Wafer detection equipment

Abstract

The wafer detection equipment comprises a rotatable module and a supporting module, the rotatable module comprises a fixing assembly and a transmission assembly, the fixing assembly is suitable for fixing a to-be-detected wafer, and the transmission assembly is arranged on the side, away from the to-be-detected wafer, of the fixing assembly in the axial direction; one side, far away from the wafer to be detected, of the transmission assembly is uniformly distributed along the circumferential direction and is provided with at least one mounting part along the axial direction; the supporting module is suitable for supporting the rotatable module, the supporting module further comprises a through hole and a plurality of limiting grooves formed corresponding to the mounting part in the axial direction, and the through hole is suitable for containing at least one part of the transmission assembly, so that the transmission assembly is rotatably mounted on the supporting module; and the limiting groove is inserted into the mounting part, so that the rotatable module can be rotationally mounted on the supporting module at a fixed angle. Through the wafer detection equipment provided by the invention, the protection effect on the to-be-detected wafer is enhanced while the accuracy of crystal measurement is improved, the risk that the to-be-detected wafer is abraded and scraped is reduced, and the production cost is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of wafer detection, and in particular to a wafer detection device. BACKGROUND

[0002] Silicon carbide (SiC) is a material with a unique hexagonal crystal structure, whose crystal directionality is determined by the layered structure in which atoms are stacked in a hexagonal form and arranged in reverse. This structure endows silicon carbide with unique physical and chemical properties in different directions, such as hardness, thermal expansion rate, optical properties, and electrical characteristics, which vary with the direction of the crystal.

[0003] Therefore, in the production, processing and application of silicon carbide, the influence of crystal directionality on material performance is crucial. For example, there are still some errors in the measurement of the crystal direction of silicon carbide wafers. For example, after cutting, the wafer is usually measured by using an X-ray orientation instrument to locate the edge as a reference surface to measure the crystal direction of the wafer, but the risk of measurement error still exists, which affects the accurate detection of the crystal direction and further affects the performance and reliability of the devices made from the wafer.

[0004] At present, the huge application potential of silicon carbide in new energy vehicles, 5G devices and renewable energy fields requires the optimization of crystal measurement to improve the processing technology and further improve the performance. SUMMARY

[0005] One object of the present application is to provide a wafer detection device that can improve the accuracy of wafer detection and further improve the performance and reliability of devices made from the wafer to be detected.

[0006] Another object of the present application is to provide a wafer detection device that can reduce the risk of wear and tear of the wafer to be detected and further reduce production costs.

[0007] Another object of the present application is to provide a wafer detection device that can improve the convenience of detection and improve the detection rate.

[0008] To achieve the above objects, the technical solution adopted by the present application is as follows: a wafer detection device, comprising:

[0009] The rotatable module comprises a fixing assembly and a transmission assembly, the fixing assembly is adapted to fix the wafer to be detected, the transmission assembly is arranged on the side of the fixing assembly away from the wafer to be detected along the axial direction, and at least one mounting portion is uniformly distributed along the circumferential direction on the side of the transmission assembly away from the wafer to be detected and arranged along the axial direction.

[0010] The support module is adapted to support the rotatable module, and further comprises a through hole adapted to accommodate at least a part of the transmission assembly so that the transmission assembly is rotatably mounted on the support module, and a plurality of limiting grooves axially corresponding to the mounting portion, and the limiting grooves are inserted with the mounting portion so that the rotatable module is angularly rotatably mounted on the support module.

[0011] In some embodiments, the transmission assembly further comprises a transmission rod and a tool piece, the transmission rod is accommodated in the through hole, one side of the transmission rod is connected with the fixing assembly, and the other side is fixedly connected with the tool piece, and the tool piece is provided with the mounting portion on the side away from the wafer to be detected.

