Self-adaptive heat dissipation device
The adaptive heat dissipation device driven by shape memory alloy solves the problems of high noise, high power consumption and obtrusive appearance in the existing technology, and achieves zero noise and high efficiency heat dissipation, which is suitable for a variety of electronic devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-02
- Publication Date
- 2026-04-07
AI Technical Summary
Existing heat dissipation technologies for electronic devices suffer from problems such as high noise, high power consumption, obtrusive appearance, high maintenance costs, and inability to dynamically adjust, resulting in poor user experience and safety hazards.
The device uses shape memory alloy lines to drive the elastic rotating component, which automatically unfolds and retracts the heat sink based on temperature changes. Combined with the heat sink fin design, it achieves efficient heat dissipation with zero noise and no manual operation required.
It achieves efficient heat dissipation with zero power consumption and no noise, adapts to different temperature scenarios, improves heat dissipation efficiency by 30%, and is suitable for a variety of electronic devices.
Smart Images
Figure CN224098016U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to electronic equipment heat dissipation technical field, concretely relates to a self -adaptation heat abstractor. BACKGROUND
[0002] With the popularity of portable electronic devices and electric vehicles, batteries as the core energy source, its performance and safety are concerned. The battery will produce heat in the working process, if the heat dissipation is improper, it will lead to the battery temperature rise, and then trigger a series of problems, such as performance decline, short life, and even there is a security risk. Therefore, efficient battery cooling technology is essential to protect the performance and safety of the battery.
[0003] The internal electrochemical reaction of the battery will inevitably produce heat when working. If the heat cannot be dissipated in time, the battery temperature will continue to rise, leading to performance decline, short life, and in severe cases, high temperature may cause battery thermal runaway, causing fire, explosion and other safety accidents.
[0004] In the field of electronic devices, the application of power banks has been more and more widely, but in the prior art, the wireless power bank generates serious heat when running at high power, for example, the temperature can reach more than 60℃ when 20W fast charging. The current industry common solution: fan cooling, fixed metal heat sink, graphene patch, etc. Among them, the fan cooling has the problems of loud noise, high power consumption, easy to accumulate dust and damage, leading to poor user experience and serious shortening of battery life; for the fixed heat sink, its thick, unable to dynamically adjust, and the problem of conspicuous appearance makes it inconvenient to carry and low in appearance acceptance; for the graphene patch technology, long-term use will lead to fast performance degradation, low cost performance, and high maintenance cost. UTILITY MODEL CONTENTS
[0005] The utility model aims at overcoming at least one of the above-mentioned defects of the prior art, and provides a self-adaptive heat dissipation device to realize the purpose of zero power consumption, no noise and high heat dissipation efficiency.
[0006] The utility model provides a self-adaptive heat dissipation device, which is arranged between a heating element and a shell and comprises a shape memory alloy wire, an elastic rotating assembly and a heat sink; the shell is provided with heat dissipation holes on both sides, the heat sink is arranged outside the heat dissipation holes, and one set of elastic rotating assemblies is fixed to both ends of the heat sink; the shape memory alloy wire is connected to the elastic rotating assemblies at both ends.
[0007] The shape memory alloy wire strip phase transition temperature characteristic matures, such as medical stents, automobile valves and the like, which can shrink by 4-8% at 55 DEG C, and the driving force is 8-10 N, meeting the expansion requirement of the heat dissipation fin, the utility model discloses a principle of heat shrinkage and temperature reset of shape memory alloy wire strip, when shape memory alloy shrinks by heat, shape memory alloy wire strip pulls elastic rotating assembly to rotate, and then directly pulls heat dissipation fin to expand, and the heat dissipation hole is convenient to heat dissipation to both sides.
[0008] Further, the elastic rotating assembly comprises a rotating arm and a torsion spring, both ends of the shape memory alloy wire strip are fixed with the rotating arm, both ends of the heat dissipation fin are respectively sleeved with a group of torsion springs, one end of the torsion spring is fixed with the rotating arm, and the other end is limited through the rotating arm and the shell.
[0009] The rotating arm mainly plays the role of fixing the torsion spring and the heat dissipation fin, when the shape memory alloy wire strip shrinks by heat, both ends of the shape memory alloy wire strip pull the rotating arm to rotate, and then drive the torsion spring to rotate, at this time, the heat dissipation fin rotates with the rotating arm, so that the heat dissipation fin expands to realize heat dissipation.
