Horizontal pluggable silicon light engine
By designing a horizontally pluggable silicon photonics engine, the problem of fiber arrays being unable to withstand high temperatures during the welding process was solved, enabling pluggable fiber arrays, simplifying the optical interface structure, and reducing manufacturing difficulty and cost.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-12
- Publication Date
- 2026-04-10
AI Technical Summary
In the prior art, fiber arrays cannot withstand the reflow soldering temperature of flip chip assembly, which means that the optical coupling of the fiber array must be performed after the chip bonding operation, and the exposed optical fibers cause difficulties during soldering and installation.
Design a horizontally pluggable silicon photonics engine. The optical fiber or optical fiber array can be separated from the silicon photonics engine during use. The plugging and unplugging direction is parallel to the bottom surface of the silicon photonics engine substrate and the light emission direction of the optical chip. First, unplug the optical fiber or optical fiber array, complete the silicon photonics engine mounting and reflow soldering, and then plug it back in.
It enables pluggable optical fibers or optical fiber arrays, simplifies the design of optical interface structures, reduces the requirements for optical chips, makes the structure more stable, easier to manufacture and mass-produce, and lowers costs.
Smart Images
Figure CN224109694U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to AI / cloud computing data center, high speed optical interconnection, optical fiber communication network etc. technical field, concretely is a kind of horizontal pluggable silicon light optical engine and its assembling method. BACKGROUND
[0002] The silicon light chip for communication is currently developing towards higher rate and higher integration. With the increase of rate, the single-channel rate has developed from 100G to 200G, and the transmission distance of signal on the circuit board is getting shorter and shorter. In order to ensure the quality of signal transmission, it is required that the distance between the optical engine and the main chip (such as switch ASIC, xPU, Memory, etc.) be as short as possible, and preferably be soldered to the same substrate. In order to meet the requirements of reflow soldering and other soldering processes and operational convenience, how to realize the pluggability of the silicon light optical engine and the optical fiber becomes a top priority.
[0003] Currently, the optical fiber array FA cannot generally withstand the reflow soldering temperature of flip-chip assembly, resulting in that the optical coupling of the optical fiber array must be performed after the chip bonding operation, which is often impossible in many application scenarios. Moreover, the long exposed optical fiber brings great trouble to the soldering assembly of the optical engine or optical assembly during soldering installation. SUMMARY
[0004] The technical problem to be solved by the utility model is how to realize the pluggability of the silicon light optical engine and the optical fiber or optical fiber array.
[0005] To solve the above technical problem, the utility model provides a horizontal pluggable silicon light optical engine, i.e. the optical fiber or optical fiber array of the silicon light optical engine can be separated from the silicon light optical engine during use, realizing the pluggability of the optical fiber or optical fiber array, and the plugging direction is parallel to the bottom surface of the silicon light optical engine substrate and the light-emitting direction of the silicon light optical chip. Before the optical engine and the system substrate are soldered, the optical fiber or optical fiber array is pulled out, and after the silicon light optical engine is attached and reflow soldering is fixed, the optical fiber or optical fiber array is inserted again.
[0006] The specific technical solutions adopted are as follows:
[0007] A horizontal pluggable silicon light optical engine, the silicon light optical engine includes an optoelectronic chip assembly, a silicon light optical engine substrate, an optical fiber array plug, an array optical fiber and a coupling lens, the optoelectronic chip assembly is fixed on the bottom surface of the silicon light optical engine substrate, and the coupling lens is fixed on the bottom surface of the silicon light optical engine substrate or the end face of the silicon light chip coupler of the optoelectronic chip assembly; the optical fiber array plug is connected to one end of the silicon light optical engine substrate in a horizontal plug-in manner, and the array optical fiber is arranged in the optical fiber array plug; a first lens is arranged at the end face of the array optical fiber in the optical fiber array plug, so as to change the divergent light beam from the array optical fiber into a collimated light beam or focus the collimated light beam from the coupling lens to the array optical fiber.
[0008] Further, the optoelectronic chip assembly is a silicon light and optoelectronic hybrid packaging assembly, and one side of the silicon light chip of the optoelectronic chip assembly is attached to the bottom surface of the silicon light engine substrate.
