Device for assisting oscillation of wafer transfer box
By designing an auxiliary wafer transfer box oscillation device, which uses a telescopic cylinder combining an outer frame and an inner box to drive the oscillation, the problem of inaccurate oscillation frequency after wafer transfer box cleaning was solved, and the standardization of particle analysis and testing and the improvement of wafer cleanliness were achieved, thereby increasing wafer yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-15
- Publication Date
- 2026-04-10
AI Technical Summary
After cleaning the existing wafer transfer box, the oscillation frequency of the oscillating container in the liquid particle counter method is not accurate enough, resulting in poor particle suspension uniformity, which affects the consistency of particle analysis and testing and wafer yield.
Design a device to assist in the oscillation of a wafer transfer box. By combining an outer frame and an inner box, a telescopic cylinder is used to drive the inner box to oscillate, ensuring the fixed connection and precise oscillation of the wafer transfer box and eliminating human operation errors.
This method improves the accuracy of the oscillation frequency of the embedded cell in the liquid particle counter method after wafer transfer box cleaning, enhances the standardization and repeatability of particle analysis and testing, increases the cleanliness of the wafer transfer box, avoids wafer contamination, and improves wafer yield.
Smart Images
Figure CN224101417U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present disclosure relates to the field of wafer transfer box cleaning, in particular, to a device for assisting wafer transfer box oscillation. BACKGROUND
[0002] A front opening unified pod (FOUP) is a key carrier for protecting, storing and transporting wafers in the semiconductor wafer manufacturing process. The main structure of the FOUP includes a front opening sealed cavity capable of accommodating wafers and a door frame mechanism matching the automatic transmission system. Through high cleanliness materials and precise locking design, the FOUP ensures that the wafers are not affected by dust, chemical pollutants and mechanical damage during the automatic transmission process in the factory. As the only physical contact interface between the wafer and the process equipment, the internal cleanliness of the FOUP is directly related to the yield and reliability of semiconductor devices.
[0003] Since the FOUP may cause wafer surface defects due to residual particles, metal ions and organic contamination during multiple cycles, a fully automatic FOUP cleaning machine has become an essential device for semiconductor production lines. Such a cleaning machine removes contaminants through multiple stages of processes (such as pre-cleaning, chemical cleaning, ultrasonic oscillation, high-purity water rinsing and nitrogen drying) to ensure that the inner surface of the FOUP reaches sub-micron cleanliness.
[0004] Generally, after the FOUP is cleaned, it needs to be verified for cleanliness through standardized testing, and particle analysis (PA) testing is a key link. The PA testing uses the liquid particle count (LPC) method, which involves injecting ultrapure water into the FOUP, taking a sample after oscillation, and quantifying the concentration and particle size distribution of micron-level particles in the water sample through an LPC device to evaluate the cleanliness of the inner wall of the FOUP.
[0005] However, the existing LPC testing relies on manual operation of the oscillation container (such as manual shaking or simple mechanical assistance), and the frequency, amplitude and force are significantly affected by individual differences of the operator. Fluctuations in oscillation frequency can cause differences in particle suspension uniformity, which in turn can cause deviations in LPC readings. This uncontrollable human factor seriously restricts the consistency of LPC test results, especially in the context of advanced processes (such as below 3nm) requiring FOUP cleanliness approaching "zero defects", the traditional oscillation method has become a bottleneck restricting yield improvement.
[0006] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the present disclosure, and therefore can include information that does not constitute prior art known to those of ordinary skill in the art. CONTENT OF THE INVENTION
[0007] Therefore, the present disclosure provides a device for assisting the oscillation of a FOUP to at least solve the problem of the lack of accuracy of the oscillation frequency of the oscillation container in the liquid particle counter method after the cleaning of the FOUP.
[0008] Embodiments of the present disclosure provide a device for assisting the oscillation of a FOUP, comprising:
[0009] an outer frame;
[0010] an inner-embedded box rotatably connected to the inside of the outer frame, the inner-embedded box being used to accommodate and fixedly connect with the FOUP;
[0011] a telescopic cylinder located inside the outer frame and on the lower side of the inner-embedded box, the telescopic cylinder having a telescopic rod abutting against the lower surface of the inner-embedded box, the inner-embedded box having an oscillation trajectory relative to the outer frame based on the telescopic movement of the telescopic rod.
