Thin film capacitor and electrical equipment

Abstract

The utility model discloses a thin-film capacitor and electrical equipment, and belongs to the field of thin-film capacitors. The thin-film capacitor comprises a heat dissipation plate, the heat dissipation plate is arranged outside the thin-film capacitor, the heat dissipation plate is composed of heat dissipation areas and a communication structure, and each heat dissipation area corresponds to one heating point of the thin-film capacitor, so that the heat dissipation effect of the thin-film capacitor is guaranteed, the area of the heat dissipation plate is reduced, the thin-film capacitor does not need to be completely covered by the heat dissipation plate, and the heat dissipation efficiency is improved. And materials are greatly saved. Every two adjacent heat dissipation areas are connected through one communicating structure, the communicating structures are arranged to connect the two heat dissipation areas, the two heat dissipation areas can be integrally formed during production, and production is facilitated; and meanwhile, the communication structure can conduct heat between the heat dissipation areas, heat dissipation is assisted, and the heat dissipation effect is enhanced. The width of the heat dissipation area is larger than that of the communication structure, so that the material consumption of the communication structure can be reduced, and the material is further saved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a film capacitor, especially, relate to a film capacitor and electrical equipment. BACKGROUND

[0002] With the rapid development of new energy automobile, wind power generation and solar power generation and other new energy industries, as an important part of energy storage system, the market demand of film capacitor will continue to rise. Especially in the field of new energy vehicles, film capacitors are used in auxiliary power systems, which improves the starting performance and power output of vehicles.

[0003] According to industry data, the Chinese market has changed rapidly in the past few years, and the market size in 2022 was 34.57 million US dollars, accounting for about 24.87% of the global market. It is expected to reach 80.35 million US dollars by 2029, and the global market share will reach 28.51%. With the rapid development of China's new energy industry and the promotion of smart grid construction, the demand for film capacitors will continue to grow. It is expected that in the next few years, the market size of China's film capacitor market will maintain a steady growth trend, and the market growth rate is expected to further increase.

[0004] In summary, the film capacitor market will usher in broad prospects and numerous market opportunities. Enterprises need to follow the development trend of technology and changes in market demand, and continuously improve their competitiveness to adapt to the fierce market competition environment.

[0005] At present, based on the progress of material science and manufacturing process, film capacitors will develop towards higher energy density, higher power density and longer cycle life, which makes the film capacitors used in this product have the following design difficulties:

[0006] Capacitors will generate heat during operation, and if the heat dissipation is poor, it will cause the temperature of the capacitor to rise, which will affect its electrical performance and service life. Therefore, when designing, it is necessary to reasonably arrange the heat dissipation structure and adopt effective heat dissipation measures such as heat dissipation fins, fans, etc. to ensure that the capacitor can dissipate heat normally. The performance of the capacitor is greatly affected by temperature, and when designing, the influence of temperature on the performance of the capacitor needs to be considered, and appropriate measures need to be taken to compensate or adjust.

[0007] In order to meet the energy storage needs of power electronic equipment, capacitors need to have a large capacity. However, the increase of capacity will lead to the increase of volume and weight of the capacitor, which will bring difficulties to design and manufacturing. Therefore, it is necessary to optimize the structure and material of the capacitor while ensuring the capacity, so as to realize miniaturization and light weight. SUMMARY

[0008] In order to overcome the shortcomings of the prior art, this utility model provides a thin film capacitor and electrical device to solve the problems of large size, heavy weight, and high cost of existing capacitors after arranging heat dissipation structure.

[0009] The technical solution adopted by this utility model to solve its technical problem is:

[0010] On one hand, a thin-film capacitor is provided, comprising: a heat sink;

[0011] The heat sink is disposed outside the film capacitor;

[0012] The heat sink consists of a heat dissipation area and a connecting structure, wherein the width of the heat dissipation area is greater than or equal to the width of the connecting structure.

[0013] Each heat dissipation area corresponds to a heat-generating point of the thin-film capacitor, and two adjacent heat dissipation areas are connected by a connecting structure.

[0014] As an optional implementation of this application, the area of ​​the heat dissipation region decreases sequentially;

[0015] The area with the largest heat dissipation area is closest to the input terminal of the thin-film capacitor.

[0016] As an optional implementation of this application, the shape of the heat dissipation area can be any of the following:

[0017] Circles, squares, ovals, rhombuses, and rectangles.

