Polishing equipment for solar silicon wafer loader

Abstract

The utility model provides polishing equipment for a solar silicon wafer loader. Relates to the technical field of silicon wafer loader processing. The solar silicon wafer loader polishing equipment comprises a main body support, a positioning frame is fixedly installed on one side of the main body support, a connecting rotating shaft is rotatably installed on the side, away from the main body support, of the positioning frame, and a first open connecting frame is fixedly installed at the end, away from the main body support, of the connecting rotating shaft; telescopic air cylinders are fixedly installed on the outer walls of the two sides of the first open connecting frame correspondingly, output shafts of the two telescopic air cylinders extend into the first open connecting frame and are slidably connected with the first open connecting frame, and linkage strips are fixedly installed on the output shafts of the two telescopic air cylinders correspondingly. And two arc-shaped positioning sheets are arranged between the two linkage strips. The cylindrical parts can be turned over rapidly, and the grinding efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of silicon wafer carrier processing, especially to a solar silicon wafer carrier polishing equipment. BACKGROUND

[0002] The silicon wafer carrier is also called a photovoltaic silicon wafer basket, which is mainly used for loading and storing good solar silicon wafers, so as to meet the requirements of placing and storing the silicon wafers and separating the silicon wafers one by one, thereby preventing the silicon wafers from being abraded by mutual friction. The current carrier is generally composed of two side plates and a plurality of cylindrical parts, such as the authorized announcement number CN221103225U of an enhanced PVDF solar silicon wafer carrier.

[0003] In the actual production process, in order to ensure that the two ends of the cylindrical part are completely attached to the two side plates, the two end surfaces of the cut cylindrical part need to be polished to make the two end surfaces of the cylindrical part smooth, so that the cylindrical part can be completely attached to the side plate when installed on the two side plates, thereby ensuring the stability of the entire carrier.

[0004] However, the common polishing method generally positions the cylindrical part first, so that one end corresponds to the polishing mechanism, and then polishes one end by the polishing mechanism. After polishing one end, the cylindrical part needs to be flipped over so that the other end corresponds to the polishing mechanism, and then polished. The entire polishing operation is relatively complicated, and the cylindrical part needs to be removed and repositioned for flipping, so that the polishing efficiency cannot be improved.

[0005] Therefore, it is necessary to provide a new solar silicon wafer carrier polishing equipment to solve the above technical problems. UTILITY MODEL CONTENT

[0006] The utility model aims at providing a solar silicon wafer carrier polishing equipment which can quickly flip the cylindrical part and accelerate the polishing efficiency.

[0007] To solve the above-mentioned technical problems, the solar silicon wafer carrier grinding equipment provided by this utility model includes: a main support frame, a positioning frame fixedly installed on one side of the main support frame, a connecting shaft rotatably installed on the side of the positioning frame away from the main support frame, a first open connecting frame fixedly installed at the end of the connecting shaft away from the main support frame, telescopic cylinders fixedly installed on both outer walls of the first open connecting frame, the output shafts of the two telescopic cylinders extending into the first open connecting frame and slidably connected to the first open connecting frame, a linkage bar fixedly installed on the output shafts of the two telescopic cylinders, two arc-shaped positioning plates provided between the two linkage bars, a second open connecting frame fixedly installed on one side of the main support frame, a vertical lead screw rotatably installed in the second open connecting frame, a lifting arm threaded on the vertical lead screw, a positioning cylinder provided above the lifting arm, and a grinding mechanism provided above the first open connecting frame.

[0008] Preferably, each of the two linkage bars has a first mounting port, and a first fixing head is fixedly installed in each of the two first mounting ports by bolts. The sides of the two first fixing heads that are close to each other are respectively fixedly connected to the two arc-shaped positioning pieces.

[0009] Preferably, the lifting arm has a second mounting port, and a second fixing head is fixedly installed in the second mounting port by bolts, and the top of the second fixing head is fixedly connected to the positioning cylinder.

[0010] Preferably, a rodless cylinder is fixedly installed on one side of the main support, a horizontal protrusion is fixedly installed on the slider of the rodless cylinder, an mounting plate is fixedly installed at the bottom of the horizontal protrusion, a pressure spring is fixedly installed at the bottom of the mounting plate, a connecting piece is fixedly installed at the bottom end of the pressure spring, and the grinding mechanism is fixedly connected to the bottom of the connecting piece.

[0011] Preferably, a first servo motor is fixedly installed inside the positioning frame, and the output shaft of the first servo motor is fixedly connected to one end of the connecting shaft. A second servo motor is fixedly installed on the top of the second open connecting frame, and the output shaft of the second servo motor is fixedly connected to the top end of the vertical lead screw.

