Chip defect detection device
By designing a chip defect detection device with a flip positioning component and a vision inspection component, the problem of only being able to detect one side in the existing technology is solved. This enables the chip to be quickly flipped and inspected on both sides in the same device, thus improving the detection efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-25
- Publication Date
- 2026-04-07
AI Technical Summary
Existing chip defect detection devices can only inspect one side of the chip, requiring the chip to be flipped over to inspect the other side, resulting in low detection efficiency.
A chip defect detection device including a vision inspection component and a flip positioning component was designed. The positioning plate is rotated 180° by a rotary motor to realize the flip detection of the chip in the positioning hole. The use of telescopic rod and clamping plate ensures improved detection efficiency.
It enables rapid flipping and inspection of both sides of the chip within the same device, improving inspection efficiency and making it suitable for high-efficiency defect inspection of large batches of chips.
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Figure CN224095721U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to chip technical field, concretely relates to a chip defect detection device. BACKGROUND
[0002] When detecting the chip defects, the number of faces to be detected depends on the specific requirements of detection and the type of chip. Generally speaking, chip defect detection mainly involves the following several faces: the front face of the chip, which is its main functional face, usually containing circuits and various microstructures. The defect detection of the front face is the core part of chip detection, because these defects directly affect the performance and reliability of the chip; the back face of the chip, in some cases, the back face of the chip also needs to be detected, and the defects that may exist on the back face include scratches, contamination, cracks, etc. These defects may affect the heat dissipation performance or mechanical stability of the chip.
[0003] Therefore, there are many defect detection devices in the prior art, such as the chip surface defect detection device with patent number CN202320502648.3, which includes a detection box, a mounting base, a moving table, a positioning frame, a transmission beam, a transmission crankshaft, a transmission worm gear, a driving mechanism and a transmission mechanism. The detection box is installed on the mounting base, and the moving table is slidably installed in the detection box slot cavity. In this prior art, the chip is placed in the positioning frame before detection, and the other side of the chip is in contact with the ground of the positioning frame at this time, which cannot be detected. That is, in the prior art, the detection device can usually only detect one side of the chip, and when the other side of the chip needs to be detected, the chip needs to be taken out, turned over and then placed for detection again. Obviously, this method greatly reduces the chip defect detection efficiency. UTILITY MODEL CONTENTS
[0004] Therefore, the utility model aims to provide a chip defect detection device to improve the detection efficiency of chip defects.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:
[0006] A chip defect detection device includes a visual inspection component and a flip positioning component. The visual inspection component is disposed above the flip positioning component. The flip positioning component includes a positioning plate with several rows of positioning holes on the positioning plate. Each row of positioning holes includes several positioning holes. Slide plates are provided on the surface of the positioning plate at both ends of the positioning holes. Several rectangular slots are arranged side by side on the slide plates. The length of the rectangular slots matches the length of the positioning hole groups, and the width of the rectangular slots matches the diameter of the positioning holes. A connecting block is provided at one end of the slide plate, and one end of the connecting block is fixed to the slide plate. A first telescopic rod is provided at the other end of the connecting block. A fixing seat is provided on the end face of the positioning plate, and the first telescopic rod is fixed to the fixing seat. The output end of the first telescopic rod is fixedly connected to the other end of the connecting block. A rotary motor is provided on the positioning plate, and the output end of the rotary motor is connected to the positioning plate. The rotary motor is disposed opposite to the first telescopic rod.
[0007] Furthermore, it also includes a base, on which a vertical plate and an L-shaped plate are provided. One end of the vertical plate is fixed to the base, and the other end of the vertical plate is fixedly connected to a rotary motor. The visual inspection component includes a camera. One end of the L-shaped plate is fixed to the base, and the camera is disposed on the other end of the L-shaped plate.
[0008] Furthermore, a second telescopic rod is provided on the other end of the L-shaped plate. The second telescopic rod is connected to the L-shaped plate, and the output end of the second telescopic rod is connected to the camera to drive the camera to move vertically up and down.
