Drying device convenient for semiconductor chip processing

Abstract

The utility model provides a drying device convenient for semiconductor chip processing, which relates to the technical field of semiconductor chip processing and comprises a drying box, a box door is rotatably mounted on the front side of the drying box, a plurality of drying lamps are mounted on the inner side wall of the drying box, a plurality of fans are mounted at the top of the drying box, and a plurality of ventilation nets are mounted at the bottom of the drying box; the rotating mechanism is arranged in the drying box and used for driving the semiconductor chip to rotate in the drying box; and the plurality of clamping mechanisms are uniformly arranged on the rotating mechanism and are used for clamping and fixing the semiconductor chips. According to the utility model, through the arrangement of the insertion plate, the T-shaped block and the T-shaped groove, the insertion plate can be conveniently taken down from the movable plate, and a plurality of chips can be simultaneously clamped and fixed at one time by pulling the handle, so that the fixing efficiency of the chips is greatly improved; compared with the prior art, the method has the advantage that tedious operation steps caused by clamping and fixing the chips one by one are avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor chip processing, especially to a drying device convenient for semiconductor chip processing. BACKGROUND

[0002] In the field of semiconductor chip manufacturing, the drying link is crucial. After the chip goes through a series of processing procedures such as etching and cleaning, the surface often has various liquids such as etching liquid and cleaning solvent. If these liquids cannot be removed in time and effectively, electrical faults such as short circuit may occur in the subsequent packaging and testing procedures, affecting the performance and yield of the chip; therefore, a drying device needs to be used to dry the chip.

[0003] As shown in the patent with the patent name of a drying device convenient for semiconductor chip processing and the publication number of CN221859107U, the above-mentioned drying device has a rotating mechanism that can drive the chip to continuously rotate and turn over in the drying box, so that the chip is evenly heated, thereby improving the drying efficiency of the semiconductor chip. However, when the chip is fixed, the chip is installed on the fixing assembly one by one. This installation method not only consumes time and effort, but also greatly reduces the fixing efficiency, ultimately affecting the overall drying process.

[0004] Therefore, it is necessary to provide a drying device convenient for semiconductor chip processing to solve the above technical problems. UTILITY MODEL CONTENTS

[0005] To solve the above technical problems, the utility model provides a drying device convenient for semiconductor chip processing.

[0006] The utility model provides a drying device convenient for semiconductor chip processing, which comprises:

[0007] A drying box is provided with a door on the front side, a plurality of drying lamps are installed on the inner wall of the drying box, a plurality of fans are installed on the top of the drying box, and a plurality of ventilation nets are installed on the bottom of the drying box.

[0008] A rotating mechanism is arranged in the drying box and used to drive the semiconductor chip to rotate in the drying box.

[0009] A plurality of clamping mechanisms are uniformly arranged on the rotating mechanism and used to clamp and fix the semiconductor chip.

[0010] Preferably, the rotating mechanism comprises a turntable, the turntable comprises two upper and lower discs and a rotating rod connecting the two discs, a slot is formed at each upper and lower end of the turntable, a rotating shaft is arranged in each slot, a bearing is sleeved on the upper end of each rotating shaft, and the two bearings are fixedly installed on the drying box.

[0011] Preferably, the drying box is provided with a rotary motor at the lower end, and the output shaft of the rotary motor is fixedly connected with the rotating shaft at the lower end.

[0012] Preferably, each clamping mechanism comprises a fixed plate and a movable plate, the fixed plate and the movable plate are oppositely arranged, the fixed plate is connected with the outer surface of the rotating shaft, and a plurality of clamping blocks for clamping the semiconductor chip are connected with the fixed plate at intervals along the length direction of the fixed plate at the side close to the movable plate, and the opposite sides of the fixed plate and the movable plate are respectively provided with a movable slot and a T-shaped slot.

[0013] Preferably, the movable slot is provided with a movable block, the side close to the movable plate of the movable block is connected with a connecting rod, the connecting rod is connected with the movable plate through the movable slot, a spring is arranged on the outer surface of the connecting rod, and the two ends of the spring are respectively connected with the side of the movable block and the inner wall of the movable slot.

