Structure for carrying small wafer on large base of quartz crystal oscillator

Abstract

The utility model discloses a structure for carrying a small wafer on a large base of a quartz crystal oscillator, which comprises a base, a connecting disc, a dispensing adhesive and a wafer, the two connecting discs are mounted in the base; the upper surfaces of the ends, close to each other, of the two connecting discs are provided with arc structures, each arc structure is provided with dispensing glue, the wafer is arranged on the two connecting discs through the dispensing glue, the head of the wafer is flush with the head of the dispensing glue, and the wafer is parallel to the base. According to the device, the amount of glue below the leftmost end of the wafer is large, the right end of the wafer extends into the containing space, the right end of the wafer is arranged in the containing space in a suspended mode, the whole wafer is parallel to the base, after the wafer is fixed, the next baking process is carried out, the dispensing glue below the left end of the wafer can contract, downward pulling force is generated on the left end of the wafer, and the wafer can be dried. The right end of the wafer is lifted by utilizing the lever effect, thereby effectively preventing the right end of the wafer from collapsing, ensuring that the right end of the wafer does not touch the base bottom plate, and improving the stability and reliability of the product.

Description

Technical Field

[0001] This utility model relates to the technical field of quartz crystal resonators and related fields, and in particular to a structure for mounting a small crystal on a large base of a quartz crystal oscillator. Background Technology

[0002] Quartz crystal resonators mainly consist of a base, a wafer, conductive adhesive, and a top cover. During production, to reduce development costs and improve the versatility of wafer materials, a small-sized wafer is sometimes mounted in bases of various sizes. However, when a small-sized wafer is mounted in a large or medium-sized base, the right end of the wafer cannot contact the right-side pad within the base, causing it to collapse. This design places high demands on the dispensing process. Adhesive is typically applied to the lower left side of the wafer to secure it, while the right end needs to be suspended to ensure the wafer does not touch the base plate; otherwise, product failure or performance instability may occur. In existing technologies, improper dispensing and wafer mounting positions can easily lead to right-side wafer collapse, affecting product reliability. Utility Model Content

[0003] In view of this, in order to solve the above problems, the purpose of this utility model is to provide a structure for mounting a small crystal chip on a large base of a quartz crystal oscillator, comprising:

[0004] Base, connecting plate, dispensing, chip;

[0005] The two connecting discs are installed inside the base;

[0006] The upper surface of the two connecting disks at their close ends is provided with an arc structure, and each arc structure is provided with a dispensing adhesive. The wafer is set on the two connecting disks by the two dispensing adhesives. The head of the wafer and the head of the dispensing adhesive are flush, and the wafer is parallel to the base.

[0007] The above-mentioned structure of a quartz crystal oscillator base supporting a small crystal chip includes an opening in which an inwardly recessed accommodating space is provided, and two connecting disks are disposed in the accommodating space.

[0008] In the above-mentioned structure of a large base for a quartz crystal oscillator with a small wafer, the bottom of the two connecting disks is located at the bottom of the accommodating space, and the sidewalls of the two connecting disks are attached to the sidewalls of the accommodating space.

[0009] In the above-mentioned structure of a large base for a quartz crystal oscillator with a small wafer, the head of each dispensing nozzle is located on the arc-shaped portion of the arc structure, and the tail of the dispensing nozzle is located on the top of the arc structure.

[0010] In the above-mentioned structure of a large base for a quartz crystal oscillator with a small wafer, the thickness of the head of the dispensing is greater than the thickness of the tail of the dispensing, so that the upper surface of the dispensing is flush.

[0011] In the above-mentioned structure of a quartz crystal oscillator with a large base supporting a small chip, the head of the chip is disposed at the head of the dispensing, and the tail of the chip is suspended in the accommodating space.

[0012] The above-mentioned structure of a quartz crystal oscillator large base supporting a small chip, wherein the two corners of the chip are disposed at the heads of the two dispensing points.

[0013] The positive effects of the above technical solution compared with the existing technology are:

[0014] By applying this utility model, a structure is provided for mounting a small crystal on a large quartz crystal base. The adhesive layer on the lower left side of the crystal is thicker, and the right side of the crystal extends into the receiving space. The right side of the crystal is suspended in the receiving space, and the crystal is parallel to the base. After the crystal is fixed, the next baking process is carried out. The adhesive layer on the lower left side of the crystal shrinks, generating a downward pulling force on the left side of the crystal. By utilizing the leverage effect, the right side of the crystal is lifted, which can effectively prevent the right side of the crystal from collapsing and ensure that the right side of the crystal does not touch the base plate, thereby improving the stability and reliability of the product. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of a structure of a large base for a quartz crystal oscillator with a small crystal chip mounted on it, according to the present invention.

[0016] Figure 2 This is a side view of a structure of a large base for a quartz crystal oscillator with a small crystal chip mounted on it, according to the present invention.

[0017] Figure 3 for Figure 2 Enlarged view of part A in the middle.

[0018] 1. Base; 2. Connecting plate; 3. Dispensing adhesive; 4. Wafer; 5. Arc structure; 6. Accommodation space. Detailed Implementation

[0019] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.

[0020] The structures, proportions, and sizes illustrated in the accompanying drawings are merely for illustrative purposes and to aid those skilled in the art. They are not intended to limit the scope of this invention and therefore have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, provided they do not affect the effectiveness or purpose of this invention, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms "upper," "lower," "left," "right," "middle," and "one" used in this specification are merely for clarity and not intended to limit the scope of this invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this invention.

[0021] like Figures 1 to 3 As shown, a preferred embodiment of a quartz crystal oscillator large base mounting a small chip is illustrated, which includes: base 1, connecting disk 2, adhesive dispensing 3, and chip 4.