[0018] As an optional implementation of this application, the number of heat dissipation areas is any value between 4 and 10.

[0019] As an optional implementation of this application, the number of heat dissipation areas is 7.

[0020] As an optional implementation of this application, the fewer the number of heat dissipation areas, the larger the area of ​​the heat dissipation area closest to the input terminal of the thin-film capacitor.

[0021] As an optional implementation of this application, the thin-film capacitor includes a core, a busbar, an insulating film, epoxy resin, and a plastic shell;

[0022] The core is disposed on the busbar, an insulating film is disposed on the outside of the busbar, epoxy resin is disposed on the outside of the insulating film, and a plastic shell is disposed on the outside of the epoxy resin.

[0023] As an optional implementation of this application, the heat sink is disposed on the plastic shell.

[0024] As an optional implementation of this application, the heat sink is a metal plate with better heat dissipation capacity than the plastic shell;

[0025] The metal plate includes any one of the following:

[0026] Aluminum, copper, steel.

[0027] On the other hand, an electrical device is provided, comprising: a film capacitor as described in any of the preceding claims.

[0028] The application employs the above technical solution and has at least the following beneficial effects:

[0029] This application provides a thin-film capacitor and electrical device. The thin-film capacitor includes a heat sink, which is disposed outside the capacitor. The heat sink consists of heat dissipation areas and a connecting structure. Each heat dissipation area corresponds to a heat-generating point of the thin-film capacitor. This design ensures the heat dissipation effect of the thin-film capacitor while reducing the area of ​​the heat sink, eliminating the need for the heat sink to completely cover the capacitor, thus significantly saving material. Adjacent heat dissipation areas are connected by a connecting structure. This connecting structure allows for integral molding of the two heat dissipation areas during production, facilitating manufacturing. Simultaneously, the connecting structure enables heat conduction between the heat dissipation areas, aiding in heat dissipation and enhancing the overall heat dissipation effect. The width of the heat dissipation area is greater than the width of the connecting structure, further reducing the material used in the connecting structure and saving material. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of a heat dissipation structure for a thin-film capacitor in the prior art, provided by an embodiment of this utility model;

[0032] Figure 2 This is a schematic diagram of a heat dissipation structure for a thin-film capacitor provided in an embodiment of the present invention;

[0033] Figure 3 This is a cross-sectional structural diagram of a thin-film capacitor provided in an embodiment of the present invention. Attached image description:

[0035] 1-Core;

[0036] 2-Mother row;

[0037] 3-Insulating film;

[0038] 4-Epoxy resin;

[0039] 5-Plastic shell;

[0040] 6-Heat dissipation plate;

[0041] 61-Heat dissipation area;

[0042] 62-Connected structure. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this utility model will be described in detail below with reference to the accompanying drawings and embodiments. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments of this application, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0044] It should be noted that the heat source refers to the concentrated temperature area during capacitor use. Due to the arrangement of the cores, there are multiple concentrated temperature areas, which are not continuous. The heat source for each model can be determined through simulation or experimental measurement.

[0045] The cross-sectional structure of existing thin-film capacitors is as follows: Figure 3 As shown, from the inside out: core 1, busbar 2, insulating film 3, epoxy resin 4, plastic shell 5, heat sink 6.

[0046] The assembly sequence during production is as follows: arrange the core 1 and weld it onto the busbar 2, place it into the plastic shell 5, separate the plastic shell 5 and the busbar 2 with an insulating film 3, and finally pour in epoxy resin 4 for curing.

[0047] The capacitor core is the core component of a capacitor, consisting of two metal foils and an insulating material sandwiched between them. The insulating material is typically a polypropylene film or ceramic sheet, while the metal foils are usually aluminum or silver foil. The manufacturing process of the capacitor core is complex, requiring specialized winding techniques and automated production technology to ensure the capacitor's quality and stable performance.

[0048] A busbar is a metallic conductor whose primary function is to efficiently conduct electricity from a power source (such as a transformer or generator) to the capacitor core. It is not only an important connection point for electrical equipment such as circuit breakers, fuses, and switches, but also allows for the direct mounting or connection of these components via bolts, clips, or other means. The busbar provides a low-resistance path for current, thereby reducing power loss and ensuring efficient power transmission.

[0049] Busbars are primarily made of highly conductive and corrosion-resistant materials such as copper or aluminum, and come in various forms, including flat bars, rectangular bars, and tubular bars, to meet different application requirements and current-carrying standards. Their large surface area helps to quickly dissipate the heat generated by the current, ensuring the stability and safety of the busbar during operation.