[0014] Preferably, the fixed plate and the movable plate are provided with an insertion plate therebetween, the insertion plate is provided with a connecting handle, the side close to the movable plate of the insertion plate is connected with a T-shaped block, and the T-shaped block is matched with the T-shaped slot.

[0015] Preferably, the side close to the fixed plate of the insertion plate is provided with a plurality of L-shaped clamping plates at intervals along the length direction of the insertion plate, the semiconductor chip is preliminarily placed on the insertion plate through the L-shaped clamping plates, and the semiconductor chip is fixed through the L-shaped clamping plates and the clamping blocks.

[0016] Compared with the related art, the drying device for semiconductor chip processing has the following beneficial effects:

[0017] 1. The rotating mechanism drives the chip to continuously rotate in the drying box, and the fan promotes the circulation of hot air, so that each surface of the chip can be uniformly heated, the problem of uneven drying quality of the chip caused by local overheating or uneven heat distribution in the traditional drying method is avoided, and it is ensured that each chip can reach the consistent drying standard, thereby providing reliable quality guarantee for subsequent packaging, testing and other processes of the chip. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 FIG. 1 is a schematic structural diagram of the whole device according to the embodiment of the present application;

[0019] Figure 2 FIG. 2 is a schematic structural diagram of the whole device according to the embodiment of the present application in an unfolded state;

[0020] Figure 3A partial structure schematic diagram of the embodiment of the present application;

[0021] Figure 4 A partial rotating mechanism schematic diagram of the embodiment of the present application;

[0022] Figure 5 An exploded view of the clamping mechanism of the embodiment of the present application.

[0023] Labels in the figure: 1, drying box; 2, box door; 3, fan; 4, ventilation net; 5, drying lamp; 6, rotating mechanism; 601, rotary table; 6011, slot; 602, rotating shaft; 603, bearing; 604, rotating motor; 7, clamping mechanism; 701, fixed plate; 7011, movable slot; 702, clamping block; 703, movable plate; 7031, T-shaped slot; 704, movable block; 705, connecting rod; 706, spring; 707, handle; 708, plug plate; 709, T-shaped block; 710, L-shaped clamping plate; 711, connecting handle; 712, semiconductor chip. DETAILED DESCRIPTION

[0024] The present application will be further described below in conjunction with the drawings and embodiments.

[0025] Please refer to Figures 1 to 5 A drying device convenient for semiconductor chip processing, comprising:

[0026] The drying box 1 is provided with a box door 2 rotatably installed at the front side, a plurality of drying lamps 5 are installed on the inner side wall of the drying box 1, a plurality of fans 3 are installed on the top of the drying box 1, and a plurality of ventilation nets 4 are installed on the bottom of the drying box 1;

[0027] The rotating mechanism 6 is arranged in the drying box 1 and is used to drive the semiconductor chip 712 to rotate in the drying box 1;

[0028] A plurality of clamping mechanisms 7 are uniformly arranged on the rotating mechanism 6 and are used to clamp and fix the semiconductor chip 712.

[0029] It should be noted that the ventilation net 4 is arranged to filter dust, so as to avoid that dust in the outside enters the drying box 1 under the action of the fan 3 in the drying process, thereby reducing the quality of the semiconductor chip 712 after drying; the drying lamp 5 continuously provides stable infrared radiation heat, so as to ensure that the chip is always at a suitable drying temperature. The operator monitors the drying process in real time through the temperature and humidity monitoring device provided on the drying box 1, so as to ensure that the drying effect reaches the best.

[0030] Reference Figures 1-4As shown, the rotating mechanism 6 comprises a rotating table 601, the rotating table 601 comprises two upper and lower discs and a rotating rod connecting the two discs, the rotating table 601 is provided with a slot 6011 at the upper and lower ends, each slot 6011 is provided with a rotating shaft 602, the upper end of each rotating shaft 602 is provided with a bearing 603, and the two bearings 603 are fixedly installed on the drying box 1; the drying box 1 is provided with a rotating motor 604 at the lower end, and the output shaft of the rotating motor 604 is fixedly connected with the rotating shaft 602 at the lower end.

