Immersion type photoresist removing device

Abstract

The utility model belongs to the technical field of wet degumming, and particularly relates to a soaking type degumming device which comprises a fixing part, a soaking tank, a circulating pipeline, a circulating pump, a first heating part and a second heating part, and the first heating part is arranged on the circulating pipeline and used for heating degumming solution in the circulating pipeline; the second heating part is arranged in the soaking tank and used for heating the photoresist removing solution in the soaking tank and keeping the photoresist removing solution at the preset temperature. Under the action of the first heating part and the second heating part, the heating efficiency and the heating precision of the degumming solution can be improved, so that the degumming efficiency and the product yield of the degumming solution can be ensured, and the uniformity of the temperature of the degumming solution at each part in the soaking tank can be ensured under the action of the circulating pump and the circulating pipeline; therefore, the photoresist removing efficiency and the product yield can be further ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to wet method glue removal technical field especially, relate to a kind of soaking type glue removal device. BACKGROUND

[0002] Now the process of wafer glue removal is mainly dry method glue removal, but too many key factors need to be considered in dry method glue removal, such as the power applied when glue removal, gas flow etc. will affect the quality and rate of glue removal, and other substances will also be generated during glue removal, thereby easily affecting product yield etc. Therefore, wet method glue removal has also begun to be used. Because photoresist is subjected to dry etching process, it can lead to hardening and carbonization of photoresist. Therefore, during wet method glue removal process, the wafer needs to be placed in soaking tank for soaking, and the photoresist is softened and removed by using glue removal solution.

[0003] The currently used soaking tank structure is relatively simple, which leads to low photoresist softening efficiency, long soaking time is required, and abnormal conditions such as residual glue are easily generated, which seriously affects the glue removal efficiency and product yield.

[0004] Therefore, the above problems need to be solved. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a kind of soaking type glue removal device to improve glue removal efficiency and product yield.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] A kind of soaking type glue removal device is used to remove glue on product, which comprises:

[0008] Fixing part for fixing the product;

[0009] Soaking tank for containing glue removal solution, and the product is immersed in the glue removal solution;

[0010] Circulating pipeline with inlet end and outlet end, the inlet end and the outlet end are communicated with the inside of the soaking tank, and the inlet end is below the liquid level of the glue removal solution, and the outlet end is above the liquid level of the glue removal solution;

[0011] Circulating pump connected with the circulating pipeline, and used to drive the glue removal solution to enter the circulating pipeline from the inlet end, and circulate to the soaking tank from the outlet end;

[0012] First heating part is arranged in the circulating pipeline, for heating the glue removal solution in the circulating pipeline;

[0013] Second heating part is arranged in the soaking tank, for heating and keeping the glue removal solution in the soaking tank at the preset temperature.

[0014] As preferred, the second heating part comprises an electric heating wire, which is arranged around the inner side wall of the soaking tank and used for heating the stripping solution in the soaking tank.

[0015] As preferred, the second heating part further comprises:

[0016] a temperature sensor, which is arranged in the soaking tank and used for monitoring the actual solution temperature in the soaking tank;

[0017] a temperature controller, which is electrically connected with the temperature sensor and the electric heating wire, and configured to control the heating power of the electric heating wire to compensate for the difference between the actual solution temperature and the preset temperature.

[0018] As preferred, the soaking type stripping device further comprises an ultrasonic generator, which is arranged at the bottom of the soaking tank.

[0019] As preferred, the soaking type stripping device further comprises a posture adjusting part, and the fixing part is arranged at the adjusting end of the posture adjusting part to adjust the posture of the product.

[0020] As preferred, the posture adjusting part comprises:

[0021] a frame;

[0022] a connecting piece, which is hingedly connected at both ends with the frame and the fixing part;

[0023] a telescopic piece, which is arranged in parallel and spaced apart from the connecting piece, and hingedly connected at both ends with the frame and the fixing part, and used for adjusting the inclination angle of the product.