[0010] Further, the rotating arm comprises a first side plate and a second side plate, the first side plate and the second side plate are fixed, and the cross section is L-shaped, both ends of the shape memory alloy wire strip are respectively fixed on the first side plate, both ends of the heat dissipation fin are fixed on the second side plate, one end of the torsion spring is a rotating end, and the other end is a limiting end, the rotating end is fixed with the first side plate, and the limiting end is limited between the first side plate and the shell.
[0011] The first side plate and the second side plate of the rotating arm can be welded or integrally formed and perpendicular to each other, one section of both ends of the heat dissipation fin is cylindrical, so that the torsion spring can be sleeved outside, and the other end is semicylindrical, facilitating fixed with the second side plate of the rotating arm, the top end of the shape memory alloy wire strip is bent and welded with the first side plate, so that when the shape memory alloy wire strip shrinks by heat, a pulling force can be formed on the first side plate, so that the first side plate rotates.
[0012] Further, the first side plate is provided with a giving slot, and the giving slot is used for avoiding the limiting end of the torsion spring.
[0013] Since the torsional spring only rotates the rotating end when rotating, the position of the limiting end remains unchanged to form the rebounding force, so a let-out groove needs to be reserved during the rotation of the rotating arm, and when the shape memory alloy wire shrinks after the first side plate rotates, the limiting end of the torsional spring is just located in the let-out groove.
[0014] Further, a plurality of groups of heat dissipation fins are arranged on the heat dissipation fin, the heat dissipation fins are 90° with the main body of the heat dissipation fin, and in the initial state, the heat dissipation fins are directed to the direction of the heat dissipation hole, and more preferably, the surface of the heat dissipation fin can be plated with aluminum nitride to double the thermal conductivity, which can be applied to scenes with higher heat dissipation requirements, and the heat dissipation efficiency is improved, and it is suitable for high-end markets.
[0015] Further, the heat dissipation fin is staggered with the heat dissipation hole.
[0016] Further, when the temperature of the heat generating element is greater than a set threshold, the shape memory alloy wire shrinks, so that the elastic rotating assembly drives the heat dissipation fin to rotate 30°-90°.
[0017] More preferably, the heat dissipation hole is in a honeycomb shape and is aligned with the heat dissipation fin to form an air duct.
[0018] Further, the shape memory alloy wire is at least 2, and in some embodiments of the present application, the shape memory alloy wire is 2.
[0019] Further, the heat dissipation fin is two groups, and the double-sided heat dissipation fins are expanded synchronously to balance the heat dissipation pressure.
[0020] Compared with the prior art, the present application has the following advantages:
[0021] The present application directly expands the heat dissipation fin by using the heat shrinkage of the shape memory alloy, and the heat dissipation fin is automatically retracted by the spring when the temperature drops, without manual operation and zero noise of the fan, and is suitable for scenes such as libraries and offices.
[0022] The heat dissipation fin is completely embedded into the shell when being closed, and dust and shock are prevented, the heat dissipation fin increases the heat dissipation area, and the cooling theory value can reach 10-15 DEG C, and the shell heat dissipation hole and the heat dissipation fin are designed to be dislocated to improve the natural convection efficiency by 30%, and the heat dissipation fin air duct of the utility model is universal, and the similar design of the application can also be used for notebook computer heat dissipation, and the actual measured cooling is 8-12 DEG C.
[0023] The shape memory alloy line in the utility model can be limited to a temperature threshold value during manufacturing according to the temperature threshold value of the power bank or the heating component, for example, can be partially unfolded at 50 DEG C and completely unfolded at 60 DEG C, and can be applied to the power bank, mobile phone and computer, is also applicable to outdoor power supply, mobile phone heat dissipation back clamps, unmanned aerial vehicle batteries and other high-temperature scenes, has strong technical universality and great market potential. BRIEF DESCRIPTION OF DRAWINGS
[0024] Figure 1 It is a use state diagram of the adaptive heat dissipation device of the utility model applied to the wireless power bank.
[0025] Figure 2 It is a schematic view of the adaptive heat dissipation device of the utility model in an initial state.
[0026] Figure 3 It is a schematic view of the adaptive heat dissipation device of the utility model in a heat dissipation fin unfolded state.
[0027] Figure 4 It is a schematic view of the adaptive heat dissipation device of the utility model in an initial state.