[0050] The insulating film plays a crucial role in capacitors, providing not only electrical insulation but also influencing performance parameters such as capacitance density, temperature resistance, and dielectric loss. Below are some commonly used insulating film materials for capacitors in the semiconductor field:

[0051] 1. Polyimide: Polyimide is a high-performance polymer insulating material with excellent thermal stability and electrical insulation properties. It is often used in flexible circuit boards and as an insulating film for semiconductor devices.

[0052] 2. Polytetrafluoroethylene (PTFE): Polytetrafluoroethylene has extremely high dielectric strength and heat resistance, making it suitable for capacitor insulation in high-temperature environments.

[0053] 3. Polyester: Polyester films, such as polyethylene terephthalate (PET), have good electrical insulation properties and mechanical strength, and are widely used in the electronics industry.

[0054] 4. Polypropylene: Polypropylene film (PP) has low cost and good insulation properties, making it suitable for low-voltage applications.

[0055] 5. Polyphenylene Sulfide: Polyphenylene sulfide film has excellent heat resistance and chemical stability, making it suitable for capacitor insulation in high-temperature environments.

[0056] 6. Biaxially Oriented Polypropylene (BOPP): BOPP film has high breakdown strength and low dielectric loss, making it suitable for film capacitors.

[0057] 7. Composite ceramic films: Some studies are exploring the use of composite ceramic films as insulators for MIM capacitors to improve capacitance density and performance.

[0058] 8. Fluorinated polypropylene: By grafting fluorinated groups onto polypropylene, the dielectric properties of the film can be improved, the energy storage density and the adhesion of the metal electrode can be increased, making it suitable for high-performance film capacitors.

[0059] The choice of these materials depends on the specific requirements of the end application, including operating temperature, electrical strength, chemical stability, and cost-effectiveness. As technology advances, new insulating film materials are constantly being developed to meet the demands of higher performance and a wider range of applications.

[0060] Epoxy resin is a high molecular weight polymer with the molecular formula (C11H12O3)n, referring to a class of polymers containing two or more epoxy groups in their molecules. It is a condensation product of epichlorohydrin and bisphenol A (C15H16O2) or polyols. Due to the chemical reactivity of epoxy groups, many compounds containing active hydrogen can react with it to open rings, thereby curing and cross-linking to form a network structure; therefore, it is a thermosetting polymer material. Capacitors are one of the most commonly used components in electronic devices, storing charge and playing a vital role in circuits. However, the internal components of capacitors are often affected by the environment, such as humidity, oxidation, and corrosion, which can lead to performance degradation or even failure.

[0061] To address these issues, epoxy resin 4 is widely used in capacitors. Epoxy resin 4 possesses excellent insulation properties, heat resistance, corrosion resistance, hardness, and temperature resistance. By coating the internal components of a capacitor with epoxy resin 4, the capacitor's performance can be effectively improved, and its service life extended.

[0062] Specific applications of epoxy resin 4 in capacitors

[0063] 1. Protect internal components

[0064] During the capacitor manufacturing process, the internal components are first mounted on the capacitor's busbar 2, and then a layer of epoxy resin 4 is coated on top. This epoxy resin 4 not only protects the internal components from the environmental influences within the capacitor, but also prevents short circuits between components and protects the component wires from damage.

[0065] 2. Improve capacitor performance

[0066] During the use of capacitors, epoxy resin 4 can improve the insulation performance of the capacitors, preventing external factors such as oxidation and humidity from affecting their performance. Furthermore, epoxy resin 4 can also improve the hardness and heat resistance of the capacitors, increasing their stability and reliability.

[0067] The plastic casing (5) is an important component of a capacitor. It not only protects the internal structure of the capacitor but also directly affects its overall performance.

[0068] Plastic, as a lightweight and easily processed material, is widely used in the manufacture of capacitor casings. Compared to traditional metal casings, plastic casings offer lower costs and lighter weight, giving capacitors a significant advantage in fields such as portable electronic devices and automotive electronics. Furthermore, plastic casings possess excellent insulation properties, effectively preventing safety issues such as short circuits or leakage during operation.

[0069] Besides its material advantages, the plastic capacitor casing also exhibits excellent electrical performance. Because plastic itself is an insulating material, it effectively isolates the internal electrode plates of the capacitor from the external environment, thus ensuring stable operation. Furthermore, the plastic casing has good voltage and current withstand capabilities, enabling it to withstand high electrical loads and ensuring normal operation of the capacitor even in harsh working environments.