[0012] In some embodiments, the transmission rod is provided with a tool guide groove axially arranged and uniformly distributed in the circumferential direction on the side away from the wafer to be detected, the tool guide groove is adapted to accommodate the mounting portion so that the transmission rod is fixedly connected with the tool piece.

[0013] In some embodiments, the four limiting grooves are arranged at intervals on the circumferential side of the through hole, the support module comprises a ring-shaped rod axially arranged, the ring-shaped rod is internally provided with the through hole adapted to accommodate the transmission rod, and the ring-shaped rod is provided with the limiting grooves on the side away from the wafer to be detected, the limiting grooves are inserted with the mounting portion so that the tool piece is inserted into the ring-shaped rod.

[0014] In some embodiments, the fixing assembly is provided with a support piece axially arranged on the side away from the wafer to be detected, and the support piece is fixedly connected with the transmission rod.

[0015] In some embodiments, the support piece is provided with an assembly portion axially arranged on the side away from the wafer to be detected, and the transmission rod is provided with a support guide groove axially corresponding on the side close to the wafer to be detected, the assembly portion is adapted to extend into the support guide groove so that the support piece is fixedly connected with the transmission rod.

[0016] In some embodiments, in the rotating state, the axial distance between the end face of the support piece close to the wafer to be detected and the end face of the ring-shaped rod away from the wafer to be detected is h1, and the axial length of the ring-shaped rod is h2, wherein h1>h2, so that the transmission rod is movably mounted on the ring-shaped rod in the axial direction.

[0017] In some embodiments, the fixing assembly further comprises a fixing surface and a fixing piece, wherein the fixing surface is adapted to abut the wafer to be detected, the fixing piece is circumferentially arranged on the outer periphery of the fixing surface and is adapted to fix the wafer to be detected, and the fixing piece is provided with flannelette, or sponge, or foam material, or rubber material on the side close to the wafer to be detected.

[0018] In some embodiments, the fixing surface is provided with a positioning edge, which is coincided with the cutting edge of the wafer to be detected.

[0019] In some embodiments, the fixing assembly, the transmission rod and the tooling piece are integrally formed.

[0020] Compared with the prior art, the application has the following advantages:

[0021] (1) The wafer to be detected is rotated at a fixed angle during detection through the mounting portion provided in the rotatable module and the limiting groove in the supporting module matched with the mounting portion, which is beneficial to improve the accuracy and ease of operation of the detection link, further improve the performance and reliability of the device manufactured by using the wafer to be detected, and improve the detection rate.

[0022] (2) The fixing assembly provided in the supporting module is beneficial to reduce the risk of wear and scratch of the wafer to be detected, and further reduce the production cost. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 is a structural schematic view of a crystal detection device of some embodiments of the application.

[0024] Figure 2 is an exploded view of a crystal detection device of some embodiments of the application.

[0025] Figure 3 is a structural schematic view of a fixing assembly of some embodiments of the application.

[0026] Figure 4 is a structural schematic view of a supporting module of some embodiments of the application.

[0027] Figure 5 is a structural schematic view of a transmission rod of some embodiments of the application.

[0028] In the figure: 1, wafer detection device; 10, fixing assembly; 11, fixing piece; 12, fixing surface; 121, positioning edge; 13, supporting piece; 131, supporting rod; 132, assembly groove; 133, assembly portion; 200, transmission assembly; 20, supporting module; 21, bearing table; 220, ring rod; 22, first ring rod; 23, second ring rod; 231, through hole; 232, rod neck portion; 233, limiting protrusion; 234, limiting groove; 30, transmission rod; 31, connecting portion; 32, supporting guide groove; 33, supporting protrusion portion; 34, tooling guide groove; 35, tooling protrusion portion; 40, tooling piece; 41, main body portion; 411, mounting portion; 412, mounting groove; 42, control portion. DETAILED DESCRIPTION

[0029] The present application will be further described below with reference to specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0030] In the description of this application, it should be noted that the directional terms such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this application.