[0012] In some embodiments, the device for assisting the oscillation of a FOUP further comprises:
[0013] a buffer arranged between the inner surface of the inner-embedded box and the FOUP, the buffer abutting against both the inner-embedded box and the FOUP.
[0014] In some embodiments, the outer frame is a box body with an open top end, the inner surface of the side wall of the box body having two first connecting parts connected to the outer surface of the side wall of the inner-embedded box.
[0015] In some embodiments, the oscillation trajectory of the inner-embedded box is contained in the bottom surface of the box body based on the projection of the plane where the bottom surface of the box body is located.
[0016] In some embodiments, the line connecting the two first connecting parts is perpendicular to the oscillation trajectory of the inner-embedded box.
[0017] In some embodiments, the number of telescopic cylinders is two, and the extension directions of the two telescopic rods intersect.
[0018] In some embodiments, the plane formed by the extension directions of the two telescopic rods is a first plane, the plane where the oscillation trajectory of any point on the inner-embedded box is located is a second plane, and the first plane is parallel to the second plane.
[0019] In some embodiments, the two telescopic rods are a first telescopic rod and a second telescopic rod, respectively, and the first telescopic rod and the second telescopic rod have an extended state and a retracted state.
[0020] At any moment of the device for assisting the oscillation of a FOUP, when the first telescopic rod is in the extended state, the second telescopic rod is in the retracted state, and when the first telescopic rod is in the retracted state, the second telescopic rod is in the extended state.
[0021] In some embodiments, the end of the telescopic rod is a spherical structure, which is in sliding abutment with the lower surface of the embedded box.
[0022] In some embodiments, the outer frame is a gantry, which has two vertically arranged support columns, each of which has a second connecting part, and the two second connecting parts are connected to the outer surface of the side wall of the embedded box, and the line connecting the two second connecting parts is perpendicular to the oscillation trajectory of the embedded box.
[0023] Compared with the prior art, the present disclosure has at least the following technical effects:
[0024] The device for assisting the oscillation of the wafer transfer box of the present disclosure can improve the accuracy of the oscillation frequency of the embedded box in the liquid particle counter method after the wafer transfer box is cleaned, eliminate the errors caused by the manual operation of the operator, improve the standardization and repeatability of the particle analysis test, increase the cleanliness of the wafer transfer box cleaning, avoid the defects caused by the pollution of the wafer transfer box to the wafer, and improve the yield of the wafer. BRIEF DESCRIPTION OF DRAWINGS
[0025] The drawings incorporated into the specification and forming a part thereof, show embodiments consistent with the present disclosure, and together with the specification serve to explain the principles of the present disclosure. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can be obtained according to these drawings without creative labor for those skilled in the art.
[0026] Figure 1 is a structural schematic view of a device for assisting the oscillation of a wafer transfer box provided by the present disclosure;
[0027] Figure 2 is Figure 1 is a structural schematic view of another side of the device for assisting the oscillation of the wafer transfer box in
[0028] Figure 3 is a structural schematic view of another device for assisting the oscillation of a wafer transfer box provided by the present disclosure.
[0029] Reference signs:
[0030] 100 device for assisting the oscillation of a wafer transfer box
[0031] 110 outer frame
[0032] 111 first connecting part
[0033] 112 second connecting part
[0034] 120 Embedded Box
[0035] 130 telescopic cylinder
[0036] 131 Telescopic pole
[0037] 132 Spherical Structure
[0038] 140 buffer
[0039] 200 wafer transfer boxes Detailed Implementation
[0040] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore repeated descriptions of them will be omitted.
[0041] The use of terms such as "first," "second," and similar terms in the specific description does not indicate any order, quantity, or importance, but is merely used to distinguish different components. Furthermore, in the description of this disclosure, the terms "upper," "lower," etc., indicate orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings. These are for ease of description only and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure.
[0042] It should be noted that, unless otherwise specified, the embodiments of this disclosure and the features in different embodiments can be combined with each other.
[0043] like Figure 1 and Figure 2 As shown, an embodiment of this disclosure provides an apparatus 100 for oscillating an auxiliary wafer transfer box 200, comprising: an outer frame 110, an inner box 120, and a telescopic cylinder 130.
[0044] The outer frame 110 is used to fix the inner box 120 and provide space for the inner box 120 to vibrate.