[0009] Further, the fiber array plug is provided with at least two positioning guide holes in the horizontal direction of the fiber array plug, and the positioning guide holes are connected with the positioning guide columns protruding from the end surface of the silicon light engine substrate. The positioning guide holes and the positioning guide columns are connected, so that the array optical fibers in the fiber array plug are aligned with the coupling waveguide of the silicon light chip of the optoelectronic chip assembly of the silicon light engine through the coupling lens system.
[0010] Further, the end surface of one end of the silicon light engine substrate is provided with a slot.
[0011] Further, the two sides of the fiber array plug are provided with elastic catches in the horizontal direction of the fiber array plug, and the slot walls on the two sides of the slot are concave to accommodate the catches.
[0012] Further, a guide support structure is arranged between the fiber array plug and the slot of the silicon light engine substrate.
[0013] Further, the silicon light engine substrate is made of metal, and the top surface of the silicon light engine substrate is further provided with a heat sink, and a dust plug is arranged in the slot. The silicon light engine substrate is made of metal, such as tungsten copper, which is used for fixing the optoelectronic chip assembly and the fiber array plug, and positioning the positions of the two relative to the silicon light engine substrate and heat dissipation. The top surface of the silicon light engine substrate is further provided with a heat sink, which can effectively conduct the heat of the optoelectronic chip assembly. Increasing the heat sink on the light engine substrate increases the heat dissipation area, further improves the heat dissipation effect, and reduces the temperature of the optoelectronic chip inside the silicon light engine. When the fiber array plug in the slot of the silicon light engine substrate is removed, a dust plug is inserted into the slot.
[0014] Further, the bottom surface of the coupling lens is a fixed surface, which is attached to the silicon light engine substrate; the material of the coupling lens is glass or silicon, and the outer periphery of the coupling lens is provided with a dust cover. The dust cover is fixed on the silicon light engine substrate by bolts. The dust plug is arranged in the slot at one end of the silicon light engine substrate, and the dust cover covers the periphery of the coupling lens. Covering the periphery of the coupling lens with the dust cover on the bottom surface of the silicon light engine substrate avoids the dirt entering the coupling light path when the light engine is used for a long time, which causes the end surface of the coupling lens and the optical chip of the optoelectronic chip assembly to be dirty, affecting the coupling efficiency of the optical channel, and causing large insertion loss. Considering the transportation, storage and installation conditions of the silicon light engine, it is more convenient to remove the fiber array plug assembly, and the dustproof requirement of the silicon light engine optical port needs to be considered when the fiber array plug assembly is removed. Therefore, the dust plug is arranged in the slot.
[0015] Further, the optoelectronic chip assembly is fixed on the bottom surface of the silicon light engine substrate by means of bonding or welding; the coupling lens is fixed on the bottom surface of the silicon light engine substrate by means of bonding or welding, or is fixed to the end surface of the optical chip coupler of the optoelectronic chip assembly in a photolithographic manner.
[0016] The utility model discloses a horizontal pluggable silicon light engine has the beneficial effect compared with prior art:
[0017] The utility model discloses a horizontal pluggable silicon light engine, and the fiber or fiber array is pluggable with the silicon light engine through the fiber array plug, and before the light engine is welded to the system substrate or circuit board, first, the fiber array plug is pulled out, then the silicon light engine is welded to the system substrate or circuit board through the reflow soldering, and then the fiber array plug is inserted again.
[0018] The utility model discloses a horizontal pluggable silicon light engine, and the fiber or fiber array is pluggable with the silicon light engine through the fiber array plug, and before the light engine is welded to the system substrate or circuit board, first, the fiber array plug is pulled out, then the silicon light engine is welded to the system substrate or circuit board through the reflow soldering, and then the fiber array plug is inserted again. BRIEF DESCRIPTION OF DRAWINGS
[0019] Figure 1 It is the horizontal pluggable silicon light engine's perspective structure schematic diagram of the utility model embodiment 1;
[0020] Figure 2 It is the horizontal pluggable silicon light engine's plan view of the utility model embodiment 1;
[0021] Figure 3 It is the horizontal pluggable silicon light engine's bottom view of the utility model embodiment 1;
[0022] Figure 4 It is the horizontal pluggable silicon light engine's side view of the utility model embodiment 1;
[0023] Figure 5 It is the horizontal pluggable silicon light engine's front view of the utility model embodiment 1;
[0024] Figure 6 It is Figure 5 B-B cut view of;
[0025] Figure 7 It is Figure 6 A place enlarged view of;
[0026] Figure 8 It is the horizontal pluggable silicon light engine's perspective diagram of the utility model embodiment 1 pulling out fiber array plug and inserting dustproof plug;
[0027] Figure 9 It is Figure 8 Plan view of;
[0028] Among them, 1-optoelectronic chip assembly, 2-silicon photonic engine substrate, 21-support pillar, 23-positioning guide pillar, 3-fiber array plug, 31-first lens, 32-second lens, 34-positioning guide hole, 35-elastic hook, 36-slot, 37-slide groove, 38-slider, 4-heat sink, 5-array fiber, 6-dust cover, 8-coupling lens, 10-dust plug. Detailed Implementation
[0029] To make the objectives, technical solutions, and advantages of this utility model clearer, the following description is provided in conjunction with the appendix. Figures 1-9 The present invention will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention. Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0030] like Figures 1-6 As shown, this embodiment is a horizontally pluggable silicon photonic engine, including an optoelectronic chip assembly 1, a silicon photonic engine substrate 2, a fiber array plug 3, an array fiber optic cable 5, and a coupling lens 8.