[0031] It should be noted that the terms "first," "second," etc., used in the specification and claims of this application are suitable for distinguishing similar objects, but not necessarily for describing a specific order or sequence.

[0032] The terms “comprising” and “having”, and any variations thereof, in the specification and claims of this application are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0033] To achieve the above objectives, such as Figures 1-5 As shown, this application provides a wafer inspection device 1 including: a support module 20 and a rotatable module, wherein the rotatable module is rotatably and axially movable on the support module 20, that is, the rotatable module can rotate about a rotation axis and can also be displaced along the rotation axis.

[0034] The rotatable module comprises a fixed assembly 10 and a transmission assembly 200, the fixed assembly 10 is suitable for mounting a wafer to be detected, the middle part of the transmission assembly 200 is arranged in a through hole 231 of a support module 20, the first end of the transmission assembly 200 outside the through hole 231 is connected with the fixed assembly 10, and the second end is used for rotating operation by a user. The transmission assembly 200 is circumferentially provided with at least one mounting portion 411, the support module 20 is provided with a plurality of limiting grooves 234 on the circumferential side of the through hole 231, the limiting grooves 234 are arranged at intervals, when the transmission assembly 200 moves along the rotation axis, the mounting portion 411 is suitable for being inserted into the limiting groove 234 or being separated from the limiting groove 234, when the transmission assembly 200 rotates around the rotation axis, the mounting portion 411 is suitable for being aligned with different limiting grooves 234, so that by rotating the transmission assembly 200 and axially moving the transmission assembly 200, the mounting portion 411 can be clamped into different limiting grooves 234, so as to keep the rotatable module at different angles.

[0035] It is worth mentioning that when the wafer mounted on the fixed assembly 10 is detected, different angles need to be detected for multiple times to determine the crystal direction. The crystal direction detection device provided by the application can quickly and stably switch the angle of the wafer on the fixed assembly 10, thereby providing convenience for the detection of the crystal direction of the wafer.

[0036] The transmission assembly 200 is arranged on the side of the fixed assembly 10 away from the wafer to be detected in the axial direction, and the transmission assembly 200 is circumferentially distributed with a plurality of mounting portions 411 on the side away from the wafer to be detected, the number of the mounting portions 411 is consistent with the number of the limiting grooves 234.

[0037] The through hole 231 of the support module 20 is suitable for accommodating at least a part of the transmission assembly 200, so that the transmission assembly 200 can be rotatably mounted on the support module 20; the limiting groove 234 is inserted with the mounting portion 411, so that the rotatable module can be fixedly and angularly rotated on the support module 20. By the mounting portion 411 and the limiting groove 234 being inserted with each other, the use reliability and stability of the detection equipment are improved, and the fixed-angle rotation of the rotatable module is further realized, thereby improving the detection accuracy of the wafer to be detected.

[0038] Among them, the fixed-angle rotation is that the rotatable module rotates 90° at a time, or multiple rotations are performed to reach an angle of, for example, 180° or 270°, that is, four limiting grooves 234 are equally spaced on the circumferential side of the through hole 231, and the mounting portion 411 of the rotatable module is inserted into the corresponding limiting groove 234 after being fixedly rotated 90° each time.

[0039] In some embodiments, with reference to Figure 2It can be known that the transmission assembly 200 comprises the transmission rod 30 and the tool piece 40, the transmission rod 30 is contained in the through hole 231; one side of the transmission rod 30 is connected with the fixed assembly 10, and the other side is connected with the tool piece 40; the tool piece 40 is provided with the mounting portion 411 on the side away from the wafer to be detected. Through the transmission rod 30, the convenience of the rotatable module in the rotating operation is improved, and the accuracy and reliability of wafer detection are further enhanced.

