Double-heat-dissipation water circulation system
By introducing a dual heat dissipation water circulation system into the laser therapy device, combined with an air-cooled radiator and a semiconductor TEC cooler, the problems of low heat dissipation efficiency and poor stability of traditional laser therapy devices are solved, achieving a more efficient and stable heat dissipation effect, and preventing tube bursts through a monitoring system.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-04
- Publication Date
- 2026-04-07
AI Technical Summary
Traditional laser therapy devices typically rely on heat dissipation tubes or fins, resulting in low heat dissipation efficiency, low stability, and limited flexibility.
A dual-cooling water circulation system is adopted, which combines an air-cooled radiator and a semiconductor TEC cooler to form a dual-cooling water circulation system. The circulation system is monitored by water flow sensors and pressure sensors, and a bypass pipe is set up to solve the pressure and flow rate problems.
It improves heat dissipation efficiency, enhances the stability and flexibility of the heat dissipation system, avoids pipe bursting problems caused by excessive pressure, and protects surrounding electrical equipment.
Smart Images
Figure CN224098005U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to laser treatment device heat dissipation technical field especially is related to a double heat dissipation water circulation system. BACKGROUND
[0002] A laser treatment device is a device that uses laser technology for treatment. The laser treatment device generates a high-energy, monochromatic, focused laser beam through a laser, which can be used to irradiate and treat human tissues. Therefore, the laser treatment device has a wide range of applications in the medical field, including skin disease treatment, eye surgery, dental treatment, plastic surgery, laser weight loss, etc. The advantages of the laser treatment device include non-invasive treatment process, no trauma, less bleeding, quick recovery, and significant effect.
[0003] The laser treatment device generates a large amount of heat during use, which needs to be promptly treated and dissipated. If the heat dissipation is not timely or the heat dissipation effect is not good, it may cause the treatment effect to decrease, the service life of the laser device to be shortened, safety hazards, system failures, etc. Therefore, in order to avoid the above risks, the design and performance of the heat dissipation system should be fully considered during the design and use of the laser treatment device to ensure that the laser device can effectively dissipate heat and avoid adverse effects caused by overheating.
[0004] The heat dissipation mode of the traditional laser treatment device is usually only two kinds of heat dissipation pipes or fin heat dissipation, the heat dissipation efficiency is low, the heat dissipation stability is low, and the heat dissipation flexibility is weak. Therefore, there is an urgent need for a heat dissipation system that can improve the heat dissipation efficiency and stability, and has strong flexibility. TECHNICAL FIELD
[0005] The technical problem solved by the utility model is that the heat dissipation mode of the traditional laser treatment device is usually only two kinds of heat dissipation pipes or fin heat dissipation, the heat dissipation efficiency is low, the heat dissipation stability is low, and the heat dissipation flexibility is weak.
[0006] To solve the above technical problems, the utility model technical scheme provides a double heat dissipation water circulation system, characterized by comprising a water tank, a water pump, a water ion filter, a plug-in seat and an air-cooled radiator, the water tank and the water ion filter are connected to the inlet and outlet of the water pump through connecting pipes respectively, the inlet and outlet directions of the plug-in seat are connected to the water ion filter and the air-cooled radiator through connecting pipes respectively, and the air-cooled radiator is connected to the water tank through a connecting pipe, wherein the air-cooled radiator and the water tank are connected to a TEC refrigerator through a connecting pipe, the TEC refrigerator and the water tank are also connected to a water flow sensor through a connecting pipe, and the water pump and the water ion filter are connected to a pressure sensor through a connecting pipe.
[0007] Optionally, it also includes a bypass pipe which is connected at both ends of the water ion filter in communication.
[0008] Optionally, the water ion filter and the bypass pipe are connected to the first and second connecting ports of the first tee joint respectively, and the third connecting port of the first tee joint is connected to the water pump and the plug-in seat through connecting pipes respectively.
[0009] Optionally, the end of the bypass pipe towards the plug-in seat is connected to the first tee joint through a T-shaped plug.
[0010] Optionally, an extension pipe is connected to the connecting pipe between the water ion filter and the water pump, and the outer end of the extension pipe is connected to the pressure sensor.
[0011] Optionally, a second tee joint is further included, the first and second connecting ports of the second tee joint are connected to the third connecting port of the first tee joint and the water pump respectively, and the third connecting port of the second tee joint is connected to the extension pipe.