[0070] However, the heat dissipation capacity of the plastic shell 5 is poor, so existing technology sets a heat dissipation plate 6 on the outside of the plastic shell 5, such as... Figure 1 As shown, in the prior art, a single aluminum plate is directly placed on the outside of the plastic shell 5, covering most of the plastic shell 5. This allows the heat generated by the capacitor to quickly exchange with the air through the aluminum plate, achieving heat dissipation. However, while the advantages of the plastic shell 5 are mentioned above, using a heat dissipation plate 6, such as an aluminum plate, would significantly increase the cost. In simulating the capacitor, the inventors of this application discovered that the heat generated by the heater is concentrated in certain areas. Through reverse deduction, it was found that the capacitor's heating is due to the core 1 being energized, and since the core 1 is arranged at intervals, the heating points are distributed at intervals.

[0071] Therefore, refer to Figure 2 This utility model embodiment provides a thin film capacitor, including: a heat sink 6;

[0072] The heat sink 6 is disposed outside the film capacitor;

[0073] As a preferred implementation of this application, the film capacitor includes a core 1, a busbar 2, an insulating film 3, epoxy resin 4, and a plastic shell 5;

[0074] The core 1 is disposed on the busbar 2, the busbar 2 is provided with an insulating film 3 on the outside, the insulating film 3 is provided with an epoxy resin 4 on the outside, and the epoxy resin 4 is provided with a plastic shell 5 on the outside.

[0075] It should be noted that the embodiments provided in this application only show the structure inside a common capacitor. The structure of other capacitors may not be completely consistent with this embodiment, but as long as they use spaced cores 1, they are all protected by this application. For example, some capacitors do not include epoxy resin 4 and use other materials.

[0076] The heat sink 6 is disposed on the plastic shell 5. In a preferred embodiment of this application, the heat sink 6 is a metal plate with a heat dissipation capacity superior to that of the plastic shell 5.

[0077] The metal plate includes any one of the following:

[0078] Aluminum, copper, steel.

[0079] It should be noted that some non-metallic materials with strong heat dissipation capabilities can also be used to make heat sinks, such as ceramics.

[0080] The heat sink 6 can accelerate the dissipation of heat from the plastic shell 5 and improve the heat dissipation effect.

[0081] The heat sink 6 consists of a heat dissipation area 61 and a connecting structure 62. The width of the heat dissipation area 61 is greater than the width of the connecting structure 62. This reduces the material usage of the connecting structure 62 and further saves materials.

[0082] It should be noted that the heating plate in this application is relatively thin, and the heat sink 6 is considered a two-dimensional object. The width referred to in this application refers to the maximum length of the heat dissipation area 61 or the connecting structure 62 in the target direction, where the target direction is the direction perpendicular to the line connecting the heat-generating points.

[0083] The shape of the heat dissipation area 61 can be any of the following:

[0084] Circles, squares, ovals, rhombuses, and rectangles.

[0085] As a preferred implementation of this application embodiment, the heat dissipation area 61 is circular, which has the best effect (using less material and achieving better heat dissipation). The connected structure 62 is rectangular.

[0086] Each heat dissipation area 61 corresponds to a heating point of the film capacitor, and adjacent heat dissipation areas 61 are connected by a connecting structure 62. Each heat dissipation area 61 corresponds to a heating point of the film capacitor, thus ensuring the heat dissipation effect of the film capacitor while reducing the area of ​​the heat sink 6, eliminating the need for the heat sink 6 to completely cover the film capacitor, and significantly saving material. The connecting structure 62 allows the two heat dissipation areas 61 to be integrally formed during production, facilitating manufacturing; simultaneously, the connecting structure 62 enables heat conduction between the heat dissipation areas 61, assisting in heat dissipation and enhancing the heat dissipation effect.

[0087] Depending on the model of the capacitor, its size and heat generation will vary, but based on experiments with most existing capacitors, the number of heat dissipation areas 61 is any value between 4 and 10.

[0088] In actual production design, the number of heat dissipation areas 61 can be adjusted according to actual needs. The fewer the number of heat dissipation areas 61, the larger the area of ​​the heat dissipation area 61 closest to the input terminal of the film capacitor. The fewer the number, the larger the required heat dissipation area 61, thus ensuring the heat dissipation effect.

