Automatic detection equipment for improving yield of chips

Abstract

The utility model provides automatic detection equipment for improving the yield of chips, which comprises an adjusting assembly, and the adjusting assembly comprises a detection table, a support frame, a first sliding block, a first mounting hole and a detection assembly. According to the utility model, through cooperation of the adjusting assembly and the detection assembly, automatic three-dimensional accurate moving and positioning of the detection head are realized, chips can be rapidly detected, the detection time is greatly shortened, meanwhile, a plurality of chip limiting seats can be simultaneously placed in a plurality of mounting grooves of the detection table, multiple chips can be sequentially detected, and the batch detection efficiency is further improved; the visual detection module and the electrical performance detection module at the bottom of the detection head work cooperatively to detect the chip, so that the yield of the chip can be judged more comprehensively and accurately, and the conditions of missing detection and false detection are effectively reduced; according to chips of different specifications, the chip limiting seats corresponding to the sizes of the chip placing grooves can be easily disassembled and replaced, so that the limiting requirements of various chips are met, the equipment can cope with detection of various chips, and the universality is improved.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to an automated testing device for improving chip yield. Background Technology

[0002] In the chip manufacturing process, rigorous testing is required to ensure the quality of chips leaving the factory. Traditional chip testing methods rely heavily on manual labor, which is not only inefficient but also prone to causing fatigue among testers due to long working hours, thus affecting the accuracy of test results. Missed or false detections occur frequently, which in turn affects the chip yield.

[0003] With the development of chip manufacturing technology, the requirements for testing efficiency and accuracy are constantly increasing. Although some existing automated testing equipment has improved the testing speed to a certain extent, it still has shortcomings in terms of the comprehensiveness of testing, adaptability to chips of different specifications, and chip stability during the testing process. It cannot well meet the needs of improving chip yield. Therefore, an automated testing equipment to improve chip yield is proposed. Utility Model Content

[0004] In view of this, the present invention aims to provide an automated testing device to improve chip yield, so as to solve or alleviate the technical problems existing in the prior art, or at least provide a beneficial option.

[0005] The technical solution of this utility model embodiment is implemented as follows: An automated testing device for improving chip yield includes an adjustment component, which includes a testing stage, a support frame, a slide groove, a first slider, a first mounting hole, a first bidirectional synchronous motor, a first output shaft, a first gear, a first through groove, a first toothed plate, a connecting plate, a mounting frame, a second slider, a second mounting hole, a second bidirectional synchronous motor, a second output shaft, a second gear, a second through groove, a second toothed plate, and a testing component;

[0006] Support frames are fixedly connected to the center of both sides of the upper surface of the testing platform. A sliding groove is formed in the middle of the upper surface of the support frame. A first slider is slidably connected to the inner wall of the sliding groove. A first mounting hole is formed in the center of the front surface of the first slider. A first bidirectional synchronous motor is fixedly connected to the inner wall of the first mounting hole. Both output ends of the first bidirectional synchronous motor are fixedly connected to a first gear via a first output shaft. First through slots are formed on the upper part of both the front and rear surfaces of the support frame. A first toothed plate is provided on the inner bottom wall of the first through slot. The outer wall of the first gear meshes with the upper surface of the first toothed plate. A connecting rod is fixedly connected to the bottom of the first slider. The connecting plate has its upper surface slidably connected to the inner top wall of the support frame, and its lower surface is fixedly connected to a mounting frame. A second slider is slidably connected to the inner side wall of the mounting frame. A second mounting hole is provided at the center of one side of the second slider. A second bidirectional synchronous motor is fixedly connected to the inner side wall of the second mounting hole. Both output ends of the second bidirectional synchronous motor are fixedly connected to a second gear through a second output shaft. A second through groove is provided in the middle of both sides of the mounting frame. A second toothed plate is provided on the inner bottom wall of the second through groove. The outer side wall of the second gear is meshed with the upper surface of the second toothed plate. A detection component is fixedly connected to the bottom of the second slider.

[0007] More preferably, the detection component includes a mounting plate, a lifting electric cylinder, a limit post, a detection head, a vision inspection module, and an electrical performance detection module;

[0008] The bottom of the second slider is fixedly connected to a mounting plate, the top of the mounting plate is slidably connected to the bottom of the mounting frame, the bottom of the mounting plate is fixedly connected to a lifting electric cylinder, the output end of the lifting electric cylinder is fixedly connected to a detection head through a limit post, and the bottom of the detection head is provided with a visual inspection module and an electrical performance inspection module.