[0012] Optionally, the plug-in seat has a liquid outlet and a liquid inlet, the liquid outlet is connected to the first tee joint in the direction of the water outlet of the water ion filter and the bypass pipe, and the liquid inlet is connected to the air-cooled radiator.
[0013] Optionally, the water flow direction of the double-radiation water circulation system is: water pump→water ion filter, bypass pipe→plug-in seat→air-cooled radiator→TEC refrigeration device→water tank→water pump.
[0014] Optionally, the air-cooled radiator is an air-cooled red copper radiator.
[0015] Optionally, the TEC refrigeration device is a semiconductor TEC refrigeration device.
[0016] The beneficial effects of the technical scheme of the utility model are as follows:
[0017] The utility model discloses a semiconductor TEC refrigeration device is added in the traditional air-cooled radiator system to form a double-radiation water circulation system, improves the radiation efficiency, improves the stability of the radiator system and strengthens the flexibility of the radiation.
[0018] The utility model discloses a water flow sensor and pressure sensor monitoring, when monitoring that flow rate is insufficient requirement or pressure is unusual, can control system to close water pump, and the abnormal reason is conveniently looked for, the problem of pipe explosion caused by excessive pressure is avoided, and the damage of surrounding electrical appliances caused by splashing water after pipe explosion is also avoided.
[0019] The utility model discloses a bypass pipe is arranged at the water ion filter, and the flow is limited through a T-shaped plug, and part of water does not directly pass through the water ion filter, so that the problem of excessive pressure and insufficient flow rate of the radiator system is solved. BRIEF DESCRIPTION OF DRAWINGS
[0020] Figure 1The utility model discloses a structure diagram of double radiating water circulation system.
[0021] In the drawing: 1, air cooling radiator, 2, TEC refrigerator, 3, water flow sensor, 4, water tank, 5, water pump, 6, pressure sensor, 7, second three -way, 8, water ion filter, 9, T type plug, 10, plug -in seat, 11, bypass pipe, 12, first three -way, 13 extension pipe. DETAILED DESCRIPTION
[0022] The utility model makes further explanation to the utility model below combining with the drawing and specific embodiment, but not as the limitation of the utility model.
[0023] In the description of the utility model, it is understood that the orientation or positional relation indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" are based on the orientation or positional relation shown in the drawing, and are only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as limiting the utility model to a specific orientation, structure and operation of the indicated device or element.
[0024] In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.
[0025] In the utility model, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, can be fixedly connected, can be detachably connected, or integrally connected, can be mechanically connected, or electrically connected, can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two elements.
[0026] In the utility model, unless another definite provision and limitation, first feature is in second feature " on " or " under " can include first and second features direct contact, also can include first and second features not direct contact but contact through additional feature between them.Moreover, first feature is in second feature " on ", " above " and " on " include first feature is in second feature right above and oblique above, or just indicate first feature horizontal height higher than second feature.First feature is in second feature " under ", " below " and " under " include first feature is in second feature right above and oblique above, or just indicate first feature horizontal height less than second feature.
[0027] Please see Figure 1 As shown in the figure, show a double heat dissipation water circulation system of an embodiment, it is characterized in containing water tank 4, water pump 5, water ion filter 8, plug-in seat 10 and air cooling radiator 1, water tank 4 and water ion filter 5 are connected respectively through connecting pipe water pump 5's import and export, the import and export direction of plug-in seat 10 is connected respectively through connecting pipe water ion filter 8 and air cooling radiator 1, air cooling radiator 1 is connected through connecting pipe water tank 4, wherein, air cooling radiator 1 and water tank 4 are connected through connecting pipe TEC refrigerator 2, TEC refrigerator 2 and water tank 4 are also connected through connecting pipe water flow sensor 3, water pump 5 and water ion filter 8 are connected through connecting pipe pressure sensor 6.
[0028] In the embodiment, it also includes bypass pipe 11, and the bypass pipe 11 is connected to both ends of the water ion filter 8 in communication.The two ends of the water ion filter 8 and the bypass pipe 11 are connected to the first connecting port and the second connecting port of the first three-way pipe 12 respectively, and the third connecting port of the two first three-way pipes 12 is connected to the water pump 5 and the plug-in seat 10 through the connecting pipes respectively.The end of the bypass pipe 11 towards the plug-in seat 10 is connected to the first three-way pipe 12 through a T-shaped plug 9.