[0089] Preferably, the number of heat dissipation areas 61 is 7.

[0090] In one embodiment, the area of ​​the heat dissipation region 61 is the same.

[0091] However, through simulation and experimental testing, the inventors of this application discovered that the heat generated by each heating point of the electric heater is different. The heating point closest to the input terminal (with the positive and negative terminals set at the same end) generates the most heat, and the further away the heating point is from the input terminal, the lower the heat generation.

[0092] Therefore, as a preferred implementation of this application embodiment, the area of ​​the heat dissipation area 61 decreases sequentially;

[0093] Among them, the heat dissipation area 61, which has the largest area, is closest to the input terminal of the thin-film capacitor.

[0094] Taking the heat dissipation area 61 as a circle as an example, the closer it is to the input end of the thin film capacitor, the larger its diameter or radius. This can ensure the heat dissipation effect while saving materials.

[0095] The thin-film capacitor provided in this application includes a heat sink, which is disposed outside the thin-film capacitor. The heat sink consists of heat dissipation areas and a connecting structure. Each heat dissipation area corresponds to a heat-generating point of the thin-film capacitor. This reduces the area of ​​the heat sink while ensuring the heat dissipation effect of the thin-film capacitor, as it does not need to completely cover the thin-film capacitor, thus greatly saving materials. Adjacent heat dissipation areas are connected by a connecting structure. The connecting structure allows the two heat dissipation areas to be integrally molded during production, facilitating manufacturing. Simultaneously, the connecting structure enables heat conduction between the heat dissipation areas, aiding in heat dissipation and enhancing the heat dissipation effect. The width of the heat dissipation area is greater than the width of the connecting structure, which reduces the material used in the connecting structure, further saving materials.

[0096] The following provides a specific experimental comparison, using a target capacitor (such as...) Figure 2 The heat dissipation structure shown is an electrical component, and the comparison capacitor (using, for example) is a capacitor with a heat dissipation structure shown. Figure 1 The capacitor shown in the heat dissipation structure has specifications of 1000V, 1300μF, DC input current of 550A, and ripple current of 360A. Its basic structure consists of a core, insulating film, epoxy resin, plastic shell, busbar, and aluminum plate.

[0097] The capacitor consists of 24 cores arranged in 3 rows and 8 columns. Cut copper plates are stamped to create solder joints and through holes, then bent to form separate upper and lower busbars. Insulating paper is added between the stacked busbars. The assembled semi-finished product is then filled with epoxy resin. The insulating film is 4-5mm larger than the aluminum plate, completely covering it, and is installed tightly against the aluminum plate. (The two capacitors use the same gas, except for the aluminum plate.)

[0098] The aluminum plate is designed according to the actual heating point. It mainly adopts a gourd-shaped integrated design with seven circles connected in series, which facilitates the injection molding of the aluminum plate. The area of ​​the aluminum plate accounts for about 60% of the original design area and about 40% to 50% of the cost.

[0099] Temperature rise tests were conducted on the target capacitor and the control capacitor. Temperature sensing wires were placed at the heating points of each core, and a 360A ripple AC current at a frequency of 4kHz was applied to each pair of small terminals. The test was conducted for 48 hours at 85℃. Capacitance, loss, and ESR (Equivalent Series Resistance) were measured before and after the test. For the last 6 hours, the temperature of each sensing wire was measured every hour. The test data for the last 6 hours are shown in Table 1 (Ripple Temperature Rise Test Data for Control Capacitor) and Table 2 (Ripple Temperature Rise Test Data for Target Capacitor).

[0100] Table 1

[0101] 43h 44h 45h 46h 47h 48h Average CH1 / °C 90.7 90.9 90.8 90.8 90.9 91.2 90.9 CH2 / °C 88.2 88.2 88.2 88.2 88.2 88.5 88.3 CH3 / °C 87.5 87.7 87.6 87.5 87.6 88.0 87.7 CH4 / °C 91.0 90.9 91.0 91.0 91.1 91.4 91.1 CH5 / °C 88.4 88.3 88.4 88.4 88.5 88.8 88.5 CH6 / °C 86.5 86.6 86.5 86.5 86.6 86.8 86.6 Ambient °C 85.5 85.6 85.9 85.8 85.8 85.9 85.8

[0102] Table 2

[0103]

[0104]

[0105] Six temperature sensing lines were installed inside the target capacitor and the control capacitor. By comparing the ripple temperature rise test data of the two designs, the maximum design temperature of the target capacitor reached 93.6℃, ​​which is 2.5℃ different from the maximum design temperature of the control capacitor. The average design temperature of the target capacitor was 91.9℃, which is 3.06℃ different from the average design temperature of the control capacitor. This temperature difference has little impact on the operational stability and reliability of the capacitor, and it is estimated that it can reduce the amount of aluminum plate used by 40% to 50%.

