Semi-solid vapor chamber and electronic device
By using hydrogel and a closed vacuum chamber structure in the heat spreader, the high cost of liquid injection and vacuuming during the preparation process was solved, achieving low-cost and efficient heat transfer and uniform heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-11
- Publication Date
- 2026-04-07
AI Technical Summary
The preparation process of a heat spreader requires precise liquid injection and multiple vacuuming processes, resulting in high manufacturing costs.
A semi-solid isothermal plate structure is adopted, using hydrogel instead of liquid working fluid. Steam is generated through temperature change for phase change heat transfer. Combined with liquid wick and steam flow plate, a closed vacuum chamber is formed, avoiding vacuum liquid injection and non-condensable gas extraction processes.
It significantly reduces processing costs while maintaining efficient heat transfer and uniform heat dissipation, avoiding localized overheating.
Smart Images
Figure CN224098022U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of electronic product heat dissipation, in particular to a semi-solid vapor chamber and an electronic device. BACKGROUND
[0002] A vapor chamber is a plate-shaped heat transfer device that can perform phase change heat transfer by injecting a working liquid into an internal near-vacuum cavity with a capillary structure. The main structure of the vapor chamber includes a shell plate, a wick, and a liquid filling pipe. The internal structure of the vapor chamber is a near-vacuum cavity structure, which is light in weight; it does not require external driving force during operation, saving energy; the cavity is sealed by welding and forming, and will not leak, safe and reliable.
[0003] Its heat transfer mode is phase change heat transfer, with high heat transfer coefficient; it can perform two-dimensional heat transfer, with fast heat conduction speed, which can quickly and evenly distribute the heat of the point heat source on the heat dissipation surface; its size can be designed according to specific use occasions; it can be directly packaged with electronic devices, or closely attached to the chip base to reduce the contact thermal resistance.
[0004] In related technologies, the commonly used vapor chamber is a high-efficiency uniform temperature element realized by liquid phase change principle. Its working principle is as follows:
[0005] (1) Evaporation and heat absorption: when the hot end of the vapor chamber contacts with a heat source (such as an electronic component, a chip, etc.), the working liquid (usually water, also ethanol, ammonia, etc.) filled inside will absorb heat and evaporate into vapor quickly, this process absorbs a large amount of heat, thereby reducing the temperature of the hot end.
[0006] (2) Vapor diffusion and heat conduction: the vapor formed by evaporation diffuses to the cold end area of the cavity due to pressure difference and other reasons, and transfers heat during the diffusion process.
[0007] (3) Condensation and heat release: when the vapor reaches the cold end area, it will condense into liquid due to the lower temperature of the inner wall, and release the heat absorbed during evaporation, which is conducted to the external environment through the connection device of the cold end and the heat sink or heat sink.
[0008] (4) Liquid return: the condensed liquid will return to the hot end area through the capillary channel in the vapor chamber under the action of capillary force, preparing to participate in the evaporation process again.
[0009] Through the circulation process of evaporation-condensation-return of the liquid, the vapor chamber can quickly and evenly distribute the heat, prevent local overheating, ensure uniform temperature distribution, and thus improve the stability and service life of the equipment.
[0010] However, the preparation process of the uniform temperature plate needs precise liquid injection, and multiple vacuum extraction and removal of non-condensable gas. The liquid injection and the first and second removal of non-condensable gas are process flows with high equipment and control precision, and are the most time-consuming and expensive process flows in the manufacturing process of the uniform temperature plate, so that the manufacturing cost of the uniform temperature plate is high. SUMMARY
[0011] Embodiments of the present application provide a semi-solid uniform temperature plate and an electronic device to solve the problem of high manufacturing cost of the uniform temperature plate in the related art due to the high process requirement of the preparation process of the uniform temperature plate.
[0012] The first aspect of embodiments of the present application provides a semi-solid uniform temperature plate, comprising:
[0013] An outer shell, a closed vacuum chamber is formed in the outer shell, and the outer shell has an evaporation end and a condensation end;
[0014] A hydrogel, the hydrogel is located in the closed vacuum chamber and close to the evaporation end of the outer shell;
[0015] A liquid absorption core, the liquid absorption core is located in the closed vacuum chamber to fix the hydrogel at the evaporation end of the outer shell;
[0016] A steam flow plate, the steam flow plate is located in the closed vacuum chamber and close to the condensation end of the outer shell.