[0012] Preferably, two guide rods are fixedly installed at the bottom of the mounting plate, and the bottom ends of the two guide rods pass through the connecting piece and are slidably connected to the connecting piece.

[0013] Preferably, the positioning frame has a stabilizing annular groove on the side away from the main support, and two stabilizing sliders are slidably installed in the stabilizing annular groove. The sides of the two stabilizing sliders away from the main support are fixedly connected to the first open connecting frame.

[0014] Compared with the related art, the solar silicon wafer carrier polishing equipment has the following beneficial effects:

[0015] The utility model provides a solar silicon wafer carrier polishing equipment, through the setting two telescopic pneumatic cylinders and two arc locating piece can clamp the cylindrical part of polishing, through the bottom end of cylindrical part enters into the locating cylinder and with its bottom resistance, can pass through the mode of starting the rodless cylinder to the top end surface of cylindrical part and polish, after, through the rotation of the connecting shaft, can quickly the cylindrical part is turned over 180 DEG, makes its both ends complete position alternation, to be able to quickly polish the other end surface of cylindrical part, improves the polishing efficiency to a certain extent, need not to take out the cylindrical part again and install it again,

[0016] And, the locating cylinder and arc locating piece can be replaced according to the diameter of the cylindrical part to be polished, and are flexible to use and have a wide range of applications. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 A structure schematic view of a preferred embodiment of the solar silicon wafer carrier polishing equipment provided by the utility model;

[0018] Figure 2 A connection structure schematic view of the positioning frame and the connecting shaft in the utility model;

[0019] Figure 3 An assembly schematic view of the linkage strip and the arc locating piece in the utility model;

[0020] Figure 4 A setting schematic view of the first mounting port in the utility model;

[0021] Figure 5 A connection structure schematic view of the arc locating piece and the first fixed head in the utility model;

[0022] Figure 6 A connection structure schematic view of the locating cylinder and the second fixed head in the utility model;

[0023] Figure 7 A connection structure schematic view of the mounting plate and the linking piece in the utility model;

[0024] Figure 8 A state schematic view of the cylindrical part placed in the locating cylinder in the utility model.

[0025] The figure label: 1, main support; 2, positioning frame; 3, connecting shaft; 4, first open connection frame; 5, telescopic cylinder; 6, linkage strip; 7, arc-shaped positioning piece; 8, first mounting port; 9, first fixed head; 10, second open connection frame; 11, vertical screw; 12, lifting arm; 13, positioning cylinder; 14, second mounting port; 15, second fixed head; 16, rodless cylinder; 17, horizontal protruding strip; 18, mounting plate; 19, pressure spring; 20, link piece; 21, polishing mechanism. DETAILED DESCRIPTION

[0026] The utility model will be further described below in combination with the drawings and embodiments.

[0027] Please refer to Figures 1-8 . Solar silicon wafer carrier polishing equipment includes: main support 1, positioning frame 2 is fixedly installed on one side of the main support 1, and connecting shaft 3 is rotatably installed on the side away from the main support 1 of the positioning frame 2, and first servo motor is fixedly installed in the positioning frame 2, and the output shaft of the first servo motor is fixedly connected with one end of the connecting shaft 3, and first open connection frame 4 is fixedly installed on the end of the connecting shaft 3 away from the main support 1, and telescopic cylinder 5 is fixedly installed on the both sides outer walls of the first open connection frame 4, and the output shafts of the two telescopic cylinders 5 are extended into the first open connection frame 4 and are slidably connected with the first open connection frame 4, and linkage strip 6 is fixedly installed on the output shafts of the two telescopic cylinders 5, and two arc-shaped positioning pieces 7 are arranged between the two linkage strips 6, and the two arc-shaped positioning pieces 7 are used to clamp and fix the cylindrical part to be polished, in addition, a horizontal bar is fixed in the first open connection frame 4, the horizontal bar penetrates through the two linkage strips 6 and is slidably connected with the two linkage strips 6, so that the output shaft of the telescopic cylinder 5 cannot rotate, second open connection frame 10 is fixedly installed on one side of the main support 1, vertical screw 11 is rotatably installed in the second open connection frame 10, second servo motor is fixedly installed on the top of the second open connection frame 10, the output shaft of the second servo motor is fixedly connected with the top end of the vertical screw 11, lifting arm 12 is screwedly installed on the vertical screw 11, positioning cylinder 13 is arranged above the lifting arm 12, and in order to ensure that the lifting arm 12 stably lifts, a vertical bar is fixed in the second open connection frame 10, the vertical bar penetrates through the lifting arm 12 and is slidably connected with the lifting arm 12, polishing mechanism 21 is arranged above the first open connection frame 4, the polishing mechanism 21 is a common polishing equipment on the market, has driving motor and polishing piece, and here will not be too much described.