[0024] As preferred, the posture adjusting part further comprises a lifting mechanism, and the frame is arranged at the lifting end of the lifting mechanism, and the lifting mechanism is used for adjusting the height of the fixing part and can make the fixing part hover at any height.

[0025] As preferred, the lifting mechanism is a linear motor.

[0026] As preferred, the soaking type stripping device further comprises an air nozzle, which is arranged at the bottom of the soaking tank and opposite to the product, and used for conveying inert gas into the soaking tank.

[0027] As preferred, the soaking type stripping device further comprises a filter, which is arranged at the inlet end and used for filtering the colloid.

[0028] The beneficial effects of the present application are as follows:

[0029] The soaking type degumming device, the first heating part can heat the degumming solution in the circulating pipeline, then the degumming solution can be circulated to the soaking tank again under the action of the circulating pump, so as to complete the preheating of the whole degumming device, the second heating part can heat the degumming solution in the soaking tank to the preset temperature and keep at the preset temperature, so as to complete the fine heating of the whole degumming device. Under the action of the first heating part and the second heating part, the heating efficiency and the heating precision of the degumming solution can be improved, so that the degumming efficiency of the degumming solution and the product yield can be guaranteed, and under the action of the circulating pump and the circulating pipeline, the uniformity of the degumming solution temperature in the soaking tank can be guaranteed, so that the degumming efficiency and the product yield can be further guaranteed. BRIEF DESCRIPTION OF DRAWINGS

[0030] Fig. 1 is a structure schematic view of the soaking type degumming device in the embodiment of the utility model;

[0031] Fig. 2 is a structure schematic view of the soaking type degumming device in the embodiment of the utility model;

[0032] Fig. 3 is a structure schematic view of the soaking type degumming device in the embodiment of the utility model.

[0033] In the drawing:

[0034] 1, fixed part; 2, soaking tank; 3, circulating pipeline; 4, first heating part; 5, heating wire; 6, ultrasonic generator;

[0035] 7, attitude adjusting part; 71, rack; 72, connecting piece; 73, telescopic piece; 74, lifting mechanism;

[0036] 8, filter. DETAILED DESCRIPTION

[0037] The utility model will be further explained in detail in combination with the drawings and embodiments. It can be understood that the specific embodiments described here are only used to explain the utility model, and not limited to the utility model. In addition, it should be noted that in order to facilitate the description, only the part related to the utility model is shown in the drawing, not all the structures.

[0038] In the description of the utility model, unless another definite provision and limit, the term "link", "connect", "fix" should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or be integrated;Can be mechanical connection, also can be electrical connection;Can be directly connected, also can be indirectly connected through intermediate medium, can be two element internal communication or two element mutual action relationship.For the ordinary skilled in the art, the specific meaning of the above-mentioned terms in the utility model can be understood according to the specific circumstances.

[0039] In the utility model, unless another definite provision and limit, the first feature is "on" or "under" the second feature can include the first and second features direct contact, also can include the first and second features are not direct contact but contact through the additional features between them.Moreover, the first feature is "on", "above" and "on" the second feature includes the first feature is directly above and obliquely above the second feature, or just indicates that the horizontal height of the first feature is higher than the second feature.The first feature is "under", "below" and "under" the second feature includes the first feature is directly below and obliquely below the second feature, or just indicates that the horizontal height of the first feature is less than the second feature.

[0040] In the description of the embodiment, the orientation or position relationship of the terms "on", "under", "left", "right" and the like is based on the orientation or position relationship shown in the drawing, only for the convenience of description and simplification of operation, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore cannot be understood as a limitation on the utility model.In addition, the terms "first", "second" are only used to distinguish in the description, and have no special meaning.

[0041] The embodiment proposes a soaking type degumming device, which removes the colloid on the product by soaking, and the product is taken as a wafer for illustration in the embodiment, and the photoresist on the wafer surface needs to be removed in the manufacturing process of the wafer semiconductor, so as to ensure the smooth progress of subsequent work, of course, in some other feasible embodiments, the product can also be other products to be removed from the colloid, which is not described here.