[0017] In some embodiments: the outer shell includes an upper plate and a lower plate, the four peripheral edges of the upper plate and the lower plate are sealed and connected to each other, and a closed vacuum chamber accommodating the hydrogel, the liquid absorption core and the steam flow plate is formed in the middle part.
[0018] In some embodiments: the upper plate and the lower plate are made of aluminum plastic film or copper foil, the inner surface of the upper plate is provided with a pit or a channel, and the steam flow plate is close to the upper plate of the outer shell.
[0019] In some embodiments: the liquid absorption core is a copper mesh or a porous sintered plate, and a plurality of capillary voids for adsorbing water in the hydrogel are arranged in the liquid absorption core.
[0020] In some embodiments: the steam flow plate is a sheet structure with a set thickness, and a plurality of gas flow channels extending from the evaporation end to the condensation end are formed on the steam flow plate.
[0021] In some embodiments: one side of the steam flow plate close to the liquid absorption core is in close contact with the liquid absorption core, and the other side of the steam flow plate away from the liquid absorption core is in close contact with the condensation end of the outer shell.
[0022] In some embodiments: the hydrogel is a semi-solid temperature-sensitive hydrogel.
[0023] In some embodiments: the shell body, the liquid absorbing core and the vapor flow plate are all flexible materials that can be deformed.
[0024] The second aspect of the embodiments of the present application provides an electronic device, which comprises the semi-solid vapor chamber of any of the above embodiments, and the electronic device and the semi-solid vapor chamber are connected to each other by mutual adhesion.
[0025] In some embodiments: the electronic device and the evaporation end of the semi-solid vapor chamber are connected to each other by mutual adhesion through the heat-conducting glue, and the condensation end of the semi-solid vapor chamber is connected to the electronic heat sink through the heat-conducting glue.
[0026] The technical solutions provided by the present application have the following beneficial effects:
[0027] The semi-solid vapor chamber and the electronic device provided by the embodiments of the present application have the following beneficial effects: the semi-solid vapor chamber is provided with a shell body, a closed vacuum chamber is formed in the shell body, the shell body has an evaporation end and a condensation end, a hydrogel is located in the closed vacuum chamber and close to the evaporation end of the shell body, a liquid absorbing core is located in the closed vacuum chamber to fix the hydrogel at the evaporation end of the shell body and absorb the moisture of the hydrogel, and a vapor flow plate is located in the closed vacuum chamber and close to the condensation end of the shell body.
[0028] Therefore, the semi-solid vapor chamber provided by the present application uses a hydrogel to replace the liquid working medium for heat absorption and evaporation, and the semi-solid vapor chamber is a solid at room temperature, and the hydrogel is sealed in the closed vacuum chamber of the shell body. When a heat source that needs to be cooled transmits heat to the evaporation end of the shell body, the temperature of the hydrogel rises, and the hydrogel will rapidly release steam when the temperature rises to a certain extent, thereby absorbing a large amount of heat.
[0029] The steam rapidly spreads in the vapor flow plate to the entire condensation end plate surface, uniformly transmits the heat gas to the condensation end, and avoids local overheating. The steam condenses into liquid after being cooled at the condensation end, and releases heat to the external environment. The condensed liquid returns to the evaporation end by capillary action or gravity of the liquid absorbing core, and participates in the evaporation cycle again. After the hydrogel is used to replace the liquid working medium, the process of vacuum injection and repeated extraction of non-condensable gas is not needed, and the processing cost is significantly reduced. BRIEF DESCRIPTION OF DRAWINGS
[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creating labor.
[0031] Figure 1 A structure sectional view of the semi-solid heat spreader according to an embodiment of the present application;
[0032] Figure 2 An exploded view of the semi-solid heat spreader according to an embodiment of the present application;
[0033] Figure 3 A comparison chart of temperature test results of the semi-solid heat spreader according to an embodiment of the present application and graphene sheet and ordinary VC, respectively.
[0034] Reference signs:
[0035] 10, outer shell; 11, evaporation end; 12, condensation end; 13, upper layer plate; 14, lower layer plate; 20, hydrogel; 30, liquid-absorbing core; 40, vapor flow-through plate. DETAILED DESCRIPTION
[0036] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described below in connection with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.