[0009] Furthermore, a third telescopic rod is provided on the other end of the L-shaped plate. The third telescopic rod is fixed to the L-shaped plate, and a connecting plate is provided on the output end of the third telescopic rod. The second telescopic rod is fixed to the connecting plate, and the third telescopic rod is used to drive the camera to move laterally.
[0010] Furthermore, the output end of the rotary motor is provided with symmetrically arranged clamping plates and locking pins. The locking pins detachably connect the positioning plate to the two clamping plates, and the distance between the two clamping plates matches the thickness of the positioning plate.
[0011] Furthermore, each of the two slide plates has a slider at one of its four corners. One end of the slider is fixed to the slide plate, and the other end of the slider located on one side of the slide plate has a sliding rod. The slider is slidably connected to the sliding rod, and the two ends of the sliding rod have fixing blocks that connect the sliding rod to the positioning plate.
[0012] The beneficial effects of this utility model are as follows:
[0013] This technical solution, through ingenious structural design, enables the chip to be flipped and detected within the positioning holes of the same positioning plate, thereby improving the efficiency of chip defect detection.
[0014] Other advantages, objects, and features of the present application will become more apparent from the following specification when taken in conjunction with the accompanying drawings. The objects and other advantages of the present application can be realized and attained by means specified in the specification and accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS
[0015] To make the objects, technical solutions, and advantages of the present application clearer, the present application is described below with the help of the accompanying drawings:
[0016] Fig. 1 FIG. 1 is a perspective view of a chip defect detection device according to the present application;
[0017] Fig. 2 FIG. 2 is a side view of the chip defect detection device according to the present application;
[0018] Fig. 3 FIG. 3 is a perspective view of a positioning plate part of the chip defect detection device according to the present application;
[0019] Fig. 4 FIG. 4 is a perspective view of another view of the positioning plate part of the chip defect detection device according to the present application.
[0020] In the drawings, the following signs are used:
[0021] 1, base; 2, vertical plate; 3, rotating motor; 4, positioning plate; 5, positioning hole; 6, fixed block; 7, sliding rod; 8, sliding block; 9, sliding plate; 10, rectangular groove; 11, fixed seat; 12, first telescopic rod; 13, connecting block; 14, clamping plate; 15, locking pin; 16, camera; 17, second telescopic rod; 18, L-shaped plate; 19, connecting plate; 20, third telescopic rod. DETAILED DESCRIPTION
[0022] As Figs. 1-4As shown, a chip defect detection device, comprising a visual detection assembly and a flip positioning assembly, the visual detection assembly is arranged above the flip positioning assembly, the flip positioning assembly comprises a positioning plate 4, a plurality of positioning hole groups 5 are arranged on the positioning plate 4, a positioning hole group 5 comprises a plurality of positioning holes 5, a sliding plate 9 is arranged on the surface of the positioning plate 4 at both ends of the positioning hole 5, a plurality of rectangular grooves 10 are arranged side by side on the sliding plate 9, the length of the plurality of rectangular grooves 10 matches the length of the positioning hole group 5, the width of the rectangular groove 10 matches the diameter of the positioning hole 5, a connecting block 13 is arranged on one end of the sliding plate 9, one end of the connecting block 13 is fixed on the sliding plate 9, a first telescopic rod 12 (electric telescopic rod) is arranged on the other end of the connecting block 13, a fixed seat 11 is arranged on the end face of the positioning plate 4, the first telescopic rod 12 is fixed on the fixed seat 11, and the output end of the first telescopic rod 12 is fixedly connected with the other end of the connecting block 13, a rotating motor 3 is arranged on the positioning plate 4, the output end of the rotating motor 3 is connected with the positioning plate 4, and the rotating motor 3 is arranged opposite to the first telescopic rod 12.