[0042] Specifically, refer to Figs. 1 to 3The soaking type degumming device comprises a fixing part 1, a soaking tank 2, a circulating pipeline 3, a circulating pump, a first heating part 4 and a second heating part. The fixing part 1 is used for fixing products. The soaking tank 2 is used for containing a degumming solution, and the products are immersed in the degumming solution. The circulating pipeline 3 has an inlet end and an outlet end, both of which are in communication with the inside of the soaking tank 2, and the inlet end is below the liquid level of the degumming solution, and the outlet end is above the liquid level of the degumming solution. The circulating pump is connected with the circulating pipeline 3, and is used for driving the degumming solution to enter the circulating pipeline 3 from the inlet end and to circulate to the soaking tank 2 from the outlet end. The first heating part 4 is arranged in the circulating pipeline 3, and is used for heating the degumming solution in the circulating pipeline 3 to a first preset temperature. The second heating part is arranged in the soaking tank 2, and is used for heating and maintaining the degumming solution in the soaking tank 2 at a preset temperature. The degumming solution is preferably an existing organic solution used for degumming, which is not described herein.

[0043] It can be understood that the first heating part 4 can heat the degumming solution in the circulating pipeline, and then the degumming solution can be circulated to the soaking tank 2 again under the action of the circulating pump to complete the preheating of the entire degumming device. The second heating part can heat the degumming solution in the soaking tank 2 to a preset temperature and maintain it at the preset temperature to complete the fine heating of the entire degumming device. The heating efficiency and precision of the degumming solution can be improved under the action of the first heating part 4 and the second heating part, so as to ensure the degumming efficiency and product yield of the degumming solution. The uniformity of the degumming solution temperature in the soaking tank 2 can be ensured under the action of the circulating pump and the circulating pipeline 3, so as to further ensure the degumming efficiency and product yield.

[0044] Specifically, the second heating part comprises a temperature sensor, an electric heating wire 5 and a temperature controller. The temperature sensor is arranged in the soaking tank 2 and is used for monitoring the actual solution temperature in the soaking tank 2. The electric heating wire 5 is arranged around the side wall of the soaking tank 2 and is used for heating the degumming solution in the soaking tank 2. The temperature controller is electrically connected with the temperature sensor and the electric heating wire 5, and is configured to control the heating power of the electric heating wire 5 to compensate for the difference between the actual solution temperature and the preset temperature. It can be understood that the temperature sensor can transmit a signal to the temperature controller after monitoring the actual solution temperature, and then the temperature controller can adjust the heating power of the electric heating wire 5 according to the difference between the actual solution temperature and the preset temperature. Since the electric heating wire 5 is arranged around the side wall of the soaking tank 2, it is easy to cause a difference between the temperature in the central region of the soaking tank 2 and the temperature near the side wall. Under the action of the circulating pipeline 3 and the circulating pump, the uniformity of the solution temperature in the soaking tank 2 can be further ensured.

[0045] Exemplarily, the optimal removal temperature of the photoresist is 55-60℃, the first heating part 4 can heat the photoresist removal solution in the circulating pipeline 3 to about 55℃, since the photoresist removal solution in the whole circulating pipeline 3 is in flow, the temperature of the photoresist removal solution at different positions cannot be guaranteed to be consistent, thus leading to the temperature difference of the photoresist removal solution at different positions after circulating to the soaking tank 2, thus affecting the overall photoresist removal efficiency, therefore, the real-time temperature of the photoresist removal solution circulating to the soaking tank 2 can be monitored under the action of the second heating part, and the photoresist removal solution in the soaking tank 2 can be secondarily heated according to the monitoring result, so as to ensure that the photoresist removal solution is kept at the optimal removal temperature of the photoresist, i.e. the second preset temperature.

