Sealing structure of electronic equipment and underwater cleaning robot

Abstract

The embodiment of the utility model provides a sealing structure of electronic equipment and an underwater cleaning robot. The sealing structure of the electronic equipment comprises a heat dissipation unit and a sealing shell, the sealing shell is provided with a heat dissipation through hole for communicating the inside and the outside of the sealing shell, and the heat dissipation unit is in sealing fit with the heat dissipation through hole; the heat dissipation unit comprises a first part and a second part which are connected, the first part is located in the sealing shell and is close to or connected with electronic equipment in the sealing structure, and the second part is exposed out of the sealing shell through the heat dissipation through hole, so that the heat dissipation performance of the sealing structure can be improved; heat generated by the electronic equipment is prevented from being accumulated in the sealing structure, and the performance of the electronic equipment is guaranteed.

Description

[0001] This application claims priority to PCT application filed on March 28, 2024, with application number "PCT / CN2024 / 084561" and patent title "Underwater Cleaning Robot and Its Filtration and Transmission Structure", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of sealing technology, and more particularly to a sealing structure for electronic devices and an underwater cleaning robot. Background Technology

[0003] Underwater cleaning robots are designed to meet underwater cleaning needs. They can clean the underwater portions of structures and filter the water. Because pollutants in water are highly corrosive and the conductivity of water can affect the performance of electronic equipment, the sealing of the components in underwater cleaning robots is particularly important.

[0004] Underwater cleaning robots based on related technologies typically only have one large sealed unit to seal electronic devices such as drive circuits, drive motors, and batteries. However, existing sealed structures have poor heat dissipation, and the heat generated by the electronic devices inside is difficult to dissipate, which can easily have an adverse effect on the performance of the electronic devices. Utility Model Content

[0005] In view of this, embodiments of this application provide a sealing structure for an electronic device to at least partially solve the above-mentioned problems.

[0006] This application provides a sealing structure for an electronic device, including: a heat dissipation unit and a sealing shell; the sealing shell is provided with a heat dissipation through hole communicating between the inside and outside of the sealing shell, and the heat dissipation unit and the heat dissipation through hole are sealed together; the heat dissipation unit includes a first part and a second part connected together, the first part is located inside the sealing shell and is close to or connected to the electronic device inside the sealing structure, and the second part is exposed outside the sealing shell through the heat dissipation through hole.

[0007] In some alternative embodiments, the second part includes a plurality of heat dissipation teeth with a gap between adjacent heat dissipation teeth.

[0008] In some alternative embodiments, the heat dissipation teeth are entirely located within the heat dissipation through-hole, or at least a portion of the heat dissipation teeth are located outside the heat dissipation through-hole.

[0009] In some optional embodiments, the sealing structure includes a sealing ring, and the heat dissipation unit further includes a mounting wall connected to the first part and / or the second part, the mounting wall being fitted into the heat dissipation through hole, and the gap between the mounting wall and the hole wall of the heat dissipation through hole is sealed by the sealing ring.

[0010] In some alternative embodiments, the mounting wall is connected to the first portion; the mounting wall and the second portion are located on the same side of the first portion, and there is a gap between the mounting wall and the second portion.

[0011] In some optional embodiments, the mounting wall includes a first wall segment and a second wall segment connected together, the first wall segment being located on the side of the mounting wall closer to the interior of the sealing shell, and the second wall segment being located on the side of the mounting wall closer to the exterior of the sealing shell; the gap between the first wall segment and the hole wall is sealed by the sealing ring, and the gap between the first wall segment and the hole wall and the gap between the second wall segment and the hole wall are staggered.

[0012] In some optional embodiments, the second wall segment includes a connecting segment and a heat dissipation segment, the heat dissipation segment being connected to the connecting segment, and the connecting segment being connected to the first wall segment; the distance between the heat dissipation segment and the hole wall is greater than the distance between the connecting segment and the hole wall.

