A wafer support ring for proton irradiation

Abstract

This utility model discloses a wafer support ring holder for proton irradiation of wafers, relating to wafer irradiation processing. It includes a wafer tray, which is the main tray. The top surface of the wafer tray has an irradiation width region, within which several wafer support rings are arranged. Each wafer support ring is circular, and adjacent wafer support rings are evenly spaced within the irradiation width region. The wafer tray is made of 5051 aluminum alloy. This utility model improves the wafer placement method by structurally adding support rings. Through welding fixtures, the center of the wafer is precisely aligned with the irradiation center, ensuring irradiation accuracy. This utility model optimizes the wafer handling operation by structurally designing the support rings as two-lobed pieces with a gap in the middle, facilitating alignment and flipping operations with a vacuum pen, reducing damage to the wafer during manual handling.

Description

Technical Field

[0001] This utility model belongs to the field of nuclear technology application and semiconductor manufacturing, and relates to the irradiation processing of wafers, specifically a wafer support ring for proton irradiation. Background Technology

[0002] Currently, there are limitations to the working environment of wafers used in proton irradiation. Firstly, in the proton irradiation process, the positioning accuracy of the wafer is one of the key factors ensuring irradiation quality and uniformity. Conventional trays, lacking phase control during irradiation, may experience edge chipping during movement. Therefore, adding a welded support ring structure to the existing tray not only protects the wafer from phase movement but also, through welding fixtures, precisely positions the wafer relative to the tray, effectively ensuring the wafer's accuracy requirements during proton irradiation.

[0003] In proton irradiation, both sides of the wafer must be irradiated. Usually, the wafer cannot be flipped after it has directly contacted the tray, and blindly flipping it with a pick-up pen also carries the risk of damaging the wafer. Therefore, the wafer support ring is designed in a two-part shape with a pick-up pen slot in the middle. This facilitates flipping while reducing the drawbacks of vacuuming and the risk of air blowing out of the vacuum. Utility Model Content

[0004] In view of this, the purpose of this utility model is to provide a wafer support ring for proton irradiation, so as to solve the problem that wafer positioning accuracy is one of the key factors in ensuring irradiation quality and uniformity in the proton irradiation process. Conventional trays do not provide phase restriction for the wafer during irradiation, which may cause edge chipping of the wafer during movement. In addition, in the proton irradiation process, both sides of the wafer need to be irradiated. Usually, the wafer cannot be flipped after direct contact with the tray, and blindly flipping it with a pick-up pen also poses a technical problem of damaging the wafer.

[0005] To achieve the above objectives, this utility model employs the following technical solution:

[0006] A wafer support ring for proton irradiation includes a wafer tray, which is the main tray. The top surface of the wafer tray is provided with an irradiation width region. A plurality of wafer support rings are provided in the irradiation width region. Each wafer support ring is circular, and two adjacent wafer support rings are equally spaced in the irradiation width region.

[0007] As a preferred embodiment of this utility model, the wafer tray is made of 5051 aluminum alloy.

[0008] As a preferred embodiment of this invention, two metering film fixtures are provided on one side of the irradiation width area on the top surface of the wafer tray.

[0009] As a preferred embodiment of this invention, each of the wafer support rings is welded and fixed to the top surface of the wafer tray.

[0010] As a preferred technical solution of this utility model, the wafer support ring is designed as a two-lobed type, with a certain gap left in the middle of the two-lobed wafer support ring.

[0011] As a preferred technical solution of this utility model, the top of the wafer support ring is provided with two layers of stepped grooves, the top stepped groove being a wafer support groove, and the bottom of the wafer support groove being a clearance hole.

[0012] This invention improves the wafer placement method by adding a wafer support ring to the structure. The wafer's center is precisely aligned with the irradiation center using welding fixtures, ensuring irradiation accuracy.

[0013] This invention optimizes the wafer handling process by designing the wafer support ring into a two-lobed shape with a gap in the middle. This facilitates alignment and flipping of the wafer using a vacuum pen, reducing damage to the wafer during manual handling.

[0014] Specifically, this invention adds a wafer support ring welding structure to the existing wafer tray, which not only protects the wafer from phase movement, but also uses welding fixtures to accurately position the wafer relative to the wafer tray, thus ensuring the accuracy requirements of the wafer during proton irradiation.

[0015] The design of this novel wafer support ring is a two-part design with a suction pen slot in the middle. This makes it easy to flip the wafer while reducing the drawbacks of vacuuming and the risk of air blowing out of the vacuum.

[0016] This utility model focuses on design improvements in terms of accuracy and operation. First, for wafers requiring manual reverse operation, the two-lobed design of the wafer support ring provides a convenient position for the vacuum suction pen. Second, the wafer support ring and metrology film fixture are precisely positioned using soldering fixtures, eliminating irradiation problems such as missed or insufficient irradiation.

[0017] In addition, the wafer support ring formed by machining of this utility model has wafer slots and clearance holes. Through the design tolerances, the circumferential positioning design can effectively protect the wafer frame from damage during phase movement.