[0028] Figure 5 It is a schematic view of the adaptive heat dissipation device of the utility model in a heat dissipation fin unfolded state. DETAILED DESCRIPTION
[0029] The drawings in the embodiments are used to describe the technical scheme in the embodiments of the utility model in more detail. In the drawings, the same or similar reference signs represent the same or similar elements or elements with the same or similar functions from beginning to end. The described embodiments are part of the embodiments of the utility model, not all the embodiments. The embodiments described below by referring to the drawings are exemplary and are intended to explain the utility model, and cannot be understood as limiting the utility model. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model. The embodiments of the utility model are described in detail below in combination with the drawings.
[0030] It should be noted that if the application embodiments have directionality indications (such as up, down, left, right, front, back, etc.), the directionality indications are only used to explain the relative position relationship, movement, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directionality indications also change accordingly.
[0031] In addition, if the application embodiments have descriptions of "first", "second", etc., the "first", "second", etc. descriptions are only for description purposes and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In addition, the technical solutions of various embodiments can be combined with each other, but must be based on the realization of ordinary skilled in the art, and when the combination of technical solutions contradicts each other or cannot be realized, it should be considered that the combination of technical solutions does not exist and is not within the protection scope claimed by the present application.
[0032] Embodiments
[0033] The present embodiment provides a self-adaptive heat dissipation device 10, as shown in Figure 1 The heat dissipation device is arranged between the heat generating member 100 and the shell 200. In the present embodiment, the heat generating member 100 is exemplified by a wireless power bank. The wireless power bank can be used for charging a mobile terminal 300. In the charging process, the wireless power bank generates heat. The self-adaptive heat dissipation device in the present embodiment is used for heat dissipation. Other heat generating members 100 can also be applicable and are within the protection scope of the present application. As shown in Figures 2-3 The heat dissipation device includes two shape memory alloy strips 1, two rotating arms 2 and two torsional springs 3 arranged on each side. The shell 200 is provided with a heat dissipation fin 4 and a heat dissipation hole 5 on each side. The heat dissipation hole 5 is in a honeycomb shape. The heat dissipation fin 4 is arranged outside the heat dissipation hole 5. The heat dissipation fin 4 is provided with a plurality of heat dissipation fins 41. In the initial state, the heat dissipation fin 4 is closed. At this time, the heat dissipation fins 41 are directed towards the heat dissipation hole 5. The heat dissipation fins 41 are misaligned with the heat dissipation hole 5. The two ends of the shape memory alloy strip 1 are fixed with the rotating arm 2. The two ends of the heat dissipation fin 4 are respectively sleeved with a group of torsional springs 3. One end of the torsional spring 3 is fixed with the rotating arm 2. The other end is limited by the rotating arm 2 and the shell 200.
[0034] As shown in Figures 4-5As shown, the rotating arm 2 includes a first side plate 21 and a second side plate 22; the first side plate 21 and the second side plate 22 are fixed vertically and have an L-shaped cross section; two ends of the shape memory alloy wire 1 are fixed to the first side plate 21 respectively; two ends of the heat sink 4 are fixed to the second side plate 22; one end of the torsion spring 3 is a rotating end 31, and the other end is a limiting end 32; the rotating end 31 is fixed to the first side plate 21, and the combination Figures 2-3 As shown, the limiting end 32 is limited between the first side plate 21 and the shell 200. The first side plate 21 is provided with a clearance groove 23 for avoiding the limiting end 32 of the torsion spring 3. The middle part of the shape memory alloy wire 1 can be fixed to the inner side of the shell 200.
[0035] The rotating arm 2 mainly plays a role of fixing the torsion spring 3 and the heat sink 4. When the shape memory alloy wire 1 is heated and shrinks, the two ends of the shape memory alloy wire 1 pull the rotating arm 2 to rotate, and then drive the torsion spring 3 to rotate, at this time, the heat sink 4 rotates with the rotating arm 2, so that the heat dissipation hole 5 is opened to realize heat dissipation. When the temperature of the heating element 100 decreases to below the deformation threshold of the shape memory alloy wire 1, the shape memory alloy wire 1 restores the original length and is lengthened, and under the action of the elastic force of the torsion spring 3, the rotating arm 2 is reset, and the heat sink 4 is reset. One end of the heat sink 4 is cylindrical, so that the torsion spring 3 can be sleeved outside, and the other end is semicylindrical, which is convenient for being fixed to the second side plate 22 of the rotating arm 2. The top end of the shape memory alloy wire 1 is bent and welded to the first side plate 21, so that when it is heated and shrinks, a pulling force can be formed on the first side plate 21 to make it rotate. When the shape memory alloy wire 1 is heated and shrinks, the first side plate 21 rotates, and the limiting end 32 of the torsion spring 3 is located in the clearance groove 23.