[0013] In some optional embodiments, the heat dissipation teeth are plate-shaped, the plurality of heat dissipation teeth are parallel to each other, and the distance between two adjacent heat dissipation teeth is greater than or equal to the thickness of the heat dissipation teeth.

[0014] This application also provides an underwater cleaning robot, including the sealing structure described in any of the above embodiments, and the control unit of the underwater cleaning robot is located inside the sealing shell of the sealing structure.

[0015] In some alternative embodiments, the control unit includes a drive circuit for controlling a drive motor, the drive circuit being close to or connected to at least a portion of the heat dissipation unit of the sealed structure.

[0016] In this embodiment, the sealing shell is provided with a heat dissipation hole connecting the inside and outside of the sealing shell. The heat dissipation unit and the heat dissipation hole are sealed together, forming a sealed, waterproof inner cavity inside the sealing shell. The heat dissipation unit includes a first part and a second part connected together. The first part is located inside the sealing shell and is close to or connected to the electronic device inside the sealing structure. The second part is exposed to the working environment outside the sealing shell through the heat dissipation hole. By sealing together the heat dissipation unit and the heat dissipation hole, external water or contaminants are prevented from entering the sealing shell through the heat dissipation hole. The first part of the heat dissipation unit located inside the sealing shell ensures that the heat from the electronic device can be effectively transferred to the first part, thereby allowing the heat inside the sealing shell to be discharged through the second part of the heat dissipation unit exposed to the external working environment. This facilitates the dissipation of heat from the sealing shell to the outside while ensuring the sealing performance of the sealing structure, optimizing the heat dissipation of the sealing structure, preventing the heat generated by the electronic device from accumulating inside the sealing structure, and ensuring the performance of the electronic device.

[0017] Furthermore, when the aforementioned sealing structure is applied to an underwater cleaning robot, the working environment outside the sealing structure is below the surface of the swimming pool liquid. The second part of the heat dissipation unit can directly contact the pool liquid to achieve water cooling and further improve the heat dissipation efficiency of the sealing structure. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.

[0019] Figure 1 A sealing structure is provided as an optional embodiment of this application.

[0020] Figure 2 This is a cross-sectional schematic diagram of a sealing structure provided in an optional embodiment of this application.

[0021] Figure 3 Provided for optional embodiments of this application Figure 2 Enlarged view of the area within the dashed box.

[0022] Figure 4 An underwater cleaning robot is provided as an optional embodiment of this application.

[0023] Figure label:

[0024] 10. Underwater cleaning robot; 100. Sealed structure; 110. Heat dissipation unit; 111. First part; 112. Second part; 1121. Heat dissipation teeth; 113. Mounting wall; 1131. First wall section; 1132. Second wall section; 1133. Connecting section; 1134. Heat dissipation section; 120. Sealing shell; 121. Heat dissipation through hole; 1211. Hole wall; 130. Sealing ring; 140. Detection module; 210. Drive circuit. Detailed Implementation

[0025] To enable those skilled in the art to better understand the technical solutions in the embodiments of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art should fall within the protection scope of the embodiments of this application.

[0026] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used in the embodiments of this application refers to and includes any or all possible combinations of one or more associated listed items.

[0027] It should be understood that in the description of the embodiments of this application, the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the scheme of the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0028] The terms First, Second, etc., are used to describe various elements, components, regions, modules, and / or parts, but these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, module, and / or part from another element, component, region, module, and / or part.

[0029] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0030] like Figure 1 and Figure 2 As shown, this application embodiment provides a sealing structure 100 for an electronic device, including a heat dissipation unit 110 and a sealing shell 120.

[0031] The sealing shell 120 is provided with a heat dissipation through hole 121 that connects the inside and outside of the sealing shell 120. The heat dissipation unit 110 is sealed inside the heat dissipation through hole 121 and is sealed with the heat dissipation through hole 121 so that while sealing the heat dissipation through hole 121 and sealing the inner cavity of the sealing shell 120, the heat inside the sealing shell is allowed to pass through the heat dissipation unit 110 to the outside of the sealing shell 120.