[0046] In addition, the first heating part 4 is preferably a liquid heater, which can quickly raise the temperature of the photoresist removal solution to the first preset temperature, thus further improving the photoresist removal efficiency of the soaking type photoresist removal device.

[0047] Further, the soaking type photoresist removal device further comprises an ultrasonic generator 6, which is arranged at the bottom of the soaking tank 2. It can be understood that, during the photoresist removal process, the ultrasonic generator 6 can emit ultrasonic waves, which can facilitate the photoresist to separate from the wafer under the action of the ultrasonic waves, thus further ensuring the photoresist removal efficiency and product yield.

[0048] Still further, the soaking type photoresist removal device further comprises a posture adjusting part 7, and the fixing part 1 is arranged at the adjusting end of the posture adjusting part 7 to adjust the posture of the product. It can be understood that, during the photoresist removal process, the posture of the fixing part 1 is adjusted by the posture adjusting part 7, thus the posture of the product is adjusted, and during the adjustment process, the friction between the product and the photoresist removal solution can help to remove the photoresist, thus further improving the photoresist removal efficiency.

[0049] In particular, after the fixing part 1 is placed in the photoresist removal solution, the radial direction of the wafer is arranged perpendicularly to the surface of the ultrasonic generator 6 by the posture adjusting part 7, thus further increasing the ultrasonic photoresist removal efficiency.

[0050] In this embodiment, the posture adjusting part 7 comprises a rack 71, a connecting piece 72 and an extension piece 73, the connecting piece 72 is hingedly connected to the rack 71 and the fixing part 1 at two ends respectively, the extension piece 73 is arranged in parallel and spaced apart from the connecting piece 72, and the two ends of the extension piece 73 are hingedly connected to the rack 71 and the fixing part 1 respectively, and the extension piece 73 is used to adjust the inclination angle of the product. It can be understood that, during the extension or contraction of the extension piece 73, the fixing part 1 can swing around the connection point between the fixing part 1 and the connecting piece 72, thus the posture of the fixing part 1 can be adjusted. The extension piece 73 is a telescopic cylinder, of course, in some other feasible embodiments, the extension piece 73 can also be other existing linear extension structures, which will not be described here.

[0051] Preferably, the connecting member 72 is two connecting rods, and the two connecting rods and the telescopic cylinder can form a triangular structure, so as to improve the stability of the fixing part 1 and improve the safety performance.

[0052] Further, the posture adjusting part 7 further comprises a lifting mechanism 74, the rack 71 is arranged at a lifting end of the lifting mechanism 74, and the lifting mechanism 74 is used for adjusting the height of the fixing part 1 and enabling the fixing part 1 to hover at any height. It can be understood that the height of the fixing part 1 can be controlled under the action of the lifting mechanism 74, so as to facilitate the placement of the product to be delaminated on the fixing part 1 and the taking out of the wafer after delamination, thereby further improving the delamination efficiency. Preferably, the lifting mechanism 74 is a linear motor or other linear driving structure.

[0053] It should be noted that the fixing part 1 is preferably a cassette or other existing wafer fixing structure, which is not described herein.

[0054] In this embodiment, the soaking type delamination device further comprises an air nozzle, the air nozzle is arranged at the bottom of the soaking tank 2 and faces the product, and the air nozzle is used for conveying inert gas into the soaking tank 2. It can be understood that the inert gas conveyed into the soaking tank 2 through the air nozzle will generate bubbles, and the bubbles will break when they contact the product during the rising process, thereby generating oscillation, and further improving the delamination efficiency.

[0055] In addition, it should be noted that heat will be generated during the breaking of the bubbles and the working of the ultrasonic generator 6, thereby causing the temperature of the delamination solution in the soaking tank 2 to rise. At this time, the temperature sensor can monitor the temperature of the delamination solution in real time, thereby transmitting a signal to the temperature controller, so that the temperature controller can regulate the heating power of the heating wire 5, and thereby the temperature of the delamination solution in the soaking tank 2 can be maintained at the second preset temperature.

