Wafer detection drying mechanism and wafer detector
By designing connectable or detachable linear modules and drying modules in the wafer inspection machine, the problem of high-temperature radiation affecting test accuracy has been solved, improving inspection efficiency and precision.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-29
- Publication Date
- 2026-04-07
AI Technical Summary
High-temperature radiation during wafer inspection can negatively impact testing accuracy and reduce efficiency.
A wafer inspection and drying mechanism was designed, including a linear module, an inspection module, and a drying module. The connection structure allows them to be connected or separated to avoid the influence of high-temperature radiation on the inspection module. Two inspection stations are set on the linear module to improve inspection efficiency.
This effectively avoids the impact of high-temperature radiation on the test module, improving the efficiency and accuracy of wafer inspection.
Smart Images
Figure CN224098105U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of semiconductor equipment, and more particularly to a wafer detection and drying mechanism and a wafer testing machine. BACKGROUND
[0002] In wafer processing, a test module is needed to test the performance of a wafer, a dotting module is needed to mark defective dies of the wafer, and an oven module is needed to dry the ink dots on individual dies of the wafer after the marking.
[0003] In related technologies, on the one hand, after the wafer testing machine is started, the oven module is in a constant heating state. However, the detection and drying of the wafer need a long time. If the oven module is too close to the test module and the dotting module during the detection of the wafer, the high-temperature radiation of the oven module will damage the precise test components in the test module, affect the test accuracy, and make the ink in the dotting module solidify due to the heat, thereby affecting the smooth flow of the ink dots and causing the dotting to be interrupted or even stopped. On the other hand, only one wafer can be detected at a time during the detection of the wafer, and the wafer needs to be positionally corrected before being detected, which results in a slow wafer detection efficiency. CONTENT OF THE INVENTION
[0004] The purpose of the embodiments of the application is to provide a wafer detection and drying mechanism and a wafer testing machine to solve the technical problems of the high-temperature radiation during wafer drying and the slow wafer detection efficiency in the prior art.
[0005] To achieve the above purpose, the technical solution adopted by the first aspect of the embodiments of the application is to provide a wafer detection and drying mechanism, which comprises:
[0006] a linear module;
[0007] a detection module driven and arranged by the linear module, the detection module comprising two detection stations arranged in the moving direction of the linear module and capable of carrying wafers for detection, one of the detection stations being capable of carrying a wafer for position correction;
[0008] an oven module capable of being slidably arranged in the same direction as the detection module on a machine table, the oven module being provided with an oven station to carry wafers for dotting and drying;
[0009] The oven module and the detection module are provided with a connecting structure capable of connecting them together or separating them from each other.
[0010] Optionally, a slide rail module is arranged on the machine table at one side of the linear module, and the oven module is arranged in the slide rail module; or the oven module is slidably arranged in the linear module.
[0011] Optionally, the detection module comprises a detection frame and two detection discs arranged on the detection frame, each of the detection discs is provided with one detection station; the drying module comprises a drying frame and a heating disc arranged on the drying frame, the drying station is arranged on the heating disc; the connecting structure is used for connecting the detection frame and the drying frame.
[0012] Optionally, the connecting structure comprises a clamping jaw cylinder arranged on any one of the detection frame or the drying frame, and a clamped part arranged on any other one of the detection frame or the drying frame, the clamping jaw cylinder is used for clamping the clamped part to connect the detection module and the drying module.
[0013] Optionally, the connecting structure comprises a magnetic attraction part arranged on any one of the detection frame or the drying frame, and an electromagnet arranged on any other one of the detection frame or the drying frame.
[0014] Optionally, the connecting structure comprises a connecting slot arranged on any one of the detection frame or the drying frame, and a buckling mechanism arranged on any other one of the detection frame or the drying frame, the buckling mechanism can be buckled to the connecting slot to connect the detection module and the drying module.
