A multi-layer circuit board with inner layer interconnection and its inner layer interconnection structure
By designing an inner interconnect structure, the multilayer circuit board can be automatically aligned before lamination, solving the problem of time-consuming alignment that requires external force in existing technologies and improving assembly efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN XINRUIXIN ELECTRONICS CO LTD
- Filing Date
- 2025-08-19
- Publication Date
- 2026-07-07
AI Technical Summary
Existing multilayer circuit boards require external force for alignment before lamination, which results in operators spending a lot of time.
It adopts an inner layer interconnection structure, including an outer layer board and an inner layer board. The inner layer board is set inside the outer layer board. The through-hole surface has copper foil. The connecting piece is combined with the sliding block and the fixing pin, and the reset mechanism, etc., to realize automatic alignment and assembly.
This reduces the time operators spend adjusting the outer and inner layers, decreases the number of times alignment is achieved with external force, and improves assembly efficiency.
Smart Images
Figure CN224473485U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board technology, and in particular to a multilayer circuit board with inner layer interconnection and its inner layer interconnection structure. Background Technology
[0002] Multilayer circuit boards refer to double-sided or multi-sided circuit boards with conventional buried vias, blind vias, and through vias. In order to achieve more complex circuit designs, HDI circuit boards are mostly designed as multilayer boards, so that the interconnection between the circuit layers can meet the higher requirements of the circuit design.
[0003] Existing multilayer circuit boards are divided into inner and outer layers. The stacked circuit boards are pressed together by a laminating equipment. However, before lamination, the multilayer circuit boards need to be aligned by external equipment, which consumes a lot of time for operators.
[0004] The aforementioned multi-layer circuit boards require external force for alignment before lamination, which consumes a significant amount of alignment time for operators, thus reducing the effectiveness of the device. Utility Model Content
[0005] The purpose of this invention is to provide a multilayer circuit board with internal interconnection and its internal interconnection structure, which solves the problem that the multilayer circuit board needs to be aligned with external force before lamination, resulting in a lot of alignment time for operators.
[0006] To achieve this objective, the present invention adopts the following technical solution: a multilayer circuit board with inner layer interconnection and its inner layer interconnection structure, wherein the inner layer interconnection structure is applied to the circuit board, the circuit board includes an outer layer board and an inner layer board, the inner layer board is disposed on the inner side of two sets of the outer layer boards, and through holes are opened in the interior of both the outer layer board and the inner layer board. Copper foil is disposed on the outer surface of the through holes, and a first connecting piece is also included. A second connecting piece is installed on the inner side of the two sets of the first connecting pieces. The outer side of the second connecting piece is slidably connected to the inner layer board located at the top and the inner layer board located in the middle, and a reset mechanism is provided between the outer layer board and the inner layer board for automatic alignment during the assembly of the outer layer board and the inner layer board.
[0007] As a preferred embodiment of the inner layer interconnection structure described in this utility model, in order to prevent misalignment between the inner layer plate located at the top and the inner layer plate located in the middle, the outer side of the second connecting piece is slidably connected to the upper layer block, and the lower surface of the second connecting piece is threaded through a first fixing pin, the first fixing pin being threaded through the inner end of the second connecting piece and threaded through the interior of the upper layer block.
[0008] As a preferred embodiment of the inner interconnection structure of this utility model, in order to facilitate the operator to assemble the device, the outer side of the second connecting piece is slidably connected to the lower block, the upper surface of the second connecting piece is threaded through a second fixing pin, and one end of the second fixing pin is threaded through the interior of the lower block.
[0009] In a preferred embodiment of the inner interconnection structure described in this utility model, in order to make the outer layer plate located at the top and the inner layer plate located at the top fit together more closely, a plug-in post is provided inside the inner layer plate located at the top, and the top end of the plug-in post is installed on the lower surface of the outer layer plate located at the top.
[0010] As a preferred embodiment of the inner layer interconnection structure described in this utility model, in order to better coordinate the positions between the three sets of inner layer plates, a positioning rod is inserted through the interior of the bottom inner layer plate, and the top end of the positioning rod is inserted through the inner layer plate located in the middle.
[0011] As a preferred embodiment of the inner layer interconnection structure described in this utility model, in order to prevent loosening during the pressing process of the inner layer plate and the outer layer plate, positioning pieces are slidably connected inside the inner layer plate located in the middle and the inner layer plate located at the bottom.