[0032] One or more electronic devices, such as drive circuits, drive motors, and batteries, can be installed inside the sealed housing 120. A heat dissipation unit 110 and a heat dissipation hole 121 are sealed together to prevent water and contaminants from entering the sealed housing 120 through the heat dissipation hole 121, thereby preventing corrosion or contamination of the electronic devices inside the sealed housing 120. The heat dissipation unit 110 can be installed inside the heat dissipation hole 121 via a direct or indirect sealed connection. For example, when the heat dissipation unit 110 is indirectly sealed to the wall of the heat dissipation through hole 121, the heat dissipation unit 110 and the heat dissipation through hole 121 can be sealed by setting a sealing ring or other sealing element in the gap between the heat dissipation unit 110 and the heat dissipation through hole 121. Alternatively, the heat dissipation unit 110 and the heat dissipation through hole 121 can be sealed by injecting a sealing material such as sealant into the gap between the heat dissipation unit 110 and the heat dissipation through hole 121. Or, when the heat dissipation unit 110 is directly sealed to the wall of the heat dissipation through hole 121, at least the part of the heat dissipation unit 110 that seals with the heat dissipation through hole 121 is configured to fit tightly against the wall of the heat dissipation through hole 121 to block the heat dissipation through hole 121, thereby achieving a sealed fit between the heat dissipation unit 110 and the heat dissipation through hole 121. For example, if the heat dissipation unit 110 is provided with a rubber coating, the coating allows the heat dissipation unit 110 to be tightly fitted into the heat dissipation through hole 121, thereby achieving a waterproof sealing effect on the heat dissipation through hole 121. Of course, other suitable methods can also be used to achieve a sealed fit between the heat dissipation unit 110 and the heat dissipation through hole 121, which will not be elaborated here.

[0033] As a feasible implementation, the sealing shell 120 may include an upper sealing shell 120 and a lower sealing shell 120 that are sealed together, and the upper sealing shell 120 and the lower sealing shell 120 are detachably connected, thereby facilitating the installation and removal of the heat dissipation unit 110 and the electronic equipment inside the sealing shell 120.

[0034] The main body of the heat dissipation unit 110 includes a first part 111 and a second part 112 connected together. At least a portion of the first part 111 is located inside the sealing housing 120, and the end of the first part 111 away from the second part 112 is close to or connected to an electronic device inside the sealing structure 100, such as an electronic device inside the sealing structure 100 that requires heat dissipation. The end of the second part 112 away from the first part 111 is exposed outside the sealing housing 120 through a heat dissipation hole 121.

[0035] The first part 111 and the second part 112 of the heat dissipation unit 110 can be made of materials with good thermal conductivity, such as metal materials such as copper, aluminum or iron, or non-metallic materials such as graphite or ceramics. The embodiments of this application do not limit the materials of the heat dissipation unit 110.

[0036] In this embodiment, the sealing shell 120 is provided with a heat dissipation through hole 121 connecting the inside and outside of the sealing shell 120. The heat dissipation unit 110 and the heat dissipation through hole 121 are sealed together, forming a sealed waterproof cavity inside the sealing shell 120. The heat dissipation unit 110 includes a first part 111 and a second part 112 connected together. The first part 111 is located inside the sealing shell 120 and is close to or connected to the electronic equipment inside the sealing structure 100. The second part 112 is exposed to the working environment outside the sealing shell 120 through the heat dissipation through hole 121. By sealing the heat dissipation unit 110 and the heat dissipation hole 121, external water or contaminants are prevented from entering the sealed housing 120 through the heat dissipation hole 121. The heat dissipation unit 110, located inside the sealed housing 120, ensures that the heat on the electronic device can be effectively transferred to the first part. This allows the heat inside the sealed housing 120 to be discharged through the second part 112 of the heat dissipation unit 110, which is exposed to the external working environment, so as to dissipate the heat inside the sealed housing 120 to the outside of the sealed housing 120. While ensuring the sealing performance of the sealed structure 100, the heat dissipation of the sealed structure is optimized, preventing the heat generated by the electronic device from accumulating inside the sealed structure 100 and ensuring the performance of the electronic device.