[0009] More preferably, the upper surface of the testing station is provided with multiple mounting slots, and the inner bottom wall of each of the multiple mounting slots is provided with a positioning slot. The inner sidewall of the mounting slot is fixedly connected to a chip limiting seat by multiple screws. The lower part of the outer sidewall of the chip limiting seat is slidably connected to the inner sidewall of the positioning slot. A chip placement slot is provided at the center of the upper surface of the chip limiting seat.

[0010] More preferably, an assembly hole is provided at the center of the front part of the upper surface of the testing platform, and a controller is fixedly connected to the inner side wall of the assembly hole. The input ends of the first bidirectional synchronous motor, the second bidirectional synchronous motor and the lifting electric cylinder are all electrically connected to the output end of the controller, and the output ends of the vision inspection module and the electrical performance inspection module are all electrically connected to the input end of the controller.

[0011] More preferably, the lower surface of the lifting electric cylinder is fixedly connected to both sides of the limiting plate, and the two sides of the limiting post are respectively slidably connected to the adjacent side of the two limiting plates.

[0012] More preferably, a limiting groove is formed in the middle of one side of the limiting plate, and limiting blocks are fixedly connected to the upper parts of both sides of the limiting post, with the outer side wall of the limiting block slidably connected to the inner side wall of the limiting groove.

[0013] More preferably, the upper surface of the testing station has a limiting seat pick-and-place slot on both sides near the mounting slot, and the upper surface of the chip limiting seat has a chip pick-and-place slot on both sides near the chip placement slot.

[0014] More preferably, a touch screen is provided in the middle of the upper surface of the controller.

[0015] The present invention has the following advantages due to the adoption of the above technical solution:

[0016] 1. This utility model achieves automated three-dimensional precise movement and positioning of the detection head through the cooperation of the adjustment component and the detection component, which can quickly detect chips, greatly shorten the detection time, and far exceed the speed of manual operation. At the same time, the multiple mounting slots of the detection table can simultaneously place multiple chip limit seats, realize the sequential detection of multiple chips, further improve the efficiency of batch detection, and reduce operation steps and time.

[0017] 2. This utility model uses the visual inspection module and electrical performance inspection module at the bottom of the inspection head to work together to inspect the chip, which can more comprehensively and accurately determine the chip yield rate, thereby effectively reducing the situation of missed detection and false detection.

[0018] 3. This utility model allows for easy disassembly and replacement of chip limit seats with corresponding chip placement slot sizes for chips of different specifications, thereby adapting to various chip limit requirements, enabling the equipment to handle the detection of various chips, eliminating the need for multiple sets of equipment, reducing costs, and improving versatility.

[0019] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is an overall structural diagram of the present invention;

[0022] Figure 2 This is a structural diagram of the first and second sliders of this utility model;

[0023] Figure 3 This is a structural diagram of the lifting electric cylinder and detection head of this utility model;

[0024] Figure 4 This is a structural diagram of the detection stage and chip limiting seat of this utility model.

[0025] Reference numerals: 1. Adjustment component; 11. Detection table; 12. Support frame; 13. Slide groove; 14. First slider; 15. First mounting hole; 16. First bidirectional synchronous motor; 17. First output shaft; 18. First gear; 19. First through groove; 20. First gear plate; 21. Connecting plate; 22. Mounting frame; 23. Second slider; 24. Second mounting hole; 25. Second bidirectional synchronous motor; 26. Second output shaft; 27. Second gear; 28. Second through groove 29. Second toothed plate; 3. Detection component; 30. Mounting plate; 31. Lifting electric cylinder; 32. Limiting post; 33. Detection head; 34. Vision inspection module; 35. Electrical performance testing module; 36. Mounting slot; 37. Positioning slot; 38. Chip limiting seat; 39. Chip placement slot; 40. Assembly hole; 41. Controller; 42. Limiting plate; 43. Limiting slot; 44. Limiting block; 45. Limiting seat pick-and-place slot; 46. Chip pick-and-place slot; 47. Touch screen. Detailed Implementation

[0026] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this invention. Therefore, the drawings and description are considered exemplary in nature and not restrictive.

[0027] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0028] like Figures 1-4As shown, this utility model embodiment provides an automated testing device for improving chip yield, including an adjustment component 1. The adjustment component 1 includes a testing table 11, a support frame 12, a slide groove 13, a first slider 14, a first mounting hole 15, a first bidirectional synchronous motor 16, a first output shaft 17, a first gear 18, a first through groove 19, a first toothed plate 20, a connecting plate 21, a mounting frame 22, a second slider 23, a second mounting hole 24, a second bidirectional synchronous motor 25, a second output shaft 26, a second gear 27, a second through groove 28, a second toothed plate 29, and a testing component 3.