[0018] Other advantages, objectives, and features of this invention will be set forth in part in the description which follows, and in part will be apparent to those skilled in the art from the following examination and study, or may be learned from practice of this invention. The objectives and other advantages of this invention can be realized and obtained through the following description. Attached Figure Description

[0019] Figure 1 This is a top view schematic diagram of the wafer support ring for proton irradiation according to this utility model;

[0020] Figure 2 This is a schematic cross-sectional view of the wafer support ring of this utility model;

[0021] In the diagram: 1. Wafer tray; 2. Metering film fixture; 3. Wafer support ring; 4. Irradiation width; 5. Wafer slot; 6. Clearance hole. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0024] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0025] In the above description of this utility model, it should be noted that the terms "one side," "the other side," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0026] Furthermore, terms such as "identical" do not imply that components must be absolutely identical; minor differences are permissible. The term "perpendicular" simply means that the positional relationship between components is more perpendicular than "parallel," not that the structure must be perfectly perpendicular; a slight tilt is acceptable. Example

[0027] Please see Figure 1-2 The present invention provides a technical solution: a wafer support ring holder for proton irradiation of wafers, comprising a wafer tray 1, which is the main tray. An irradiation width region 4 is provided on the top surface of the wafer tray 1. Several wafer support rings 3 are arranged within the irradiation width region 4, each wafer support ring 3 being circular. Adjacent wafer support rings 3 are equally spaced within the irradiation width region 4. The wafer tray 1 is made of 5051 aluminum alloy. Two metering film fixtures 2 are provided on one side of the irradiation width region 4 on the top surface of the wafer tray 1.

[0028] Specifically, in this embodiment, firstly, in terms of material selection, 5051 aluminum alloy with suitable strength and density is selected as the wafer tray as much as possible. In order not to introduce other elements for contamination, the wafer support ring 3 and the metering film fixture 2 are both made of 5051 aluminum alloy for processing and welding.

[0029] In addition, the wafer support ring formed by machining of this utility model has wafer slots and clearance holes. Through the design tolerances, the circumferential positioning design can effectively protect the wafer frame from damage during phase movement.

[0030] Specifically, in this embodiment, the present invention improves the manual operation of the tray. It facilitates manual operation while reducing the risk of wafer damage caused by manual handling.

[0031] Specifically, in this embodiment, the present invention starts from the irradiation process. While ensuring the irradiation accuracy, it also records the dose of the irradiated wafer by welding a metering film, which facilitates retrospective investigation.

[0032] Each wafer support ring 3 is welded and fixed to the top surface of the wafer tray 1.

[0033] Specifically, in this embodiment, the present invention adds a wafer support ring welding structure to the existing wafer tray, which not only protects the wafer from phase movement, but also uses welding fixtures to accurately position the wafer relative to the wafer tray, thus ensuring the accuracy requirements of the wafer during proton irradiation. Example

[0034] Please see Figure 1-2This is another technical solution provided by the present invention. This embodiment has the same features as the above embodiment 1, and the similarities will not be described in this embodiment. The specific differences are as follows:

[0035] A wafer support ring holder for proton irradiation includes a wafer tray 1, which is the main tray. An irradiation width region 4 is provided on the top surface of the wafer tray 1. Several wafer support rings 3 are arranged within the irradiation width region 4, each of which is circular. Adjacent wafer support rings 3 are evenly spaced within the irradiation width region 4. The wafer tray 1 is made of 5051 aluminum alloy. Two metering film fixtures 2 are provided on one side of the irradiation width region 4 on the top surface of the wafer tray 1.

[0036] Specifically, in this embodiment, firstly, in terms of material selection, 5051 aluminum alloy with suitable strength and density is selected as the wafer tray as much as possible. In order not to introduce other elements for contamination, the wafer support ring 3 and the metering film fixture 2 are both made of 5051 aluminum alloy for processing and welding.

[0037] In addition, the wafer support ring formed by machining of this utility model has wafer slots and clearance holes. Through the design tolerances, the circumferential positioning design can effectively protect the wafer frame from damage during phase movement.

[0038] The wafer support ring 3 is designed as a two-lobed type, with a certain gap between the two lobes of the wafer support ring 3.

[0039] The top of the wafer support ring 3 is provided with two layers of stepped grooves. The top stepped groove is the wafer tray 5, and the bottom of the wafer tray 5 is the clearance hole 6.

[0040] Specifically, in this embodiment, the design of the novel wafer support ring is made into a two-lobed type, with a suction pen slot in the middle, which facilitates flipping while reducing the drawbacks of vacuuming and gas storage and the risk of being blown out by the vacuum.

[0041] Specifically, in this embodiment, the present invention focuses on design improvements in terms of accuracy and operation. First, for wafers requiring manual reverse operation, the two-lobed design of the wafer support ring provides a convenient position for the vacuum suction pen. Second, the wafer support ring and the metering film fixture are precisely positioned using soldering fixtures to prevent irradiation problems such as missed or insufficient irradiation.

[0042] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the spirit and scope of the technical solutions of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A wafer support ring for proton irradiation, comprising a wafer tray (1), characterized in that: The wafer tray (1) is the main tray. The top surface of the wafer tray (1) is provided with an irradiation width area (4). Several wafer support rings (3) are provided in the irradiation width area (4). Each wafer support ring (3) is circular. Two adjacent wafer support rings (3) are equally spaced in the irradiation width area (4).

2. The wafer support ring for proton irradiation according to claim 1, characterized in that: The wafer tray (1) is made of 5051 aluminum alloy.

3. The wafer support ring for proton irradiation according to claim 1, characterized in that: Two metering film fixtures (2) are provided on one side of the irradiation width area (4) on the top surface of the wafer tray (1).

4. The wafer support ring for proton irradiation according to claim 1, characterized in that: Each of the wafer support rings (3) is welded and fixed to the top surface of the wafer tray (1).

5. A wafer support ring for proton irradiation according to claim 4, characterized in that: The wafer support ring (3) is designed as a two-lobed type, with a certain gap between the two-lobed wafer support ring (3).

6. A wafer support ring for proton irradiation according to claim 5, characterized in that: The top of the wafer support ring (3) is provided with two layers of stepped grooves, the topmost stepped groove being a wafer tray (5), and below the wafer tray (5) being a clearance hole (6).

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