[0031] In traditional silicon photonics component packaging, optical fibers or arrayed optical fibers are directly bonded to the end face of the silicon photonics chip coupler using adhesive. However, in the technical solution of this application, such as... Figure 1 As shown, the optical chip in the optoelectronic chip assembly 1 is fixed on the bottom surface of the silicon photonics engine substrate 2, and the array optical fiber 5 set in the optical fiber array plug 3 can be horizontally plugged and unplugged with the end face of the silicon photonics engine substrate 2.
[0032] like Figure 1 and 7 As shown, the optoelectronic chip assembly 1 is fixed on the bottom surface of the silicon photonic engine substrate 2, and the coupling lens 8 is fixed on the bottom surface of the silicon photonic engine substrate 2 or on the end face of the optoelectronic chip coupler of the optoelectronic chip assembly 1; the fiber array plug 3 is horizontally plugged into one end of the silicon photonic engine substrate 2, and the array fiber 5 is disposed inside the fiber array plug 3; a first lens 31 is disposed at the end face of the array fiber inside the fiber array plug 3 to convert the diverging beam from the array fiber 5 into a collimated beam or to focus the collimated beam from the coupling lens 8 onto the array fiber 5.
[0033] At the emitting end of the silicon photonics engine, the horizontal light emitted from the optoelectronic chip component 1 is collimated after passing through the coupling lens 8. The first lens 31 at the fiber array 5 focuses the collimated light received from the coupling lens 8 onto the end face of the array fiber 5. The array fiber 5 is connected to the external transmission fiber.
[0034] At the receiving end of the silicon photonics engine, the externally input optical signal enters the array optical fiber 5 located in the optical fiber array plug 3. The first lens 31 at the optical fiber array 5 converts the light from the optical fiber into collimated light, and the coupling lens 8 focuses the collimated beam from the first lens 31 onto the optical chip coupler end face of the optoelectronic chip assembly 1.
[0035] like Figure 1 As shown, in this embodiment, the optoelectronic chip assembly 1 includes an optical chip, an electrical chip, an electrical connection layer for interconnecting the optical chip and the electrical chip, and bottom solder balls. The optoelectronic chip assembly 1 is fixed to the silicon photonics engine substrate 2 by adhesive bonding or welding, and the bottom surface of the silicon photonics engine substrate 2 is in contact with one side of the optical chip in the optoelectronic chip assembly 1; the silicon photonics engine substrate 2 also serves to dissipate heat from the optoelectronic chip assembly 1.
[0036] In this embodiment, the silicon photonics engine substrate 2 is preferably made of tungsten copper, which is used to fix the optoelectronic chip assembly 1 and the fiber array plug 3, as well as to position and dissipate heat between the two relative to the silicon photonics engine substrate 2.
[0037] like Figure 7 As shown, in this embodiment, the coupling lens 8 is fixed to the bottom surface of the silicon photonics engine substrate 2 or integrated to the silicon photonics chip coupler end face of the optoelectronic chip assembly 1 via photolithography. Furthermore, the coupling lens 8 is directly fixed to the silicon photonics engine substrate 2, using active coupling alignment and adhesive application or welding. Directly integrating the lens to the coupler end face via photolithography eliminates the need for complex active lens coupling.