[0023] The working principle of the above technical scheme is as follows:
[0024] Firstly, the chip to be detected is placed in each positioning hole 5, at this time the rectangular groove 10 on the sliding plate 9 close to the camera 16 should be arranged in the plurality of positioning hole groups 5, that is, it will not interfere with the shooting work of the camera 16; the rectangular groove 10 on the sliding plate 9 away from the camera 16 is located in the spacing between the adjacent positioning hole groups 5 at this time, that is, the spacing between the adjacent rectangular grooves 10 partially closes the positioning hole group 5, that is, the sliding plate 9 is used as a supporting plate at this time, that is, the chip is prevented on the sliding plate 9.
[0025] When the detection of one surface of the new chip is completed, the sliding plate 9 close to the camera 16 is moved by the first telescopic rod 12 to close the plurality of positioning hole groups 5, and then the rotating motor 3 drives the positioning plate 4 to rotate 180°, so that the chip is flipped to the upper side, and then the sliding plate 9 on the upper side is moved by the first telescopic rod 12, so that the rectangular groove 10 and the positioning hole group 5 are arranged in coincidence, so that the chip in the positioning hole 5 is exposed, and the other surface of the chip can be detected for defect.
[0026] The technical scheme ingeniously designs the structure, so that the chip can be flipped and detected in the positioning hole 5 of the positioning plate 4, thereby improving the defect detection efficiency of the chip.
[0027] It is not difficult to understand that the specific structure and principle of the visual detection assembly are prior art, and will not be described in detail here, such as should also include: image processing module, image acquisition card: responsible for receiving and transmitting image data output by the camera, and quickly transmitting it to the computer; image processing software: based on complex algorithms to analyze the collected images, extract feature information, and make decisions accordingly. Image analysis module, analysis software: further deepening after image processing, comparing it with the standard value, thereby marking the defective part. Data management module, storage device: used to store the collected image data and analysis results, for subsequent query and statistics. Control and execution module, computer: as the control center of the entire visual detection system, responsible for image storage, processing, analysis and output.
[0028] In an implementable manner, a base 1 is further included, the base 1 is provided with a vertical plate 2 and an L-shaped plate 18, one end of the vertical plate 2 is fixed on the base 1, the other end of the vertical plate 2 is fixedly connected with the rotating motor 3, the visual detection assembly includes a camera 16, one end of the L-shaped plate 18 is fixed on the base 1, and the camera 16 is arranged on the other end of the L-shaped plate 18.
[0029] In an implementable manner, a second telescopic rod 17 is arranged on the other end of the L-shaped plate 18, the second telescopic rod 17 is connected to the L-shaped plate 18, and an output end of the second telescopic rod 17 is connected to the camera 16, so as to drive the camera 16 to vertically ascend and descend, thereby the distance between the camera 16 and the chips can be adjusted, that is, the camera 16 can be adjusted to a suitable distance according to different chips, and the defect detection effect is improved.
[0030] In an implementable manner, a third telescopic rod 20 is arranged on the other end of the L-shaped plate 18, the third telescopic rod 20 is fixed to the L-shaped plate 18, a connecting plate 19 is arranged on an output end of the third telescopic rod 20, the second telescopic rod 17 is fixed to the connecting plate 19, and the third telescopic rod 20 is used to drive the camera 16 to horizontally translate, so that the camera 16 can avoid the overturning of the positioning plate 4 and also drive the camera 16 to horizontally and slowly move, and a plurality of chips can be detected, that is, this kind of arrangement is suitable for the positioning plate 4 with a large length and a plurality of chips arranged thereon, and large-batch chip detection is realized.
[0031] In an implementable mode, the output end of the rotary motor 3 is provided with symmetrically arranged clamping plates 14 and locking pins 15, the locking pins 15 detachably connect the positioning plate 4 between the two clamping plates 14, the spacing between the two clamping plates 14 matches the thickness of the positioning plate 4, the locking pins 15 and the clamping plates 14 can be threadedly connected, and the positioning plate 4 should be provided with through holes for the locking pins 15 to pass through. This arrangement facilitates the disassembly and assembly of the positioning plate 4, that is, facilitates the unloading and loading operations after the positioning plate 4 is disassembled, that is, after disassembly, the other chip-loaded positioning plate 4 can be installed on the clamping plate 14 under the action of manual or mechanical hand to realize detection, that is, this mode can further improve the detection efficiency of chip defects.
