Multifunctional base structure with four built-in PADs

Abstract

The utility model discloses a built-in four-PAD multifunctional pedestal structure, comprising a pedestal main body, the middle of the pedestal main body is provided with a groove used for carrying a wafer, the bottom of the groove is provided with four boss-shaped dispensing PAD, and the four corners of the bottom of the wafer are respectively adhered to the four dispensing PAD. According to the utility model, the number of the bottom glue points in the cavity of the base is increased to four from two in the prior art, the bonding interface structure of the wafer and the base is obviously optimized, the four bottom glue points are symmetrically distributed, the bonding area is effectively enlarged, the stress distribution of the glue layer is more uniform, the bonding strength is improved, and the bonding strength is improved in a harsh vibration environment. The structure can greatly reduce the risk of fatigue cracking of the adhesive layer, and ensures that the wafer and the base are always kept in good contact.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of quartz crystal resonator especially relates to a built-in four PAD multifunctional pedestal structure. BACKGROUND

[0002] In prior art, quartz wafer is usually fixed through double bottom glue points on two PADs in pedestal cavity, and two glue points are additionally arranged on wafer surface to complete packaging.

[0003] The above scheme can meet the basic fixing requirement under conventional vibration environment, but when the product is applied to high-frequency and high-amplitude harsh vibration scene such as ultrasonic wave, there are significant defects. Since vibration energy is concentrated on the wafer and the bonding interface of the pedestal, the conventional dispensing structure is difficult to effectively disperse stress, leading to fatigue cracking of the glue layer, eventually causing the wafer and the pedestal to separate, causing product failure. This failure mode is particularly prominent in ultrasonic cleaning equipment, precision vibration sensor and other application scenarios, and has become a technical bottleneck restricting the improvement of product reliability. Therefore, developing a packaging structure with stronger anti-vibration capability has become an urgent technical direction to meet the demand of new generation of high-reliability products. SUMMARY

[0004] In view of the above problems of the existing quartz wafer packaging, the utility model is to provide a built-in four PAD multifunctional pedestal structure.

[0005] The specific technical scheme is as follows:

[0006] A built-in four PAD multifunctional pedestal structure comprises: a pedestal main body, the middle of the pedestal main body has a groove for carrying a wafer, the bottom of the groove has four glue dispensing PADs in the form of bosses, and the bottom four corners of the wafer are bonded to the four glue dispensing PADs respectively.

[0007] As a further improvement and optimization of the scheme, the thickness of the glue dispensing PAD is 0.055-0.1mm.

[0008] As a further improvement and optimization of the scheme, two of the glue dispensing PADs on the same side form two inner electrodes, and the two inner electrodes are connected to two electrodes on the wafer respectively.

[0009] As a further improvement and optimization of the scheme, the bottom of the pedestal main body forms four outer electrodes, and two of the outer electrodes are connected to two of the inner electrodes respectively.

[0010] As a further improvement and optimization of the scheme, the pedestal main body is packaged by a metal cover.

[0011] As a further improvement and optimization of the scheme, the metal cover is connected to the pedestal main body by seam welding.

[0012] As a further improvement and optimization of the present solution, the molten metal of the seam weld is nickel / gold.

[0013] As a further improvement and optimization of the present solution, the base body comprises:

[0014] The ceramic substrate forms a ceramic cavity on the top, four glue dispensing pads are arranged on the bottom of the ceramic cavity, and four external electrodes are arranged on the bottom of the ceramic substrate; The top, bottom and side of the ceramic substrate are provided with conductive grooves, and conductive lines connecting the internal electrodes and the external electrodes are printed in the conductive grooves.

[0015] The Kovar ring is arranged on the top of the ceramic cavity.

[0016] As a further improvement and optimization of the present solution, two internal electrodes are respectively connected to two electrodes on the wafer through conductive glue.

[0017] The above technical solution has the following advantages compared with the prior art:

[0018] The number of bottom glue points in the base cavity is increased from two to four, the bonding interface structure of the wafer and the base is significantly optimized, the four bottom glue points are symmetrically distributed, the bonding area is effectively enlarged, the glue layer stress distribution is more uniform, the bonding strength is improved, and in a harsh vibration environment, the structure can greatly reduce the risk of glue layer fatigue cracking, and ensure that the wafer and the base maintain good contact at all times.

[0019] The utility model discloses a convex structure glue dispensing pad design, by increasing the height of glue point forms the physical isolation layer, effectively avoids the direct contact of wafer electrode and base inner chamber bottom, this design is especially for low frequency wafer application, and its lower resonant frequency is more sensitive to mechanical stability, and the convex structure can ensure that the wafer and the base maintain uniform gap, and significantly reduce the electrode short circuit risk. ACCURACY OF DRAWINGS

[0020] Figure 1 It is a structure schematic view of a built-in four-PAD multifunctional base structure of the utility model;

[0021] Figure 2 It is a top view of a built-in four-PAD multifunctional base structure of the utility model;

[0022] Figure 3 It is a bottom view of a built-in four-PAD multifunctional base structure of the utility model;

[0023] Figure 4 It is a line schematic view of a built-in four-PAD multifunctional base structure of the utility model;

[0024] In the drawings: 1, base body; 2, dispensing PAD; 3, wafer; 4, metal upper cover; 5, external electrode; 11, groove. DETAILED DESCRIPTION

[0025] The technical solutions of the present application will be described clearly and completely below in conjunction with the drawings. Obviously, the described embodiments are some embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0026] In the description of the present application, it should be noted that if terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like appear, the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, if the terms "first", "second", "third" appear, they are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0027] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, terms such as "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between two elements inside. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0028] Figure 1 is a structural schematic view of the present application, Figure 2 is a top view of the present application, Figure 3 is a bottom view of the present application, Figure 4 is a schematic line of the present application, Figures 1-4 As shown, a preferred embodiment of a four-PAD multifunctional base structure is shown, which comprises: a base body 1, the middle of the base body 1 has a groove 11 for carrying a wafer 3, the bottom of the groove 11 has four dispensing PADs 2 in the form of bosses, and the bottom four corners of the wafer 3 are respectively bonded to the four dispensing PADs 2.