[0038] like Figure 7 As shown, in this embodiment, preferably, the coupling lens 8 can be bonded or welded to the bottom surface of the silicon photonics engine substrate 2; the bottom surface of the coupling lens 8 is bonded to the bottom surface of the silicon photonics engine substrate 2. The silicon photonics engine substrate 2 also serves as a heat dissipation unit. After the photoelectric chip assembly 1 and the coupling lens 8 are fixed on the silicon photonics engine substrate 2, the emitted light from the photoelectric chip assembly 1 is collimated after passing through the coupling lens 8.
[0039] like Figure 7 As shown, in the silicon photonics engine of this embodiment, at the emitting end of the silicon photonics engine, the horizontal light emitted from the photoelectric chip assembly 1 is collimated by the coupling lens 8. The first lens 31, disposed within the fiber array connector 3, focuses the collimated light from the coupling lens 8 onto the array fiber 5 disposed within the fiber array connector 3. The array fiber 5 is connected to an external transmission fiber. Furthermore, in this embodiment, the array fiber 5 is connected to the transmission fiber through a fiber optic interface, such as MPO / MTP / SN-MT.
[0040] like Figure 7As shown, at the receiving end of the silicon light engine, the externally inputted optical signal enters into the arrayed optical fibers 5 in the fiber array plug 3, and is converted into collimated light by the first lens 31 arranged in the fiber array plug 3, and the collimated light is focused in the coupler waveguide of the silicon light chip in the optoelectronic chip assembly 1 after being incident to the coupling lens 8.
[0041] In this embodiment, the fiber array plug 3 is made of a fiber insertion optical resin injection molding piece, and there are optical fiber holes matched with the arrayed optical fibers 5 in the arrayed optical fiber injection molding piece in the optical array plug. The first lens 31 arranged in the fiber array plug 3 is arranged at the end face of the fiber array plug 3. The material of the first lens 31 can also be glass or other materials such as silicon.
[0042] In this embodiment, the second lens 32 can be arranged at the arrayed optical fiber end face in the fiber array plug 3. The lens system of the first lens 31 and the second lens 32 functions to convert the divergent light from the arrayed optical fibers 5 into collimated light, or focus the collimated light from the coupling lens 8 to the arrayed optical fibers 5.
[0043] In this embodiment, the manufacturing method of the fiber array plug 3 with arrayed optical fibers 5 is known to those skilled in the art, and preferably an integrated injection molding of resin is adopted.
[0044] As shown in Figure 6 and 7 In this embodiment, the fiber array plug 3 is horizontally inserted into the silicon light engine substrate 2, and the arrayed optical fibers 5 are matched with the positioning guide column 23 arranged at the end face of the silicon light engine substrate 2 through the positioning guide hole 34 in the fiber array plug 3, so as to ensure the optimal coupling alignment of the first lens 31, the second lens 32 or the fiber end face with the optical chip.
[0045] The optimal coupling alignment is that the coupling lens 8 is coupled and attached to the optoelectronic chip assembly 1, the position of the coupling lens 8 on the bottom surface of the silicon light engine substrate 2 is adjusted, the light beam from the fiber array is coupled into the optoelectronic chip assembly through the coupling lens 8 to maximize the optical power, and the light emitted by the optoelectronic chip assembly 1 enters the arrayed optical fibers 5 in the fiber array plug through the coupling lens 8 to maximize the optical power.
[0046] As shown in Figure 1 , 2 and 4, in this embodiment, the fiber array plug 3 is horizontally inserted into the silicon light engine substrate 2 and fixed. Specifically:
[0047] The guide hole of the fiber array plug 3 is aligned with the positioning guide column on the end surface of the light engine substrate and is inserted into the slot of the silicon light engine substrate horizontally, and at the same time, the elastic clamping hooks 35 arranged on both sides of the fiber array plug 3 are pressed, until the elastic clamping hooks 35 are completely inserted into the clamping grooves 36 arranged on both sides of the slot on the end surface of the silicon light engine substrate 2 and are released, and the elastic clamping hooks 35 are reset and clamped into the clamping grooves 36, thereby fixing the fiber array plug.
[0048] When the fiber array plug 3 is pulled out, the elastic clamping hooks 35 arranged on both sides of the fiber array plug 3 are pressed to make them disengage from the clamping grooves 36 arranged on the side walls of the slot of the light engine substrate, and the fiber array plug 3 is pulled out.