[0029] In the embodiment, the connecting pipe between the water ion filter 8 and the water pump 5 is connected with an extension pipe 13, and the outer end of the extension pipe 13 is connected with the pressure sensor 6.The second three-way pipe 7 is also included, the first connecting port and the second connecting port of the second three-way pipe 7 are connected to the third connecting port of the first three-way pipe 12 and the water pump 5 respectively, and the third connecting port of the second three-way pipe 7 is connected to the extension pipe 13.The plug-in seat 10 has a liquid outlet and a liquid inlet, the liquid outlet is connected to the first three-way pipe 12 in the water outlet direction of the water ion filter 8 and the bypass pipe 11, and the liquid inlet is connected to the air cooling radiator 1.
[0030] In the embodiment, the water flow direction sequence of the double heat dissipation water circulation system is water pump 5→water ion filter 8, bypass pipe 11→plug-in seat 10→air cooling radiator 1→TEC refrigerator 2→water tank 4→water pump 5.
[0031] In the embodiment, the air cooling radiator 1 is an air cooling red copper radiator.
[0032] In this embodiment, the TEC cooler 2 is a semiconductor TEC cooler.
[0033] The characteristics and functions of the present application will be further understood through the following description.
[0034] In the double heat dissipation water circulation system of this embodiment, according to the water flow direction of the system, hot water is cooled once by the air-cooled radiator, then flows into the TEC cooler for 2 times of internal circulation cooling, the low-temperature water flows back to the water tank, and after passing through the water pump and the water ion filter, it is cooled again by the laser through the plug-in seat, completing the circulation.
[0035] By adding a semiconductor TEC cooler to the traditional air-cooled cooling system, the cooling principle of the semiconductor TEC (Thermoelectric Cooler) is based on the Peltier effect. The Peltier effect refers to the generation of thermoelectric effect when there is a temperature difference between the contact interface of two materials with different electrical conductivity, which causes heat transfer.
[0036] In the semiconductor TEC cooling device, two semiconductor materials with different thermal conductivity are connected together through electrodes, one end is heated (heat source), and the other end is cooled (cold source). When an electric current is applied through an external power source, the electric current will generate a thermoelectric effect between the two semiconductors, causing heat to be absorbed from the heat source end and released to the cold source end, achieving the effect of cooling. By controlling the direction and size of the current, the cooling effect of the semiconductor TEC cooling device can be controlled.
[0037] Compared with single-mode cooling systems, the cooling system combined with two or more modes has the following advantages:
[0038] 1. Improve cooling efficiency: The cooling system combined with multiple modes can fully utilize the characteristics of different cooling methods, such as air cooling, liquid cooling, heat pipe cooling, etc., to improve the overall cooling efficiency. Different cooling methods complement each other, making the cooling system more quickly and effectively reduce the temperature of the cooling device.
[0039] 2. Improve system stability: The cooling system combined with multiple modes can reduce the dependence on a single cooling method. If a certain cooling method fails, other cooling methods can still function, ensuring the stability and reliability of the system.
[0040] 3. Improve cooling environment: Different cooling methods can be used in different locations of the cooling device to avoid heat accumulation and improve the overall cooling environment, reducing the impact of hot spots on the device.
[0041] 4. Flexibility: The multi-mode combined heat dissipation system can be flexibly combined and adjusted according to actual conditions and requirements, and is suitable for different heat dissipation requirements and environmental conditions.
[0042] Therefore, compared with the single-mode heat dissipation system, the multi-mode combined heat dissipation system has higher heat dissipation efficiency, better system stability, improved heat dissipation environment and greater flexibility. In occasions with higher heat dissipation requirements or higher system stability requirements, the multi-mode combined heat dissipation system is usually more suitable.
[0043] The circulation system of the embodiment is mainly used for heat dissipation cooling of the laser, and the water flow monitoring and pressure monitoring are added in the system. When the flow rate in the circulation system is insufficient or the pressure is abnormal, the control system can shut down the water pump to find the abnormal condition, so that the problem of pipe explosion caused by excessive pressure is avoided, and the damage of surrounding electrical appliances caused by splashing water is avoided. The bypass pipe is added to the water ion filter, the flow is limited through the T-shaped plug, and part of the water does not pass through the water ion filter, so that the problems of excessive pressure and insufficient flow rate of the heat dissipation system are solved.