[0031] It should be noted that the end of the rotating shaft 602 inserted into the slot 6011 is provided with a limiting block, so as to avoid the slippage between the rotating shaft 602 and the disc when the rotating motor 604 drives the rotating shaft 602 to rotate.

[0032] Reference Figure 1 、 Figure 2 、 Figure 5 As shown, each clamping mechanism 7 comprises a fixed plate 701 and a movable plate 703, the fixed plate 701 and the movable plate 703 are oppositely arranged and the fixed plate 701 is connected with the outer surface of the rotating rod, the side of the fixed plate 701 close to the movable plate 703 is connected with a plurality of clamping blocks 702 for clamping the semiconductor chip 712 along the length direction of the fixed plate 701, and the opposite sides of the fixed plate 701 and the movable plate 703 are respectively provided with a movable slot 7011 and a T-shaped slot 7031; the movable slot 7011 is provided with a movable block 704, the side of the movable block 704 close to the movable plate 703 is connected with a connecting rod 705, the connecting rod 705 passes through the movable slot 7011 and is connected with the movable plate 703, the connecting rod 705 is provided with a spring 706, and the two ends of the spring 706 are respectively connected with the side of the movable block 704 and the inner wall of the movable slot 7011, and the outer side of the movable plate 703 is connected with a handle 707; the fixed plate 701 and the movable plate 703 are provided with an insertion plate 708, the insertion plate 708 is provided with a connecting handle 711, the side of the insertion plate 708 close to the movable plate 703 is connected with a T-shaped block 709, and the T-shaped block 709 is matched with the T-shaped slot 7031; the side of the insertion plate 708 close to the fixed plate 701 is provided with a plurality of L-shaped clamping plates 710 for initially placing the semiconductor chip 712 on the insertion plate 708 along the length direction of the insertion plate 708, and the semiconductor chip 712 is fixed through the L-shaped clamping plate 710 and the clamping block 702.

[0033] It needs to be explained that pulling the handle 707 makes the movable plate 703 move outward, and simultaneously drives the connecting rod 705 and the movable block 704 to slide in the movable slot 7011, so as to expand the distance between the fixed plate 701 and the movable plate 703. Then a plurality of chips are inserted on each L-shaped clamping plate 710 in turn, and then the connecting handle 711 is held to insert the inserting plate 708 on the movable plate 703, so as to ensure the stable position of the inserting plate 708. Then the handle 707 is slowly loosened, the spring 706 rebounds, drives the movable plate 703 to be close to the fixed plate 701, and the chips are fixed under the cooperation of the clamping block 702 and the L-shaped clamping plate 710, so as to ensure that the chips do not displace in the drying process.

[0034] The working principle of the drying device convenient for semiconductor chip processing is as follows:

[0035] Chip fixing: open the box door 2, pull the handle 707 to drive the movable plate 703 to move outward, and expand the distance between the fixed plate 701 and the movable plate 703. Then the inserting plate 708 is pulled out of the movable plate 703, and then a plurality of chips are inserted on each L-shaped clamping plate 710 in turn, and then the inserting plate 708 is inserted on the movable plate 703 again by holding the connecting handle 711. Then the handle 707 is slowly loosened, the spring 706 rebounds, drives the movable plate 703 to be close to the fixed plate 701, and the chips are fixed under the cooperation of the clamping block 702 and the L-shaped clamping plate 710;

[0036] Start drying: after closing the box door 2, start the drying device. The fan 3 operates first, and the external air is sucked into the drying box 1. At the same time, a plurality of drying lamps 5 on the drying box 1 are turned on, and the air in the box is rapidly heated by infrared radiation. The ventilation net 4 at the bottom guarantees the smooth circulation of the air, so that the hot air can be uniformly distributed in the drying box 1. The rotary motor 604 is started to drive the rotating shaft 602 fixedly connected thereto to rotate, and then drives the rotating table 601 to start rotating. At this time, the semiconductor chip 712 fixed on the clamping mechanism 7 also makes circular motion in the drying box 1, so that each surface of the chip is exposed to the hot air and the drying lamp 5 in all directions; in the drying process, the fan 3 continuously circulates the hot air, accelerates the drying efficiency of the chip, and timely takes out the water vapor generated in the drying process, so as to maintain the dry environment in the box.