[0036] The heat dissipation fin 41 of the utility model increases the heat dissipation area, and the shell 200 heat dissipation hole 5 and the heat dissipation fin 41 are designed to be staggered to improve the natural convection efficiency by 30%. The heat dissipation fin 41 air duct of the utility model is universal, and similar design of the embodiment can also be used for notebook computer heat dissipation, and the actual measurement cooling is 8-12 DEG C.
[0037] When the temperature of the heat-generating element 100 is greater than a set threshold, the shape memory alloy wire 1 contracts, causing the elastic rotating assembly to drive the heat sink 4 to rotate 30-90°. The shape memory alloy wire 1 in the utility model can be set according to the temperature threshold of the power bank or the heat-generating component, and the temperature threshold can be limited during production, for example, the shape memory alloy wire 1 can be partially unfolded at 50℃ and completely unfolded at 60℃, accurately adapting to different heat-generating scenarios. The specific material formula of the shape memory alloy wire 1 is not the main point of the utility model, and the threshold can be set by using the prior art. The unfolded angle can be gradient-rotated according to the change of the temperature to adapt to different heat dissipation scenarios.
[0038] The above embodiments are only used to illustrate the technical solutions of the utility model and not to limit it. Although the utility model has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that the technical solutions of the utility model can be modified or replaced without departing from the spirit and scope of the utility model. Those skilled in the art can also make other changes within the spirit of the utility model and use them in the design of the utility model, as long as they do not deviate from the technical effects of the utility model. These changes made according to the spirit of the utility model should be included in the scope of protection of the utility model.
Claims
1. An adaptive heat dissipation device, disposed between a heat-generating element (100) and a housing (200), characterized in that, It includes shape memory alloy lines (1), elastic rotating components and heat sinks (4); the housing (200) has heat dissipation holes (5) on both sides, the heat sinks (4) are located outside the heat dissipation holes (5), and a set of elastic rotating components are fixed at both ends of the heat sinks (4); the two ends of the shape memory alloy lines (1) are connected to the elastic rotating components.
2. The adaptive heat dissipation device according to claim 1, characterized in that, The elastic rotating assembly includes a rotating arm (2) and a torsion spring (3); the two ends of the shape memory alloy line (1) are fixed to the rotating arm (2); a set of torsion springs (3) are respectively sleeved on both ends of the heat sink (4), one end of the torsion spring (3) is fixed to the rotating arm (2), and the other end is limited by the rotating arm (2) and the housing (200).
3. The adaptive heat dissipation device according to claim 2, characterized in that, The rotating arm (2) includes a first side plate (21) and a second side plate (22); the first side plate (21) and the second side plate (22) are fixed and have an L-shaped cross-section; the two ends of the shape memory alloy line (1) are respectively fixed to the first side plate (21); the two ends of the heat sink (4) are attached and fixed to the second side plate (22); one end of the torsion spring (3) is a rotating end (31) and the other end is a limiting end (32); the rotating end (31) is fixed to the first side plate (21), and the limiting end (32) is limited between the first side plate (21) and the housing (200).
4. The adaptive heat dissipation device according to claim 3, characterized in that, The first side plate (21) is provided with a relief groove (23), which is used to avoid the limiting end (32) of the torsion spring (3).
5. The adaptive heat dissipation device according to claim 1, characterized in that, The heat sink (4) is provided with multiple sets of heat dissipation fins (41).
6. The adaptive heat dissipation device according to claim 5, characterized in that, The heat dissipation fins (41) are misaligned with the heat dissipation holes (5).
7. The adaptive heat dissipation device according to any one of claims 1 to 6, characterized in that, When the temperature of the heating element (100) exceeds the set threshold, the shape memory alloy line (1) contracts, causing the elastic rotating component to drive the heat sink (4) to rotate 30 to 90°.
8. The adaptive heat dissipation device according to any one of claims 1 to 6, characterized in that, The heat dissipation holes (5) are honeycomb-shaped.
9. The adaptive heat dissipation device according to any one of claims 1 to 6, characterized in that, The shape memory alloy lines (1) are at least two.
10. The adaptive heat dissipation device according to any one of claims 1 to 6, characterized in that, The heat sink (4) consists of two sets.