[0028] And in the above manner, in order to be applicable to different diameter cylindrical parts polishing processing, the first installation opening 8 is arranged on the two linkage strips 6, the first fixed head 9 is fixedly installed in the two first installation openings 8 through bolts, and the two first fixed heads 9 are fixedly connected with the two arc-shaped positioning pieces 7 on the side close to each other. And, the second installation opening 14 is arranged on the lifting arm 12, and the second fixed head 15 is fixedly installed in the second installation opening 14 through bolts, and the top of the second fixed head 15 is fixedly connected with the positioning cylinder 13. The first fixed head 9 and the second fixed head 15 are connected through ordinary countersunk head bolts, which are not shown in detail in the figure, and the corresponding bolts are selected for use in actual operation.

[0029] In the present manner, in order to drive the polishing mechanism 21 to descend to contact the end side of the cylindrical part to form polishing, the rodless cylinder 16 is fixedly installed on one side of the main body support 1, the horizontal protruding strip 17 is fixedly installed on the sliding block of the rodless cylinder 16, the mounting plate 18 is fixedly installed at the bottom of the horizontal protruding strip 17, the pressure spring 19 is fixedly installed at the bottom of the mounting plate 18, the connecting piece 20 is fixedly installed at the bottom end of the pressure spring 19, and the polishing mechanism 21 is fixedly connected with the bottom of the connecting piece 20. The pressure spring 19 can have a certain polishing pressure between the polishing mechanism 21 and the end side of the cylindrical part to ensure good polishing effect, and two guide round rods are fixedly installed at the bottom of the mounting plate 18, the bottom ends of the two guide round rods penetrate through the connecting piece 20 and are slidably connected with the connecting piece 20 to provide stable guidance.

[0030] In the present manner, in order to reduce the bearing force of the continuous rotating shaft 3, the stable ring groove is arranged on the side of the positioning frame 2 away from the main body support 1, the two stable sliding heads are slidably installed in the stable ring groove, and the two stable sliding heads are fixedly connected with the first open connection frame 4 on the side away from the main body support 1. By connecting the stable sliding head with the first open connection frame 4, the stable sliding head can share the weight with the continuous rotating shaft 3, thereby improving the stability of the rotation of the continuous rotating shaft 3.

[0031] The working principle of the solar silicon wafer carrier polishing equipment is as follows:

[0032] In the present equipment, the positioning cylinder 13 and the arc-shaped positioning piece 7 can be prepared in multiple specifications in advance, and the diameters of each specification are different, so that they can be used with cylindrical parts of different diameters.

[0033] When the two ends of the cylindrical part on the silicon wafer carrier need to be polished, the corresponding positioning cylinder 13 and arc-shaped positioning piece 7 are replaced according to the diameter of the cylindrical part to be polished. When replacing, the bolts of the first fixed head 9 on the linkage strip 6 are removed, then the two arc-shaped positioning pieces 7 are directly extracted, then the arc-shaped positioning piece 7 of the corresponding size specification is taken out and the first fixed head 9 on it is inserted into the first installation opening 8, and then fixed.

[0034] After that, the bolt between the second fixing head 15 and the lifting arm 12 is taken out, the positioning cylinder 13 is directly taken out, the corresponding specification of the positioning cylinder 13 is taken out, then the second fixing head 15 at the bottom is inserted into the second mounting port 14, and the bolt is screwed to be fixed.

[0035] Then, the cylindrical part to be polished is placed in the positioning cylinder 13, at this time, the cylindrical part is just fitted with the inner wall of the positioning cylinder 13, then, the second servo motor is started in the positive direction according to the length of the cylindrical part, the lifting arm 12 rises with the cylindrical part, when the middle section of the cylindrical part is moved to between the two arc-shaped positioning sheets 7, the second servo motor is turned off, then the output shaft of the two telescopic cylinders 5 is extended, the cylindrical part to be polished can be clamped by the arc-shaped positioning sheet 7, then the rodless cylinder 16 and the polishing mechanism 21 are started, the horizontal convex strip 17 descends with the polishing mechanism 21, when the polishing sheet on the polishing mechanism 21 contacts the top end face of the cylindrical part, the polishing work is started, and in the polishing process, the pressure spring 19 acts, so that the polishing mechanism 21 and the end face of the cylindrical part have a certain pressure, so that the polishing effect is good.