[0032] In an implementable mode, the four corners of the two sliding plates 9 are each provided with a sliding block 8, one end of the sliding block 8 is fixed to the sliding plate 9, the other end of the sliding block 8 located on one side of the sliding plate 9 is provided with a sliding rod 7, the sliding block 8 is slidingly connected to the sliding rod 7, and the two ends of the sliding rod 7 are provided with fixed blocks 6, the fixed blocks 6 connect the sliding rod 7 to the positioning plate 4. The arrangement of the sliding rod 7 and the sliding block 8 can ensure the stability of the sliding of the sliding plate 9 and avoid the problems of excessive contact gap or poor movement effect between the sliding plate 9 and the positioning plate 4.
[0033] It should be noted that the control system for controlling the coordinated movement of various components should also be included in the technical solution, such as programming through PLC, which is prior art and will not be described in detail here.
[0034] Finally, it should be noted that the above preferred embodiments are only used to illustrate the technical solutions of the present application and are not limiting. Although the present application has been described in detail through the above preferred embodiments, those skilled in the art should understand that various changes can be made in form and detail without departing from the scope defined by the claims of the present application.
Claims
1. A chip defect detection device, characterized in that: The device includes a visual inspection component and a flip positioning component. The visual inspection component is positioned above the flip positioning component. The flip positioning component includes a positioning plate with several rows of positioning holes. Each row of positioning holes includes several positioning holes. Slide plates are provided on the surfaces of the positioning plate at both ends of the positioning holes. Several rectangular slots are arranged side-by-side on the slide plates. The length of each rectangular slot matches the length of the positioning hole group, and the width of each rectangular slot matches the diameter of the positioning hole. A connecting block is provided at one end of the slide plate, and one end of the connecting block is fixed to the slide plate. A first telescopic rod is provided at the other end of the connecting block. A fixing seat is provided on the end face of the positioning plate, and the first telescopic rod is fixed to the fixing seat. The output end of the first telescopic rod is fixedly connected to the other end of the connecting block. A rotary motor is provided on the positioning plate, and the output end of the rotary motor is connected to the positioning plate. The rotary motor is positioned opposite to the first telescopic rod.
2. The chip defect detection device according to claim 1, characterized in that: It also includes a base, on which a vertical plate and an L-shaped plate are provided. One end of the vertical plate is fixed to the base, and the other end of the vertical plate is fixedly connected to a rotary motor. The visual inspection component includes a camera. One end of the L-shaped plate is fixed to the base, and the camera is set on the other end of the L-shaped plate.
3. The chip defect detection device according to claim 2, characterized in that: The other end of the L-shaped plate is provided with a second telescopic rod, which is connected to the L-shaped plate. The output end of the second telescopic rod is connected to the camera to drive the camera to move vertically up and down.
4. The chip defect detection device according to claim 3, characterized in that: A third telescopic rod is provided at the other end of the L-shaped plate. The third telescopic rod is fixed to the L-shaped plate. A connecting plate is provided at the output end of the third telescopic rod. The second telescopic rod is fixed to the connecting plate. The third telescopic rod is used to drive the camera to move laterally.
5. The chip defect detection device according to claim 1, characterized in that: The output end of the rotary motor is provided with symmetrically arranged clamping plates and locking pins. The locking pins detachably connect the positioning plate to the two clamping plates, and the distance between the two clamping plates matches the thickness of the positioning plate.
6. The chip defect detection device according to claim 1, characterized in that: Each of the two slide plates has a slider at one of its four corners. One end of the slider is fixed to the slide plate, and the other end of the slider located on one side of the slide plate has a slide rod. The slider is slidably connected to the slide rod. The two ends of the slide rod have fixing blocks, which connect the slide rod to the positioning plate.
Citation Information
Patent Citations
Chip surface defect detection device
CN219532965U