Structure for enhancing wafer holding force

Abstract

The utility model belongs to the technical field of high-speed backplane connectors, and particularly relates to a structure for enhancing wafer retention, which comprises a plurality of high-speed backplane connectors arranged side by side along the width direction, and each high-speed backplane connector comprises a shell, a wafer, a positioning plate and a fixing sheet, and one, two or three of the shell, the positioning plate and the fixing sheet in each high-speed backboard connector are connected through the corresponding connecting parts. According to the utility model, two or more than two adjacent high-speed backboard connectors arranged side by side in a case are improved, and the shell, the positioning plate or the fixing sheet are connected into a whole through the connecting part, so that the high-speed backboard connectors arranged side by side form a whole, the arm of force of holding force is increased, and the reliability of the high-speed backboard connectors is improved. And the plugging stability of the high-speed backboard connector on the printed board is improved.

Description

Technical Field

[0001] This utility model belongs to the field of high-speed backplane connector technology, specifically relating to a structure that enhances chip retention force. Background Technology

[0002] High-speed backplane connectors with a fisheye structure are mounted on a printed circuit board. When transmitting high-speed signals, and especially when the number of differential pairs in the high-speed backplane connector is small, significant differences in the aspect ratio often occur. In some cases, the aspect ratio of the high-speed backplane connector is greater than 2. Figure 1 As shown, this can easily lead to the high-speed backplane connector detaching from the printed circuit board (PCB) under normal operating conditions. For example, when the high-speed backplane connector is mounted on the PCB, its width direction is vertical. In the vertical direction, due to the fewer fisheye structures, the holding arm of the high-speed backplane connector is short, resulting in a weak bonding force between the connector and the PCB, making it easy for the connector to detach. Furthermore, when the high-speed backplane connector is subjected to vibration or lateral push (in which case the force is applied in the width direction), it is even more likely to detach. Therefore, how to further enhance the chip retention force in the high-speed backplane connector without affecting customer use or reducing its performance and reliability becomes a design challenge.

[0003] To address the aforementioned challenges, existing high-speed backplane connectors employ the following technical solutions:

[0004] Option 1: Increase the size of the fisheye structure in the high-speed backplane connector and the corresponding aperture on the printed circuit board (PCB). This increases the holding force of the fisheye structure to enhance the overall reliability of the high-speed backplane connector and prevent it from detaching from the PCB. Disadvantages of this option: Enlarging the fisheye structure requires a corresponding increase in the PCB aperture, compressing the PCB design space; the increased size of the fisheye structure further reduces the fisheye impedance on the PCB, significantly impacting the performance of the high-speed backplane connector; and the optimization of the overall holding force by increasing the fisheye structure is limited, with an optimization range of approximately 20%-50%.

[0005] Option 2: Reduce the overall length or height of the high-speed backplane connector. Disadvantages of this option: poor versatility; it cannot be adjusted for mating area compatibility issues and cannot be adapted to corresponding high-speed backplane connector models; the high-speed backplane connector solution requires major modifications, and product performance cannot be guaranteed. Utility Model Content

[0006] To address the aforementioned technical problem of poor overall holding force in high-speed backplane connectors, this invention provides a structure that enhances chip holding force.

[0007] The purpose of this utility model is achieved by the following technical solution. According to this utility model, an enhanced wafer retention force structure includes several high-speed backplane connectors arranged side-by-side along the width direction. Each high-speed backplane connector includes a housing, a wafer, a positioning plate, and a fixing plate. One, two, or three of the housing, positioning plate, and fixing plate in each high-speed backplane connector are connected by corresponding connecting parts.

[0008] Furthermore, the positioning plates in each high-speed backplane connector are connected via connecting part I, and the positioning plate and connecting part I are integrally formed.

[0009] Furthermore, the positioning plate is a plastic positioning plate, and the connecting part I is a plastic connecting part. The thickness of the connecting part I is greater than the thickness of the positioning plate, and the connecting part I protrudes from the rear end face of the positioning plate.

[0010] Furthermore, the housings in each high-speed backplane connector are connected by a connecting part II, the end of which is located on the side wall of the housing.

[0011] Furthermore, the fixing plates in each high-speed backplane connector are connected by the connecting part III, and the fixing plates and the connecting part III are integrally formed.