[0037] Chip taking: when the predetermined drying time is reached or the humidity of the chip reaches the process requirement, the drying lamp 5, the fan 3 and the rotary motor 604 are turned off in turn, the box door 2 is opened, the handle 707 is pulled again, and the dried chip is taken out, and the whole drying process is completed.

[0038] The above merely illustrates the embodiments of the present application, and does not limit the patent scope of the present application, and any equivalent structure or equivalent process transformation, or direct or indirect application in other related technical fields, which are made by using the content of the present application specification and drawings, are also included in the patent protection scope of the present application.

Claims

1. A drying apparatus for facilitating semiconductor chip processing, characterized in that, Include: The front side of the drying box (1) is rotatably installed with a box door (2), a plurality of drying lamps (5) are installed on the inner side wall of the drying box (1), a plurality of fans (3) are installed on the top of the drying box (1), and a plurality of ventilation nets (4) are installed on the bottom of the drying box (1); A rotating mechanism (6) is arranged in the drying box (1) for driving the semiconductor chip (712) to rotate in the drying box (1); A plurality of clamping mechanisms (7) are uniformly arranged on the rotating mechanism (6) for clamping and fixing the semiconductor chip (712); Each clamping mechanism (7) includes a fixed plate (701) and a movable plate (703), the fixed plate (701) and the movable plate (703) are oppositely arranged, the fixed plate (701) is connected with the outer surface of the rotating shaft, a plurality of clamping blocks (702) for clamping the semiconductor chip (712) are connected on one side of the fixed plate (701) close to the movable plate (703) along the length direction of the fixed plate (701), and a movable slot (7011) and a T-shaped slot (7031) are respectively formed on the opposite sides of the fixed plate (701) and the movable plate (703); The movable slot (7011) is provided with a movable block (704), one side of the movable block (704) close to the movable plate (703) is connected with a connecting rod (705), the connecting rod (705) penetrates through the movable slot (7011) and is connected with the movable plate (703), a spring (706) is arranged on the outer sleeve of the connecting rod (705), and the two ends of the spring (706) are respectively connected with one side of the movable block (704) and the inner wall of the movable slot (7011). A handle (707) is connected to the outer side of the movable plate (703); A plug plate (708) is arranged between the fixed plate (701) and the movable plate (703), a connecting handle (711) is arranged on the plug plate (708), a T-shaped block (709) is connected to one side of the plug plate (708) close to the movable plate (703), and the T-shaped block (709) is matched with the T-shaped slot (7031).

2. The drying apparatus for facilitating processing of semiconductor chips according to claim 1, wherein The rotating mechanism (6) includes a rotating table (601), the rotating table (601) includes two upper and lower discs and a rotating shaft connecting the two discs, the upper and lower ends of the rotating table (601) are provided with plug slots (6011), each plug slot (6011) is provided with a rotating shaft (602), the upper end of each rotating shaft (602) is provided with a bearing (603), and the two bearings (603) are fixedly installed on the drying box (1).

3. The drying apparatus of claim 2, wherein the drying apparatus is configured to facilitate processing of semiconductor chips. A rotating motor (604) is installed at the lower end of the drying box (1), and the output shaft of the rotating motor (604) is fixedly connected with the rotating shaft (602) at the lower end.

4. The drying apparatus of claim 1, wherein A plurality of L-shaped clamping plates (710) for initially placing the semiconductor chip (712) on the plug plate (708) are arranged on one side of the plug plate (708) close to the fixed plate (701) along the length direction of the plug plate (708), and the semiconductor chip (712) is fixed by the L-shaped clamping plate (710) and the clamping block (702).

Images