[0049] As shown in Figure 5 , in this embodiment, a guide support structure is arranged between the fiber array plug 3 and the slot of the silicon light engine substrate 2, which is a slider and a sliding groove structure. A sliding groove 37 with a rectangular cross section is arranged on the side surface of the fiber array plug 3, and a sliding block 38 with a rectangular cross section is arranged on the groove wall of the slot of the silicon light engine substrate 2.
[0050] The guide support structure plays a guiding role in the process of inserting the fiber array plug 3, and after the fiber array plug 3 is inserted into place, it plays a supporting role for the fiber array plug 3.
[0051] As shown in Figures 1-5 , in this embodiment, the silicon light engine substrate 2 is made of tungsten copper, which is used for fixing the optoelectronic chip assembly 1 and the fiber array plug 3, and positioning and heat dissipation of the positions of the two relative to the silicon light engine substrate. A heat sink or liquid cooling cold plate can be installed on the silicon light engine substrate 2 to further enhance the heat dissipation effect. In this embodiment, the light engine is provided with a heat sink 4, which is suitable for the scene of single silicon light engine assembly. The heat sink can be configured with the silicon light engine; when multiple silicon light engines and ASIC chips (such as switch chips, xPU chips, and Memory) need to be placed side by side or combined, the silicon light engine does not need to be separately configured with a heat sink, and the equipment manufacturer will design and install the heat sinks or liquid cooling cold plates of multiple light engines as a whole according to the system structure requirements.
[0052] As shown in Figure 7 , in this embodiment, the bottom surface of the coupling lens 8 is a fixed surface, which is attached to the bottom surface of the silicon light engine substrate 2, and the material of the coupling lens 8 is glass or silicon. The outer periphery of the coupling lens 8 is installed with a dustproof cover plate 6, and the dustproof cover plate 6 is fixed on the silicon light engine substrate 2 by screws.
[0053] In this embodiment, the dust cover 6 is covered on the bottom surface of the silicon light engine substrate 2 around the coupling lens 8 to avoid dust entering the lens and the light chip end face of the photoelectric chip assembly 1 in long-term use, affecting the coupling efficiency of the light channel and causing large insertion loss. Considering the transportation and storage and installation conditions of the optical engine, it is more convenient to remove the fiber array plug. The dustproof requirement of the optical port of the optical engine needs to be considered when the fiber array plug is removed. As shown in Figure 8 After the optical engine removes the fiber array plug 3, the dust plug 10 is inserted into the slot of the optical engine substrate to play a dustproof role. After the optical engine completes the reflow soldering, the dust plug is pulled out and the fiber array plug is reinserted. The fiber array plug can use ordinary UV glue and optical resin and does not need to withstand high-temperature reflow soldering.
[0054] In this embodiment, the assembly method of the horizontal pluggable silicon light engine includes the following steps:
[0055] Step 1, the bottom surface of the silicon light engine substrate 2 is upward, the photoelectric chip assembly 1 is placed on the bottom surface of the silicon light engine substrate 2, the coupler end face of the silicon light chip in the photoelectric chip assembly 1 is aligned with the pre-marked positioning mark line on the bottom surface of the silicon light engine substrate 2, and is fixed;
[0056] Step 2, the top surface of the silicon light engine substrate 2 is upward, the fiber array plug 3 provided with the array optical fiber 5 is connected to the positioning guide column 23 of the silicon light engine substrate 2 through the positioning guide hole 34, and is fixed through the elastic clamping hooks on both sides of the fiber array plug and the clamping grooves 36 on the two side surfaces in the slot of the silicon light engine substrate 2;
[0057] Step 3, the bottom surface of the optical engine substrate is upward, the position of the coupling lens 8 on the bottom surface of the silicon light engine substrate 2 is adjusted, the coupling lens 8 and the photoelectric chip assembly 1 are coupled and aligned, and are attached on the bottom surface of the optical engine substrate;
[0058] has the following steps:
[0059] S31, the array optical fiber 5 is inserted into the fiber array plug 3, the array optical fiber 5 in the fiber array plug 3 is connected to the external light source and the optical power meter; the optical engine test fixture is connected to the bottom solder ball or bump of the photoelectric chip assembly 1, and then the photoelectric chip assembly 1, the light source and the optical power meter are powered on;
[0060] S32. Couple the coupling lens 8 to the optoelectronic chip assembly 1, adjust the position of the coupling lens 8 on the bottom surface of the silicon photonic engine substrate 2, so that the light beam from the fiber array is coupled into the optoelectronic chip assembly through the coupling lens system (coupling lens 8, first lens 31) to maximize the light power, and the light beam emitted from the optoelectronic chip assembly 1 enters the array fiber 5 in the fiber array plug through the lens system composed of the coupling lens 8 and the first lens 31 to maximize the light power, and fix the coupling lens 8 to the bottom surface of the silicon photonic engine substrate 2.