[0037] like Figure 1-3 As shown, in some alternative embodiments, the portion of the second portion 112 exposed to the outside of the sealing housing 120 includes a plurality of heat dissipation teeth 1121, with a gap between adjacent heat dissipation teeth 1121.

[0038] It is understood that the shape of the aforementioned heat dissipation teeth 1121 is not limited. Although the example in the figure illustrates the case where the heat dissipation teeth 1121 are rectangular plate-shaped teeth, those skilled in the art can also set the heat dissipation teeth 1121 to other shapes, such as regular shapes like columnar or plate-shaped, or irregular shapes, as long as the heat dissipation area of ​​the second part can be increased through the tooth surface of the heat dissipation teeth 1121. Multiple heat dissipation teeth 1121 can be arranged in one or more rows, or in other suitable ways. The embodiments of this application do not limit the arrangement of the heat dissipation teeth 1121.

[0039] In this embodiment of the application, the second part 112 of the heat dissipation unit 110 includes a plurality of heat dissipation teeth 1121. There is a gap between two adjacent heat dissipation teeth 1121, which can disperse the second part 112, thereby increasing the contact area between the second part 112 of the heat dissipation unit 110 and the heat transfer medium (such as water or air) of the external environment, that is, increasing the heat dissipation area of ​​the second part 112 of the heat dissipation unit 110, thereby improving the heat dissipation effect of the second part 112 of the heat dissipation unit 110.

[0040] like Figure 3 As shown, in some optional embodiments, the heat dissipation fins 1121 are plate-shaped, with multiple heat dissipation fins 1121 parallel to each other and arranged in a row along the thickness direction. The spacing between two adjacent heat dissipation fins 1121 can be greater than or equal to the thickness of the heat dissipation fin 1121.

[0041] The thickness of multiple heat dissipation teeth 1121 can be equal or unequal. When the thickness of two adjacent heat dissipation teeth 1121 is not equal, the distance between the two heat dissipation teeth 1121 can be greater than or equal to the thickness of the heat dissipation tooth 1121 with smaller thickness, or greater than or equal to the thickness of the heat dissipation tooth 1121 with larger thickness.

[0042] In this embodiment, the heat dissipation teeth 1121 are plate-shaped, which helps to increase the contact area between the heat dissipation teeth 1121 and water or air. Multiple heat dissipation teeth 1121 are parallel to each other, and the distance between two adjacent heat dissipation teeth 1121 is greater than or equal to the thickness of the heat dissipation teeth 1121. This helps to form regular water flow or air flow channels between the heat dissipation teeth 1121, reduce the resistance of water flow or air flow, increase the flow rate of water flow or air flow, and improve the efficiency of heat dissipation teeth 1121 in dissipating heat to water or air.

[0043] In some optional embodiments, the heat dissipation teeth 1121 are entirely located within the heat dissipation through hole 121, the tooth tip height of the plurality of heat dissipation teeth 1121 does not exceed the edge of the hole wall of the heat dissipation through hole 121 near the external environment, the entire row of heat dissipation teeth 1121 is surrounded by the heat dissipation through hole 121, or at least a portion of the heat dissipation teeth 1121 is located outside the heat dissipation through hole 121.

[0044] By positioning the heat dissipation fins 1121 entirely within the heat dissipation through-hole 121, the structure of the heat dissipation unit 110 and the sealing shell 120 can be made more compact, thereby reducing the space occupied by the sealing structure 100. By positioning at least a portion of the heat dissipation fins 1121 outside the heat dissipation through-hole 121, it is easier for the heat dissipation fins 1121 to come into contact with water or air in the external environment, thereby improving the heat dissipation efficiency of the heat dissipation fins 1121.