[0029] The number of bottom glue points in the base cavity is increased from two to four in the embodiment, the bonding interface structure of the wafer 3 and the base is significantly optimized, the four bottom glue points are symmetrically distributed, the bonding area is effectively expanded, the glue layer stress distribution is more uniform, the bonding strength is improved, the glue layer fatigue cracking risk is greatly reduced in a harsh vibration environment, and the wafer 3 and the base can always maintain good contact.

[0030] In the embodiment, the PAD2 is designed in the form of a boss structure, a physical isolation layer is formed by increasing the height of the glue point, and direct contact of the wafer 3 electrode and the bottom of the base inner cavity is effectively avoided. The design is particularly suitable for low-frequency wafer 3 applications, which are more sensitive to mechanical stability due to their lower resonant frequency. The boss structure can ensure that the wafer 3 and the base maintain a uniform gap, significantly reducing the risk of electrode short circuit.

[0031] Further, as a preferred embodiment, the thickness of the glue point PAD2 is 0.055-0.1mm.

[0032] Further, as a preferred embodiment, the two glue points PAD2 on the same side form two inner electrodes, and the two inner electrodes are connected to the two electrodes on the wafer 3.

[0033] Further, as a preferred embodiment, the bottom of the base body 1 forms four outer electrodes 5, and two outer electrodes 5 are connected to two inner electrodes.

[0034] Further, as a preferred embodiment, the base body 1 is packaged by the metal cover 4.

[0035] Further, as a preferred embodiment, the metal cover 4 is connected to the base body 1 by seam welding.

[0036] Further, as a preferred embodiment, the molten metal of the seam welding is nickel / gold.

[0037] Further, as a preferred embodiment, the base body 1 comprises: a ceramic substrate and a Kovar ring, the top of the ceramic substrate forms a ceramic cavity, four glue points PAD2 are arranged at the bottom of the ceramic cavity, and four outer electrodes 5 are arranged at the bottom of the ceramic substrate.

[0038] Further, as a preferred embodiment, the two inner electrodes are connected to the two electrodes on the wafer 3 through conductive glue.

[0039] The utility model further has the following implementation modes on the basis of the above:

[0040] Further, as a preferred embodiment, the top, bottom and side of the ceramic substrate are provided with conductive grooves, the conductive grooves are printed with conductive lines connected to the inner electrodes and the outer electrodes 5, and the Kovar ring is arranged at the top of the ceramic cavity.

[0041] Further, as a preferred embodiment, the Kovar ring is made of iron-cobalt-nickel alloy material (surface plating layer is nickel / gold).

[0042] Further, as a preferred embodiment, the upper left and lower right of the ceramic substrate are provided with through holes, the upper through hole is communicated with the metal upper cover 4 through the Kovar ring, and the lower through hole is connected with two external electrodes 5 respectively; in the circuit, when one of the connected external electrodes 5 is grounded, the metal upper cover 4 can play a shielding role.

[0043] The above only describes the preferred embodiments of the present application, and does not limit the implementation and protection scope of the present application. For those skilled in the art, it should be realized that any equivalent replacement and obvious changes made according to the content of the present application description and drawings should be included in the protection scope of the present application.

Claims

1. A multi-functional base structure with built-in four PADs, characterized in that, include: The base body has a groove in the middle for mounting the wafer, and the bottom of the groove has four adhesive pads in the shape of protrusions. The four bottom corners of the wafer are respectively bonded to the four adhesive pads.

2. The built-in four-PAD multifunctional base structure according to claim 1, characterized in that, The thickness of the dispensing PAD is 0.055–0.1 mm.

3. The built-in four-PAD multifunctional base structure according to claim 1, characterized in that, The two dispensing PADs on the same side form two internal electrodes, which are respectively connected to two electrodes on the wafer.

4. The built-in four-PAD multifunctional base structure according to claim 3, characterized in that, Four external electrodes are formed at the bottom of the base body, two of which are respectively connected to the two internal electrodes.

5. The built-in four-PAD multifunctional base structure according to claim 4, characterized in that, The base body encapsulates the groove with a metal top cover.

6. The built-in four-PAD multifunctional base structure according to claim 5, characterized in that, The metal top cover is connected to the base body by seam welding.

7. The built-in four-PAD multifunctional base structure according to claim 6, characterized in that, The molten metal used in the seam weld is nickel / gold.

8. The built-in four-PAD multifunctional base structure according to claim 5, characterized in that, The base body includes: A ceramic substrate, wherein a ceramic cavity is formed on the top of the ceramic substrate, four adhesive pads are disposed at the bottom of the ceramic cavity, and four external electrodes are disposed at the bottom of the ceramic substrate; Kovar ring, which is disposed at the top of the ceramic cavity.

9. The built-in four-PAD multifunctional base structure according to claim 3, characterized in that, The two internal electrodes are respectively connected to the two electrodes on the wafer via conductive adhesive.

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