[0022] Two connecting disks 2 are installed inside the base 1; an arc structure 5 is provided on the upper surface of the two connecting disks 2 at the ends that are close to each other, and a dot adhesive 3 is provided on each arc structure 5. The chip 4 is set on the two connecting disks 2 through the two dots adhesive 3. The head of the chip 4 and the head of the dot adhesive 3 are flush, and the chip 4 is parallel to the base 1.

[0023] In actual use, a glue dot 3 is set on the upper surface of each of the two connecting disks 2 that are close to each other. The chip 4 can be mounted on the two connecting disks 2 through the two glue dots 3, so that the left end of the chip 4 is attached to the glue dot 3, and the right end of the chip 4 is suspended inside the base 1. When the chip 4 needs to proceed to the next baking process, the glue dot 3 below the left end of the chip 4 contracts and generates a downward pulling force on the chip, using the leverage effect to lift the right end of the chip 4.

[0024] Based on the above, this utility model also has the following embodiments:

[0025] Furthermore, a structure for mounting a small chip on a large quartz crystal oscillator base is provided, wherein the base 1 has an opening, and the opening is recessed inward to provide an accommodating space 6, and two connecting disks 2 are disposed in the accommodating space 6.

[0026] Furthermore, a structure for mounting a small chip on a large quartz crystal oscillator base is provided, wherein the bottom of the two connecting disks 2 is located at the bottom of the accommodating space 6, and the sidewalls of the two connecting disks 2 are attached to the sidewalls of the accommodating space 6.

[0027] Furthermore, a structure for mounting a small chip on a large quartz crystal oscillator base is provided, wherein the head of each adhesive dot 3 is located on the arc-shaped part of the arc structure 5, and the tail of the adhesive dot 3 is located on the top of the arc structure 5.

[0028] Furthermore, a structure for mounting a small chip on a large quartz crystal oscillator base is provided, wherein the thickness of the head of the adhesive 3 is greater than the thickness of the tail of the adhesive 3, so that the upper surface of the adhesive 3 is flush.

[0029] Furthermore, a structure for mounting a small crystal chip on a large quartz crystal oscillator base is provided. The head of the chip 4 is positioned at the head of the adhesive dispensing 3, and the tail of the chip 4 is suspended within the accommodating space 6. Specifically, the leftmost end of the chip 4 is located in the arc portion of the arc structure 5, and the adhesive layer below the leftmost end of the chip 4 is thicker. The right end of the chip 4 extends into the accommodating space 6, and is suspended within the accommodating space 6. The chip 4 is parallel to the base 1. After the chip 4 is fixed in place, during the next baking process, the adhesive dispensing 3 below the left end of the chip 4 contracts, generating a downward pulling force on the left end of the chip 4. Utilizing the leverage effect, this lifts the right end of the chip 4. Compared to conventional dispensing methods, the position of the adhesive dispensing 3 is shifted to the left relative to the left end of the chip 4, causing the chip 4 to move to the left as a whole, thereby increasing the probability of the right end of the chip 4 being suspended from 55% to 90%.

[0030] In practical applications, the offset distance of the dispensing position 3 can be adjusted according to the size of the chip 4 and the size of the connecting plate 2, so that the thicker part of the dispensing 3 is aligned with the head of the chip 4. By adjusting the position of the dispensing 3, the right end of the chip 4 can be effectively prevented from collapsing, ensuring that the right end of the chip 4 will not touch the base plate 1, thereby improving the stability and reliability of the product.

[0031] Furthermore, a structure is provided for a quartz crystal oscillator base with a small chip mounted on it, wherein the two corners of the chip 4 are positioned at the head of the two adhesive dots 3.

[0032] The above description is only a preferred embodiment of the present utility model and does not limit the implementation method and protection scope of the present utility model. Those skilled in the art should realize that all solutions obtained by equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A structure for mounting a small crystal chip on a large quartz crystal oscillator base, characterized in that, include: Base, connecting plate, dispensing, chip; The two connecting discs are installed inside the base; The upper surface of the two connecting disks at their close ends is provided with an arc structure, and each arc structure is provided with a dispensing adhesive. The wafer is set on the two connecting disks by the two dispensing adhesives. The head of the wafer and the head of the dispensing adhesive are flush, and the wafer is parallel to the base.

2. The structure of a quartz crystal oscillator with a small wafer mounted on a large base according to claim 1, characterized in that, The base has an opening, and the opening is recessed inward to provide an accommodating space, in which the two connecting discs are disposed.

3. The structure of a quartz crystal oscillator with a small wafer mounted on a large base according to claim 2, characterized in that, The bottom of the two connecting discs is located at the bottom of the accommodating space, and the sidewalls of the two connecting discs are attached to the sidewalls of the accommodating space.

4. The structure of a quartz crystal oscillator with a small wafer mounted on a large base according to claim 2, characterized in that, Each dispensing head is located on the arc-shaped portion of the arc structure, and the dispensing tail is located on the top of the arc structure.

5. The structure of a quartz crystal oscillator with a small wafer mounted on a large base according to claim 4, characterized in that, The thickness of the dispensing head is greater than the thickness of the dispensing tail, so that the upper surface of the dispensing is flush.

6. The structure of a quartz crystal oscillator with a small wafer mounted on a large base according to claim 5, characterized in that, The head of the wafer is disposed at the head of the dispensing device, and the tail of the wafer is suspended within the accommodating space.

7. The structure of a quartz crystal oscillator with a small wafer mounted on a large base according to claim 1, characterized in that, The two corners of the wafer are located at the heads of the two dispensing points.

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