[0045] like Figure 3 As shown, in some optional embodiments, the sealing structure 100 includes a sealing ring 130, and the heat dissipation unit 110 further includes a mounting wall 113 connected to the first part 111 and / or the second part 112. The mounting wall 113 has a cylindrical structure, and its shape is adapted to the shape of the heat dissipation through hole 121 so that the heat dissipation through hole 121 is sealed by being snapped into the heat dissipation through hole 121. The outer wall of the mounting wall 113 mates with the heat dissipation through hole 121, and the heat dissipation teeth 1121 are disposed in the space enclosed by the inner wall of the mounting wall 113. The gap between the mounting wall 113 and the hole wall of the heat dissipation through hole 121 is sealed by the sealing ring 130.

[0046] The sealing ring 130 can be made of an elastic material such as rubber to block the gap between the mounting wall 113 and the wall of the heat dissipation hole 121. The mounting wall 113 of the heat dissipation unit 110 can be connected to the first part 111 of the heat dissipation unit 110, or to the second part 112 of the heat dissipation unit 110, or to both the first part 111 and the second part 112 of the heat dissipation unit 110, as long as the mounting wall 113 can be fitted into the heat dissipation hole 121.

[0047] In this embodiment, the heat dissipation unit 110 further includes a mounting wall 113 connected to the first part 111 and / or the second part 112. The mounting wall 113 is fitted into the heat dissipation through hole 121, and the gap between the mounting wall 113 and the hole wall of the heat dissipation through hole 121 is sealed by a sealing ring 130. The heat dissipation unit 110, which can be quickly positioned and installed using the mounting wall 113, and the sealing ring 130 is used to seal the heat dissipation unit 110 and the heat dissipation through hole 121, allows the first part 111 and the second part 112 of the heat dissipation unit 110 to be dedicated to heat conduction or heat dissipation, which is beneficial to improving the design freedom of the first part 111 and the second part 112 of the heat dissipation unit 110.

[0048] like Figure 3As shown, in some optional embodiments, the first part 111 is a horizontally arranged plate-like structure. The first part 111 is located on one side of the cavity of the sealing shell 120 communicating with the heat dissipation hole 121. The plate surface of the first part 111 facing away from the heat dissipation hole 121 is connected to or close to the electronic device, and a mounting wall 113 is provided on the plate surface of the first part 111 facing the heat dissipation hole 121, forming a cap-like structure. The second part 112 is located on the side where the mounting wall 113 of the first part 111 is located, and is disposed within the enclosing body of the cap-like structure, and there is a gap between the mounting wall 113 and the second part 112. The above-mentioned shape arrangement causes the first part 111 to extend along the plate surface direction, increasing the conductive surface area for absorbing heat from the electronic device, while the mounting wall 113 and the second part 112 extend outward along the depth direction of the heat dissipation hole 121, increasing the heat dissipation area when transferring heat to the external environment, and ensuring that the heat dissipation unit 110 has good heat conduction performance.

[0049] When the mounting wall 113 and the second part 112 are located on the same side of the first part 111, the mounting wall 113 is also located on the side of the second part 112 closest to the outside of the sealing shell 120, so that the mounting wall 113 can also undertake part of the heat dissipation work. By setting a gap between the mounting wall 113 and the second part 112, a channel for water or air to pass through can be formed between the mounting wall 113 and the second part 112, so that water or air can carry away the heat of the mounting wall 113 and the second part 112, thereby improving the heat dissipation efficiency of the heat dissipation unit 110.