[0012] Furthermore, both the fixing plate and the connecting part III have L-shaped cross sections. The two mutually perpendicular surfaces of the connecting part III extend in a direction away from the right angle and are flush with the corresponding surfaces of the fixing plate.

[0013] Furthermore, the extension lengths of both surfaces of the connecting part III away from the right angle are shorter than the extension lengths of the corresponding surfaces of the fixing piece.

[0014] Furthermore, a through hole is provided on the connecting part III.

[0015] Furthermore, the connecting part III is a stainless steel connecting part, and the fixing plate is a stainless steel fixing plate.

[0016] Compared with the prior art, the advantages of this utility model are:

[0017] This invention improves upon two or more high-speed backplane connectors that are arranged side-by-side and adjacent within a chassis. By connecting the housing, positioning plate, or fixing plate into a single unit through a connecting part, the high-speed backplane connectors arranged side-by-side form a whole, thereby increasing the holding force arm and improving the stability of the high-speed backplane connectors when inserted onto the printed circuit board.

[0018] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, and to make the purpose, features and advantages of this utility model more obvious and easy to understand, the following are preferred embodiments, and detailed descriptions are provided in conjunction with the accompanying drawings. Attached Figure Description

[0019] Figure 1 This is a schematic diagram showing the length and width of a high-speed backplane connector in the prior art;

[0020] Figure 2 This is a schematic diagram of the components of a high-speed backplane connector in the prior art;

[0021] Figure 3 This is a three-dimensional schematic diagram of a first embodiment of the structure for enhancing wafer retention force according to this utility model;

[0022] Figure 4 for Figure 3 A three-dimensional diagram from another perspective;

[0023] Figure 5 This is a three-dimensional schematic diagram of a second embodiment of the structure for enhancing wafer retention force according to this utility model;

[0024] Figure 6 for Figure 5 A three-dimensional diagram from another perspective;

[0025] Figure 7 This is a three-dimensional schematic diagram of a third embodiment of the structure for enhancing wafer retention force according to this utility model;

[0026] Figure 8 for Figure 7 A three-dimensional diagram from another perspective.

[0027] Figure label:

[0028] 1-Shell; 2-Crystal; 21-Fisheye structure; 3-Positioning plate; 4-Fixing piece; 5-Connecting part I; 6-Connecting part II; 7-Connecting part III. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] This invention improves upon existing high-speed backplane connectors. In the prior art, the holding force lever arm distance of the fisheye structure 21 in high-speed backplane connectors is too short, and the aspect ratio is too large (reaching 2:1 or higher). Figure 1As shown. High-speed backplane connectors are mostly used side by side in the chassis. Several high-speed backplane connectors are arranged along the width direction of the high-speed backplane connector. In order to further improve the overall holding force of the product, it can be optimized by increasing the holding force lever arm of the fisheye structure 21.

[0031] In existing technologies, high-speed backplane connectors typically include a housing 1, a wafer 2, a positioning plate 3, and a retaining plate 4, such as... Figure 2 As shown, the description focuses on the side where the high-speed backplane connector is inserted into the printed circuit board. Several chips 2 are inserted side-by-side on one side of the housing 1. A positioning plate 3 is provided on the front side of the high-speed backplane connector. The fisheye structure 21 on each chip 2 passes through and extends out of the positioning plate 3, which protects the fisheye structure 21. A fixing plate 4 is provided at the right angle formed by the side of the chip 2 away from the housing 1 and the rear side. The fixing plate 4 has an L-shaped cross-section. The two sides of the fixing plate 4 are fixed to the side of the chip 2 away from the housing 1 and the rear side of the chip 2, respectively. This increases the stability of each chip 2 in the high-speed backplane connector in the insertion direction and in the direction perpendicular to the insertion direction. Each chip 2 is fixedly set with the fixing plate 4, which prevents the chip 2 from shaking.

[0032] Since chip 2 is a component used side-by-side and is the main component for high-speed backplane connectors to achieve their signal transmission function, its shape cannot be improved. Therefore, this invention focuses on improving three components: housing 1, positioning plate 3, and fixing plate 4. Multiple high-speed backplane connectors are typically installed in the chassis and used side-by-side. Therefore, this invention improves two adjacent high-speed backplane connectors located side-by-side in the chassis by connecting housing 1 and positioning plate 3 or fixing plate 4 into a single unit through a connecting part, thereby increasing the holding force arm.