[0056] In this embodiment, the soaking type delamination device further comprises a filter 8, the filter 8 is arranged at the inlet end, and the filter 8 is used for filtering the glue. It can be understood that during the delamination process, part of the glue is dissolved in the delamination solution, and part of the glue is separated from the product and flows to the circulating pipeline 3 with the delamination solution. Under the action of the filter 8, the glue in the delamination solution can be removed, thereby avoiding the blockage of the circulating pipeline 3 or the circulating pump by the glue.

[0057] Obviously, the above embodiments of the present application are merely examples for clearly illustrating the present application, and are not intended to limit the implementation modes of the present application. For those skilled in the art, various obvious changes, re-adjustments and replacements can be made without departing from the protection scope of the present application. Here, it is not necessary and also impossible to enumerate all the implementation modes. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application claim.

Claims

1. An immersion-type adhesive removal device for removing adhesive from products, characterized in that, include: Fixing part (1) is used to fix the product; Immersion tank (2) for containing a degumming solution, wherein the product is immersed in the degumming solution; The circulation pipe (3) has an inlet end and an outlet end, both of which are connected to the interior of the soaking tank (2), and the inlet end is below the surface of the degumming solution, while the outlet end is above the surface of the degumming solution. A circulation pump is connected to the circulation pipe (3) and is used to drive the degumming solution to enter the circulation pipe (3) from the inlet end and circulate it to the soaking tank (2) from the outlet end; The first heating unit (4) is provided in the circulation pipe (3) and is used to heat the degumming solution in the circulation pipe (3); The second heating unit is provided in the soaking tank (2) and is used to heat the degumming solution in the soaking tank (2) and maintain it at a preset temperature; The second heating part includes: Heating wire (5), the heating wire (5) is arranged around the inner sidewall of the soaking tank (2) and is used to heat the adhesive removal solution in the soaking tank (2); A temperature sensor is installed in the soaking tank (2) and is used to monitor the actual solution temperature in the soaking tank (2); A temperature controller is electrically connected to the temperature sensor and the heating wire (5). The temperature controller is configured to control the heating power of the heating wire (5) to compensate for the difference between the actual solution temperature and the preset temperature.

2. The immersion-type degumming device according to claim 1, characterized in that, The immersion adhesive removal device also includes an ultrasonic generator (6), which is located at the bottom of the immersion tank (2).

3. The immersion-type degumming device according to claim 1, characterized in that, The immersion adhesive removal device also includes a posture adjustment part (7), and the fixing part (1) is disposed at the adjustment end of the posture adjustment part (7) to adjust the posture of the product.

4. The immersion-type degumming device according to claim 3, characterized in that, The attitude adjustment unit (7) includes: rack (71); The connector (72) is hinged at both ends to the frame (71) and the fixing part (1); The telescopic member (73) is arranged parallel to and spaced apart from the connecting member (72), and the two ends of the telescopic member (73) are respectively hinged to the frame (71) and the fixing part (1), and the telescopic member (73) is used to adjust the tilt angle of the product.

5. The immersion-type degumming device according to claim 4, characterized in that, The posture adjustment unit (7) further includes a lifting mechanism (74), the frame (71) is disposed at the lifting end of the lifting mechanism (74), and the lifting mechanism (74) is used to adjust the height of the fixed part (1) and can make the fixed part (1) hover at any height.

6. The immersion-type degumming device according to claim 5, characterized in that, The lifting mechanism (74) is a linear motor.

7. The immersion-type degumming device according to claim 1, characterized in that, The immersion-type degumming device also includes an air nozzle, which is located at the bottom of the immersion tank (2) and directly opposite the product. The air nozzle is used to deliver inert gas into the immersion tank (2).

8. The immersion-type degumming device according to claim 1, characterized in that, The immersion degumming device further includes a filter (8), which is disposed at the inlet end and is used to filter the colloid.

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