[0050] like Figure 3 As shown, in some optional embodiments, the mounting wall 113 includes a first wall segment 1131 and a second wall segment 1132 connected together. The first wall segment 1131 is located on the side of the mounting wall 113 near the interior of the sealing shell 120, and the second wall segment 1132 is located on the side of the mounting wall 113 near the exterior of the sealing shell 120. A mounting groove is provided on the side wall of the first wall segment 1131 near the heat dissipation hole 121, and a sealing ring 130 is disposed in the mounting groove so that the gap between the first wall segment 1131 and the hole wall is sealed by the sealing ring 130. The distance between the side wall of the second wall segment 1132 near the heat dissipation hole 121 and the second part 112 is smaller than the distance between the side wall of the first wall segment 1131 near the heat dissipation hole 121 and the second part 112, so that the side wall of the mounting wall 113 forms a stepped structure, and the shape of the hole wall of the heat dissipation hole 121 is adapted to the shape of the stepped structure. The gaps between the first wall segment 1131 and the hole wall and the gaps between the second wall segment 1132 and the hole wall are staggered, optimizing the sealing effect of the gap between the mounting wall 113 and the heat dissipation through hole 121. In the two opposing mounting wall segments 113 on the sealing unit, the gap between the second wall segment 1132 and the hole wall can be between the gaps between the first wall segment 1131 and the hole wall.

[0051] In this embodiment, the shape of the step at the mounting wall 113 allows the heat dissipation unit 110 to snap onto the stepped structure of the heat dissipation through hole 121, thereby limiting the heat dissipation unit 110 along the hole depth direction and improving the reliability of the heat dissipation unit 110's positioning. Simultaneously, it facilitates determining whether the heat dissipation unit is properly installed through the snap-fit ​​at the step, reducing assembly difficulty. Furthermore, the gap between the first wall segment 1131 and the hole wall and the gap between the second wall segment 1132 and the hole wall are staggered. This means that water or contaminants outside the sealing shell 120 must pass through the gap between the second wall segment 1132 and the hole wall, and the staggered position between this gap and the gap between the first wall segment 1131 and the hole wall, to reach the gap between the second wall segment 1132 and the hole wall and ultimately the sealing ring 130. This staggered position prevents water or contaminants from moving into the sealing shell 120, thereby improving the sealing performance of the sealing shell 120.

[0052] like Figure 3 As shown, in some optional embodiments, the second wall segment 1132 includes a connecting segment 1133 and a heat dissipation segment 1134, the heat dissipation segment 1134 is connected to the connecting segment 1133, and the connecting segment 1133 is connected to the first wall segment 1131; the distance between the heat dissipation segment 1134 and the hole wall is greater than the distance between the connecting segment 1133 and the hole wall.

[0053] The distance between the connecting section 1133 and the hole wall can be as small as possible to improve the sealing performance between the connecting section 1133 and the hole wall. The distance between the heat dissipation section 1134 and the hole wall can be set as needed, for example, it can be the same as the distance between two adjacent heat sinks to allow water or air to enter.

[0054] In this embodiment, the second wall segment 1132 includes a connecting segment 1133 and a heat dissipation segment 1134. The heat dissipation segment 1134 is connected to the connecting segment 1133, and the connecting segment 1133 is connected to the first wall segment 1131. The distance between the heat dissipation segment 1134 and the hole wall is greater than the distance between the connecting segment 1133 and the hole wall, which can form a larger gap between the heat dissipation segment 1134 and the hole wall, allowing water or air to enter the gap and carry away the heat of the heat dissipation segment 1134, thereby improving the heat dissipation effect of the heat dissipation unit 110.

[0055] like Figure 1 and Figure 4 As shown, in some optional embodiments, the electronic setup in the sealing structure 100 includes a detection module 140 to facilitate the detection of the surrounding environment.

[0056] The sealing housing 120 may be provided with a mounting hole that connects the interior and exterior of the sealing housing 120; at least a portion of the detection module 140 is located in the mounting hole, and the detection module 140 is in a sealing fit with the wall of the mounting hole. When the detection module 140 is partially located in the mounting hole, the other portions of the detection module 140 may be located inside the sealing housing 120.

