Preferably, the pressing member 3 is a roller rotatably mounted on the stage 1. Further, the roller is rotatably connected to a roller frame, which is connected to two locking screws; the side of the stage 1 has a plurality of mounting holes spaced apart along the PCB substrate conveying direction, and the two locking screws are screwed into two of these mounting holes.

[0027] This invention discloses a device for detecting the surface copper thickness of a PCB substrate. In use, the PCB substrate 10 to be tested is placed on a stage 1 and fixed by vacuum adsorption holes 11. A circulating conveyor line 2 transports the stage 1 carrying the PCB substrate 10 toward the detection position. A pressing member 3 enters the arc-shaped surface 71 of a curved block 7 and rolls along the arc-shaped surface 71, causing the curved block 7 to move downwards and then upwards, driving the lifting frame 5 and each copper thickness detection head 6 to move together. When the curved block 7 reaches its lowest point, each copper thickness detection head 6 contacts the upper surface of the PCB substrate 10 to detect the surface copper thickness. The PCB substrate 10 does not need to stop during the entire detection process, thus improving the efficiency of surface copper thickness detection.

[0028] The technical principles of this utility model have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this utility model and should not be construed as limiting the scope of protection of this utility model in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this utility model without any inventive effort, and these embodiments will all fall within the scope of protection of this utility model.

Claims

1. A device for detecting the surface copper thickness of copper foil on a PCB substrate, characterized in that, It includes a stage (1) for placing a PCB substrate (10) to be tested, the stage (1) being connected to a circulating conveyor line (2); and pressing members (3) are provided on both sides of the stage (1). Supports (4) are provided on both sides of the circulating conveyor line (2), and a lifting frame (5) is slidably connected between the two supports (4). The lifting frame (5) is located above the circulating conveyor line (2), and several copper thickness detection heads (6) are provided at intervals on the lifting frame (5). The lifting frame (5) is connected to curved blocks (7) at both ends. The bottom surface of the curved block (7) is connected to the support (4) through an elastic component (8). The pressing member (3) can slide or roll in contact with the curved block (7) located on the same side to push the curved block (7) to move downward, so that the copper thickness detection head (6) contacts the upper surface of the PCB substrate (10) carried by the platform (1).

2. The PCB substrate copper foil surface copper thickness detection device according to claim 1, characterized in that, The top surface of the curved block (7) is provided with an arc-shaped surface (71) that is high in the middle and low at both ends; and the height difference of the arc-shaped surface (71) is equal to the height distance between the copper thickness detection head (6) and the detection point of the PCB substrate.

3. The PCB substrate copper foil surface copper thickness detection device according to claim 1, characterized in that, The elastic component (8) includes two springs (81) arranged symmetrically with respect to the center of the curved block (7). A guide rod (82) is provided inside the spring (81). One end of the guide rod (82) is connected to the curved block (7), and the other end is movably disposed in the guide hole opened in the support (4) and connected to a limit nut.

4. The PCB substrate copper foil surface copper thickness detection device according to claim 1, characterized in that, The mounting position of the pressing component (3) on the platform (1) is adjustable along the PCB substrate conveying direction.

5. A device for detecting the surface copper thickness of a PCB substrate copper foil according to claim 1 or 4, characterized in that, The pressing component (3) is a roller that is rotatably mounted on the platform (1).

6. The PCB substrate copper foil surface copper thickness detection device according to claim 1, characterized in that, The top surface of the stage (1) is arrayed with several vacuum adsorption holes (11).

7. The PCB substrate copper foil surface copper thickness detection device according to claim 1, characterized in that, The mounting position of each copper thickness detection head (6) on the lifting frame (5) is adjustable along the vertical PCB substrate conveying direction.

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