[0037] The embodiments of the present application provide a semi-solid heat spreader and an electronic device, which can solve the problem of high manufacturing cost of the heat spreader due to high process requirement of the preparation process of the heat spreader in the related art.
[0038] Referring to FIGS. 1 and 2, Figure 1 and Figure 2 the first aspect of the embodiments of the present application provides a semi-solid heat spreader, which comprises:
[0039] An outer shell 10 is formed with a closed vacuum chamber inside, and the outer shell 10 has an evaporation end 11 and a condensation end 12, wherein the evaporation end 11 is located on one side of the outer shell 10, the condensation end 12 is located on the other side of the outer shell 10, and the closed vacuum chamber is located between the evaporation end 11 and the condensation end 12.
[0040] A hydrogel 20 is located inside the closed vacuum chamber and close to the evaporation end 11 of the outer shell 10; the hydrogel 20 releases internal moisture to form steam when absorbing heat in a high-temperature state, and absorbs water when in a low-temperature state. When the hydrogel 20 works, the high temperature causes the hydrogel 20 to shrink and release internal moisture, and since the inside of the closed vacuum chamber is under negative pressure, the released moisture boils and takes away heat to cool the electronic device.
[0041] The liquid suction core 30 is located in a closed vacuum chamber to fix the hydrogel 20 to the evaporation end 11 of the outer shell 10, and to allow the condensate formed by the condensation end 12 to flow back to the evaporation end 11 through the capillary action or gravity of the liquid suction core 30 and enter the hydrogel 20 to re-participate in the evaporation cycle.
[0042] A steam circulation plate 40 is located within a closed vacuum chamber, near the condenser end 12 of the outer shell 10. When the temperature rises to a certain level, the hydrogel 20 rapidly releases steam, absorbing a large amount of heat. The steam quickly diffuses within the steam circulation plate 40 to the entire surface of the condenser end 12, uniformly transferring the heated gas to the condenser end 12 and preventing localized overheating of the condenser end 12.
[0043] In this embodiment, the semi-solid vapor chamber utilizes hydrogel 20 instead of the liquid working fluid that absorbs heat through evaporation. At room temperature, the semi-solid vapor chamber is solid, and the hydrogel 20 is vacuum-sealed within the closed vacuum chamber of the outer shell 10. When a heat source requiring cooling transfers heat to the evaporation end 11 of the outer shell 10, the temperature of the hydrogel 20 rises. Once the temperature reaches a certain level, the hydrogel 20 rapidly releases vapor, absorbing a large amount of heat.
[0044] Steam rapidly diffuses within the steam flow plate 40 to the entire surface of the condenser end 12, uniformly transferring heat to the condenser end 12 and preventing localized overheating of the semi-solid vapor chamber. Upon cooling at the condenser end 12, the steam condenses into liquid, releasing heat to the external environment. The condensate flows back to the evaporator end 11 via capillary action of the wick 30 or gravity, rejoining the evaporation cycle. By utilizing hydrogel 20 instead of a liquid working fluid, this application eliminates the need for vacuum injection and repeated extraction of non-condensable gases, significantly reducing processing costs.
[0045] In some alternative embodiments: see Figure 1 and Figure 2 As shown, this application embodiment provides a semi-solid temperature distribution plate. The outer shell 10 of the semi-solid temperature distribution plate includes an upper plate 13 and a lower plate 14. The four edges of the upper plate 13 and the lower plate 14 are sealed to each other, and a closed vacuum chamber is formed in the middle to accommodate the hydrogel 20, the liquid absorption core 30 and the vapor flow plate 40.
[0046] The upper plate 13 and the lower plate 14 are preferably, but not limited to, aluminum-plastic film or copper foil materials with good thermal conductivity and easy to form. The inner surface of the upper plate 13 is provided with pits or channels. The steam flow plate 40 is close to the upper plate 13 of the outer shell 10. The pits or channels are used to form flow channels to facilitate the steam flow of the steam flow plate 40.
[0047] In some alternative embodiments: see Figure 1 and Figure 2As shown, the embodiment of the present application provides a semi-solid heat sink, the liquid absorption core 30 of the semi-solid heat sink is a copper mesh or a porous sintered plate, and a plurality of capillary voids for absorbing water in the hydrogel 20 are arranged in the liquid absorption core 30. The capillary voids of the liquid absorption core 30 are used for absorbing condensed liquid water.