[0045] The inner box 120 is rotatably connected to the inside of the outer frame 110. The inner box 120 is used to accommodate the wafer transfer box 200 and is fixedly connected to the wafer transfer box 200. The size of the inner box 120 is matched with that of the wafer transfer box 200 and fixedly connected, so that the inner box 120 can drive the wafer transfer box 200 to vibrate.
[0046] The telescopic cylinder 130 is located inside the outer frame 110 and at the lower side of the embedded box 120. The telescopic cylinder 130 has a telescopic rod 131 which is in abutment with the lower surface of the embedded box 120. The embedded box 120 has an oscillation track which oscillates relative to the outer frame 110 based on the telescopic movement of the telescopic rod 131. Specifically, the telescopic cylinder 130 can be fixedly connected to the bottom of the outer frame 110 or other components, which is not limited in the present disclosure. At the same time, since the embedded box 120 is fixedly connected to the wafer transfer box 200, the wafer transfer box 200 also has an oscillation track which oscillates relative to the outer frame 110 based on the telescopic movement of the telescopic rod 131.
[0047] In the present embodiment, the wafer transfer box 200 is fixedly connected to the inside of the embedded box 120, the embedded box 120 is rotatably connected to the inside of the outer frame 110, and the telescopic rod 131 of the telescopic cylinder 130 drives the embedded box 120 to oscillate relative to the outer frame 110 based on the telescopic movement, thereby driving the wafer transfer box 200 to oscillate. This can improve the accuracy of the oscillation frequency of the embedded box 120 in the liquid particle counter method after the wafer transfer box 200 is cleaned, eliminate the human operation error of the oscillation operator, improve the standardization and repeatability of the particle analysis test, increase the cleanliness of the wafer transfer box 200 after cleaning, avoid the defects caused by the pollution of the wafer transfer box 200 to the wafer, and improve the yield of the wafer.
[0048] In some optional embodiments, the wafer transfer box 200 can be a front opening wafer transfer box 200, an open wafer transfer box 200, a sealed vacuum wafer transfer box 200, or a double-door wafer transfer box 200, which is not limited in the present disclosure.
[0049] In some embodiments, continuing to refer to Figure 1 The device 100 for assisting the oscillation of the wafer transfer box 200 further comprises a buffer 140. The buffer 140 is arranged between the inner surface of the embedded box 120 and the wafer transfer box 200, and is in abutment with the embedded box 120 and the wafer transfer box 200. Specifically, the buffer 140 can be a flexible material such as sponge or foam which can provide a buffering effect for the wafer transfer box 200 and the embedded box 120, which is not limited in the present disclosure. The buffer 140 of the present embodiment can prevent the wafer transfer box 200 and the embedded box 120 from being hard collided due to oscillation, avoid the damage of the wafer transfer box 200 and the embedded box 120, and improve the service life of the wafer transfer box 200 and the embedded box 120.
[0050] In some embodiments, continuing to refer to Figure 1 The buffer 140 can comprise a buffer surface (141) which is in abutment with the wafer transfer box 200. Figure 1a plurality of buffer columns (not shown) that are separated from each other and abut against the inner surface of the inner box 120. Figure 1 The buffer space is formed between the plurality of buffer columns that are separated from each other. The buffer 140 of the embodiment can further improve the buffering effect between the wafer transfer box 200 and the inner box 120, and prevent damage caused by hard collision between the wafer transfer box 200 and the inner box 120 due to vibration.
[0051] In some embodiments, continuing to refer to Figure 1 The outer frame 110 is a box body with an open top end, and the inner surface of the side wall of the box body has two first connecting portions 111 connected to the outer surface of the side wall of the inner box 120. The first connecting portion 111 of the embodiment is used to ensure that the inner box 120 is rotatably connected to the inside of the outer frame 110, so that the inner box 120 can have a vibration trajectory based on the telescopic movement of the telescopic rod 131 relative to the outer frame 110.
[0052] In some embodiments, the vibration trajectory of the inner box 120 is contained in the bottom surface of the box body based on the projection of the plane on which the bottom surface of the box body lies. That is, the inner box 120 will not collide with the inner wall of the outer frame 110 in the form of the box body during the vibration process. The above-mentioned arrangement of the embodiment can avoid damage to the outer frame 110 and the inner box 120, and improve the service life of the outer frame 110 and the inner box 120.