[0106] Based on the same concept, embodiments of this application also provide an electrical device, including: a thin-film capacitor as described in any of the above embodiments.

[0107] The electrical device provided in this application includes an internal thin-film capacitor with a heat sink. The heat sink is disposed outside the thin-film capacitor and consists of heat dissipation areas and a connecting structure. Each heat dissipation area corresponds to a heating point of the thin-film capacitor. This ensures the heat dissipation effect of the thin-film capacitor while reducing the area of ​​the heat sink, eliminating the need for the heat sink to completely cover the thin-film capacitor, thus significantly saving materials. Adjacent heat dissipation areas are connected by a connecting structure. This connecting structure allows for integral molding of the two heat dissipation areas during production, facilitating manufacturing. Simultaneously, the connecting structure enables heat conduction between the heat dissipation areas, aiding in heat dissipation and enhancing the heat dissipation effect. The width of the heat dissipation area is greater than the width of the connecting structure, reducing the material used in the connecting structure and further saving materials.

[0108] It is understood that the same or similar parts in the above embodiments can be referred to each other, and the contents not described in detail in some embodiments can be referred to the same or similar contents in other embodiments.

[0109] It should be noted that in the description of this application, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this application, unless otherwise stated, "a plurality of" means at least two.

[0110] Any process or method described in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code comprising one or more executable instructions for implementing a particular logical function or process, and the scope of the preferred embodiments of this application includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order depending on the function involved, as will be understood by those skilled in the art to which embodiments of this application pertain.

[0111] It should be understood that various parts of this application can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0112] Those skilled in the art will understand that all or part of the steps of the methods described in the above embodiments can be implemented by a program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, it includes one or a combination of the steps of the method embodiments.

[0113] Furthermore, the functional units in the various embodiments of this application can be integrated into a processing module, or each unit can exist physically separately, or two or more units can be integrated into a module. The integrated module can be implemented in hardware or as a software functional module. If the integrated module is implemented as a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium.

[0114] The storage media mentioned above can be read-only memory, disk, or optical disk, etc.

[0115] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0116] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A thin-film capacitor, characterized in that, include: Heat sink; The heat sink is disposed outside the film capacitor; The heat sink consists of a heat dissipation area and a connecting structure, wherein the width of the heat dissipation area is greater than or equal to the width of the connecting structure. Each heat dissipation area corresponds to a heat-generating point of the thin-film capacitor, and two adjacent heat dissipation areas are connected by a connecting structure.

2. The thin-film capacitor according to claim 1, characterized in that: The area of ​​the heat dissipation zone decreases sequentially; The area with the largest heat dissipation area is closest to the input terminal of the thin-film capacitor.

3. The thin-film capacitor according to claim 1, characterized in that: The shape of the heat dissipation area can be any of the following: Circles, squares, ovals, rhombuses, and rectangles.

4. The thin-film capacitor according to claim 1, characterized in that: The number of heat dissipation zones is any value between 4 and 10.

5. The thin-film capacitor according to claim 4, characterized in that: The number of heat dissipation zones is 7.

6. The thin-film capacitor according to claim 1, characterized in that: The fewer the number of heat dissipation areas, the larger the area of ​​the heat dissipation area closest to the input terminal of the thin-film capacitor.

7. The thin-film capacitor according to claim 1, characterized in that: The film capacitor includes a core, busbar, insulating film, epoxy resin, and plastic shell; The core is disposed on the busbar, an insulating film is disposed on the outside of the busbar, epoxy resin is disposed on the outside of the insulating film, and a plastic shell is disposed on the outside of the epoxy resin.

8. The thin-film capacitor according to claim 7, characterized in that: The heat sink is mounted on the plastic casing.

9. The thin-film capacitor according to claim 7, characterized in that: The heat sink is a metal plate with better heat dissipation capacity than the plastic shell; The metal plate includes any one of the following: Aluminum, copper, steel.

10. An electrical appliance, characterized in that, include: The film capacitor as described in any one of claims 1-9.

Images