[0012] In a preferred embodiment of the inner interconnection structure described in this utility model, in order to strengthen the connection between the positioning pieces and the positioning rods, positioning posts are installed on the inner sides of the two sets of positioning pieces, and the positioning posts pass through the positioning rods.
[0013] In a preferred embodiment of the inner layer interconnection structure described in this utility model, in order to prevent misalignment when the inner layer plates at the bottom are connected, the reset mechanism includes a reset plate, a reset post, and a reset groove. The reset plate is slidably connected to the interior of the outer layer plate at the bottom. The reset post is installed on the upper surface of the reset plate. The reset groove is opened on the lower surface of the inner layer plate at the bottom. The outer surface of the reset post is slidably connected to the reset groove.
[0014] In a preferred embodiment of the inner interconnection structure described in this utility model, in order to prevent the reset plate from becoming loose during use, the bottom end of the positioning rod passes through the interior of the reset plate.
[0015] A multilayer circuit board with inner layer interconnects, comprising an inner layer interconnect structure as described in any of the above embodiments.
[0016] Compared with the prior art, the present invention has the following beneficial effects:
[0017] 1. In this utility model, by placing the inner layer plate located at the bottom on the outer layer plate located at the bottom, and manipulating the reset plate to slide along the outer layer plate located at the bottom, the reset post slides into the reset groove. Compared with the prior art of aligning multilayer circuit boards through external equipment, this device can automatically align during the assembly process, shortening the time required for operators to adjust the outer and inner layer plates.
[0018] 2. In this utility model, by manipulating the first connecting piece to put the second connecting piece into the inner layer plate, the upper layer block slides into the inner layer plate located at the top, and the lower layer block slides into the inner layer plate located in the middle. Compared with the prior art which uses external force to align the circuit board, this device can be assembled through the connection between the upper and lower blocks and the inner layer plate, reducing the number of times operators need to use external force to align the outer and inner layer plates after stacking them. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and purposes that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.
[0021] Figure 1 This is a schematic diagram of the overall structure of a multilayer circuit board with inner layer interconnection and its inner layer interconnection structure.
[0022] Figure 2 This is a vertical sectional view of a multilayer circuit board with inner layer interconnection and its overall inner layer interconnection structure.
[0023] Figure 3 This is an exploded view of a multilayer circuit board with inner layer interconnection and the inner layer board located at the top of the inner layer interconnection structure.
[0024] Figure 4 This is an exploded view of a multilayer circuit board with internal interconnection and the inner layer board and positioning rod mating structure located at the bottom of the internal interconnection structure.
[0025] Figure 5 This is an exploded view of a multilayer circuit board with internal interconnects and the outer layer board and reset board located at the bottom of the internal interconnect structure.
[0026] Figure 6 A multilayer circuit board with inner layer interconnection and the inner layer interconnection structure thereof. Figure 3 Enlarged schematic diagram of the structure at point A in the middle.
[0027] Figure 7 A multilayer circuit board with inner layer interconnection and the inner layer interconnection structure thereof. Figure 4 Enlarged schematic diagram of the structure at point B.
[0028] Illustration: 1. Outer layer plate; 2. Inner layer plate; 3. Through hole; 4. Copper foil; 5. Insertion post; 6. First connecting piece; 7. Second connecting piece; 8. Upper layer block; 9. First fixing pin; 10. Lower layer block; 11. Second fixing pin; 12. Positioning rod; 13. Positioning piece; 14. Positioning post; 15. Reset plate; 16. Reset post; 17. Reset groove. Detailed Implementation
[0029] To make the utility model's objectives, features, and advantages more apparent and understandable, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.
[0030] In the description of this utility model, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component centrally located at the same time.
[0031] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.