[0029] Support frames 12 are fixedly connected to the center of both sides of the upper surface of the testing table 11. A slide groove 13 is provided in the middle of the upper surface of the support frame 12. A first slider 14 is slidably connected to the inner wall of the slide groove 13. A first mounting hole 15 is provided in the center of the front surface of the first slider 14. A first bidirectional synchronous motor 16 is fixedly connected to the inner wall of the first mounting hole 15. The two output ends of the first bidirectional synchronous motor 16 are fixedly connected to a first gear 18 through a first output shaft 17. A first through groove 19 is provided in the upper part of the front and rear surfaces of the support frame 12. A first toothed plate 20 is provided in the inner bottom wall of the first through groove 19. The outer wall of the first gear 18 is meshed with the upper surface of the first toothed plate 20. A connecting plate 21 is fixedly connected to the bottom of the first slider 14. The upper surface of the connecting plate 21 is slidably connected to the support frame 11. The inner top wall of the second slider 23 is fixedly connected to the lower surface of the connecting plate 21. The inner side wall of the mounting frame 22 is slidably connected to the second slider 23. A second mounting hole 24 is opened at the center of one side of the second slider 23. A second bidirectional synchronous motor 25 is fixedly connected to the inner side wall of the second mounting hole 24. The two output ends of the second bidirectional synchronous motor 25 are fixedly connected to the second gear 27 through the second output shaft 26. A second through groove 28 is opened in the middle of both sides of the mounting frame 22. A second toothed plate 29 is provided on the inner bottom wall of the second through groove 28. The outer side wall of the second gear 27 is meshed with the upper surface of the second toothed plate 29. A detection component 3 is fixedly connected to the bottom of the second slider 23. The first slider 14 moves along the inner top wall of the support frame 12 through the upper surface of the connecting plate 21, thereby increasing the stability of the movement of the first slider 14.

[0030] In one embodiment, the detection component 3 specifically includes a mounting plate 30, a lifting electric cylinder 31, a limit post 32, a detection head 33, a vision inspection module 34, and an electrical performance inspection module 35.

[0031] The bottom of the second slider 23 is fixedly connected to a mounting plate 30, and the top of the mounting plate 30 is slidably connected to the bottom of the mounting frame 22. A lifting electric cylinder 31 is fixedly connected to the bottom of the mounting plate 30. The output end of the lifting electric cylinder 31 is fixedly connected to a detection head 33 via a limiting post 32. A vision inspection module 34 and an electrical performance inspection module 35 are installed at the bottom of the detection head 33. The vision inspection module 34 is equipped with a high-resolution image sensor. When the detection head 33 descends to a suitable position close to the chip, the sensor begins to collect image information from the chip surface. During the acquisition process, the module automatically controls the lighting system to ensure uniform light on the chip surface to obtain clear and accurate images. The acquired raw images are first pre-processed, including image denoising and grayscale correction, to remove image defects caused by light interference, sensor noise, and other factors, thereby improving image quality for subsequent processing. This lays the foundation for subsequent feature extraction and analysis. Utilizing advanced image processing algorithms, the visual inspection module 34 extracts various features from the preprocessed image, such as edges, textures, and colors, onto the chip surface. For the chip's pins, the edge detection algorithm accurately identifies the pin's position and shape. For printed markings or patterns on the chip surface, a texture analysis algorithm is used to determine their integrity and clarity. Then, the extracted features are compared and analyzed with a preset standard chip feature template. Based on the feature comparison results, the visual inspection module 34 can quickly and accurately detect various defects on the chip surface, such as scratches, stains, cracks, and pin defects. It can not only detect the existence of defects but also classify them, determining their type, location, and size. This detailed defect information is transmitted in real time to the controller 41 via a data transmission line for further processing and recording.