[0053] In some embodiments, the line connecting the two first connecting portions 111 is perpendicular to the vibration trajectory of the inner box 120. The above-mentioned arrangement of the embodiment can maximize the vibration amplitude of the wafer transfer box 200 and increase the cleanliness of the wafer transfer box 200 during cleaning.
[0054] In some embodiments, continuing to refer to Figure 1 and Figure 2 The number of telescopic cylinders 130 is two, and the extension directions of the two telescopic rods 131 intersect. Specifically, two telescopic cylinders 130 are arranged below the inner box 120, and the extension directions of the telescopic rods 131 of the two telescopic cylinders 130 are a first direction and a second direction, respectively. The first direction and the second direction can be symmetrically arranged about the vertical direction. The arrangement of the two telescopic cylinders 130 of the embodiment can facilitate the vibration of the inner box 120 driven by the telescopic cylinder 130, and avoid collision between the telescopic cylinder 130 and the inner box 120 during the vibration of the inner box 120, thereby improving the service life of the telescopic cylinder 130 and the inner box 120.
[0055] In some embodiments, the extension direction of the two telescopic rods 131 forms a first plane, and the plane in which the oscillation track of any point on the inner box 120 lies forms a second plane, and the first plane is parallel to the second plane. Specifically, the plane formed by the intersecting first direction and the second direction is the first plane. The above arrangement of the embodiment can maximize the oscillation amplitude of the wafer transfer box 200 and increase the cleanliness of the wafer transfer box 200 after cleaning.
[0056] In some embodiments, continuing to refer to Figure 1 , the two telescopic rods 131 are a first telescopic rod and a second telescopic rod, and the first telescopic rod and the second telescopic rod have an extended state and a retracted state. At any time of the device 100 assisting the oscillation of the wafer transfer box 200, when the first telescopic rod is in the extended state, the second telescopic rod is in the retracted state, and when the first telescopic rod is in the retracted state, the second telescopic rod is in the extended state. Specifically, when the device 100 assisting the oscillation of the wafer transfer box 200 is stationary, the piston of the telescopic cylinder 130 remains in a half-stroke state, and the first telescopic rod and the second telescopic rod are both in an initial state. When the device 100 assisting the oscillation of the wafer transfer box 200 starts to operate, one of the two telescopic cylinders 130 retracts the piston, and the other ejects the piston, so that the inner box 120 drives the wafer transfer box 200 to start oscillation. The piston movement speed of the telescopic cylinder 130 is adjusted to make the inner box 120 drive the wafer transfer box 200 to swing at a fixed speed, achieving the effect of oscillation. The embodiment can improve the accuracy of the oscillation frequency of the inner box 120 in the liquid particle counter method after the wafer transfer box 200 is cleaned, and eliminate the error caused by manual operation of the operator.
[0057] In some embodiments, continuing to refer to Figure 1 , the end of the telescopic rod 131 is a spherical structure 132, and the spherical structure 132 is in sliding abutment with the lower surface of the inner box 120. Since the telescopic rod 131 is always in abutment with the lower surface of the inner box 120 during the oscillation of the inner box 120, the spherical structure 132 of the embodiment can reduce the resistance between the telescopic rod 131 and the lower surface of the inner box 120 during the oscillation process, reduce the wear between the telescopic rod 131 and the inner box 120, and improve the service life of the telescopic rod 131 and the inner box 120.
[0058] In some embodiments, as Figure 3As shown, the outer frame 110 is a gantry, which has two vertically arranged support columns, each of which has a second connecting part 112, and the two second connecting parts 112 are connected to the outer surface of the side wall of the inner box 120, and the line connecting the two second connecting parts 112 is perpendicular to the oscillation track of the inner box 120. The outer frame 110 in the form of a gantry in this embodiment can improve the visibility of the oscillation process of the inner box 120, and facilitate the recording and analysis of the oscillation process of the inner box 120; the second connecting part 112 is used to ensure that the inner box 120 is rotatably connected to the inside of the outer frame 110, so that the inner box 120 can have an oscillation track relative to the outer frame 110 based on the telescopic movement of the telescopic rod 131; the line connecting the two second connecting parts 112 is perpendicular to the oscillation track of the inner box 120, which can maximize the oscillation amplitude of the wafer transfer box 200 and increase the cleanliness of the wafer transfer box 200.