[0015] Optionally, one of the detection discs is rotationally arranged on the detection frame, and a motor for driving the detection disc to rotate is arranged on the detection frame.
[0016] Optionally, each of the detection discs is conductive, a negative electrode connecting part is arranged on the detection frame between the two detection discs, and the negative electrode connecting part is in sliding contact with the circumferential sides of the two detection discs.
[0017] Optionally, a negative pressure pipeline is arranged in each of the detection discs and the heating disc, and a suction port is arranged on the surface of each of the detection discs and the heating disc.
[0018] In the second aspect of the present application, a wafer testing machine is provided, which comprises:
[0019] The wafer testing machine further comprises a machine table, a wafer detection and drying mechanism, a transfer module, a testing module and a dotting module arranged on the machine table and across the wafer detection and drying mechanism, respectively, for transferring, detecting and dotting the wafer.
[0020] The wafer detection and drying mechanism and the wafer testing machine provided by the embodiments of the present application have at least the following beneficial effects:
[0021] The inspection module can connect to the drying module to move it to the drying position, thus avoiding the impact of high-temperature radiation during wafer drying on the inspection module and dotting module on the wafer tester. At the same time, each linear module is equipped with two inspection stations. After the wafer completes position correction at the previous inspection station, it is promptly transferred to the next inspection station, and the wafer is reloaded at the previous inspection station. Then, the wafers at both inspection stations are tested simultaneously, which can effectively improve the wafer inspection efficiency. Attached Figure Description
[0022] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0023] Figure 1 and Figure 2 This is a schematic diagram showing the different positional states of the wafer inspection and drying mechanism in some embodiments of this application;
[0024] Figure 3 This is a schematic diagram of a wafer inspection and drying mechanism in some other embodiments of this application;
[0025] Figure 4 This is a perspective view of the wafer inspection and drying mechanism in some embodiments of this application;
[0026] Figure 5 These are perspective views of the connection structures in some embodiments of this application;
[0027] Figure 6 This is a perspective view of a wafer testing machine in some embodiments of this application. Detailed Implementation
[0028] To make the technical problems, technical solutions and beneficial effects to be solved by this application clearer, the following describes this application in further detail with reference to the accompanying drawings and embodiments.
[0029] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.
[0030] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on the other component or indirectly on that other component.
[0031] When a component is said to be "connected to" another component, it can be directly connected to the other component or indirectly connected to that other component.
[0032] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.
[0034] In the description of this application, "multiple" means two or more, unless otherwise expressly and specifically defined.
[0035] Please refer to the following: Figures 1 to 6 The wafer inspection and drying mechanism provided in the embodiments of this application will now be described.
[0036] It is understood that the wafer inspection and drying mechanism provided in the first aspect of this application is used on a wafer testing machine, specifically for wafer testing, dot marking and dot drying processes.
[0037] refer to Figure 6 It is understood that the wafer testing machine provided in the second aspect of this application includes at least one wafer inspection and drying mechanism, a transfer module 520, a testing module 530, and a marking module 540. The transfer module 520 is used to transfer the wafer to inspection station a or drying station b; the testing module 530 is used to inspect the wafer at inspection station a; and the marking module 540 is used to mark defective dies on the wafer at drying station b.
[0038] A gantry 510 is fixedly installed on the wafer testing machine, spanning all wafer inspection and drying mechanisms. The transfer module 520, testing module 530, and marking module 540 are all located within the gantry 510. More specifically, each of the transfer module 520, testing module 530, and marking module 540 is equipped with Y-axis and Z-axis drive devices. The transfer module 520 is used for loading and unloading wafers, the testing module 530 is used for performance testing of the wafers on the inspection module 200, and the marking module 540 is used to mark defective dies found after wafer testing with ink dots. It should be understood that the working principles of the transfer module 520, testing module 530, and marking module 540 have been described in detail in relevant prior applications and will not be repeated here.