[0048] The steam flow plate 40 is a sheet structure with a set thickness, and a plurality of gas flow channels extending from the evaporation end 11 to the condensation end 12 are arranged on the steam flow plate 40. The gas flow channels are used for flowing the steam generated by the evaporation end 11 to the condensation end 12, and the steam flow plate 40 uniformly disperses the steam to the condensation end 12, so that the steam is uniformly cooled and heat is released at the condensation end 12, preventing the local temperature of the condensation end 12 from being too high.
[0049] The side of the steam flow plate 40 close to the liquid absorption core 30 is attached to the liquid absorption core 30, and the side of the steam flow plate 40 away from the liquid absorption core 30 is attached to the condensation end 12 of the outer shell 10. The steam flow plate 40 can quickly flow and disperse the steam discharged from the liquid absorption core 30 to the condensation end 12, shorten the flow path of the steam, and uniformly and quickly complete the heat dissipation cooling of the steam at the condensation end 12 to form condensed water, thereby improving the heat dissipation efficiency.
[0050] In some optional embodiments, referring to Figure 1 and Figure 2 As shown, the embodiment of the present application provides a semi-solid heat sink, the hydrogel 20 of the semi-solid heat sink is preferably but not limited to a semi-solid temperature-sensitive hydrogel. The semi-solid temperature-sensitive hydrogel has temperature sensitivity and can undergo phase transition when the temperature changes.
[0051] When the temperature of the hydrogel 20 rises to a certain extent, the hydrogel 20 will quickly release steam and absorb a large amount of heat. The steam quickly spreads to the entire surface of the condensation end 12 in the steam flow plate 40, and the steam flow plate 40 uniformly transfers the heat gas to the condensation end 12, avoiding local overheating. The steam condenses into liquid after being cooled at the condensation end, and releases heat to the external environment.
[0052] In some optional embodiments, referring to Figure 1 and Figure 2 As shown, the embodiment of the present application provides a semi-solid heat sink, the outer shell 10, the liquid absorption core 30 and the steam flow plate 40 of the semi-solid heat sink are all flexible materials that can be bent and deformed, and the shapes of the outer shell 10, the liquid absorption core 30 and the steam flow plate 40 can be completely deformed according to the appearance contour of the electronic device, so as to better fit the outer surface of the electronic device and improve the heat conduction efficiency.
[0053] Referring to Figure 3As shown, the semi-solid heat spreader of the present application is tested on a 40x40mm heater simulation chip heat source. Without using any heat spreader, the top temperature of the heat source is 70℃. As a comparison, a graphene sheet and a conventional VC heat spreader of the same size are used for comparison tests.
[0054] Figure 3 The middle red curve is the temperature change curve of the graphene sheet, the green curve is the temperature change curve of the conventional VC, and the yellow curve is the temperature change curve of the semi-solid heat spreader of the present application. The comparison test results show that after using the heat spreader, the top center temperature of the heat source is significantly reduced, among which the semi-solid heat spreader of the present application is slightly better than the conventional VC, and the cooling capacity of the graphene sheet is relatively weak.
[0055] The second aspect of the embodiment of the present application provides an electronic device, which comprises the semi-solid heat spreader of any one of the above-mentioned embodiments, and the electronic device and the semi-solid heat spreader are mutually attached and connected. The electronic device is mutually attached with the evaporation end of the semi-solid heat spreader through the heat-conducting glue, and the condensation end of the semi-solid heat spreader is connected with an electronic heat sink through the heat-conducting glue. The electronic heat sink is preferably but not limited to a chip, a battery, a display, etc.
[0056] Working principle
[0057] The embodiment of the present application provides a semi-solid heat spreader and an electronic device. Since the semi-solid heat spreader of the present application is provided with an outer shell 10, a closed vacuum chamber is formed in the outer shell 10, the outer shell 10 has an evaporation end 11 and a condensation end 12; a hydrogel 20, which is located in the closed vacuum chamber and close to the evaporation end 11 of the outer shell 10; a liquid-absorbing core 30, which is located in the closed vacuum chamber to fix the hydrogel 20 at the evaporation end 11 of the outer shell 10 and absorb the water in the hydrogel 20; and a steam flow-through plate 40, which is located in the closed vacuum chamber and close to the condensation end 12 of the outer shell 10.