[0044] The working mode of the double heat dissipation water circulation system of the embodiment is as follows:
[0045] The plug-in seat 10 is connected with the treatment head of the laser treatment device. The refrigeration water flows from the plug-in seat 10 to the treatment head, and then flows back to the plug-in seat 10 and flows to the air-cooled radiator 1 to be cooled once, and then flows to the semiconductor TEC refrigeration device to be cooled twice, and then flows back to the water tank 4 and is transported to the water pump 5 from the water tank 4, and then is transported to the water ion filter 8 and / or the bypass pipe 11 by the water pump 5, and then flows to the plug-in seat 10 and finally returns to the treatment head to complete the circulation.
[0046] In summary, the double heat dissipation water circulation system is formed by adding the semiconductor TEC refrigeration device to the traditional air-cooled heat dissipation system, so that the heat dissipation efficiency is improved, the stability of the heat dissipation system is improved, and the flexibility of heat dissipation is improved.
[0047] The water flow sensor and the pressure sensor are monitored. When the flow rate is insufficient or the pressure is abnormal, the system can be controlled to shut down the water pump, the abnormal reason can be found conveniently, the problem of pipe explosion caused by excessive pressure is avoided, and the damage of surrounding electrical appliances caused by splashing water after pipe explosion is also avoided.
[0048] The bypass pipe is arranged beside the water ion filter, and the flow is limited through the T-shaped plug, so that part of the water does not directly pass through the water ion filter, so that the problems of excessive pressure and insufficient flow rate of the heat dissipation system are solved.
[0049] The above merely describes preferred embodiments of the present application, and is not intended to limit the implementation and protection scope of the present application. For those skilled in the art, it should be understood that any equivalent substitutions and obvious changes made according to the content of the present application and drawings should be included in the protection scope of the present application.
Claims
1. A dual-heat dissipation water circulation system, characterized in that, The device includes a water tank, a water pump, a water ion filter, a plug-in connector, and an air-cooled radiator. The water tank and the water ion filter are connected to the inlet and outlet of the water pump, respectively, via connecting pipes. The inlet and outlet of the plug-in connector are connected to the water ion filter and the air-cooled radiator, respectively, via connecting pipes. The air-cooled radiator is connected to the water tank via a connecting pipe. A TEC (Technology, Energy, and Temperature) cooler is connected between the air-cooled radiator and the water tank. A water flow sensor is also connected between the TEC cooler and the water tank via a connecting pipe. A pressure sensor is connected between the water pump and the water ion filter via a connecting pipe.
2. The dual heat dissipation water circulation system according to claim 1, characterized in that, It also includes a bypass pipe, which is connected in a continuous manner to both ends of the water ion filter.
3. The dual heat dissipation water circulation system according to claim 2, characterized in that, The water ion filter and the bypass pipe are each connected to the first and second connection ports of the first tee, and the third connection ports of the two first tee are respectively connected to the water pump and the plug-in socket through connecting pipes.
4. The dual heat dissipation water circulation system according to claim 3, characterized in that, The bypass tube is connected to the first tee via a T-shaped plug at one end facing the plug socket.
5. The dual heat dissipation water circulation system according to claim 4, characterized in that, An extension tube is connected to the connecting pipe between the water ion filter and the water pump, and the pressure sensor is connected to the outward-extending end of the extension tube.
6. The dual-heating water circulation system according to claim 5, characterized in that, It also includes a second tee, the first and second connecting ports of which are respectively connected to the third connecting port of the first tee and the water pump, and the third connecting port of the second tee is connected to the extension pipe.
7. The dual heat dissipation water circulation system according to claim 6, characterized in that, The plug-in socket has an outlet and an inlet. The outlet is connected to the first tee in the direction of the outlet of the water ion filter and the bypass pipe, and the inlet is connected to the air-cooled radiator.
8. The dual-heating water circulation system according to claim 7, characterized in that, The water flow sequence of the dual heat dissipation water circulation system is as follows: water pump → water ion filter, bypass pipe → plug-in socket → air-cooled radiator → TEC cooler → water tank → water pump.
9. The dual-heating water circulation system according to claim 8, characterized in that, The air-cooled radiator is an air-cooled copper radiator.
10. The dual-heating water circulation system according to claim 9, characterized in that, The TEC cooler is a semiconductor TEC cooler.