[0039] refer to Figures 1 to 5 It is understood that the wafer inspection and drying mechanism provided in this application embodiment includes a linear module 110, an inspection module 200, and a drying module 300.
[0040] Specifically, in practical applications, the linear module 110 can be a ball screw module, which includes a drive system, a transmission system, and a sliding system. The transmission system is connected to the drive system. The drive system is a motor. The transmission system includes a ball screw device. The screw and the motor are connected by a coupling. The sliding system includes guide rails set on one or both sides of the screw and sliders slidably set on the guide rails.
[0041] The testing module 200 has two testing stations 'a' arranged along its longitudinal direction to carry the wafer for testing. These are the first testing station 1a and the second testing station 2a. The first testing station 1a can carry the wafer for position correction. Specifically, wafer position correction is achieved by adjusting the angular position of the wafer.
[0042] Specifically, the first inspection station 1a can dynamically rotate to adjust the position and angle of the wafer, while the second inspection station 2a is only used for static loading of the wafer. Generally, wafers need to be adjusted in angle and position during testing to eliminate possible positional errors during transport. Therefore, after the wafer is adjusted in angle and position at the first inspection station 1a, it is transported to the second inspection station 2a. At the same time, the first inspection station 1a continues to load wafers and perform angle and position correction. After both inspection stations a have finished loading, electrical performance tests are performed on the two wafers simultaneously.
[0043] The drying module 300 is equipped with a drying station b that can heat the wafer. The drying station b is used to dry the wafer by dotting ink dots and marking points.
[0044] Specifically, the detection module 200 is connected to both the transmission system and the sliding system in the linear module 110. Specifically, the detection module 200 is fixedly connected to the ball nut and simultaneously slidably mounted on the guide rail so that it can reciprocate along a straight line following the transmission system.
[0045] The drying module 300 can be slidably mounted on the machine in the same direction as the detection module 200, and the drying station b and the detection station a are located in the same straight line direction.
[0046] Specifically, the sliding connection of the drying module 300 on the machine base can be implemented in the following ways. For example, refer to... Figure 1 and Figure 2In the first embodiment, a slide rail module 120 is provided on the machine base, located on one side of the linear module 110, and a drying platform is disposed on the slide rail module 120. Furthermore, the drying station b of the drying platform is located above the linear module 110. Alternatively, refer to... Figure 3 , Figure 4 and Figure 6 In the second embodiment, the drying module 300 is connected to a sliding system on the linear module 110, which allows it to slide freely on the linear module 110 without power.
[0047] refer to Figures 4 to 6 Furthermore, a connecting structure 400 is provided between the detection module 200 and the drying module 300, enabling the two to be connected as one unit or separated, thereby allowing the detection module 200 to drive the drying module 300 to slide relative to the machine platform. The connecting structure 400 includes, but is not limited to, any one of a clamping structure, a snap-fit structure, or a magnetic attraction structure.
[0048] refer to Figure 5 In some embodiments, the clamping structure includes a gripper cylinder 410 and a clamped component 420. The gripper cylinder 410 is disposed in one of the detection module 200 and the drying module 300, and the clamped component 420 is disposed in the other of the detection module 200 and the drying module 300. When the detection module 200 and the drying module 300 need to be connected, the gripper cylinder 410 clamps the clamped component 420; when the detection module 200 and the drying module 300 need to be separated, the gripper cylinder 410 releases the clamped component 420.
[0049] In some embodiments, the fastening structure includes a fastening member and a slot. The fastening member may include a driving component such as a cylinder or motor, and a locking block disposed on the driving component. The driving component drives the locking block to engage in the slot. The fastening member is disposed in one of the detection module 200 and the drying module 300, and the slot is disposed in the other. When the detection module 200 and the drying module 300 need to be connected, the fastening member drives the locking block to engage in the slot; when the detection module 200 and the drying module 300 need to be separated, the fastening member drives the locking block to release from the slot.