[0059] In some optional embodiments, the device 100 for assisting the oscillation of the wafer transfer box 200 can also include a conveyor belt, a mechanical hand, a water injection assembly, etc., to complete the functions of automatically transporting the wafer transfer box 200, automatically placing the wafer transfer box 200 inside the inner box 120, automatically opening the door of the wafer transfer box 200, automatically injecting water into the wafer transfer box 200, automatically pouring water inside the wafer transfer box 200, and automatically closing the door of the wafer transfer box 200, etc., and the present disclosure does not limit this.
[0060] In summary, the device for assisting the oscillation of the wafer transfer box of the present disclosure can fix the wafer transfer box to the inside of the inner box, rotatably connect the inner box to the inside of the outer frame, and make the telescopic rod of the telescopic cylinder drive the inner box to oscillate relative to the outer frame based on the telescopic movement, thereby driving the wafer transfer box to oscillate, which can improve the accuracy of the oscillation frequency of the inner box in the liquid particle counter method after the wafer transfer box is cleaned, eliminate the human error in the oscillation operation, improve the standardization and repeatability of the particle analysis test, increase the cleanliness of the wafer transfer box cleaning, avoid the defects caused by the pollution of the wafer transfer box to the wafer, and improve the yield of the wafer.
[0061] The above is a further detailed description of the present disclosure in combination with specific optional embodiments, and the specific implementation of the present disclosure cannot be limited to these descriptions. For ordinary skilled persons in the technical field to which the present disclosure belongs, some simple deductions or replacements can be made without departing from the concept of the present disclosure, and all of them should be regarded as falling within the protection scope of the present disclosure.
Claims
1. An apparatus for assisting a wafer transfer cassette in oscillation, the apparatus comprising: a first oscillating member; a second oscillating member; and a coupling member coupling the first oscillating member to the second oscillating member. The device comprises: an outer frame; an inner box rotatably connected to the inside of the outer frame, the inner box being used to accommodate a wafer transfer box and fixedly connected with the wafer transfer box; a telescopic cylinder located inside the outer frame and at the lower side of the inner box; the telescopic cylinder has a telescopic rod abutting against the lower surface of the inner box; the inner box has an oscillation track relative to the outer frame based on the telescopic movement of the telescopic rod.
2. The apparatus of claim 1, wherein, Further comprising: a buffer arranged between the inner surface of the inner box and the wafer transfer box, the buffer abutting against the inner box and the wafer transfer box.
3. The apparatus of claim 1, wherein, The outer frame is a box body with an open top end, the inner surface of the side wall of the box body has two first connecting parts, and the two first connecting parts are connected to the outer surface of the side wall of the inner box.
4. The apparatus of claim 3, wherein the at least one of the plurality of fingers is configured to be moved in a direction that is substantially perpendicular to the direction of movement of the FOUP. The oscillation track of the inner box is contained in the bottom surface of the box body based on the projection of the plane where the bottom surface of the box body is located.
5. The apparatus of claim 3, wherein the at least one of the plurality of shock absorbers is a spring. The line connecting the two first connecting parts is perpendicular to the oscillation track of the inner box.
6. The apparatus of claim 1, wherein, The number of telescopic cylinders is two, and the extension directions of the two telescopic rods intersect.
7. The apparatus of claim 6, wherein, The plane formed by the extension directions of the two telescopic rods is a first plane, the plane where the oscillation track of any point on the inner box is located is a second plane, and the first plane is parallel to the second plane.
8. The apparatus of claim 6, wherein the at least one of the plurality of fingers is configured to be moved in a direction that is substantially perpendicular to the direction of movement of the FOUP. The two telescopic rods are a first telescopic rod and a second telescopic rod, respectively, and the first telescopic rod and the second telescopic rod have an extended state and a retracted state. At any moment of the device for oscillating the auxiliary wafer transfer box, when the first telescopic rod is in the extended state, the second telescopic rod is in the retracted state, and when the first telescopic rod is in the retracted state, the second telescopic rod is in the extended state.
9. The apparatus of claim 1, wherein, The end of the telescopic rod is a spherical structure, and the spherical structure is in sliding abutment with the lower surface of the inner box.
10. The apparatus of claim 1, wherein, The outer frame is a gantry, the gantry has two vertically arranged support columns, each of the support columns has a second connecting part, and the two second connecting parts are connected to the outer surface of the side wall of the inner box. The line connecting the two second connecting parts is perpendicular to the oscillation track of the inner box.