[0040] In some embodiments, reference is made to Figure 2 With Figure 5 It can be known that the transmission rod 30 further comprises the connecting portion 31, the connecting portion 31 is provided with the tool guide groove 34 which is arranged along the axial direction and is uniformly distributed along the circumferential direction on the side away from the wafer to be detected, the tool guide groove 34 is suitable for containing the mounting portion 411, so that the transmission rod 30 and the tool piece 40 are fixedly connected. Through the transmission rod 30 and the tool piece 40 which are fixedly connected with each other, the sliding and falling phenomena generated in the rotating operation are reduced, and the use stability of the detection equipment is further improved.

[0041] In some embodiments, as Figure 2 With Figure 3 It can be known that the fixed assembly 10 is provided with the support piece 13 which is arranged along the axial direction on the side away from the wafer to be detected, and the support piece 13 is fixedly connected with the transmission rod 30. Through the support piece 13, the stability and reliability of the fixed assembly 10 in rotation are further improved, so that the accuracy of wafer detection is improved.

[0042] In some embodiments, the support piece 13 comprises the support rod 131, the support rod 131 is provided with the assembly portion 133 which is arranged along the axial direction on the side away from the wafer to be detected, the transmission rod 30 is provided with the support guide groove 32 which is arranged along the axial direction on the side close to the wafer to be detected, and the assembly portion 133 is suitable for extending to the support guide groove 32, so that the support piece 13 is fixedly connected with the transmission rod 30.

[0043] In some embodiments, as Figure 2 With Figure 4 It can be known that the support module 20 comprises the ring rod 220 which is arranged along the axial direction, the ring rod 220 is internally provided with the through hole 231 which is suitable for containing the transmission rod 30; the ring rod 220 is provided with the limiting groove 234 on the side away from the wafer to be detected, the limiting groove 234 is inserted with the mounting portion 411, so that the tool piece 40 is inserted with the ring rod 220. Through the ring rod 220, the tool piece 40 and the support module 20 are connected.

[0044] In some embodiments, as Figure 4 With Figure 5It can be seen that the supporting module 20 further comprises a load-bearing table 21 to improve the stability of the wafer detection device 1. The ring rod 220 further comprises a first ring rod 22 and a second ring rod 23, wherein the first ring rod 22 is fixed to the side of the load-bearing table 21 away from the detection device placement surface, and the first ring rod 22 is fixed to the outside of the second ring rod 23. The second ring rod 23 comprises a horizontally arranged rod neck portion 232, and the rod neck portion 232 is provided with a limiting groove 234 on the side away from the wafer to be detected. The first ring rod 22 extends axially on the side away from the wafer to be detected until the limiting groove 234 of the second ring rod 23 is included in the first ring rod 22, thereby improving the mounting stability when the tooling part 40 is inserted into the first ring rod 22. Further, the rod neck portion 232 of the second ring rod 23 extends outward on the side close to the wafer to be detected and protrudes on the side close to the wafer to be detected of the first ring rod 22, thereby improving the mounting stability of the supporting part 13 of the fixing assembly 10 when the supporting part 13 is connected to the transmission rod 30 and extends to the through hole 231 of the second ring rod 23, so that the fixing assembly 10 is not easy to slip or fall out.

[0045] In at least one embodiment, the first ring rod 22 and the second ring rod 23 are fixed to each other. It can be understood that the fixation can improve the stability of the structure and the reliability of the detection device in use, and further ensure the accuracy of the test data.

[0046] In at least one embodiment, the first ring rod 22 and the second ring rod 23 are integrally formed. It can be understood that the integral forming processing method is beneficial to reduce the manufacturing difficulty, and can also enhance the overall strength of the structure and prolong the service life.

[0047] In some embodiments, in the rotating state, the axial distance between the end surface of the supporting part 13 close to the wafer to be detected and the end surface of the ring rod 220 away from the wafer to be detected is h1, and the axial length of the ring rod 220 is h2, wherein h1>h2, so that the transmission rod 30 can be mounted in the ring rod 220 in an axial movement manner. By the larger h1 distance value, the transmission rod 30 can move in the axial direction, thereby realizing the angular rotation mounting of the rotating module to the supporting module 20.