[0050] In some embodiments, the magnetic attraction structure includes an electromagnet and a permanent magnet. The electromagnet is disposed in one of the detection module 200 and the drying module 300, and the permanent magnet is disposed in the other of the detection module 200 and the drying module 300. When the detection module 200 and the drying module 300 need to be connected, the electromagnet is energized to attract the electromagnet to the permanent magnet; when the detection module 200 and the drying module 300 need to be separated, the electromagnet is de-energized.
[0051] By providing a connection structure 400 between the detection module 200 and the drying module 300, and by driving the detection module 200 with the linear module 110 while allowing the drying module 300 to slide freely, the drying module 300 can be selectively connected to or separated from the detection module 200. Therefore, when the drying module 300 continuously heats and dries the wafer, it can be moved to any position away from the gantry 510 on the wafer testing machine.
[0052] refer to Figure 2 , Figure 3 and Figure 6 It is understandable that the axial position of the gantry 510 on the wafer testing machine relative to the linear module 110 is defined as the first position A. It should be understood that since the gantry 510 has a certain width, the aforementioned first position A has a certain segment distance and is not a fixed point position; the end of the linear module 110 away from the gantry 510 is defined as the second position B.
[0053] By configuring the wafer inspection and drying mechanism in this way, at least the following advantages are achieved:
[0054] Firstly, when the wafer is loaded to the inspection station a, the inspection module 200 and the drying module 300 can be connected or separated. Preferably, the inspection module 200 and the drying module 300 are separated and far apart from each other. When the inspection module 200 carries the wafer and performs wafer inspection at the first position A, the drying module 300 can be pushed to the second position B. This is to avoid the high temperature affecting the inspection module 530 and the dotting module 540 on the wafer testing machine.
[0055] Secondly, the testing module 200 is equipped with two testing stations a. The first testing station 1a is used to perform position correction and testing on the wafer, and the second testing station 2a is used to carry the position-corrected wafer for testing. When the drying module 300 dries the wafer at the second position B, the testing module 200 can test two wafers at the same time, thereby improving the wafer turnover and scheduling efficiency.
[0056] Thirdly, the transfer of wafers between inspection station a and drying station b is carried out at the first position A, which eliminates the drive requirement of gantry 510 on the X-axis. The drive load of linear module 110 on the X-axis is also small. Under the condition of small drive load, the drive accuracy of the X-axis can be effectively improved. That is, the die detection of each row / column of wafers can be more accurate during testing.
[0057] refer to Figure 4In some embodiments, the testing module 200 includes a testing frame 210, which is connected to the ball nut and slider in the linear module 110. Two testing disks 220, namely a first testing disk 221 and a second testing disk 222, are provided on the testing frame 210. The testing disks 220 are electrically conductive, and each testing station a is located on each testing disk 220. During wafer testing, a conductive circuit is formed between the testing module 530 and the testing disks 220 to detect the electrical performance of each die.
[0058] refer to Figure 4 The drying module 300 includes a drying rack 310 and a heating plate 320 disposed on the drying rack 310. Drying station b is disposed on the heating plate 320. Specifically, the heating plate 320 is made of a conductive material, and an electric heating rod is disposed within the heating plate 320. It is understood that in the first embodiment of the aforementioned sliding arrangement of the drying module 300, the drying rack 310 is slidably disposed on the slide rail module 120; in the second embodiment of the aforementioned sliding arrangement of the drying module 300, the drying rack 310 is connected to a slider on the linear module 110.
[0059] The aforementioned connection structure 400 is used to connect the testing rack 210 and the drying rack 310.
[0060] refer to Figure 4 Furthermore, in the same detection module 200, the first detection disk 221 is rotatably mounted on the detection frame 210, and a motor 231 for driving the detection disk 220 to rotate is mounted on the detection frame 210. The motor 231 can be directly mounted on the bottom of the first detection disk 221 to directly drive the first detection disk 221, or the motor 231 can be mounted on one side of the first detection disk 221 and drive the first detection disk 221 to rotate through the synchronous belt mechanism 232.