[0061] Step 4: Separate the fiber optic array plug 3 with the arrayed fiber optics from the silicon photonics engine substrate 2, insert the dust plug 10 into the silicon photonics engine substrate 2, and then place the assembly formed by the optoelectronic chip assembly 1, the coupling lens 8 and the silicon photonics engine substrate 2 on the system substrate or circuit board and fix it by reflow soldering.
[0062] Step 5: Remove the dust plug 10 and reinsert the fiber optic array plug 3 so that the positioning guide post 23 of the silicon photonic engine substrate is inserted into the positioning guide hole 34 of the fiber optic array plug 3 and fixed to the silicon photonic engine substrate 2.
[0063] Step 6: Fix the heat sink 4 onto the silicon photonics engine substrate 2. Assembly is complete.
[0064] The assembly method of the horizontally pluggable silicon photonic engine in this embodiment, compared with the non-pluggable fiber optic interface, not only facilitates the SMT soldering process, but also avoids the requirement that the adhesive used for the optical path of the array fiber and the fiber array plug must withstand the high temperature of reflow soldering.
[0065] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A horizontally pluggable silicon photonic engine, characterized by, The silicon light engine includes a photoelectric chip assembly (1), a silicon light engine substrate (2), a fiber array plug (3), an array optical fiber (5), and a coupling lens (8). The photoelectric chip assembly (1) is fixed to the bottom surface of the silicon light engine substrate (2). The coupling lens (8) is fixed to the bottom surface of the silicon light engine substrate (2) or the end surface of the silicon light chip coupler of the photoelectric chip assembly (1). The fiber array plug (3) is horizontally connected to one end of the silicon light engine substrate (2). The array optical fiber (5) is arranged in the fiber array plug (3). The first lens (31) is arranged at the end surface of the array optical fiber in the fiber array plug (3), which changes the divergent light beam from the array optical fiber (5) into a collimated light beam or focuses the collimated light beam from the coupling lens (8) to the array optical fiber.
2. The horizontal pluggable silicon photonic engine of claim 1, wherein, The photoelectric chip assembly (1) is a silicon light photoelectric hybrid packaging assembly. One surface of the silicon light chip of the photoelectric chip assembly (1) is attached to the bottom surface of the silicon light engine substrate (2).
3. The horizontal pluggable silicon photonic engine of claim 1, wherein, The fiber array plug (3) is provided with at least two positioning guide holes (34) in the horizontal direction of the fiber array plug (3). The positioning guide holes (34) are connected to the positioning guide columns (23) protruding from the end surface of the silicon light engine substrate (2).
4. The horizontal pluggable silicon photonic engine of claim 1, wherein, The end surface of one end of the silicon light engine substrate (2) is provided with a slot.
5. The horizontal pluggable silicon photonic engine of claim 4, wherein, The fiber array plug (3) is provided with elastic clamping hooks (35) on both sides in the horizontal direction of the fiber array plug (3). The slot walls on both sides of the slot are recessed to accommodate the clamping hooks (35).
6. The horizontal pluggable silicon photonic engine of claim 4, wherein, A guide support structure is arranged between the fiber array plug (3) and the slot of the silicon light engine substrate (2).
7. The horizontal pluggable silicon photonic engine of claim 4, wherein, The silicon light engine substrate is made of metal. The top surface of the silicon light engine substrate is further provided with a heat sink. A dustproof plug (10) is arranged in the slot.
8. The horizontal pluggable silicon photonic engine of claim 1, wherein, The bottom surface of the coupling lens (8) is a fixed surface, which is attached to the light engine substrate. The coupling lens (8) is made of glass or silicon. A dustproof cover (6) is mounted on the outer periphery of the coupling lens (8).
9. The horizontal pluggable silicon photonic engine of claim 1, wherein, The photoelectric chip assembly (1) is fixed to the bottom surface of the silicon light engine substrate (2) by adhesion or welding. The coupling lens (8) is fixed to the bottom surface of the silicon light engine substrate (2) by adhesion or welding, or is fixed to the end surface of the silicon light chip coupler of the photoelectric chip assembly by lithography.