[0057] The detection module 140 includes sensors such as optical sensors and / or acoustic sensors for detection. The optical sensors and / or acoustic sensors of the detection module 140 may be partially or entirely located in the mounting holes, so that the detection module 140 can perform optical and / or acoustic detection of the environment outside the sealing shell 120 through the mounting holes without being blocked by the housing of the sealing shell 120, thereby improving the detection effect of the detection module 140.

[0058] As a feasible implementation, the sealing structure 100 may include multiple sealing units, wherein at least one sealing unit includes the aforementioned heat dissipation unit 110 and sealing shell 120. Each sealing unit may house corresponding electronic devices, thereby sealing multiple electronic devices through multiple sealing units. If an electronic device is damaged, only the sealing unit containing that electronic device needs to be opened, effectively reducing the impact of repairing that electronic device on other electronic devices.

[0059] like Figure 4 As shown, this application embodiment also provides an underwater cleaning robot 10, including the sealing structure 100 described in any of the above embodiments, and the control unit of the underwater cleaning robot 10 is located inside the sealing shell 120 of the sealing structure 100.

[0060] It should be understood that the underwater cleaning robot 10 provided in this application embodiment is based on the same inventive concept as the aforementioned sealing structure 100 embodiment and can achieve the same effect. Specifically, the sealing structure 100 can seal the control unit, and the heat dissipation unit 110 of the sealing structure 100 can conduct the heat generated by the control unit during operation to the outside of the sealing structure 100 to achieve rapid heat dissipation. For the specific implementation process, please refer to the description in the aforementioned sealing structure 100 embodiment, which will not be repeated here.

[0061] Furthermore, when the above-mentioned sealing structure is applied to the underwater cleaning robot 10, the working environment outside the sealing structure is below the surface of the swimming pool liquid. The second part of the heat dissipation unit can directly contact the swimming pool liquid to achieve water cooling and further improve the heat dissipation efficiency of the sealing structure.

[0062] like Figure 2 and Figure 3As shown, in some optional embodiments, the control unit includes a drive circuit 210 for controlling the drive motor, the drive circuit 210 being close to or connected to at least a portion of the heat dissipation unit 110 of the sealing structure 100.

[0063] The drive circuit 210 is used to control drive devices such as drive motors, and it easily generates a large amount of heat during operation. The drive circuit 210 can be close to or connected to the first part 111 of the heat dissipation unit 110 to shorten the heat conduction path between the drive circuit 210 and the heat dissipation unit 110. Preferably, the drive circuit 210 can be connected to the first part 111 of the heat dissipation unit 110, so that the heat generated by the drive circuit 210 during operation can be directly transferred to the heat dissipation unit 110, thereby increasing the heat conduction speed between the drive circuit 210 and the heat dissipation unit 110.

[0064] In some optional embodiments, a main control circuit may also be provided inside the sealing shell 120 of the sealing structure 100. This main control circuit controls the drive circuit 210, the battery, and other related electronic devices. For example, the main control circuit can control the operation of the aforementioned drive device through the drive circuit 210. The main control circuit can be located on the side of the drive circuit 210 closer to the center of the interior of the sealing shell 120 to reduce the impact of the main control circuit on the heat dissipation of the drive circuit 210. Furthermore, the heat dissipation unit 110 can be located on the side of the drive circuit 210 away from the center of the interior of the sealing shell 120. For example, when the drive circuit 210 is located in the upper half of the corresponding sealing unit, the heat dissipation unit 110 can be located above the drive circuit 210 to shorten the path from the heat dissipation unit 110 to the outside of the sealing shell 120, thereby facilitating heat dissipation of the heat dissipation unit 110. Of course, the main control circuit, drive circuit 210, and heat dissipation unit 110 can also be arranged in other suitable positions, as long as it facilitates heat dissipation of the heat dissipation unit 110.