[0048] In some embodiments, with reference to Figure 2 and Figure 4 It can be seen that the limiting grooves 234 of the ring rod 220 are provided with limiting protrusions 233 on both sides, and the mounting portions 411 of the tooling part 40 are provided with mounting grooves 412 on both sides. When the ring rod 220 and the tooling part 40 are inserted into each other, the limiting protrusions 233 also extend into the mounting grooves 412, thereby further improving the stability during the insertion.

[0049] In some embodiments, the transmission rod 30 is provided with a supporting protrusion 33 on both sides of the supporting guide slot 32, and the assembly part 133 of the supporting piece 13 is provided with an assembly slot 132 on both sides, when the supporting piece 13 is fixed with the transmission rod 30, the supporting protrusion 33 extends to the assembly slot 132, further improving the stability during the fixing.

[0050] In some embodiments, the transmission rod 30 is provided with a tool protrusion 35 on both sides of the tool guide slot 34, and the installation part 411 of the tool piece 40 is provided with an installation slot 412 on both sides, when the transmission rod 30 is fixed with the tool piece 40, the tool protrusion 35 extends to the installation slot 412, further improving the stability during the fixing.

[0051] In some embodiments, as shown in Figure 1 With Figure 2 The fixing assembly 10 further comprises a fixing surface 12 and a fixing piece 11, wherein the fixing surface 12 is suitable for being attached to the wafer to be detected; the fixing piece 11 is arranged on the outer periphery of the fixing surface 12 in the circumferential direction and is suitable for fixing the wafer to be detected; the fixing piece 11 is provided with a velvet, or a sponge, or a foam material, or a rubber material on the side facing the wafer to be detected. By providing the fixing piece 11, the stability during detection is improved, and the occurrence of phenomena such as chipping and edge collapse of the wafer to be detected during detection is further reduced. Further, since the soft material is provided on the back of the fixing piece 11, the damage phenomenon caused by the fixing piece 11 on the contact surface of the wafer during fixing is further reduced, which is beneficial to improve the use quality of the wafer.

[0052] In some embodiments, the outer periphery of the fixing surface 12 is provided with a positioning edge 121, and the positioning edge 121 and the cutting edge of the wafer to be detected coincide with each other. Before detection, the positioning edge 121 is adjusted to be in a vertical state, so that the positioning edge 121 can always remain in a horizontal or vertical state when the rotation angle is 90°, thereby facilitating the use of the positioning edge 121 as a reference surface to measure the normal orientation and the off-orientation of the wafer to be detected, thereby obtaining accurate values.

[0053] In some embodiments, the fixing assembly 10 is first integrally formed with the transmission rod 30, then the first side of the transmission rod 30 which is not connected with the fixing assembly 10 is placed into the through hole 231, and then the first side of the transmission rod 30 is fixed with the tool piece 40, thereby reducing the assembly difficulty.

[0054] In some embodiments, the transmission rod 30 is first integrally formed with the tool piece 40, then the second side of the transmission rod 30 which is not connected with the tool piece 40 is placed into the through hole 231, and then the second side of the transmission rod 30 is fixed with the fixing assembly 10, thereby reducing the assembly difficulty.

[0055] In some embodiments, the fixing assembly 10, the transmission rod 30 and the tooling piece 40 are integrally formed. By integrally forming, the overall strength of the structure is enhanced, the manufacturing difficulty is reduced, and the service life is prolonged.

[0056] In some embodiments, the ring rod 220 can be provided in an axially buckled structure, suitable for accommodating the integrally formed fixing assembly 10, the transmission rod 30 and the tooling piece 40, thereby facilitating the assembly difficulty.