[0058] Therefore, the semi-solid heat spreader of the present application uses the hydrogel 20 to replace the liquid working medium for evaporation and heat absorption. At normal temperature, the semi-solid heat spreader is a solid, and the hydrogel 20 is vacuum-sealed in the closed vacuum chamber of the outer shell 10. When the heat source to be cooled transmits heat to the evaporation end 11 of the outer shell 10, the temperature of the hydrogel 20 rises, and when the temperature rises to a certain extent, the hydrogel 20 will quickly release steam and absorb a large amount of heat.
[0059] The steam spreads rapidly in the steam flow plate 40 to the whole plate surface of the condensing end 12, and uniformly transfers the heat to the condensing end 12, avoiding local overheating. The steam condenses into liquid after being cooled in the condensing end 12, and releases heat to the external environment. The condensed liquid returns to the evaporating end 11 by capillary action or gravity of the wick 30, and participates in the evaporation cycle again. After the hydrogel 20 is used to replace the liquid working medium in the application, the process of vacuum injection and repeated extraction of non-condensable gas is not needed, and the processing cost is significantly reduced.
[0060] In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0061] It should be noted that in the present application, relational terms such as "first" and "second" and the like are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "include", "contain" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitations, the element defined by the sentence "including a" does not exclude the presence of other identical elements in the process, method, article or device including the element.
[0062] The above is only a specific embodiment of the present application, which enables those skilled in the art to understand or implement the present application. Various modifications of these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features applied herein.
Claims
1. A semi-solid temperature distribution plate, characterized in that, include: The outer shell (10) has a closed vacuum chamber formed inside it, and the outer shell (10) has an evaporation end (11) and a condensation end (12); Hydrogel (20), the hydrogel (20) is located in the closed vacuum chamber and close to the evaporation end (11) of the outer shell (10); A liquid-absorbing core (30) is located in the closed vacuum chamber to fix the hydrogel (20) at the evaporation end (11) of the outer shell (10); A steam flow plate (40) is located in the closed vacuum chamber and close to the condenser end (12) of the outer shell (10).
2. The semi-solid temperature distribution plate as described in claim 1, characterized in that: The outer shell (10) includes an upper plate (13) and a lower plate (14), the four edges of the upper plate (13) and the lower plate (14) are sealed to each other, and a closed vacuum chamber is formed in the middle to accommodate the hydrogel (20), the liquid absorption core (30) and the vapor flow plate (40).
3. A semi-solid temperature distribution plate as described in claim 2, characterized in that: The upper plate (13) and the lower plate (14) are made of aluminum-plastic film or copper foil. The inner surface of the upper plate (13) is provided with pits or channels. The steam circulation plate (40) is close to the upper plate (13) of the outer shell (10).
4. A semi-solid temperature distribution plate as described in claim 1, characterized in that: The liquid-absorbing core (30) is a copper mesh or a porous sintered plate, and the liquid-absorbing core (30) is provided with a number of capillary pores for adsorbing water in the hydrogel (20).
5. A semi-solid temperature distribution plate as described in claim 1, characterized in that: The steam flow plate (40) is a sheet structure with a set thickness, and the steam flow plate (40) has a number of gas flow channels extending from the evaporation end (11) to the condensation end (12).
6. A semi-solid temperature distribution plate as described in claim 1, characterized in that: The side of the steam flow plate (40) close to the liquid absorption core (30) is in contact with the liquid absorption core (30), and the side of the steam flow plate (40) away from the liquid absorption core (30) is in contact with the condenser end (12) of the outer shell (10).
7. A semi-solid heat spreader as described in any one of claims 1 to 6, characterized in that: The hydrogel (20) is a semi-solid temperature-sensitive hydrogel (20).
8. A semi-solid heat spreader as described in any one of claims 1 to 6, characterized in that: The outer shell (10), the liquid-absorbing core (30), and the steam circulation plate (40) are all made of flexible materials that can be bent and deformed.
9. An electronic device, characterized in that, The electronic device includes a semi-solid heat spreader as described in any one of claims 1 to 8, wherein the electronic device and the semi-solid heat spreader are attached and connected to each other.
10. An electronic device as described in claim 9, characterized in that: The electronic device is attached to the evaporation end (11) of the semi-solid vapor chamber via thermally conductive adhesive, and the condensation end (12) of the semi-solid vapor chamber is connected to an electronic heat sink via thermally conductive adhesive.