[0032] like Figures 1-7 As shown, this utility model embodiment provides a multilayer circuit board with inner layer interconnection and its inner layer interconnection structure, wherein the inner layer interconnection structure is applied to the circuit board, such as... Figure 1 and Figure 2As shown, the circuit board includes an outer layer board 1 and an inner layer board 2. The inner layer board 2 is disposed on the inner side of the two sets of outer layer boards 1. The outer layer boards 1 are divided into two groups: top and bottom. The inner layer boards 2 are divided into three groups: top, middle, and bottom. Both the outer layer boards 1 and the inner layer boards 2 have through holes 3 inside. Copper foil 4 is disposed on the outer surface of the through holes 3. It should be noted that the thickness of the outer layer boards 1 and the inner layer boards 2 in reality is less than [a certain value]. Figure 1 and Figure 2 The thickness is specified, and a reset mechanism is provided between the outer layer 1 and the inner layer 2 for automatic alignment during the assembly process of the outer layer 1 and the inner layer 2;
[0033] like Figure 6 As shown, the inner interconnection structure also includes a first connecting piece 6. The inner sides of the two sets of first connecting pieces 6 are equipped with second connecting pieces 7. The outer sides of the second connecting pieces 7 are slidably connected to the inner plate 2 located at the top and the inner plate 2 located in the middle. The outer sides of the second connecting pieces 7 are slidably connected to the upper block 8. The lower surface of the second connecting pieces 7 is threaded through a first fixing pin 9. One end of the first fixing pin 9, which is threaded through the second connecting pieces 7, is threaded inside the upper block 8. The outer side of the second connecting pieces 7 is slidably connected to a lower block 10. The upper surface of the second connecting pieces 7 is threaded through a second fixing pin 11. One end of the second fixing pin 11, which is threaded through the second connecting pieces 7, is threaded inside the lower block 10. Before the operator places the first connecting pieces 6 and the second connecting pieces 7, the upper block 8 and the lower block 10 need to be fixed on the second connecting pieces 7.
[0034] like Figure 3 As shown, a plug-in post 5 is inserted inside the inner layer plate 2 located at the top. The top of the plug-in post 5 is installed on the lower surface of the outer layer plate 1 located at the top. A plug-in hole is opened on the upper surface of the inner layer plate 2 located at the top, and the plug-in post 5 is inserted into the plug-in hole.
[0035] like Figure 7 As shown, a positioning rod 12 passes through the interior of the bottom inner layer plate 2. The top end of the positioning rod 12 passes through the middle inner layer plate 2. Positioning pieces 13 are slidably connected to the interior of the middle inner layer plate 2 and the bottom inner layer plate 2. Positioning posts 14 are installed on the inner sides of the two sets of positioning pieces 13. The positioning posts 14 pass through the positioning rod 12. The reset mechanism includes a reset plate 15, a reset post 16, and a reset groove 17. The reset plate 15 is slidably connected to the interior of the bottom outer layer plate 1. The reset post 16 is installed on the upper surface of the reset plate 15. The reset groove 17 is opened on the lower surface of the bottom inner layer plate 2. The outer surface of the reset post 16 is slidably connected to the reset groove 17. The reset post 16 can push the bottom inner layer plate 2 to reset through the reset groove 17. The bottom end of the positioning rod 12 passes through the interior of the reset plate 15.
[0036] It should be noted that when assembling this device, it needs to be connected sequentially from bottom to top. The holes or slots inside the inner layer plate 2 have corresponding structures for connection. The front and back sides need to be adjusted during installation.
[0037] It should also be noted that a multilayer circuit board with inner layer interconnects includes an inner layer interconnect structure as described in any of the above-mentioned solutions.
[0038] The working principle is as follows: the outer layer plate 1 at the bottom is placed on the worktable, and the inner layer plate 2 at the bottom is placed on the upper surface of the outer layer plate 1 at the bottom. The reset plate 15 is manipulated to slide along the outer layer plate 1 at the bottom, so that the reset pin 16 enters the reset groove 17. The reset plate 15 moves inward, which drives the reset pin 16 to move inward. This inward movement is centered on the outer layer plate 1 at the bottom. The inward movement of the reset pin 16 through the reset groove 17 pushes the inner layer plate 2 at the bottom to reset, so that the inner layer plate 2 at the bottom is aligned with the outer layer plate 1 at the bottom.
[0039] The positioning rod 12 passes through the interior of the bottom inner plate 2. The bottom end of the positioning rod 12 passes through the interior of the bottom inner plate 2 and is inserted into the reset plate 15 to fix the reset plate 15. The middle inner plate 2 is placed on the upper surface of the bottom inner plate 2 so that the top end of the positioning rod 12 passes through the middle inner plate 2. The positioning piece 13 slides along the middle inner plate 2 and the bottom inner plate 2 so that the positioning piece 13 contacts the outer surface of the positioning rod 12. The positioning post 14 is inserted into the positioning rod 12.