[0033] One embodiment of the present invention is a structure for enhancing wafer retention force, as shown in the example below. Figures 3-4 As shown, for two adjacent high-speed backplane connectors, the positioning plates 3 of the two high-speed backplane connectors are connected by the connecting part I5, so that the two high-speed backplane connectors are combined into one, increasing the holding force arm of the fisheye structure 21, making the high-speed backplane connectors more reliable in vibration environment or during side push process, and preventing the high-speed backplane connectors from falling off the printed circuit board.

[0034] The positioning plate 3 is made of plastic, and the connecting part I5 is also made of plastic. The positioning plate 3 and connecting part I5 are integrally formed. This integrated structure is located at the front end of the two high-speed backplane connectors. After the high-speed backplane connectors are inserted into the printed circuit board (PCB), the integrated structure is close to the PCB, effectively placing the front ends of the two high-speed backplane connectors integrally onto the PCB, thus increasing the holding force arm. Since both the positioning plate 3 and connecting part I5 are made of plastic, a relatively soft material, to increase rigidity and prevent the holding force arm from wobbling, thereby maintaining the stability of the high-speed backplane connectors on the PCB, the thickness of connecting part I5 needs to be increased. Therefore, the thickness of connecting part I5 is greater than the thickness of the positioning plate 3, and the increase in thickness is backward, causing connecting part I5 to protrude beyond the rear end face of the positioning plate 3 to avoid interference with the PCB.

[0035] In this embodiment, the rear end of the high-speed backplane connector is suspended, causing it to tilt during side pushing. Therefore, it is necessary to maintain the stability of the rear end of the high-speed backplane connector during operation. When using the improved high-speed backplane connector, the printed circuit board between the two connectors connected by the connecting part I5 may contain components, which could easily lead to interference. Therefore, when using the improved high-speed backplane connector of this embodiment, it is necessary to ensure that there are no components on the printed circuit board between the two connectors connected by the connecting part I5, or that the components are low enough to avoid interference. Furthermore, since the positioning plate 3 is a plastic part, it requires a relatively thick and wide surface to achieve good strength. Therefore, this embodiment is suitable for applications where volume and space are not critical.

[0036] A second embodiment of the present invention provides a structure for enhancing wafer retention force, as follows: Figures 5-6 As shown, a connecting part II6 is provided between the housings 1 of two adjacent high-speed backplane connectors. The end of the connecting part II6 is located on the side wall of the housing 1. The connecting part II6 is integrally formed with the housing 1 or separately formed. If it is separately formed, the connecting part II6 can be fixed to the housing 1 of the high-speed backplane connector by adhesive bonding. The material of the connecting part II6 is the same as or different from that of the housing 1. The interior of the connecting part II6 is hollow or solid. The housings 1 of two adjacent high-speed backplane connectors are connected together through the connecting part II6, so that the housings 1 of the two adjacent high-speed backplane connectors form a whole, which increases the stability between the high-speed backplane connector and the printed circuit board.

[0037] The housings 1 of two adjacent high-speed backplane connectors are connected together, so that the two high-speed backplane connectors are connected from the front end to the rear end. However, the housing 1 is located on the side of the high-speed backplane connector. The chip 2, positioning plate 3, and fixing plate 4 in the two high-speed backplane connectors are still in a separate state. In particular, the chip 2 in the two high-speed backplane connectors is in an independent state. The overall stability of the high-speed backplane connector is poor. In actual use, the high-speed backplane connector is prone to slight separation. Therefore, this embodiment is suitable for environments that are not subject to vibration and shock.

[0038] Embodiment 3 of the present invention provides a structure for enhancing wafer retention force, such as... Figures 7-8 As shown, the fixing plates 4 of two adjacent high-speed backplane connectors are connected by the connecting part Ⅲ7. In this embodiment, the connecting part Ⅲ7 and the fixing plate 4 are integrally formed. In other embodiments, the connecting part Ⅲ7 can also be separately formed from the fixing plate 4, and the connecting part Ⅲ7 and the fixing plate 4 can be connected together by screws, rivets or other connecting parts.