[0061] refer to Figure 4 Furthermore, a negative electrode connector 240 is disposed on the test rack 210 between the two test trays 220, making slidable contact with the periphery of each test tray 220. Exemplarily, the negative electrode connector 240 includes a conductive spring that maintains continuous contact with the test tray 220, and the conductive spring is in an elastically compressed state. When the first test tray 221 rotates, the conductive spring can maintain contact with the first test tray 221 under the action of elastic force, thereby ensuring the stability of the conductive path during wafer testing.
[0062] In some embodiments, negative pressure pipes are provided in both the detection plate 220 and the heating plate 320, and adsorption ports are provided on the surfaces of both the detection plate 220 and the heating plate 320. The negative pressure pipes are connected to an external negative pressure generating device. In this way, the wafer can be better fixed during detection, marking, and drying.
[0063] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A wafer inspection and drying mechanism, used for mounting on the machine base of a wafer inspection machine to carry wafers for inspection, marking, and drying, characterized in that, include: Linear module; The detection module is driven by the linear module. The detection module includes two detection stations arranged in the moving direction of the linear module and both capable of carrying wafers for detection. One of the detection stations can carry wafers for position correction. A drying module is slidably mounted on the machine tool in the same direction as the detection module. A drying station is provided on the drying module to carry the wafer for marking and drying. The drying module and the detection module are provided with a connection structure that allows the two to be connected as one unit or separated from each other.
2. The wafer inspection and drying mechanism as described in claim 1, characterized in that: A slide rail module is provided on the machine platform, located on one side of the linear module, and the drying module is disposed on the slide rail module; or, the drying module is slidably disposed on the linear module.
3. The wafer inspection and drying mechanism as described in claim 1 or 2, characterized in that: The testing module includes a testing frame and two testing plates disposed on the testing frame, each testing plate having a testing station; the drying module includes a drying frame and a heating plate disposed on the drying frame, the drying station being disposed on the heating plate; the connecting structure is used to connect the testing frame and the drying frame.
4. The wafer inspection and drying mechanism as described in claim 3, characterized in that: The connection structure includes a gripper cylinder disposed on either the testing rack or the drying rack, and a clamped component disposed on the other of the testing rack or the drying rack. The gripper cylinder is used to clamp the clamped component to connect the testing module and the drying module.
5. The wafer inspection and drying mechanism as described in claim 3, characterized in that: The connection structure includes a magnetic suction element disposed on either the testing rack or the drying rack, and an electromagnet disposed on the other of the testing rack or the drying rack.
6. The wafer inspection and drying mechanism as described in claim 3, characterized in that: The connection structure includes a connection groove disposed on either the testing rack or the drying rack, and a fastening mechanism disposed on the other of the testing rack or the drying rack. The fastening mechanism can fasten to the connection groove to connect the testing module and the drying module.
7. The wafer inspection and drying mechanism as described in claim 3, characterized in that: One of the detection discs is rotatably mounted on the detection frame, and a motor for driving the detection disc to rotate is provided on the detection frame.
8. The wafer inspection and drying mechanism as described in claim 7, characterized in that: Each of the aforementioned detection discs is electrically conductive, and a negative electrode connector is provided on the detection frame between two detection discs, the negative electrode connector being in sliding contact with the periphery of both detection discs simultaneously.
9. The wafer inspection and drying mechanism as described in claim 3, characterized in that: Negative pressure pipes are provided in each detection plate and the heating plate, and adsorption ports are provided on the surface of each detection plate and the heating plate.
10. A wafer inspection machine for inspecting, marking, and drying wafers, characterized in that, The machine includes a machine and a wafer inspection and drying mechanism as described in any one of claims 1 to 9. The machine is further provided with a transfer module, a test module and a dotting module for transferring, inspecting and marking wafers, respectively.