[0036] After one end face of the cylindrical part is polished, the rodless cylinder 16 is started to take the polishing mechanism 21 back to the original height position, then the second servo motor is started in the reverse direction, the output shaft drives the positioning cylinder 13 to descend, then the first servo motor is started in the positive direction, the output shaft drives the connecting shaft 3 to rotate, so that the first open connection frame 4 can be rotated, when it is rotated by 180°, the first servo motor is turned off, at this time, the cylindrical part is turned over, the two ends are alternated, then the second servo motor is started in the positive direction, the positioning cylinder 13 is lifted again, and the bottom of the cylindrical part in the state at this time enters the positioning cylinder 13 and abuts against the bottom inner wall of the positioning cylinder 13, then the rodless cylinder 16 is started to polish the other end of the cylindrical part.

[0037] Compared with the related art, the solar silicon wafer carrier polishing equipment has the following beneficial effects:

[0038] The two telescopic cylinders 5 and the two arc-shaped positioning sheets 7 are arranged, so that the cylindrical part to be polished can be clamped, the bottom end of the cylindrical part enters the positioning cylinder 13 and abuts against the bottom, the rodless cylinder 16 is started to polish the top end face of the cylindrical part, then the connecting shaft 3 is rotated, the cylindrical part is quickly turned over by 180°, the two ends are alternated, so that the other end face of the cylindrical part can be quickly polished, the polishing efficiency is improved to a certain extent, and the cylindrical part does not need to be taken out and positioned and installed again.

[0039] And, the positioning cylinder 13 and the arc-shaped positioning sheet 7 can be adaptively replaced according to the diameters of the cylindrical parts to be polished, are more flexible to use, and have a wider application range.

[0040] The above merely describes the embodiments of the present application, and does not limit the patent range of the present application, and any equivalent structure or equivalent process transformation, or direct or indirect application in other related technical fields, which are made by using the content of the present application specification and drawings, are also included in the patent protection range of the present application.

Claims

1. A solar silicon wafer carrier polishing apparatus comprising a body support, characterized by, The side of the main support is fixedly installed with a positioning frame, a connecting rotating shaft is rotatably installed on the side away from the main support, a first open connecting frame is fixedly installed on the end of the connecting rotating shaft away from the main support, telescopic cylinders are fixedly installed on the outer walls of the two sides of the first open connecting frame, the output shafts of the two telescopic cylinders extend into the first open connecting frame and are slidably connected with the first open connecting frame, linkage strips are fixedly installed on the output shafts of the two telescopic cylinders, two arc-shaped positioning pieces are arranged between the two linkage strips, a second open connecting frame is fixedly installed on the side of the main support, a vertical lead screw is rotatably installed in the second open connecting frame, a lifting arm is threadedly installed on the vertical lead screw, a positioning cylinder is arranged above the lifting arm, and a polishing mechanism is arranged above the first open connecting frame.

2. The solar silicon wafer carrier polishing apparatus of claim 1, wherein, First installation openings are formed in the two linkage strips, first fixing heads are fixedly installed in the two first installation openings through bolts, and the sides, away from each other, of the two first fixing heads are fixedly connected with the two arc-shaped positioning pieces respectively.

3. The solar silicon wafer carrier polishing apparatus of claim 1, wherein, A second installation opening is formed in the lifting arm, a second fixing head is fixedly installed in the second installation opening through a bolt, and the top of the second fixing head is fixedly connected with the positioning cylinder.

4. The solar silicon wafer carrier polishing apparatus of claim 1, wherein, A rodless cylinder is fixedly installed on the side of the main support, a horizontal convex strip is fixedly installed on the sliding block of the rodless cylinder, an installation plate is fixedly installed at the bottom of the horizontal convex strip, a pressure spring is fixedly installed at the bottom of the installation plate, a connecting piece is fixedly installed at the bottom end of the pressure spring, and the polishing mechanism is fixedly connected with the bottom of the connecting piece.

5. The solar silicon wafer carrier polishing apparatus of claim 1, wherein, A first servo motor is fixedly installed in the positioning frame, the output shaft of the first servo motor is fixedly connected with one end of the connecting rotating shaft, a second servo motor is fixedly installed at the top of the second open connecting frame, and the output shaft of the second servo motor is fixedly connected with the top end of the vertical lead screw.

6. The solar silicon wafer carrier polishing apparatus of claim 4, wherein, Two guide round rods are fixedly installed at the bottom of the installation plate, and the bottom ends of the two guide round rods penetrate through the connecting piece and are slidably connected with the connecting piece.

7. The solar silicon wafer carrier polishing apparatus of claim 1, wherein, A stable ring groove is formed in the side, away from the main support, of the positioning frame, two stable sliding heads are slidably installed in the stable ring groove, and the sides, away from the main support, of the two stable sliding heads are fixedly connected with the first open connecting frame.

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