[0032] Among them, the electrical performance detection module 35 establishes an electrical connection with the pins or test points of the chip through precise probes. During detection, according to the type of the chip and the detection requirements, the module applies specific electrical signal excitations to the chip, such as voltage pulses, current signals, etc. These excitation signals can stimulate the internal circuits of the chip to work, making the electrical parameters of the chip in a measurable state. When the chip is working under the electrical signal excitation, the electrical performance detection module 35 uses high-precision measuring instruments to measure the electrical parameters of the chip in real time, such as resistance, capacitance, inductance, conductivity, voltage, current, etc. The measuring instrument converts the analog electrical parameters into digital signals for data processing and analysis. The module will perform multiple samplings during the measurement process to improve the accuracy and reliability of the measurement data. After the collected electrical parameter data is transmitted to the controller 41, the electrical performance detection module 35 cooperates with the analysis program in the controller 41 to evaluate the electrical performance of the chip, and compares the measured electrical parameters with the preset standard electrical parameter range. If the measured value is within the standard range, it is determined that the electrical performance of the chip in this item is qualified; if the measured value exceeds the standard range, it is determined that the chip has electrical performance defects. At the same time, the module can further analyze the electrical performance of the chip, such as judging whether there are problems such as short circuits, open circuits, and parameter drifts, and feedback the analysis results to the controller 41.

[0033] In one embodiment, specifically: a plurality of mounting grooves 36 are formed on the upper surface of the detection table 11, positioning grooves 37 are formed in the middle of the inner bottom walls of the plurality of mounting grooves 36, the inner side walls of the mounting grooves 36 are fixedly connected with chip limiting seats 38 through a plurality of screws, the lower part of the outer side wall of the chip limiting seat 38 is slidably connected to the inner side wall of the positioning groove 37, and a chip placement groove 39 is formed at the center of the upper surface of the chip limiting seat 38. Through the plurality of mounting grooves 36 on the detection table 11, it is convenient to install a plurality of chip limiting seats 38, thereby facilitating the detection of multiple chips in sequence, and then improving the detection efficiency. By removing the screws, it is convenient to take out the chip limiting seat 38 in the mounting groove 36, and then it is convenient to replace the chip limiting seat 38 adapted to different specifications and models of chips.

[0034] In one embodiment, specifically: an assembly hole 40 is provided at the center of the front part of the upper surface of the inspection table 11. A controller 41 is fixedly connected to the inner side wall of the assembly hole 40. The input ends of the first bidirectional synchronous motor 16, the second bidirectional synchronous motor 25 and the lifting electric cylinder 31 are all electrically connected to the output end of the controller 41. The output ends of the vision inspection module 34 and the electrical performance inspection module 35 are all electrically connected to the input end of the controller 41. The controller 41 precisely controls the first bidirectional synchronous motor 16, the second bidirectional synchronous motor 25 and the lifting electric cylinder 31, thereby realizing the precise movement and positioning of the inspection component 3 in the X, Y and Z axis directions, ensuring that the inspection head 33 is accurately aligned with the chip, and adjusting the distance between the inspection head 33 and the chip to avoid collision and ensure inspection accuracy.

[0035] The controller 41 receives and processes the data transmitted by the vision inspection module 34 and the electrical performance inspection module 35, and uses image processing algorithms and electrical parameter comparison to determine whether the chip appearance and electrical performance are qualified, marks and records defect information, and statistically analyzes the data, thereby providing a basis for chip quality assessment and production process optimization.

[0036] In one embodiment, specifically: both sides of the lower surface of the lifting electric cylinder 31 are fixedly connected to limit plates 42, and the two sides of the limit post 32 are respectively slidably connected to the adjacent side of the two limit plates 42. The limit post 32 is limited by the two limit plates 42, thereby increasing the stability of the limit post 32 moving up and down.

[0037] In one embodiment, specifically: a limiting groove 43 is provided in the middle of one side of the limiting plate 42, and limiting blocks 44 are fixedly connected to the upper parts of both sides of the limiting post 32. The outer side wall of the limiting block 44 is slidably connected to the inner side wall of the limiting groove 43. By the limiting block 44 on the limiting post 32 sliding inside the limiting groove 43, the limiting block 44 is limited, thereby further increasing the stability of the vertical movement of the limiting post 32.

[0038] In one embodiment, specifically: the upper surface of the detection stage 11 is provided with limit seat pick-and-place slots 45 on both sides near the mounting slot 36, and the upper surface of the chip limit seat 38 is provided with chip pick-and-place slots 46 on both sides near the chip placement slot 39. The limit seat pick-and-place slots 45 facilitate the removal of the chip limit seat 38 from the mounting slot 36 when it is disassembled, and the chip pick-and-place slots 46 facilitate the removal of the chip placed in the chip placement slot 39.