[0040] Manipulate the upper block 8 to slide into the outer side of the second connecting piece 7, manipulate the lower block 10 to slide into the outer side of the second connecting piece 7, manipulate the first fixing pin 9 to pass through the second connecting piece 7 and insert it into the upper block 8, then tighten the first fixing pin 9 clockwise to fix the upper block 8 to the side of the second connecting piece 7, manipulate the second fixing pin 11 to pass through the second connecting piece 7 and insert it into the lower block 10, then rotate the second fixing pin 11 clockwise to fix the lower block 10 to the side of the second connecting piece 7;
[0041] Manipulate the first connecting piece 6 to place the second connecting piece 7 into the inner layer plate 2 located in the middle, so that the lower layer block 10 slides into the inner layer plate 2 located in the middle. Manipulate the inner layer plate 2 located at the top to place on the upper surface of the inner layer plate 2 located in the middle, so that the upper layer block 8 slides in along the inner layer plate 2 located at the top.
[0042] Manipulate the outer layer 1 located at the top to move directly above the inner layer 2 located at the top. Manipulate the outer layer 1 located at the top to move downward, causing the insertion post 5 to move downward. The insertion post 5 moves downward and inserts into the inner layer 2 located at the top. The outer layer 1 located at the top contacts the upper surface of the inner layer 2 located at the top, completing the assembly. Then, the entire device is pressed together by an external pressing device.
[0043] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.
Claims
1. An inner layer interconnect structure applied to a circuit board, the circuit board comprising an outer layer board (1) and an inner layer board (2), the inner layer board (2) being disposed on the inner surfaces of two sets of the outer layer boards (1), and through holes (3) being provided inside both the outer layer boards (1) and the inner layer boards (2), the outer surface of the through holes (3) being provided with copper foil (4), characterized in that, It also includes a first connecting piece (6), and a second connecting piece (7) is installed on the inner side of the two sets of the first connecting pieces (6). The outer side of the second connecting piece (7) is slidably connected to the inner layer plate (2) located at the top and the inner layer plate (2) located in the middle. A reset mechanism is provided between the outer layer plate (1) and the inner layer plate (2) for automatic alignment during the assembly of the outer layer plate (1) and the inner layer plate (2).
2. The inner layer interconnect structure as described in claim 1, characterized in that: The outer side of the second connecting piece (7) is slidably connected to the upper block (8), and the lower surface of the second connecting piece (7) is threaded through the first fixing pin (9). The first fixing pin (9) is threaded through the second connecting piece (7) and one end is threaded through the upper block (8).
3. The inner layer interconnect structure as described in claim 2, characterized in that: The outer side of the second connecting piece (7) is slidably connected to the lower block (10). The upper surface of the second connecting piece (7) is threaded with a second fixing pin (11). One end of the second fixing pin (11) is threaded through the second connecting piece (7) and threaded inside the lower block (10).
4. The inner layer interconnect structure as described in claim 1, characterized in that: A plug-in post (5) is inserted inside the inner layer plate (2) located at the top, and the top end of the plug-in post (5) is installed on the lower surface of the outer layer plate (1) located at the top.
5. An inner layer interconnect structure as described in claim 1, characterized in that: A positioning rod (12) is inserted through the interior of the inner layer plate (2) located at the bottom, and the top end of the positioning rod (12) is inserted through the inner layer plate (2) located in the middle.
6. The inner layer interconnect structure as described in claim 5, characterized in that: Positioning pieces (13) are slidably connected inside the inner layer plate (2) located in the middle and the inner layer plate (2) located at the bottom.
7. An inner layer interconnect structure as described in claim 6, characterized in that: Positioning pins (14) are installed on the inner sides of the two sets of positioning plates (13), and the positioning pins (14) are inserted into the positioning rods (12).
8. An inner layer interconnect structure as described in claim 7, characterized in that: The reset mechanism includes a reset plate (15), a reset post (16), and a reset groove (17): A reset plate (15) is slidably connected to the interior of the outer layer plate (1) located at the bottom, and a reset post (16) is installed on the upper surface of the reset plate (15). The reset groove (17) is located on the lower surface of the inner layer plate (2) at the bottom, and the outer surface of the reset post (16) is slidably connected to the reset groove (17).
9. An inner layer interconnect structure as described in claim 8, characterized in that: The bottom end of the positioning rod (12) passes through the interior of the reset plate (15).
10. A multilayer circuit board with inner layer interconnections, characterized in that, Includes an inner interconnect structure as described in any one of claims 1-9.