[0057] In some embodiments, as Figure 2 It can be seen that the tooling piece 40 further comprises a main body part 41, which is provided with a mounting part 411 on the side close to the wafer to be detected, and a control part 42 extending in the circumferential direction on the side away from the wafer to be detected. When the tooling piece 40 is inserted into the limiting groove 234 of the second ring rod 23, at least a part of the main body part 41 is covered inside the first ring rod 22, further improving the stability and reliability during insertion and installation. It can be understood that, by providing the control part 42 extending in the circumferential direction, it is convenient for the operator to hold the tooling piece 40 for plugging and rotating, further improving the detection rate.

[0058] The above describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited to the above embodiments, and the above embodiments and descriptions in the specification are only the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection claimed by the present application is defined by the appended claims and their equivalents.

Claims

1. A wafer inspection device, characterized in that, include: A rotatable module includes a fixing component and a transmission component. The fixing component is adapted to fix the wafer to be tested. The transmission component is axially disposed on the side of the fixing component away from the wafer to be tested. The transmission component is circumferentially distributed on the side away from the wafer to be tested and has at least one mounting part along the axial direction. A support module is adapted to support the rotatable module. The support module further includes a through hole and a plurality of limiting grooves axially corresponding to the mounting portion. The through hole is adapted to accommodate at least a portion of the transmission component, so that the transmission component can be rotatably mounted on the support module. The limiting grooves are inserted into the mounting portion, so that the rotatable module can be rotatably mounted on the support module at a certain angle.

2. The detection device as described in claim 1, characterized in that, The transmission assembly further includes a transmission rod and a tooling component. The transmission rod is housed in the through hole. One side of the transmission rod is connected to the fixing assembly, and the other side is fixedly connected to the tooling component. The tooling component has the mounting portion on the side away from the wafer to be tested.

3. The detection device as described in claim 2, characterized in that, The transmission rod has a tooling guide groove arranged axially and evenly distributed circumferentially on the side away from the wafer to be tested. The tooling guide groove is adapted to accommodate the mounting part, so that the transmission rod is fixedly connected to the tooling part.

4. The detection device as described in claim 3, characterized in that, The four limiting grooves are spaced apart on the periphery of the through hole. The support module includes a ring rod arranged along the axial direction. The ring rod has the through hole inside, which is suitable for accommodating the transmission rod. The ring rod has the limiting groove on the side away from the wafer to be tested. The limiting groove is inserted into the mounting part, so that the tooling is inserted into the ring rod.

5. The detection device as described in claim 4, characterized in that, The fixing component has an axial support on the side away from the wafer to be tested, and the support is fixedly connected to the transmission rod.

6. The detection device as described in claim 5, characterized in that, The support member has an axially arranged assembly part on the side away from the wafer to be tested, and the transmission rod has a corresponding axially arranged support guide groove on the side close to the wafer to be tested. The assembly part is adapted to extend into the support guide groove so that the support member is fixed to the transmission rod.

7. The detection device as described in claim 6, characterized in that, In the rotating state, the axial distance between the end face of the support member near the wafer to be tested and the end face of the ring rod away from the wafer to be tested is h1, and the axial length of the ring rod is h2, wherein h1 > h2, so that the transmission rod can be mounted on the ring rod in an axially movable manner.

8. The detection device as described in claim 1, characterized in that, The fixing component further includes a fixing surface and a fixing member, wherein the fixing surface is adapted to fit the wafer to be tested; the fixing member is disposed circumferentially on the outer periphery of the fixing surface and is adapted to fix the wafer to be tested; the fixing member is provided with a velvet cloth, sponge, foam material, or rubber material on the side facing the wafer to be tested.

9. The detection device as described in claim 8, characterized in that, The fixed surface has a positioning edge on its outer periphery, and the positioning edge coincides with the cutting edge of the wafer to be tested.

10. The detection device as described in any one of claims 2-7, characterized in that, The fixing component, the transmission rod, and the tooling are integrally formed.

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