[0039] Since the fixing plate 4 has an L-shaped cross-section, the connecting part Ⅲ7 also has an L-shaped cross-section to match it. The intersection of the two mutually perpendicular surfaces of the connecting part Ⅲ7 is at a right angle. The two mutually perpendicular surfaces of the connecting part Ⅲ7 extend away from the right angle, making them flush with the corresponding surfaces of the fixing plate 4. To reduce the weight of the improved high-speed backplane connector, the extension lengths of the two surfaces of the connecting part Ⅲ7 away from the right angle are shorter than the extension lengths of the corresponding surfaces of the fixing plate 4, and through holes are provided on the connecting part Ⅲ7. The L-shaped connecting part Ⅲ7 not only connects the two high-speed backplane connectors into one body but also ensures the stability of the high-speed backplane connector in two mutually perpendicular directions.

[0040] Connector III7 is made of stainless steel. When connector III7 and fixing plate 4 are integrally set, their materials are the same. Fixing plate 4 is a stainless steel fixing plate. The stainless steel connector III7 has high overall strength, which can reduce its thickness to only 0.06mm, minimizing its impact on spatial layout. The through holes in connector III7 can be used for heat dissipation, ensuring that the improved high-speed backplane connector has similar heat dissipation performance to existing high-speed backplane connectors. Fixing plate 4 and connector III7 can be integrated as a single part or connected and fixed as a whole, which can uniformly fix the chip 2 in the two high-speed backplane connectors, ensuring accurate positioning and better stability of the two high-speed backplane connectors at the fisheye structure 21. Connecting two adjacent high-speed backplane connectors through connector III7 makes the overall crimping reliability of the product higher.

[0041] In other embodiments of this utility model, improvements are made based on the above embodiments. In other embodiments, it is not limited to two adjacent high-speed backplane connectors. Two or more high-speed backplane connectors are arranged side by side in the width direction of the high-speed backplane connectors, and the housings 1, positioning plates 3 or fixing pieces 4 of the two or more high-speed backplane connectors are connected by corresponding connecting parts.

[0042] In other embodiments of this utility model, improvements are made based on the above embodiments. In other embodiments, two or more high-speed backplane connectors arranged side by side can connect two or three of the housing 1, positioning plate 3, and fixing piece 4 of the high-speed backplane connector into one unit through corresponding connecting parts.

[0043] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A structure for enhancing wafer retention force, comprising a plurality of high-speed backplane connectors arranged side-by-side along the width direction, wherein the high-speed backplane connectors include a housing (1), a wafer (2), a positioning plate (3), and a fixing plate (4), characterized in that: One, two, or three of the housing (1), positioning plate (3), and fixing piece (4) in each high-speed backplane connector are connected by corresponding connecting parts.

2. The structure for enhancing wafer retention force according to claim 1, characterized in that: The positioning plate (3) in each high-speed backplane connector is connected by the connecting part I (5), and the positioning plate (3) and the connecting part I (5) are integrally set.

3. The structure for enhancing wafer retention force according to claim 2, characterized in that: The positioning plate (3) is a plastic positioning plate, and the connecting part I (5) is a plastic connecting part. The thickness of the connecting part I (5) is greater than the thickness of the positioning plate (3), and the connecting part I (5) protrudes from the rear end face of the positioning plate (3).

4. The structure for enhancing wafer retention force according to claim 1, characterized in that: The housing (1) in each high-speed backplane connector is connected by a connecting part II (6), the end of which is located on the side wall of the housing (1).

5. The structure for enhancing wafer retention force according to claim 1, characterized in that: The fixing piece (4) in each high-speed backplane connector is connected by the connecting part Ⅲ (7), and the fixing piece (4) and the connecting part Ⅲ (7) are integrally set.

6. The structure for enhancing wafer retention force according to claim 5, characterized in that: The cross-sections of the fixing plate (4) and the connecting part III (7) are both L-shaped. The two mutually perpendicular surfaces of the connecting part III (7) extend in a direction away from the right angle and are flush with the corresponding surfaces of the fixing plate (4).

7. The structure for enhancing wafer retention force according to claim 6, characterized in that: The extension lengths of the two surfaces of the connecting part Ⅲ (7) away from the right angle are both shorter than the extension lengths of the corresponding surfaces of the fixing piece (4).

8. The structure for enhancing wafer retention force according to claim 6, characterized in that: A through hole is provided on the connecting part Ⅲ (7).

9. The structure for enhancing wafer retention force according to claim 6, characterized in that: Connecting part Ⅲ (7) is a stainless steel connecting part, and fixing piece (4) is a stainless steel fixing piece.

Images