[0039] In one embodiment, specifically: a touch screen 47 is provided in the middle of the upper surface of the controller 41, which facilitates the operator to set detection parameters, including the image parameters of the vision inspection module 34 and the electrical parameters of the electrical performance inspection module 35; it can effectively control the detection process, start, pause and select the detection mode; it is conducive to viewing and managing the detection results, displaying the current results in real time, viewing historical records, exporting results and generating reports.

[0040] In operation, this invention works as follows: Based on the specifications of the chip to be tested, a suitable chip positioning seat 38 is selected. The chip is placed in the chip placement slot 39 via the chip pick-and-place slot 46 on the chip positioning seat 38. Then, the chip positioning seat 38 is initially positioned by sliding its lower outer wall against the positioning slot 37 in the mounting slot 36 on the testing stage 11. Finally, multiple screws are used to fix the chip positioning seat 38 in the mounting slot 36, ensuring the chip is stably placed on the testing stage 11. The operator inputs testing commands via the touchscreen 47 on the controller 41. The controller 41 first controls the start of the first bidirectional synchronous motor 16. The two output terminals of the first bidirectional synchronous motor 16 drive the first gear 18 to rotate via the first output shaft 17. The first gear 18 meshes with the first toothed plate 20 located on the bottom wall of the first through groove 19 on the upper part of the front and rear surfaces of the support frame 12, causing the first slider 14 to slide along the X-axis in the slide groove 13 in the middle of the upper surface of the support frame 12. This drives the connecting plate 21, the mounting frame 22, and the detection component 3 below the mounting frame 22 to move as a whole in the X-axis direction, initially positioning the detection component 3 above the area where the first chip is located. Then, the controller 41 controls the second bidirectional synchronous motor 25 to start. The two output ends of the second bidirectional synchronous motor 25 drive the second gear 27 to rotate through the second output shaft 26. The second gear 27 meshes with the second toothed plate 29 located on the bottom wall of the second through groove 28 in the middle of both sides of the mounting frame 22, causing the second slider 24 to slide along the X-axis in the middle part of the upper surface of the support frame 12. 3. The sensor slides along the Y-axis on the inner wall of the mounting frame 22, thereby precisely adjusting the position of the detection component 3 in the Y-axis direction, so that the detection head 33 is accurately aligned with the first chip. After the position of the detection head 33 is adjusted, the controller 41 controls the lifting electric cylinder 31 to start. The output end of the lifting electric cylinder 31 drives the detection head 33 to descend along the Z-axis direction through the limit post 32, so that the detection head 33 is close to the first chip. When the detection head 33 descends to the appropriate position, the vision inspection module 34 at the bottom of the detection head 33 inspects the appearance of the first chip, such as whether there are scratches, stains, or defects such as intact pins on the chip surface, and transmits the detected image information to the controller 41. At the same time, the electrical performance inspection module 35 inspects the first chip. Electrical performance is tested, such as the chip's resistance, capacitance, and conductivity. The test data is then transmitted to the controller 41. After receiving the data from the vision inspection module 34 and the electrical performance testing module 35, the controller 41 analyzes and judges the data according to preset testing standards. If the chip meets the standards in both appearance and electrical performance, it is considered a good product, and the controller 41 records the test result as qualified. The controller 41 can also store or display the relevant information on the touch screen 47 for the operator to view. If the chip fails to meet one or more standards in terms of appearance or electrical performance, it is considered a defective product, and the controller 41 records the test result and alerts the operator through audible and visual alarms.After the first chip is tested, the controller 41, according to a pre-set program or operator instructions, controls the first bidirectional synchronous motor 16 and the second bidirectional synchronous motor 25 to restart, moving the testing component 3 to the position of the second chip on the testing table 11. This process of lowering, testing, and raising the testing head 33 is repeated, and so on, for each chip on the testing table 11. Throughout the testing process, the controller 41 independently judges, records, and stores the testing results for each chip, ensuring the accuracy of the testing data for each chip. Furthermore, the operator can view the current chip testing progress and results at any time via the touchscreen 47.