[0065] It should be noted that, depending on the implementation needs, the various components / steps described in the embodiments of this application can be broken down into more components / steps, or two or more components / steps or parts of the operation of components / steps can be combined into new components / steps to achieve the purpose of the embodiments of this application.

[0066] The methods described above according to the embodiments of this application can be implemented in hardware, firmware, or implemented as software or computer code that can be stored in a recording medium (such as CD-ROM, RAM, floppy disk, hard disk, or magneto-optical disk), or implemented as computer code originally stored in a remote recording medium or a non-transitory machine-readable medium and to be stored in a local recording medium after being downloaded via a network. Thus, the methods described herein can be stored as software processing on a recording medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware (such as an application-specific integrated circuit (ASIC) or a field-programmable gate array (FPGA)).

[0067] Those skilled in the art will recognize that the units and method steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the embodiments of this application.

[0068] The above embodiments are only used to illustrate the embodiments of this application, and are not intended to limit the embodiments of this application. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the embodiments of this application. Therefore, all equivalent technical solutions also fall within the scope of the embodiments of this application, and the patent protection scope of the embodiments of this application should be defined by the claims.

Claims

1. A sealing structure for an electronic device, characterized in that, include: Heat dissipation unit and sealing shell; The sealing shell is provided with a heat dissipation through hole that connects the inside and outside of the sealing shell, and the heat dissipation unit and the heat dissipation through hole are sealed together. The heat dissipation unit includes a first part and a second part connected together. The first part is located inside the sealed housing and is close to or connected to an electronic device inside the sealed structure. The second part is exposed outside the sealed housing through the heat dissipation hole.

2. The sealing structure according to claim 1, characterized in that, The second part includes multiple heat dissipation teeth, with a gap between adjacent heat dissipation teeth.

3. The sealing structure according to claim 2, characterized in that, The heat dissipation teeth are entirely located inside the heat dissipation through hole, or at least a portion of the heat dissipation teeth are located outside the heat dissipation through hole.

4. The sealing structure according to claim 3, characterized in that, The sealing structure includes a sealing ring, and the heat dissipation unit further includes a mounting wall connected to the first part and / or the second part. The mounting wall is fitted into the heat dissipation through hole, and the gap between the mounting wall and the hole wall of the heat dissipation through hole is sealed by the sealing ring.

5. The sealing structure according to claim 4, characterized in that, The mounting wall is connected to the first part; The mounting wall and the second part are located on the same side of the first part, and there is a gap between the mounting wall and the second part.

6. The sealing structure according to claim 4, characterized in that, The mounting wall includes a first wall segment and a second wall segment connected together. The first wall segment is located on the side of the mounting wall closer to the inside of the sealing shell, and the second wall segment is located on the side of the mounting wall closer to the outside of the sealing shell. The gap between the first wall segment and the hole wall is sealed by the sealing ring, and the gap between the first wall segment and the hole wall and the gap between the second wall segment and the hole wall are staggered.

7. The sealing structure according to claim 6, characterized in that, The second wall segment includes a connecting segment and a heat dissipation segment. The heat dissipation segment is connected to the connecting segment, and the connecting segment is connected to the first wall segment. The distance between the heat dissipation segment and the hole wall is greater than the distance between the connecting segment and the hole wall.

8. The sealing structure according to claim 2, characterized in that, The heat dissipation teeth are plate-shaped, and multiple heat dissipation teeth are parallel to each other, with the distance between two adjacent heat dissipation teeth being greater than or equal to the thickness of the heat dissipation teeth.

9. An underwater cleaning robot, characterized in that, The underwater cleaning robot includes the sealing structure described in any one of claims 1-8, and the control unit of the underwater cleaning robot is located within the sealing shell of the sealing structure.

10. The underwater cleaning robot according to claim 9, characterized in that, The control unit includes a drive circuit for controlling the drive motor, and the drive circuit is close to or connected to at least a portion of the heat dissipation unit of the sealed structure.

Images