[0041] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this utility model, and these should all be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. An automated testing device for improving chip yield, characterized in that: The system includes an adjustment assembly (1), which comprises a detection table (11), a support frame (12), a slide groove (13), a first slider (14), a first mounting hole (15), a first bidirectional synchronous motor (16), a first output shaft (17), a first gear (18), a first through slot (19), a first toothed plate (20), a connecting plate (21), a mounting frame (22), a second slider (23), a second mounting hole (24), a second bidirectional synchronous motor (25), a second output shaft (26), a second gear (27), a second through slot (28), a second toothed plate (29), and a detection assembly (3). A support frame (12) is fixedly connected to the center of both sides of the upper surface of the testing platform (11). A slide groove (13) is opened in the middle of the upper surface of the support frame (12). A first slider (14) is slidably connected to the inner wall of the slide groove (13). A first mounting hole (15) is opened in the center of the front surface of the first slider (14). A first bidirectional synchronous motor (16) is fixedly connected to the inner wall of the first mounting hole (15). The two output ends of the first bidirectional synchronous motor (16) are fixedly connected to a first gear (18) through a first output shaft (17). A first through groove (19) is opened in the upper part of the front and rear surfaces of the support frame (12). A first toothed plate (20) is provided in the inner bottom wall of the first through groove (19). The outer wall of the first gear (18) is meshed with the upper surface of the first toothed plate (20). A connecting plate (2) is fixedly connected to the bottom of the first slider (14). 1) The upper surface of the connecting plate (21) is slidably connected to the inner top wall of the support frame (12). The lower surface of the connecting plate (21) is fixedly connected to the mounting frame (22). The inner side wall of the mounting frame (22) is slidably connected to the second slider (23). A second mounting hole (24) is opened at the center of one side of the second slider (23). A second bidirectional synchronous motor (25) is fixedly connected to the inner side wall of the second mounting hole (24). The two output ends of the second bidirectional synchronous motor (25) are fixedly connected to the second gear (27) through the second output shaft (26). A second through groove (28) is opened in the middle of both sides of the mounting frame (22). A second toothed plate (29) is provided on the inner bottom wall of the second through groove (28). The outer side wall of the second gear (27) is meshed with the upper surface of the second toothed plate (29). A detection component (3) is fixedly connected to the bottom of the second slider (23).

2. The automated testing equipment for improving chip yield according to claim 1, characterized in that: The detection component (3) includes a mounting plate (30), a lifting electric cylinder (31), a limit post (32), a detection head (33), a vision detection module (34), and an electrical performance detection module (35). The bottom of the second slider (23) is fixedly connected to a mounting plate (30), the top of the mounting plate (30) is slidably connected to the bottom of the mounting frame (22), the bottom of the mounting plate (30) is fixedly connected to a lifting electric cylinder (31), the output end of the lifting electric cylinder (31) is fixedly connected to a detection head (33) through a limiting post (32), and the bottom of the detection head (33) is provided with a visual inspection module (34) and an electrical performance inspection module (35).

3. The automated testing equipment for improving chip yield according to claim 1, characterized in that: The upper surface of the testing station (11) is provided with multiple mounting slots (36), and the inner bottom wall of each of the multiple mounting slots (36) is provided with a positioning slot (37). The inner side wall of the mounting slot (36) is fixedly connected to a chip limiting seat (38) by multiple screws. The lower part of the outer side wall of the chip limiting seat (38) is slidably connected to the inner side wall of the positioning slot (37). A chip placement slot (39) is provided at the center of the upper surface of the chip limiting seat (38).

4. The automated testing equipment for improving chip yield according to claim 2, characterized in that: An assembly hole (40) is provided at the center of the front part of the upper surface of the testing platform (11). A controller (41) is fixedly connected to the inner side wall of the assembly hole (40). The input ends of the first bidirectional synchronous motor (16), the second bidirectional synchronous motor (25) and the lifting electric cylinder (31) are all electrically connected to the output end of the controller (41). The output ends of the vision testing module (34) and the electrical performance testing module (35) are all electrically connected to the input end of the controller (41).

5. The automated testing equipment for improving chip yield according to claim 2, characterized in that: The lower surface of the lifting electric cylinder (31) is fixedly connected to both sides of the limiting plate (42), and the two sides of the limiting column (32) are respectively slidably connected to the adjacent side of the two limiting plates (42).

6. The automated testing equipment for improving chip yield according to claim 5, characterized in that: A limiting groove (43) is provided in the middle of one side of the limiting plate (42), and limiting blocks (44) are fixedly connected to the upper parts of both sides of the limiting column (32). The outer side wall of the limiting block (44) is slidably connected to the inner side wall of the limiting groove (43).

7. The automated testing equipment for improving chip yield according to claim 3, characterized in that: The upper surface of the testing station (11) is provided with a limit seat pick-and-place slot (45) on both sides near the mounting slot (36), and the upper surface of the chip limit seat (38) is provided with a chip pick-and-place slot (46) on both sides near the chip placement slot (39).

8. The automated testing equipment for improving chip yield according to claim 4, characterized in that: A touch screen (47) is provided in the middle of the upper surface of the controller (41).

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